Products & Services
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Supplier: TE Connectivity
Description: : No Other Air Velocity (LFM) : 200, 0, 400, 600 Comment : Heat sink assembly includes Four Leg Low Profile Clip, Part Number 1542385-1., Mounting clip does not increase overall heat sink height.
- Height: 9.06 mm
- Width: 34.92 mm
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Supplier: TE Connectivity
Description: : No Other Air Velocity (LFM) : 200, 600, 0, 400 Comment : Heat sink assembly includes Four Leg Standard Clip, Part Number 1542026-1., Mounting clip does not increase overall heat sink height.
- Height: 11.23 mm
- Width: 25.4 mm
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Supplier: TE Connectivity
Description: : Mounting clip does not increase overall heat sink height., Heat sink assembly includes Three Leg Low Profile Clip, Part Number 1542432-1. Product Type Features Accessory Type : Clip Connector & Contact Terminates To
- Height: 22.65 mm
- Width: 50.8 mm
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Supplier: Accuris
Description: HEAT SINK, SEMICONDUCTOR DEVICES
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Supplier: Boyd
Description: in the world available today. From small stamped aluminum parts for cooling discrete semiconductors at the board level to extremely large thermal systems utilizing large advanced fin types and unique geometries, Aavid is the industry leader in heat sink design and manufacture.
- Device: Passive Heat Sink
- Heat Sink Fin Style: Bonded Fin
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Supplier: Boyd
Description: Aavid offers thousands of heat sink options for cooling semiconductor packages and other devices for use on printed circuit boards (PCBs). Available in a variety of shapes, sizes, profiles, fabrications, and mountings, Aavid offers the widest selection of board level cooling
- Device: Passive Heat Sink
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Supplier: Accuris
Description: HEAT SINKS FOR SEMICONDUCTOR DEVICES
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Supplier: Accuris
Description: HEAT SINKS, SEMICONDUCTOR DEVICES, CLASS 1
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Supplier: Plansee SE
Description: when selecting the material for the base plate. With our materials the thermal properties can be tailored to the requirements of the semiconductor and the package. See where else our materials are used . You will find our base plates and heat spreaders in components in the fields of
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Supplier: Accuris
Description: HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FORMED
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Supplier: Boyd
Description: The Aavid Max Clip™ System is a high performance, low cost thermal solution for discrete power semiconductors. This thermal system combines Aavid’s Max Clips with specialized extruded Max Clip Heat Sinks to provide optimized thermal contact. The system eliminates the need
- Device: Passive Heat Sink
- Heat Sink Fin Style: Straight Fin
- Height: 5.1 to 48 mm
- Length: 16.5 to 37.4 mm
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Supplier: Richardson RFPD
Description: With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks are recommended for critical space applications where maximum heat dissipation is required for high-power TO-3 case styles. Forced convection performance is also exemplary with these
- Height: 31.75 mm
- Thermal Resistance: 55 °C / W
- Width: 121 mm
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Description: The thermal design and thermal management of Wanbang Technology has rich experience in water cooling system research and water-cooled plate production, friction stir welding technology, low production cost, zero contact thermal resistance, high integration design intensity, and full-scale liquid
- Device: Cold Plate
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Supplier: Richardson RFPD
Description: These exceptionally low-cost heat sinks can be mounted horizontally under a TO-220 or TO-202 case style with a maximum height of only 0.375 in (9.4). For added performance, a 271 Series heat sink can also be used for double-sided heat dissipation. The 270-AB and
- Height: 9.52 mm
- Mounting: Other
- Thermal Resistance: 6 °C / W
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Supplier: Richardson RFPD
Description: Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 semiconductor packages. These heat sinks are designed for use where minimum PC board space is available. The 288-1AB is a stamped aluminum
- Height: 31.75 mm
- Mounting: Other
- Thermal Resistance: 12 °C / W
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Supplier: Richardson RFPD
Description: Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 semiconductor packages. These heat sinks are designed for use where minimum PC board space is available. The 288-1AB is a stamped aluminum
- Height: 31.75 mm
- Mounting: Other
- Thermal Resistance: 12 °C / W
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Supplier: Applied Diamond, Inc.
Description: Applied Diamond can build heat spreaders for the most extreme possibilities. As a material, diamond has no peer as a semiconductor medium. The unsurpassed thermal conductivity of diamond and its high electrical resistivity allow for better performance across virtually all measures of
- Device: Passive Heat Sink
- Height: 0.1000 to 0.5000 mm
- Length: 1.5 to 30 mm
- Material: Mixed Material, Other Materials
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Supplier: RS Components, Ltd.
