Specification Guides
Not looking for Specification Guides? See Product and Service Suppliers
Microelectronics and thin film manufacturing equipment including vacuum systems and components, gas delivery systems, deposition systems, photolithography units, etching equipment, annealing furnaces and other accessories.
Laboratory fume hoods are partially enclosed workspaces that are exhausted to the outside.
Ionizers and static eliminators eliminate static and dust and can neutralize and clean surfaces at remote distances.
Reflow ovens are used to perform reflow soldering of surface mount electronic components to printed circuit boards (PCB).
Equipment used to manufacture or process semiconductors.
Wafer cassettes are used to transport and store wafers during semiconductor manufacturing operations. They are designed to house or carry several wafers of the same size and are available in a range of materials to support specific applications, such as thermal processing.
Wafer chucks are used to handle semiconductor wafers during wafer processing applications. Common work clamping technologies include vacuum and electrostatic.
Wire and cable crimpers are designed for the connection of electrical and metal components by cutting, stripping, bending, and deforming. Crimping is extensive in the electrical and metal-forming industries and was developed as a high-quality, low cost replacement for soldered terminations. This article does not reference hose crimping processes.
Cable and wire strippers are devices used to remove sections of insulation from electrical wire, allowing access to the conductor for terminating and splicing. This guide includes handheld, benchtop, powered, and chemical stripping processes.