Help with Beamformer ICs specifications:
Technology / Interface
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| Technology | |||
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| 4G Standard | Fourth generation (4G) wireless technology is the successor to the 3G standard. 4G is based only on packet switching. By contrast, 3G uses a combination of circuit and packet switching. | ||
| 5G Standard | Fifth generation (5G) wireless technology is the successor to the 4G standard. 5G uses multiple band widths and many network connection points to produce an ultra-high speed network. | ||
| Wi-Fi / WiMAX / Wi-Mesh | WiFi (802.11) and WiMAX (802.16) wireless Ethernet chips are used in fixed broadband wireless access networks that use point-to-multipoint architecture. WiFi chips are based on the IEEE 802.11 standard. WiMAX chips are based on the IEE 802.16 standard. WiFi is an abbreviation for wireless fidelity. WiMAX is an abbreviation for worldwide interoperability for microwave access. The IEEE 802.16 or WiMAX standard is also known as WirelessMAN®, a registered trademark of the Institute of Electrical and Electronics Engineers (IEEE). Wi-Mesh is designed to extend the reach of WiFi networks over long distances by allowing multiple access points to carry each other’s traffic. Unlike Wi-Fi hotspots, which need a direct connection to the Internet, mesh networks pass the data request until a network connection is found. | ||
| Other | Other unlisted or proprietary technology types. | ||
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Beamformer Devices
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| Beamformer Type | |||
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| Receiver | The beamformer chip is a receiver. Receivers are designed to receive signals or data from antennas or from other devices in the system. | ||
| Transmitter | The beamformer chip is a transmitter. Transmitters are designed to generate and send signals or data. | ||
| Transceiver | The beamformer chip is a transceiver (Tx/Rx). Transceivers are dual devices that can operate as a transmitter and as a receiver. | ||
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| Band Type | |||
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| C-Band | The C-band within the electromagnetic spectrum are the frequencies between 4 and 8 gigahertz (GHz) | ||
| K-Band | The Ku band within the electromagnetic spectrum are the frequencies between 18 and 27 gigahertz (GHz) | ||
| Ka-Band | The Ka-band within the electromagnetic spectrum are the frequencies between 27 and 40 gigahertz (GHz) | ||
| Ku-Band | The Ku-band within the electromagnetic spectrum are the frequencies between 12 and 18 gigahertz (GHz) | ||
| Q-Band | The Q-band within the electromagnetic spectrum are the frequencies between 33 and 50 gigahertz (GHz) | ||
| V-Band | The V-band within the electromagnetic spectrum are the frequencies between 40 and 75 gigahertz (GHz) | ||
| S-Band | The S-band within the electromagnetic spectrum are the frequencies between 2 and 4 gigahertz (GHz) | ||
| X-Band | The X-band within the electromagnetic spectrum are the frequencies between 8 and 18 gigahertz (GHz) | ||
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| Antenna Polarity | |||
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| Single Polarity | A single polarity antenna sends and receives signals in a single plane, either vertical or horizontal. | ||
| Dual Polarity | A dual polarity antenna sends and receives signals from 2 planes, horizontal and vertical. | ||
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Performance
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| Supply Voltage: | |||
| Your choices are... | |||
| -5 V | Devices operate with -5 V. | ||
| -4.5 V | Devices operate with -4.5 V. | ||
| -3.3 V | Devices operate with -3.3 V. | ||
| -3 V | Devices operate with -3 V. | ||
| 1.2 V | Devices operate with 1.2 V. | ||
| 1.5 V | Devices operate with 1.5 V. | ||
| 1.8 V | Devices operate with 1.8 V. | ||
| 2.5 V | Devices operate with 2.5 V. | ||
| 2.7 V | Devices operate with 2.7 V. | ||
| 3 V | Devices operate with 3 V. | ||
| 3.3 V | Devices operate with 3.3 V. | ||
| 3.6V | Devices operate with 3.6 V. | ||
| 5 V | Devices operate with 5 V. | ||
| Other | Other unlisted supply voltages. | ||
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| Number of Transmitters | The number of transmitters (drivers) in the chip. | ||
| Search Logic: | All matching products will have a value greater than or equal to the specified value. | ||
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| Number of Receivers | The number of receivers in the chip. | ||
| Search Logic: | All matching products will have a value greater than or equal to the specified value. | ||
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| Operating Frequency: | The operating frequency is the range of broadcast and received signals. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Number of Channels | The number of channels is the number of unique frequencies the device can communicate. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Packaging
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| IC Package Type: | |||
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| Bare Die | Devices are sold in semiconductor die form. They do not have a case or packaging. | ||
| BGA | Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs. | ||