Description: Surface mount heatsink for D-PAK package semiconductors. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package. tab to the heat sink For Use With = D2 PAK (TO-263), Power SO-10 (MO-184), SO-10
- Height: 9.52 mm
- Length: 25.91 mm
- Mounting: Other
- Thermal Resistance: 15 °C / W
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Supplier: RS Components, Ltd.
Description: Surface mount heatsink for D-PAK package semiconductors. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package. tab to the heat sink For Use With = D2 PAK (TO-263) Length = 25.4mm Width = 19.38mm
- Height: 11.43 mm
- Length: 25.4 mm
- Material: Aluminum
- Mounting: Other
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Supplier: RS Components, Ltd.
Description: ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks
- Height: 33 mm
- Length: 50 mm
- Mounting: Other
- Thermal Resistance: 6.4 °C / W
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Supplier: RS Components, Ltd.
Description: ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks
- Height: 25 mm
- Length: 100 mm
- Thermal Resistance: 1.5 °C / W
- Width: 88 mm
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Supplier: Littelfuse, Inc.
Description: To enable the correct cooling of the semiconductor device during operation, Littelfuse provides a full range of Aluminium heatsinks. These have been designed to suit both the correct distribution of force during clamping and also air-flows required to cool the devices during operation. For
- Weight: 28000 g
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Supplier: Allied Electronics, Inc.
Description: The TAP series delivers 1000 W or 2000 W of continuous power when properly mounted to a liquid cooled heat sink (based on 85°C mounting plate temperature) Applications include power conditioning, power distribution, power conversion, and power control. Features
- Category / Application: General Use
- Features: Heat Sink
- Mounting / Packaging: Surface Mount (SMT / SMD)
- Power Rating: 2000 watts
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Supplier: Gefran
Description: (AC51) at 400/480/600Vac. Control is logic type (Vdc), signaled by LEDs. Each phase is controlled by means of semiconductors . The constructive elements, special production process, and new, sturdy case, provide excellent reliability and continuity of service. The device is sized for
- Application Type: General Application Relay
- Features: Built-in Heat Sink
- Input (Pick-up) Voltage Range: 400 to 600 volts
- Input Current Range: 25 to 55 amps
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Supplier: Allied Electronics, Inc.
Description: Solid State Relays, 63 A Current Input,24-265 Vrms Input Range, with Screw Captive Wire Clamp Terminals Built-in varistor Semiconductor contactors with integrated heatsink.AC operating frequency range 45 to 65 Hz, rated insulation voltage ?4000 Vrms
- Maximum Switching Current: 50 amps
- Operating Temperature: -4 to 158 F
- Type: Electrical Contactor
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Dielectric Constant: 3.39
- Features: Electronics / Semiconductors
- Material Form: Grease / Gel
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Supplier: Ohmite Manufacturing Co.
Description: The Ohmite CP4 series Liquid Coldplates are designed for Ohmite heatsinkable type resistors, such as TAP600, TAP800, TA1K0, TA2K0, and various SOT-227 resistor packages. The CP4 series also provides maximum heat removal for SCRs, rectifiers, diodes, thyristors, and other high-power
- Device: Cold Plate
- Height: 19.05 mm
- Length: 114 mm
- Material: Aluminum, Copper
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Supplier: Allied Electronics, Inc.
Description: Heat Transfer Compound, 400 V/MIL Dielectric Strength, 2.3 Specific Gravity Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high
- Density / Specific Gravity (@15.6°C, 60°F): 2.3 specific gravity
- Dielectric Strength: 1.57E7 V/m
- Operating / Use Temperature: 392 F
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Supplier: Allied Electronics, Inc.
Description: Heat Transfer Compound, 350 V/MIL Dielectric Strength, 2.5 Specific Gravity Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high
- Dielectric Strength: 350 kV/in
- Material Type: Grease / Paste
- Thermal Conductivity: 0.6570 W/m-K
- Use Temperature: 392 F
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Supplier: Protavic America, Inc.
Description: Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm°K thermal performance with supporting laser flash data. Room temperature cure.
