Products & Services
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Supplier: JST Manufacturing, Inc.
Description: JST's Single Wafer Etching and Stripping System utilizes an automated chemical spray process on a single wafer. The system includes oscillating spray nozzles, adjustable wafer speed (RPM) and precision adjustment of the distance between the nozzles and the surface of the wafer. It
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Supplier: JST Manufacturing, Inc.
Description: JST offers affordable semi-automated systems in both rotary and linear transfer designs. Rotary Transfer stations can accomodate single or dual rotary arms. JST's robot uses DC servo motors for efficient transfers with high reliability. This servomotor technology provides precise position
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Supplier: Technic, Inc.
Description: Vertical processing is widely acknowledged as the preferred method for achieving optimum side-to-side and edge-to-edge uniformity. Technic’s MP200CS is an advanced roll-to-roll wet processing system that offers a variety of key benefits for today’s flexible printed circuits, metal
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Supplier: Technic, Inc.
Description: Technic has long been pioneer in the ongoing development of printed circuit board wet processing equipment and chemistry. Our ongoing commitment to application research and in-house product development has enabled us to continuously offer our customers the most advanced technology available
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Supplier: Terra Universal, Inc.
Description: Terra’s comprehensive range of constant-temperature baths, etching baths, dump risers, and other processing equipment is ideally suited for the high-purity requirements of the semiconductor industry. Microprocessor controls ensure the integrity of your operations.
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Supplier: HORIBA Instruments, Inc.
Description: The CS-137 is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use BHF solution to etch silicon oxide and remove particles from the wafer surface. The CS-137 continually monitors each
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Supplier: Terra Universal, Inc.
Description: Ideal for etching, stripping and cleaning Ultra-pure, 99.995% contaminant-free processing vessel is ideal for critical chemistries Externally bonded 5-sided circuit heating element provides efficient, even heating for improved process yields Redundant safety
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Supplier: Terra Universal, Inc.
Description: Ideal for etching, stripping and cleaning Seamless quartz vessel is 99.995% contaminant-free Externally bonded 5-sided circuit heating element provides efficient, even heating for improved process yields Redundant safety features minimize potential damage caused
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Supplier: Terra Universal, Inc.
Description: Precisely controlled low- or high-temperature processing (when used with RCe recirculating module) Natural polypropylene tank is ideal for etching, stripping, and developing with HF, KOH, CrO, and other chemistries (PVDF also available) Also functions as a stand
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Supplier: Hitachi High Technologies America, Inc.
Description: Conductor Etch System M-8000 Series is utilized for hard mask and silicon etching for 32nm and beyond. Hitachi High-Tech developed new process flows, such as double patterning and new material etch processes such as high-k dielectric/metal gate through JDP (Joint Development Program) with
- Applications: Etching - Plasma / Wet
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Hitachi High Technologies America, Inc.
Description: Next generation memories such as FeRAM (Ferroelectric Random Access Memory), ReRAM (Resistance Random Access Memory) and MRAM (Magnetoresistive Random Access Memory) require etching of novel non-volatile materials. However, by-product adhesion inside of etch chamber causes significant
- Applications: Etching - Plasma / Wet
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Hitachi High Technologies America, Inc.
Description: support these next-generation processes. The 9000 platform incorporates HHT’s new microwave ECR(Electron Cyclotron Resonance) plasma etching chamber that is proven in high volume manufacturing usage.
- Applications: Etching - Plasma / Wet
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Hitachi High Technologies America, Inc.
Description: Magnetically Coupled Plasma) etch system provides superior performance in profile control as well as in higher etching rate and selectivity compared to conventional ion-milling processes. Applicable wafer diameter 150mm, 200mm
- Applications: Etching - Plasma / Wet
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Advanced Energy Industries, Inc.