| FCBGA | Flip chip ball-grid array (FCBGA) uses a combination of flip chip and ball grid array features. FCBGA enables short electrical paths for high frequency applications. The simultaneous soldering of all joints in one pass through a reflow furnace facilitates the mounting of packages with thousands of solder joints. | ||
| PBGA | Plastic ball-grid array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7 mm. | ||
| MCM-PBGA | Multi-chip module plastic ball-grid array (MCM-PBGA). | ||
| SBGA | Super ball-grid array (SBGA) provides a high-power BGA package with a very low profile. With SBGA, the IC is directly attached to an integrated copper heatsink. Since the IC and I/O are on the same side, signal vias are eliminated, providing a significant improvement in electrical performance (inductance). | ||
| TBGA | Tape ball-grid array (TBGA). | ||
| CPGA | Ceramic pin-grid array (CPGA). | ||
| PPGA | Plastic pin-grid array (PPGA). | ||
| FCPGA | Flip-chip pin-grid array (FCPGA) attaches the chip to the board facedown, without any wire bonding. | ||
| IPGA | Interstitial package grid array (IPGA) carries additional pins on a 0.5" offset pattern in between the pins of a regular PGA pattern. It almost doubles the available pins on the same package size as a standard PGA. | ||
| PGA | Pin grid array (PGA) is a second generation package that uses through-hole technology (THT). Pins are located on a 0.1" grid in various patterns. Package size is reduced by moving pins to the underside of the package in a grid pattern. | ||
| CSP | Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs. | ||
| FCCSP | Flip-chip chip-scale package (FCCSP). | ||
| SuperFC® | Super flip-chip or SuperFC® packages feature a controlled bond line die attached directly to a copper heat spreader. SuperFC® is a registered trademark of Amkor. | ||
| UCSP | Ultra chip scale package (UCSP). | ||
| WLCSP | Wafer-level chip-scale package (WLCSP) allows an IC to be attached facedown so that its pads connect to the printed circuit board (PCB) through individual solder balls without any underfill material. WLCSP minimizes IC-to-PCB inductance, features small package size, and provides enhanced thermal conduction. | ||
| LGA | Tape ball-grid array (TBGA) uses a fine, polyimide substrate and provides good thermal performance with high pin counts. | ||
| FLGA | Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras. | ||
| QFP | Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets and other applications. | ||
| LQFP | Low quad flat package (LQFP). | ||
| TQFP | Thin quad flat package (TQFP). | ||
| PQFP | Plastic quad flat package (PQFP). | ||
| QFN | Quad flat non-leaded package (QFN) is also known as QFNL. | ||
| VQFP | Very thin quad flat package (VQFP). | ||
| MSOP | Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar coded. Reels are placed inside barcode-labeled boxes for shipping. | ||
| PSOP | Power small outline package (PSOP). | ||
| SOP | Small outline package (SOP). | ||
| QSOP | Quarter size outline package (QSOP). | ||
| MLP | Micro lead-frame package (MLP) is an ultra-slim, miniature package with a typical height of only 0.75 mm, length of 2 mm and width of 3 mm. | ||
| SOIC | Small outline integrated circuit (SOIC). | ||
| TSOJ | Thin small outline J-leaded package (TSOJ). | ||
| TSOP Type I, Type II | Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II. | ||
| TSOP Type I | Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. | ||
| TSOP Type II | Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. | ||
| SSOP | Shrink small outline package (SSOP). | ||
| VSSOP | Very thin shrink small outline package (VSSOP). | ||
| TVSOP | Thin very small outline package (TVSOP). | ||
| TSSOP | Thin shrink small outline L-leaded package (TSSOP). | ||
| SOJ | Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device. | ||
| HSOF | Small outline flat-leaded package with heat sink (HSOF). | ||
| HSOP | Small outline with heat sink package (HSOP). | ||
| PLCC | Plastic leaded chip carrier (PLCC). | ||
| LCCC | Leadless ceramic chip carrier (LCCC). | ||
| DIP | Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP). | ||
| CDIP | Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. | ||
| PDIP | Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications. | ||
| SIP | Single in-line package (SIP) is a semiconductor package which has only one row of pins. | ||
| SDIP | Shrink dual in-line package (SDIP). | ||
| SC-70 | SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops and other portable and hand-held applications where space is extremely limited. | ||
| SZIP | Shrink zigzag in-line package (SZIP). | ||
| TDFN | Thin dual flat no-lead (TDFN) packages are fine-pitch, high-performance replacements for 6-pin SOT23 and SC-70 packages. TDFM offers improved thermal characteristics and reduced parasitic compared to these other packages. With the same footprint as equivalent MLF and Mini-BGA packages, TDFM has a much smaller footprint than SOT23 packages. | ||
| SOT23 | SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment. | ||
| Other | Other unlisted, specialized, or proprietary IC packages. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Pin Count | The number of pins in the package. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Number of Devices in Package | The total number of devices in the IC package. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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