Products & Services
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Supplier: Allied Electronics, Inc.
Description: Epoxy Mold Release, Aliphatic Naptha, Propane, Isobutene Chemical Component, -45 °C Flash Point Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. The avoid
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Supplier: Epoxy Technology
Description: EPO-TEK® UV Epoxies are your alternative to traditional oven cured optical products. They are fast curing and photo curable. These UV cure adhesives simplify the handling process by using a single component system. Our adhesives require no mixing, cure in seconds or minutes, and have an
- Coeff. of Thermal Expansion (CTE): 22.78 to 94.44 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
- Features: Encapsulating / Potting
- Index of Refraction: 1.57 to 1.58
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Supplier: Allied Electronics, Inc.
Description: Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Maximum operating temperature: 275°C/527°F
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Supplier: Allied Electronics, Inc.
Description: Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Maximum operating temperature: 275°C/527°F
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Supplier: Accuris
Description: EPOXY RESINS: CHEMISTRY AND TECHNOLOGY
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Description: Phenicon® HIGH SOLIDS is a VOC-compliant epoxy novolac phenolic coating formulated for use as an internal lining for tanks used to hold crude oil and most refined petroleum products including unleaded gasoline, MTBE, aromatic solvents, and most octane booster blending stocks. Also formulated
- Chemistry: Epoxy, Formaldehyde Resins (Phenolic, Furan, Melamine), Resin Base / Polymer Binder, Other
- Cure / Dry Temperature: 55 to 120 F
- Features: Chemical / Oil Resistant, Other
- Form: Liquid
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Supplier: Allied Electronics, Inc.
Description: Instant Adhesives, Cyanoacrylate Chemical Component Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of
- Features: Encapsulating / Potting
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Supplier: ND Industries, Inc.
Description: Vibra-Tite is one of the world’s market leaders in anaerobics, cyanoacrylates, epoxies and ultraviolet technologies. Vibra-Tite is quickly becoming one of the most highly respected names in the adhesive industry. And, as a result of ND’s low overhead expenses and in
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Industry: Building / Construction
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Wood / Wood Product
- Use Temperature: -55 to 300 F
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Description: Dura-Plate® 301K Series epoxy systems deliver advanced technology, providing cost-effective solutions while supplying outstanding durability and long-term performance in harsh environments and challenging conditions: High-solids epoxies with surface and moisture tolerance
- Chemistry: Resin Base / Polymer Binder, Epoxy
- Cure / Dry Temperature: 65 to 104 F
- Industry: Marine
- Operating / Use Temperature: 65 to 122 F
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Supplier: Ellsworth Adhesives
Description: AI Technology Prima-Solder ME8456 Epoxy Paste Adhesive is a thermally conductive, electrically, reworkable, pure silver filled epoxy paste adhesive. It is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 7.9 W/m-K
- Viscosity: 130000 cP
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Supplier: Ellsworth Adhesives
Description: AI Technology ME7155 has thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials having highly mismatched CTE's. It is electrically insulated, reworkable, and alumina filled. ME7155 is also ideal for high power die attach. 10 cc Syringe.
- Cure Type / Technology: Single Component System
- Dielectric Strength: 750 kV/in
- Thermal Conductivity: 1.7 W/m-K
- Viscosity: 276000 cP
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Description: Dura-Plate® 301W Series epoxy systems deliver advanced technology, providing cost-effective solutions while supplying outstanding durability and long-term performance in harsh environments and challenging conditions: High-solids epoxies with surface and moisture tolerance
- Chemistry: Resin Base / Polymer Binder, Epoxy
- Cure / Dry Temperature: 35 to 75 F
- Industry: Marine
- Operating / Use Temperature: 35 to 132 F
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description ER2183 Thermally conductive epoxy potting compound is an epoxy resin which meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission. It is a low viscosity alternative to ER2220 system which is
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Thermal / Heat Conductive
- Industry: Electronics
- Thermal Conductivity: 1.25 W/m-K
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Supplier: Ellsworth Adhesives
Description: AI Technology EG7655 is an alumina filled, reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). EG7655's high thermal
- Cure Type / Technology: Two Component System
- Dielectric Strength: 750 kV/in
- Thermal Conductivity: 1.7 W/m-K
- Viscosity: 280000 cP
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description ER2188 General purpose epoxy potting compound is a two part epoxy resin for general use within the electronics industry. It’s a good all round resin offering a cost effective solution for a wide range of applications where protection is required. ER2188 is flame
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Thermal / Heat Conductive
- Industry: Electronics
- Substrate / Material Compatibility: Other
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description ER2074 Thermally conductive epoxy resin is a flame retardant system with UL94 V-0 approval. The flame retardant technology used is halogen free leading to relatively low toxicity fumes and low smoke emission and the lack of abrasive fillers means that there is lower
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Flame Retardant (e.g. UL 94 Rated), Thermal / Heat Conductive
- Thermal Conductivity: 1.26 W/m-K
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Supplier: Ellsworth Adhesives
Description: AI Technology ME7155-3 is a slightly lower bond strength but more flexible version of ME7155. The ME7155-3 exhibits excellent flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it
- Cure Type / Technology: Single Component System
- Dielectric Strength: 750 kV/in
- Thermal Conductivity: 1.7 W/m-K
- Viscosity: 175000 cP
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Supplier: Graphene Laboratories, Inc.