Description: Litmas is an all-in-one remote plasma source combining the power supply, LitmasMatch™ matching network, and plasma chamber into one compact chassis. Small-footprint point-of-use abatement solution Highly reliable, effective abatement with minimum utilities usage Lower cost of ownership than
- Applications: Semiconductor Wafers, Etching - Plasma / Wet, Photolithography / Patterning
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Hiden Analytical
Description: The ESPion advanced Langmuir probe for rapid, reliable and accurate plasma diagnostics for industry and academia.
- Applications: Etching - Plasma / Wet, Other
- Form Factor: Controller, Wafer Probing System
- Measurement Capability: Deposition Rate
- Mounting / Loading: In-situ / System Mounted
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Supplier: Hiden Analytical
Description: The Hiden Plasma Workstation, an integrated RF-ICP reactor / plasma analyser system for all you plasma process studies.
- Applications: Etching - Plasma / Wet, Optical Components
- Form Factor: Monitor / Instrument, Controller
- Measurement Capability: Deposition Rate
- Mounting / Loading: In-situ / System Mounted
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Supplier: AirClean Systems
Description: AirClean® Systems’ wet scrubber system is a wet contact scrubber that is suitable for water soluble gases. Each scrubber is constructed from thermoplastics that are resistant to the gases being scrubbed. Scrubber Features: Direct mounting to fume
- Orientation: Vertical
- Pollutants Scrubbed: Acid
- Process Type: Wet
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Supplier: Tronics Microsystems
Description: MEMS Foundry Services Doing business with Tronics Tronics will take on your MEMS project and bring it to production, whether it is a mature product or still a concept requiring design support from us. Our goal is to establish reliable supply chains for your MEMS products. We have strong experience
- Capabilities: Dry Etching (Plasma / RIE), Inspection / Testing, Metallization - Electroplating, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Screen Printing, Wafer Bonding, Wet / Chemical Etching
- Location: Europe Only
- Materials: Silicon, Quartz, SOI, Specialty / Other
- Services: Design / Engineering, Prototyping, Production, R & D / Development
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Supplier: Hiden Analytical
Description: The Hiden EQP is a combined Mass / Energy analyser for the analysis of positive AND negative ions, neutrals, and radicals from plasma processes.
- Applications: Etching - Plasma / Wet, Optical Components
- Form Factor: Monitor / Instrument, Controller
- Measurement Capability: Deposition Rate, Endpoint Detection / Plasma Diagnostics
- Mounting / Loading: In-situ / System Mounted
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Supplier: Universal Semiconductor, Inc.
Description: No Description Provided
- Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Dielectric / CVD Thin Film, Dry Etching (Plasma / RIE), Inspection / Testing, LIGA, Metallization - Electroplating, Metallization - PVD Thin Film, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Wafer Bonding,
- Location: North America, United States Only, Southwest US Only
- Materials: Silicon, Ceramic, Compound Semiconductor, Glass, Metal / Nickel, Quartz, Polymer / Organic, SOI
- Services: Design / Engineering, Prototyping, Pilot / Scale-Up, Production, R & D / Development, Specialty / Other
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Supplier: Integrated Sensing Systems, Inc.
Description: No Description Provided
- Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Dielectric / CVD Thin Film, Dry Etching (Plasma / RIE), Inspection / Testing, Metallization - Electroplating, Metallization - PVD Thin Film, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Screen Printing, Wafer
- Location: North America, United States Only, Midwest US Only
- Materials: Silicon, Compound Semiconductor, Glass, Quartz, SOI
- Services: Design / Engineering, Prototyping, Pilot / Scale-Up, Production, R & D / Development, Specialty / Other
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Supplier: Schmalz Inc.
Description: Wafer gripper for extreme fast, reliable, precise and gentle handling of wet wafers in wet bench applications Handling of wafers after etching and cleaning processes Loading and unloading of conveyor belts Fully or partially automated production of silicon wafers with maximum
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Supplier: Schmalz Inc.