- Features: Electronics / Semiconductors, Electrical Power / HV
- Material Form: Adhesive, Composite, Polymer (Plastic / Elastomer)
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Supplier: MacDermid Alpha Electronics Solutions
Description: Silver-filled Electrically Conductive Film Product Overview STAYSTIK 591 thermoplastic adhesive film is designed for use in a variety of electronic applications, and is characterized by excellent bonding at low process temperatures. Its properties make it exceptional for heat sink
- Industry: Semiconductors / IC Packaging
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Supplier: Wacker Chemical Corp.
Description: /mK Two-part, RT curing Constant properties from –50 °C to +180 °C Low stress, soft and tacky D4-D8 < 350ppm Low abrasive Application Interface material for heat sink applications for the electronics industry
- Dielectric Strength: 8.00E6
- Features: Electronics / Semiconductors
- Material Form: Potting Compound
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Supplier: Vincotech (Germany) GmbH
Description: Three-phase Rectifier High inrush current capability Single screw heat sink mounting Ultra-compact design Thermo-mechanical push-and-pull force relief Solder pin
- Configuration: Other / Specialty Configuration
- Output Current: 28 amps
- Output Voltage: 1600 volts
- Technology: Rectifier
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5150 Blue is a one component, high performance, non-curable, thermally conductive gap filler designed to dissipate heat from electronics to a heat sink providing a reliable cooling solution for a wide variety of substrates. It is reworkable, easy to dispense, has
- Cure Type / Technology: Single Component System
- Dielectric Strength: 262 kV/in
- Features: Leveling / Filling Compound, Thermal / Heat Conductive
- Industry: Automotive, Electronics, Semiconductors / IC Packaging
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Supplier: CARLO GAVAZZI Automation Components
Description: alarm, opens in the event of a system or power semiconductor fault. A load current setpint has to be TEACHed to the SSR either locally by the TEACH button on the front of the device or remotely through the provided terminal. This product is available either with integrated heatsink (RGC1S
- Application Type: General Application Relay
- Dropout Voltage: 1 volts
- Features: Built-in Heat Sink, Reverse Protection, Visual Indicator
- Input (Pick-up) Voltage Range: 3.8 volts
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derivative of our material branded as Pyroid® HT Pyrolytic Graphite material that offers heat spreaders and sink thermal conductivity up to 4 times (1700 W/m°K) that of copper at only a quarter of the weight. This “ diamond like” conduction without the “diamond” (read more)
Browse Heat Sinks Datasheets for MINTEQ® International Inc, Pyrogenics Group -
Aluminum Nitride is a material that has heat resistance, high thermal conductivity, dielectricity, piezoelectricity, low thermal expansion, and so on. Because of those properties, this material is often used for heat sinks, heaters, substrates, and so on. For example, we machine it into a part (read more)
Browse CNC Machining Services Datasheets for Top Seiko Co., Ltd. -
.3 — NXP Semiconductors (Qty: 1) $5.69 — Eight-layer conventional FR4/HF (Qty: 1) $3.64 — Heat sink (Qty: 1) $3.31 — Small fan (Qty: 1) $3.30 — Fakra Wi-Fi/BT (Qty: 1) $3.10 — 32-bit ARM Cortex-M4F Automotive MCU — Infineon (Qty: 1) (read more)
Browse Product Development Services Datasheets for TechInsights Inc. -
Thermal Management Solution for State-of-the-Art Electronics With heat issues limiting power device performance and growth, we have developed a derivative of our material branded as Pyroid® HT Pyrolytic Graphite material that offers heat spreaders and sink thermal (read more)
Browse Carbon, Graphite, and Diamond Materials Datasheets for MINTEQ® International Inc, Pyrogenics Group -
drives (VFD), wind power generators and power converters, solar inverters, uninterruptable power supplies (UPS), transformers, heat sinks, fan coils, telecom racks and other industrial equipment; in air handling units and fan filter units (FFU); and in railway, marine, military and avionics equipment (read more)
Browse Electronic Cooling Fans Datasheets for Rosenberg USA -
test setup Portable Versatile as an active heat sink or thermal cycler Plate surface sized to match bell jar and collar Cryogenic or Compressor-based refrigeration The inTEST Thermal family includes three temperature-related corporations: Temptronic (read more)
Browse Thermal Platforms and Thermal Plates Datasheets for inTEST Thermal Solutions -
conventional FR4 (Qty: 1) $2.03 — Small passive capacitor (Qty: 507) $1.96 — Heat sink #2 (Qty: 1) $1.65 — Heat sink #1 (Qty: 1) $1.20 — Oscillator (Qty: 2) (read more)
Browse Product Development Services Datasheets for TechInsights Inc. -
— Nvidia (Qty: 1) $107.47 — Mirror Mess pro (Qty: 4) $46.26 — 14 layer buildup FR4/HF (Qty: 1) $45.45 — Liquid coding enclosure (Qty: 1) $34.95 — 128 GB 3D TLC NAND flash with memory controller — Micron (Qty: 4) $31.32 — Heat sink (Qty: 1) (read more)