Description: based on advanced proprietary technology that utilizes 20% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. G6E-HTNS™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. A heating
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 302 to 356 F
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Supplier: Graphene Laboratories, Inc.
Description: technology that requires 20% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. This improvement not only reduces the cost of the material but also makes G6E-FXNS™ less prone to fracture, thus allowing for stronger adhesion to the
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Flexible / Dampening
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 302 F
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85°C,
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.9
- Features: Electrically Conductive, Electrical Insulating / Dielectric, EMI / RFI Shielding Material, Anti-static / ESD Control
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Photonics / Optoelectronics, Semiconductors / IC Packaging, Tooling / Mold Material
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes, shorter
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Electrical Insulating / Dielectric, EMI / RFI Shielding Material, Anti-static / ESD Control
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
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Supplier: Graphene Laboratories, Inc.
Description: proprietary technology that requires 25% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. This improvement not only reduces the cost of the material but also makes G6E-NS10™ less prone to fracture, thus allowing for stronger
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 77 to 302 F
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11™ has been developed based on advanced proprietary technology that requires 15% or less silver
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 77 to 302 F
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Supplier: RCD Components, Inc.
Description: GENERAL PURPOSE EPOXY COATED INDUCTORS Widest selection in the industry! Delivery typically from stock Premium grade materials enable high current, SRF, Q, and temperature ratings Low cost due to automated production
- Applications: General Purpose
- DCR: 0.0600 to 72 ohms
- Inductance Range: 0.1000 to 2200 microH
- Inductance Tolerance: 5 to 20 (+/- %)
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Supplier: Cole-Parmer
Description: • 2-year replacement warranty • Builds on the ROSS
technology for greater stability, relability, and renowned accuracy and temperature response • Less long term drift saves time from recalibrating The ROSS Ultra stability gives you 0.01 p - Body Material: Epoxy or Polymer
- Junction Type: Double Junction
- Operating Temperature: 32 to 212 F
- pH Range: 0.0 to 14 ph
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Supplier: Cole-Parmer
Description: • 2-year replacement warranty • Builds on the ROSS
technology for greater stability, relability, and renowned accuracy and temperature response • Less long term drift saves time from recalibrating The ROSS Ultra stability gives you 0.01 p - Body Material: Epoxy or Polymer
- Junction Type: Double Junction
- Operating Temperature: 32 to 212 F
- pH Range: 0.0 to 14 ph
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Supplier: Cole-Parmer
Description: • 2-year replacement warranty • Builds on the ROSS
technology for greater stability, relability, and renowned accuracy and temperature response • Less long term drift saves time from recalibrating The ROSS Ultra stability gives you 0.01 p - Body Material: Epoxy or Polymer
- Junction Type: Double Junction
- Operating Temperature: 32 to 212 F
- pH Range: 0.0 to 14 ph
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.9
- Features: Electrically Conductive, Electrical Insulating / Dielectric, EMI / RFI Shielding Material, Anti-static / ESD Control
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Photonics / Optoelectronics, Semiconductors / IC Packaging, Tooling / Mold Material
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Description: ExpressCote HCR is a glass flake filled epoxy novolac lining engineered to protect concrete and steel tank interiors from chemicals and solvents at ambient and elevated temperatures. It provides rapid return to service, high film build, and edge retentive protection compared to conventional
- Chemistry: Inorganic (Ceramic, Conversion, Glaze), Epoxy, Glaze / Glass Enamel, Resin Base / Polymer Binder, Other
- Cure / Dry Temperature: 50 to 100 F
- Features: Chemical / Oil Resistant, Heat Resistant / High Temperature, Protective, Waterproof / Water Repellant
- Form: Liquid
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP3HTMed represents a breakthrough in epoxy adhesive technology combining the ease of use of a one part, no-mix, fast curing adhesive with high shear strength. This special formulation now fully meets USP Class VI requirements. The one part EP3HTMed cures at
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Flexible / Dampening
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Medical / Food (Sanitary / FDA), OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Porous Surfaces, Other
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Supplier: Cole-Parmer
Description: • 2-year replacement warranty • Builds on the ROSS
