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  • Description: No Description Provided

    • Services: Design / Engineering, Prototyping, Pilot / Scale-Up, Production, R & D / Development, Specialty / Other
    • Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Dielectric / CVD Thin Film, Dry Etching (Plasma / RIE), Inspection / Testing, Metallization - Electroplating, Metallization - PVD Thin Film, Photolithography, Wet / Chemical Etching, Other
    • Materials: Silicon, Ceramic, Compound Semiconductor, Glass, Quartz, SOI, Specialty / Other
    • Location: North America, United States Only, Northeast US Only

  • Description: Design and Manufacturing Services One size does not fit all. Whether it is design assistance, custom products or smaller volumes, clients need flexible solutions instead of rigid excuses. In addition to our standard products, we offer an array of design and manufacturing services. As the leader

    • Services: Design / Engineering, Prototyping, Pilot / Scale-Up, Production, R & D / Development, Specialty / Other
    • Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Inspection / Testing, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Wafer Bonding, Wet / Chemical Etching, Other
    • Materials: Silicon, Ceramic, Glass, Metal / Nickel, Polymer / Organic, Specialty / Other
    • Location: North America, United States Only, Southwest US Only

  • Description: Terra’s comprehensive range of constant-temperature baths, etching baths, dump risers, and other processing equipment is ideally suited for the high-purity requirements of the semiconductor industry. Microprocessor controls ensure the integrity of your operations.

  • Description: In-situ spectroscopic ellipsometer for real-time thin film monitoring The UVISEL in-situ spectroscopic ellipsometer can be easily mounted on process chambers (PECVD, MOCVD, sputter, evaporation, ALD, MBE) for the real-time control of thin film deposition or etch processes. The UVISEL in-situ

    • Form Factor: Monitor / Instrument
    • Mounting / Loading: Floor Mounted / Stand-alone
    • Applications: Semiconductor Wafers, Electroplated Films, Etching - Plasma / Wet
    • Maximum Wafer / Part Size: 0.0394 to 0.1181 inch

  • Description: Using MTII’s exclusive Push/Pull capacitance probe technology, each PV-1000 module provides up to three pairs of probes for measurement of maximum, minimum and average thickness, as well as total thickness variation (TTV) and wafer bow. For applications requiring additional thickness channels,

    • Form Factor: Controller, Sensor / Sensing Element
    • Mounting / Loading: In-line, Floor Mounted / Stand-alone, Manual Loading
    • Applications: Etching - Plasma / Wet
    • Measurement Capability: Deposition Rate, Dopant Level / Resistivity, Endpoint Detection / Plasma Diagnostics, Roughness / Waviness, Shape / Flatness, Structure / Residual Stress, Thickness - Film / Layer, Thickness - Wafer / Disc (TTV)

  • Description: instrumentation to the electronics and solar power industries. The ABB Wet Process Analyzer (WPA) provides a fast, cost effective, space efficient and reliable means of monitoring the composition of various solutions used in cleaning, etching, and stripping baths. Provides real time characterization

    • Spectrometer Type: Fourier Transform (FTIR)
    • Display Options: Video Display

  • Description: The ESPion advanced Langmuir probe for rapid, reliable and accurate plasma diagnostics for industry and academia.

    • Form Factor: Controller, Wafer Probing System
    • Mounting / Loading: In-situ / System Mounted
    • Applications: Etching - Plasma / Wet, Other
    • Measurement Capability: Deposition Rate

  • Description: The i3 Integral SensorWafer is a thin (1.15mm), accurate (±0.5°C) instrumented wafer designed to provide critical wet wafer processing temperature data for emerging technology nodes. As specifications for wet cleans become increasingly tighter, the i3 Integral enables you to get the most

    • Form Factor: Sensor / Sensing Element
    • Mounting / Loading: In-situ / System Mounted
    • Applications: Etching - Plasma / Wet
    • Measurement Capability: Other