Description: Wafer gripper for extreme fast, reliable, precise and gentle handling of wet wafers in wet bench applications Handling of wafers after etching and cleaning processes Loading and unloading of conveyor belts Fully or partially automated production of silicon wafers with maximum
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Supplier: ASTM International
Description: -sodium dichromate, sodium metasilicate, and hydrochloric-sulfuri c-dichromate acid solutions; and vigorous scouring with wet cloth and commercial household cleaner may be used. Same mechanical methods as that employed in stainless steel and chemical etching by nitric-phosphoric acid
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Supplier: PSI Extrusions
Description: finishes (brushing, polishing, etc.) Clear chromate finish (Mil-C-5541) Gold chromate finish (Mil-C-5541) Etching Satin (Type II) Off-Site Finishing Services Bright Dip Wet Painting Film coating
- Additional Services / Processes: New / OEM Parts, On-site / Field (Large Structures)
- Cleaning / Parts Washing: Degreasing
- Coating Process: Chemical Finish / Conversion, Painting, Powder Coating, Screen Printing / Selective Coating
- Finishing / Surface Treatment: Mass Finishing (Tumbling / Vibratory)
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Supplier: Process Sensing Technologies USA
Description: of its measurements is guaranteed. Features: Precision measurement from 0.1 to 2000ppmV Fast response in both dry to wet and wet to dry transitions Simple, low cost, on-site maintenance with long service intervals Dryer can be replaced by the
- Features: Self Calibration
- Instrument Type: Analyzer
- Measurement Type: Trace
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Supplier: Plansee SE
Description: susceptibility to particle formation throughout the sputtering process. One-step Mo/Cu wet etching. In electrode layers, copper is mostly used in combination with a molybdenum adhesion promotion layer/diffusion barrier. To structure the Mo-Cu multilayers, we have worked together with
- Type: Sputtering Target
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Supplier: HORIBA Instruments, Inc.
Description: The CS-153N is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use HF/HNO3 solution to etch silicon oxide and remove particles from the wafer surface. The CS-153N continually monitors
- Display Type: Digital Display
- Electrical Output: Analog Current Output, Switch / Alarm Relay Output
- Measures Conductivity / Dissolved Solids: Yes
- Mounting / Environment: In-Situ / Field
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Supplier: HORIBA Instruments, Inc.
Description: The CS-153 is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use FPM solution to etch silicon oxide and remove particles from the wafer surface. The CS-153 continually monitors each
- Display Type: Digital Display
- Electrical Output: Analog Current Output, Switch / Alarm Relay Output
- Measures Conductivity / Dissolved Solids: Yes
- Mounting / Environment: In-Situ / Field
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Supplier: Boyd
Description: , shaping Robotic laser & spot welding Deburring, graining, polishing, sandblasting, hairline, auto degreasing or cleaning, laser etching for precise finishing needs Cleanroom manufacturing Class 100 to Class 100K, ultrasonic cleaning Levelling with CMM (Coordinate
- Additional Manufacturing Capabilities: Drilling / Tapping, Heat Treating / Stress Relieving, Painting / Powder Coating, Tool Making, CNC Machining, Welding
- Materials: Ferrous Metals, Nonferrous Metals, Other
- Regional Preference: North America, Europe Only, East Asia / Pacific Only, Oceania Only
- Stamping Capabilities: Progressive Dies
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Supplier: ASTM International
Description: , or by coils. While the material is properly magnetized, the magnetic particles may be applied by either the dry method, wet method, or fluorescent method. The parts shall also be sufficiently demagnetized after inspection so that residual or leakage fields will not interfere with future
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Supplier: ASTM International
Description: mind. 1.2.2 Intentional etching or conductive coating of the surface are considered modifications of the gas-wetted surface and are not covered by this test method. 1.2.3 This test method does not cover steels that have an oxide layer too thick to permit tunneling under the test
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Supplier: ASTM International
Description: .2.2 Intentional etching or conductive coating of the surface are considered modifications of the gas-wetted surface and are not covered by this test method. 1.2.3 This test method does not cover steels that have an oxide layer too thick to permit tunneling under the test conditions