technology for greater stability, relability, and renowned accuracy and temperature response • Less long term drift saves time from recalibrating The ROSS Ultra stability gives you 0.01 p - Body Material: Epoxy or Polymer
- Junction Type: Double Junction
- Operating Temperature: 32 to 212 F
- pH Range: 0.0 to 14 ph
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Supplier: Applied Rapid Technologies Corporation
Description: Stereolithography and Polyjet™ materials. In this case ART recommends Rapid Tooling with urethane, epoxy, or silicone castings. Our Rapid Tooling process allows us to produce anywhere from one to 100 parts from a material that will meet your requirements. Details such as color, texture and
- Industry Served: Aerospace, Electrical / Electronics, Medical, Military, Other
- Location: North America, United States Only, Southern US Only
- Mold Type: Injection Molding, Investment Casting, Sand Casting, Other
- Services: Model Making, Mold Texturing, Production Facilities, Repair and Maintenance, Prototyping, CAD/CAM Support, Design Assistance
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Supplier: Applied Rapid Technologies Corporation
Description: Stereolithography and Polyjet™ materials. In this case ART recommends Rapid Tooling with urethane, epoxy, or silicone castings. Our Rapid Tooling process allows us to produce anywhere from one to 100 parts from a material that will meet your requirements. Details such as color, texture and
- Location: North America, United States Only, Southern US Only
- Materials: Polyurethane / Urethane
- Molding Type: Injection Molding
- Services Offered: Insert Molding, Tool / Mold Making, Prototype / Market Entry Molding, High Volume Production (Long Runs), Assembly Services, Design Assistance, Graphics
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Description: Mitsubishi Chemical Carbon Fiber and Composites, Inc. manufacturing facility utilizes advanced, highly efficient production equipment and technology. This enables us to provide our customers with the advanced composite materials they require. Our facility can process nearly every high
- Applications: Aerospace, Automotive / Transportation
- Use Temperature: 380 F
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Supplier: NACE International
Description: Provides the most current technology and industry practices for the use of field-applied fusion-bonded epoxy (FBE) external pipe coating systems for girth weld joints. This standard is intended for use by corrosion control personnel, design engineers, project managers, purchasing
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Supplier: RS Components, Ltd.
Description: ER2220 is a flame retardant, thermally conductive, two-part encapsulation compound based on epoxy technology. ER2220 is a two-part epoxy potting compound. Excellent thermal conductivity. Flame Retardant. Very low shrinkage and exotherm. Good chemical and water resistance.
- Use Temperature: -40 to 266 F
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Supplier: NACE International
Description: This standard recommended practice presents guidelines for establishing requirements to ensure proper application and performance of plant-applied, fusion-bonded epoxy (FBE) coatings to the external surfaces of pipe. It is intended for use by corrosion control personnel concerned with
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Description: Mitsubishi Chemical Carbon Fiber and Composites, Inc. manufacturing facility utilizes advanced, highly efficient production equipment and technology. This enables us to provide our customers with the advanced composite materials they require. Our facility can process nearly every high
- Cure Type / Technology: Specialty / Other
- Industry: Aerospace, Military / Government (MIL-SPEC / GG)
- Use Temperature: 200 F
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Description: Mitsubishi Chemical Carbon Fiber and Composites, Inc. manufacturing facility utilizes advanced, highly efficient production equipment and technology. This enables us to provide our customers with the advanced composite materials they require. Our facility can process nearly every high
- Cure Type / Technology: Specialty / Other
- Industry: Aerospace, Marine, OEM / Industrial, Other
- Use Temperature: 180 F
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Description: Mitsubishi Chemical Carbon Fiber and Composites, Inc. manufacturing facility utilizes advanced, highly efficient production equipment and technology. This enables us to provide our customers with the advanced composite materials they require. Our facility can process nearly every high
- Cure Type / Technology: Specialty / Other
- Industry: Marine, Medical / Food (Sanitary / FDA), OEM / Industrial, Other
- Use Temperature: 200 F
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Supplier: Honeywell Sensing & IoT
Description: . Honeywell also offers RTD (Resistance Temperature Detector) technology that may be packaged into probe assemblies for similar applications that may require an RTD linear output instead of an NTC thermistor output.
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Supplier: Honeywell Sensing & IoT
Description: . Honeywell also offers RTD (Resistance Temperature Detector) technology that may be packaged into probe assemblies for similar applications that may require an RTD linear output instead of an NTC thermistor output.