  • Description: instrumentation to the electronics and solar power industries. The ABB Wet Process Analyzer (WPA) provides a fast, cost effective, space efficient and reliable means of monitoring the composition of various solutions used in cleaning, etching, and stripping baths. Provides real time characterization

  • Supplier: MEI, LLC

    Description: capabilities into a system that is tailored for your specific process needs. Ultrasonic and Megasonic tanks and baths are available. MEI Evolution Auto Wet Bench Systems are suitable for a wide variety of cleaning, etching and stripping applications, including all substrate types used in semiconductor

  • Description: ) Gold chromate finish (Mil-C-5541) Etching Satin (Type II) Off-Site Finishing Services Bright Dip Wet Painting Film coating

    • Coating Process: Chemical Finish / Conversion, Painting, Powder Coating, Screen Printing / Selective Coating
    • Functional / Performance: Conductive, Corrosion / Rust Preventive
    • Materials: Aluminum
    • Finishing / Surface Treatment: Mass Finishing (Tumbling / Vibratory)

  • Description: Description: Medium weight StanSolv AF-492 flocked lined Green Nitrile chemical resistant gloves offer embossed raised-diamond grip pattern, which is excellent for handling wet or oily parts. Flock lining offers added comfort and absorbs perspiration during extended wear. Unique carboxylated MAPA

    • Clothing Type: Gloves
    • Material: Nitrile

  • Description: DuPont WP™ Wash Primer is a non-sanding primer designed to give exceptional adhesion and corrosion resistance over bare metal surfaces. This product eliminates the need to chemically treat metal surfaces before priming.

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Conduct Research Top

  • MICRO: Wet Surface tech
    potential enabling processes for next-generation devices. This article discusses a single-wafer wet-etch technology for selective etching There are two conventional ways to etch Si films. Wet etching is accomplished by immersing wafers in a mixture of H O heated to 150 -180 C. Water in solution
  • MICRO: Wet Surface Technologies
    of such processing for foundries and pilot lines, for example, include increased product mix flexibility and faster time to first silicon. To date, few facilities have adopted single-wafer tools for wet cleaning and etch steps, primarily owing to their lack of a demonstrated advantage over batch-processing systems
  • Automation comes to wet-processing stations
    highperformance servo and stepper control, as well as room for up to 50 I/O. It has a built-in 10/100 Base T Ethernet port to query via a secure XML interface. Flexible processors helped Amerimade Technology Inc. automate wet-processing stations for etching, cleaning, stripping, and plating
  • Effects of Ohmic Metal on Electrochemical Etching of GaAs in pHEMT Manufacturing
    in the compound semiconductor industry. It is. believed that electrochemical etching, which has been studied. extensively by researchers, is responsible for the phenomenon. Solutions usually focus around the chemistries in the various. wet processing steps. In our recent experiments, we have found
  • INDUSTRY NEWS
    on a vibration-isolated floor. The cleanroom features eight bays individually dedicated to a specific process function. In addition to an Eaton NV-1002 high-energy ion implanter, the facility's equipment list features tools for optical lithography, wet etching, plasma dry etching, thermal processing, ECR chemical
  • Evaluating the performance of dual PTFE filter assemblies in hot-acid etch baths
    Recirculating hot-acid baths are widely used in the semiconductor industry for wet-etching, stripping, and cleaning silicon wafers. To meet the stringent cleanliness requirements of the industry, particulate contamination generated during processing is removed from the baths by recirculating
  • Fabrication of GaAs Devices
    Fabrication of GaAs Devices. Focusing on all aspects of GaAs processing that deal with GaAs free surfaces and interfaces between GaAs and metal contacts or dielectrics, this detailed text offers pragmatic advice on cleaning and passivation, wet and dry etching and photolithography.
  • MICRO: Surface Conditioning/Chemistries - Song (January 2001)
    in photoresist removal after dry etching or ion implantation. Most photoresist removal procedures consist of a combination of plasma-induced dry ashing and wet chemical treatments. Problems associated with the dry ashing process include incomplete resist removal and undesired by-products caused

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