Browse Product Development Services Datasheets for TechInsights Inc. -
electronic thermal management applications, including lids, heat heat sinks. Pyrogenics has an AS-9100, CNC equipped machine shop and access to laser machining to fabricate complex shapes, critical dimensions and hole patterns. We also offer a (read more)
Browse Carbon, Graphite, and Diamond Materials Datasheets for MINTEQ® International Inc, Pyrogenics Group -
voltage ratings spanning 7.5Vdc to 450Vdc. The larger case sizes are typically rated for several amps (RMS). Ripple current ratings can be significantly enhanced by adding one or more heat sinks to their flat sides. Unlike conventional electrolytics that have a rolled cover, MLPS covers are (read more)
Browse Aluminum Electrolytic Capacitors Datasheets for New Yorker Electronics Co., Inc.
Conduct Research Top
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Basic Training - Heat Sink (.pdf)
A heat sink gives waste energy a place to go. A properly sized heat sink maintains the semiconductor junction temperature at or below the max. allowable temperature.
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Market Trend Of Thin Film Ceramic Substrates
) or three-dimensional are considered thin-film ceramic substrates. They can be manufactured from a variety of materials, including Silicon Nitride, Aluminum Nitride, Beryllium Oxide, and Alumina. Because of thin-film ceramics' ability to transfer heat, electronics can use them as heat sinks.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
added a flexible multicore processing technology and new runtime optimizations to the latest release of PrimeTime static timing analysis tool. Heat sinks claim unparalleled cooling power Flared-pin-fin heat sinks from Cool Innovations provide an innovative alternative for natural convection
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A 120 °C Ambient Temperature Forced Air-Cooled Normally-off SiC JFET Automotive Inverter System
D. Design of Power Semiconductor Heat Sinks .
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Impact of Power Density Maximization on Efficiency of DC–DC Converter Systems
These losses, the ambient temperature, and the maximum junc- tion temperatures of the semiconductor devices are used for cal- culating the volume of the semiconductor heat sink including the fan based on the cooling system performance index (CSPI), which is defined …
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Impact of power density maximization on efficiency of dc-dc converter systems
These losses, the ambient temperature and the maximum junction temperatures of the semiconductor devices are used for calculating the volume of the semiconductor heat sink including the fan based on the CSPI (Cooling System Performance Index), which is defined by .
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Solid-State Power Conversion Handbook
The packaging orientation of printed circuit boards and semiconductor heat sinks within a cabinet or enclosure should minimize restrictions in the direction of air flow.
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PWM Converter Power Density Barriers
This is caused by the relatively small share of the transformer volume on the overall system volume and the volume of the semiconductor heat sink increasing with switching frequency.
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Design of a 5-kW, 1-U, 10-kW/dm^3 Resonant DC–DC Converter for Telecom Applications
These losses, the ambient temperature, and the maximum junction temperatures of the semiconductor devices are used for calcu- lating the volume of the semiconductor heat sink including the fan based on the cooling system performance index (CSPI) (in .
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Design of a 5kW, 1U, 10kW/ltr. resonant DC-DC converter for telecom applications
temperature and the maximum junction temperatures of the semiconductor devices are used for calculating the volume of the semiconductor heat sink including the fan based on the CSPI (Cooling System Performance Index), which is defined by .
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Cooling Concepts for High Power Density Magnetic Devices
Since the power loss of the transformer usually is much smaller than the losses in the semiconductors the temperature of the cooling air for the semiconductors heat sink is only slightly increased compared to ambient temperature.
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Revising the goals and means for the base-to-air cooling stage for semiconductor heat-removal-experiments and their results
The study dealt with an experimental investigation of semiconductor heat sinks performance characteristics.
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Electrodynamic equations for heterogeneous media and structures on the length scales of their constituents
Multi-variant Opti- mization in Semiconductor Heat Sink Design, Proc. 35th ASME Natl.