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Supplier: Honeywell Sensing & IoT
Description: . Honeywell also offers RTD (Resistance Temperature Detector) technology that may be packaged into probe assemblies for similar applications that may require an RTD linear output instead of an NTC thermistor output.
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Supplier: Honeywell Sensing & IoT
Description: . Honeywell also offers RTD (Resistance Temperature Detector) technology that may be packaged into probe assemblies for similar applications that may require an RTD linear output instead of an NTC thermistor output.
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Description: Provides the most current technology and industry practices for the use of field-applied fusion-bonded epoxy (FBE) external pipe coating systems for girth weld joints. This standard is intended for use by corrosion control personnel, design engineers, project managers, purchasing
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Description: This standard recommended practice presents guidelines for establishing requirements to ensure proper application and performance of plant-applied, fusion-bonded epoxy (FBE) coatings to the external surfaces of pipe. It is intended for use by corrosion control personnel concerned with
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Supplier: Advanced Sensor Technologies, Inc.
Description: lifetime in process industry through the proprietary and novel non-porous, cross-linked conductive polymer technology with triple junction is standard for all ZEUS„¢ sensor configurations. This solid-state proprietary reference system is nearly impervious to intrusion from most
- Body Material: Epoxy or Polymer
- Mounting Options: In-Line (Insertion)
- Operating Pressure Range: 200 psi
- Operating Temperature: 5 to 302 F
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Supplier: Waytek, Inc.
Description: Carling Technolgoies 6FA53-78/TABS Toggle Switch Category: Rocker Switches Manufacturer: Carling Technologies Contact Action: On-Off 12VDC Illumination: One light Easy installation: actuators snap onto switch body Removable actuators in a variety of styles sold separately Includes 4
- Maintained Contact Switch Function: ON / OFF
- Maximum Current Rating: 20 amps
- Maximum DC Voltage Rating: 12 volts
- Pole and Throw Specifications: SPST
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Supplier: Hamilton Company
Description: Hamilton’s combination Redox (ORP) electrodes are universally applicable and offer long term stability with the patented EVEREF technology. As with all other lab electrodes these sensors are individually serialized and certified.
- Body Material: Epoxy or Polymer
- Electrode Configuration: Combination
- Mounting Options: Hand Held or Portable
- ORP Range: -2000 to 2000 millivolts
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Supplier: Hamilton Company
Description: Hamilton’s combination Redox (ORP) electrodes are universally applicable and offer long term stability with the patented EVEREF technology. As with all other lab electrodes these sensors are individually serialized and certified.
- Body Material: Epoxy or Polymer
- Electrode Configuration: Combination
- Mounting Options: Hand Held or Portable
- ORP Range: -2000 to 2000 millivolts
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Supplier: Valspar Corporation (The)
Description: Full line of color and special effects are available for your cosmetic bottle applications. Differentiate your product on the shelf with the latest technology from Valspar. Technology Epoxy technology Spray application Clear Base Varnish plus 14 Colorants
- Chemistry: Epoxy, Resin Base / Polymer Binder
- Industry: Food and Beverage
- Substrate / Surface: Glass
- Type: Varnish
Find Suppliers by Category Top
Featured Products Top
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-component, have been marketed and widely utilized in various industrial production and applications for bonding metals, concrete, glass, ceramics, concrete, many plastics, wood, and other materials. Shenzhen DeepMaterial Technologies Co., Ltd is a professional epoxy adhesive glue manufacturer (read more)
Browse Electrical and Electronic Resins Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
environment, mechanical damage and corrosion. DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy, UV-curing acrylic, or silicone chemistries for good electrical insulation. DeepMaterial COB encapsulating adhesives offer good high temperature stability and thermal shock (read more)
Browse Epoxy Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
DeepMaterial’s new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical properties of components by eliminating stress caused by solder materials.