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and chemical resistance. Along with excellent barrier protection, our solid film lubricants also provide minimal particulate contamination lubrication, where traditional wet lubricants cannot be used. Our coatings are used on a wide range of semiconductor hardware and equipment such as CMP tools (read more)
Browse Datasheets for Everlube Products -
: Wet spray Powder Electrostatic wet Commonly used primers include: Two pack epoxy formulations Zinc rich primers Chromate and phosphate systems Selecting the optimum priming solution depends on the substrate and (read more)
Browse Surface Preparation Services Datasheets for Omnikote Ltd. -
particle contamination. Its low erosion rate reduces process tool cost of ownership. Perlast G65HP is ideal for use in wet and dry semiconductor processes including: Plasma Etching Ash/Resist Stripping LPCVD, HDPCVD, PECVD, SACVD, ALD Cleaning PVD Perlast G65HP can be molded into O-rings, seals, NW/KF fittings and custom components to suit any application. (read more)
Browse Rubber and Elastomer Molding Services Datasheets for Precision Polymer Engineering Ltd. -
resistance to aggressive oxygen, chlorine and fluorine-based plasmas. Together with outstanding thermal and mechanical resistance qualities and similarly low particle generation to Perlast® G65HP, Perlast® G67G is ideally suited to wet and dry etching, stripping, cleaning and PVD processes. (read more)
Browse O-rings Datasheets for Precision Polymer Engineering Ltd. -
are key to reducing process contamination, significantly increasing yield and reducing operational downtime. Perlast® Helios G7HA has been developed for use in wet and dry semiconductor processes, including etching, stripping and cleaning. The new material is expected to be moulded into (read more)
Browse O-rings Datasheets for Precision Polymer Engineering Ltd. -
Al2O3 ceramic substrate, in the N2 protection and temperature range of 1065 ? -1083 ?. Pure copper in the molten state do not need to wet Al2O3, it needs to bring in oxygen elements in the reaction process, Cu-Cu2O eutectic liquid generated at high temperature has a good wettability on Al2O3 (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd.
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MSilica Nanoparticles Treated by Cold Atmospheric-Pressure Plasmas Improve the Dielectric Performance of Organic-Inorganic Nanocomposites
to the. stamping process [46], was removed by 5 min of wet etching. using TMAH 25% at 701C. To facilitate the stamping. Figure 1. 2-D top. view schematic. of the microdevices. All dimensions. are in mm. Figure 2. log(g) surface plot of (A) device 1, (B) device 2, (C). device 3, (D) device 4, at an applied
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Fabrication of GaAs Devices
Fabrication of GaAs Devices. Focusing on all aspects of GaAs processing that deal with GaAs free surfaces and interfaces between GaAs and metal contacts or dielectrics, this detailed text offers pragmatic advice on cleaning and passivation, wet and dry etching and photolithography.
More Information Top
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MEMS Materials and Processes Handbook
Complementing the coverage of dry etching, wet etching processes for MEMS micromachining are covered in Chapter 8 with a comprehensive recipe and reference list included in this chapter to aid in finding etch rates and etch selectivities for a wide range of …
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Introduction to Microfabrication 2nd Edition
Etching, Wet Etching , Plasma Etching (RIE), .
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Encyclopedia of Microfluidics and Nanofluidics
Different etchants used in anisotropic wet etching have specific etch rates for each crystallographic plane in the material being removed.
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MEMS/NEMS
Wet etching processes can be made selective by doping the silicon heavily with boron creating what is called a p+ etch stop.
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Fabrication of GaAs Devices
4 Wet etching and photolithography of GaAs and related alloys 117 .
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Encyclopedia of Microfluidics and Nanofluidics
Different etchants used in anisotropic wet etching have specific etch rates for each crystal- lographic plane in the material being removed.
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Introduction to Semiconductor Manufacturing Technology
Wet Etch Process ..............................................................................................
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Handbook for Cleaning for Semiconductor Manufacturing: Fundamentals and Applications Complete Document
The Chemistry of Wet Etching .
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Bonding in Microsystem Technology
Fast wet etching ..........................................................
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Handbook of Porous Silicon
Micromachining and wet etching Etching (wet .