(read more)
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Here are a few considerations when using epoxy glue for plastic: Surface preparation: Before applying epoxy glue, it's crucial to prepare the plastic surface properly. This usually involves cleaning the surface (read more)
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Advantages of One Component Epoxy Adhesive One component epoxy adhesive offers several advantages over other types of bonds. Some of the key benefits include: Time-saving: One component of epoxy adhesive can save a significant amount of time in the bonding process. Since it is a (read more)
Browse Epoxy Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
Epoxy adhesives are known for their high strength and durability, making them suitable for a wide range of applications, including electronics. SMT epoxy adhesives are formulated to meet the specific requirements of SMT processes. They typically have the following characteristics (read more)
Browse Epoxy Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
Advantages Two Part Epoxy Adhesive Versatility: They can bond a wide range of materials, including metals, plastics, ceramics, composites, and even dissimilar materials. High bond strength: The adhesive provide excellent bonding (read more)
Browse Epoxy Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
Advantages Two Part Epoxy Adhesive Versatility: They can bond a wide range of materials, including metals, plastics, ceramics, composites, and even dissimilar materials. High bond strength: The adhesive provide excellent bonding (read more)
Browse Epoxy Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
Underfill is an epoxy material that fills gaps between a chip and its carrier or a finished package and the PCB substrate. Underfill protects electronic products from shock, drop, and vibration and reduces the strain on fragile solder connections caused by the difference in thermal expansion (read more)
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Underfill is an epoxy material that fills gaps between a chip and its carrier or a finished package and the PCB substrate (read more)
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Conduct Research Top
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Silver-Nanocarbon Electrically Conductive Epoxy
G6E-NS10 TM epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 TM is developed based on advanced proprietary technology that requires 25% or less silver
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Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
Epoxies are used in the packaging and assembly of three opto-electronic devices, including Fiber Optics, LEDs, and LCDss. In fiber optics, you need epoxy for the cable and for the opto-packaging. The fiber optic components are usually packaged in hybrid technology, which mean several
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All you need to know about Metal Bonding Epoxy Adhesives
DeepMaterial, as an industrial epoxy adhesive manufacturer, we do lost of research about underfill epoxy, non conductive glue for electronics, non conductive epoxy, adhesives for electronic assembly, underfill adhesive, high refractive index epoxy. Base on that, we have the latest technology
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The Use of Optically Activated Pigmented Epoxy Systems in Water Storage Tanks (.pdf)
Optically Activated Pigmented (OAP) coating systems have become a requirement in marine ballast tank applications due to their ability to assure correct application of epoxy linings. In steel and concrete water storage tanks the use of this same technology can aid in eliminating holidays
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Pros and Cons of Urethane, Epoxy, or Silicone Adhesives by Ellsworth Adhesives
With so many adhesive technologies available, choosing the right material for your application can be a daunting task. Epoxies, silicones, and urethanes are three primary chemistries widely used in industrial applications. Each has its own benefits and drawbacks to consider. This Technical Bulletin
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Best Top 10 BGA Underfill Epoxy Adhesives And Underfill Encapsulants Manufacturers In China
Underfill epoxy adhesives offer good protection against ionic residues and unwanted substances. One of the key things that the underfill helps to achieve is better adhesion of components onto the substrate and shock protection. Today, the formulations include no flow underfills. This eliminates
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Material & Material Properties: Which Requirements Does the Material Place on the Technology?
The number of adhesives, sealants and casting compounds that can be dispensed is constantly growing. The use of epoxy, polyurethane, silicone or other material types in a process depends on the requirements of the end product. Factors such as viscosity and filler concentration, as well as curing
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Best top 10 electronics assembly adhesives manufacturers in china with non conductive epoxy adhesive glue for electronics
The world is slowly changing. The way things were done a few years ago is not the same way they are being done today, thanks to innovations and advanced technology. Embracing the good and discarding the bad is the only way to move forward. One of the areas that have been greatly affected
More Information Top
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Propylene Oxide
In late 2002, Lyondell announced to build a pilot plant based on its direct epoxidation technology .
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Uses of Epoxy Resins
Useful reviews, occasioned by the twentieth anniversary of the commercial introduction of epoxy resins, have also been published on the progress of epoxy technology , and mention a number of other applications which are dealt with in later chapters of this book.
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Epoxy Adhesive Applications Guide
It was compiled through the combined efforts of multiple departments in Epoxy Technology , Inc. including: Quality Control, Research and Develop- ment, Technical Services, Special Formulating Services, Process Control and Technical Sales and Marketing.
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Advanced Blade Manufacturing Project - Final Report
Despite the failures of ABM and AWT, the technical potential for wood epoxy technology in wind turbine blade manufacture is significant.
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The VOC Voyage: An Enigmatic Journey
While solvent-borne coatings are often considered superior to waterborne technologies, this is not always the case and has been described as myth in the case of waterborne epoxy technology (10,11).
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Electronic Materials and Processes Handbook, Third Edition > Thermal Management Materials and Systems
Epoxy Technology .
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Encyclopedia of Catalysis 6 Volume Set
In the late 1980s, the first large-scale applica- tion of the Sharpless epoxidation technology was developed by the Arco Chemical Company for the production of glycidol, a versatile C3 building block.
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http://dspace.mit.edu/bitstream/handle/1721.1/9724/42686157-MIT.pdf?sequence=2
Indeed, the epoxy technology has been advancing rapidly.