Single Supply Analog-to-Digital Converter (ADC) Chips

12-Bit 3MSPS Micropower SAR ADC SOT23-6 [See More]

• Interface Type: Serial; SPI; Serial (spi)
• Pins: 6

• Package Type: Sot-23
• Resolution: 12

Manufacturer: Texas Instruments. Win Source Part Number: 077771-ADS5520IPAPR. Packaging: Tape and Reel. Operating Temp Range: -40C to 85C. Mounting: Surface Mount. Pin Count: 64. Operating Temperature Classification: Industrial. Rad Hardened: No. Package Type: HTQFP EP. Number of Elements: 1. Input... [See More]

• Packing Method: Tape Reel; Tape and Reel
• Dissipation: 627000

• Pins: 64
• Features: Single-Supply

32-Bit 38kSPS ADC with PGA, Ref. TSSOP28 [See More]

• Interface Type: Serial; SPI; Serial (spi)
• Pins: 28

• Package Type: SSOP; Tssop
• Resolution: 32

24-Bit ADC for Bridge Sensors SOIC16 [See More]

• Interface Type: Serial; SPI; Serial (spi)
• Pins: 16

• Package Type: SOIC; Soic
• Resolution: 24

ADC 13-Bit Differential 100ksps SPI DIP8 [See More]

• Interface Type: Serial; SPI; Serial (spi)
• Pins: 8

• Package Type: DIP; Pdip
• Resolution: 13

ADC 13-Bit Differential 100ksps SPI SO8 [See More]

• Interface Type: Serial; SPI; Serial (spi)
• Pins: 8

• Package Type: SOIC; Soic
• Resolution: 13

4-Ch 12-Bit ADC 2.7V SPI TSSOP14 [See More]

• Interface Type: Serial; SPI; Serial (spi)
• Pins: 14

• Package Type: SSOP; Tssop
• Resolution: 12

13-Bit Differ. A/D Converter SPI MSOP8 [See More]

• Interface Type: Serial; SPI; Serial (spi)
• Pins: 8

• Package Type: Msop
• Resolution: 13

ADC 12-Bit 4-ch Mux Intel. Power Control [See More]

• Interface Type: Serial; SPI; Serial (spi)
• Pins: 16

• Package Type: Wqfn
• Resolution: 12

Low-Power SPI 12-Bit ADC Temp. VSSOP10 [See More]

• Interface Type: Serial; SPI; Serial (spi)
• Pins: 10

• Package Type: SSOP; Vssop
• Resolution: 12

Quad Channel Single ADC Delta-Sigma 3.3k [See More]

• Package Type: X2qfn
• Resolution: 12

• Pins: 10
• Features: Single-Supply

12-bit ADC, SPI, single channel [See More]

• Interface Type: Serial; SPI; Serial (spi)
• Pins: 8

• Package Type: Msop
• Resolution: 12

10-bit ADC, SPI, 8-channel [See More]

• Interface Type: Serial; SPI; Serial (spi)
• Pins: 16

• Package Type: SOIC; Soic
• Resolution: 10

ADC 12-Bit Dual SAR 100ksps SPI PDIP8 [See More]

• Interface Type: Serial; SPI; Serial (spi)
• Pins: 8

• Package Type: DIP; Pdip
• Resolution: 12

8 BIT DUAL RESOLUTION CMOS ADC [See More]

• Interface Type: Parallel; Parallel
• Pins: 28

• Package Type: SSOP; Ssop
• Resolution: 8

Microchip Technology, MCP33121-10-E/MS [See More]

• Package Type: Msop
• Resolution: 14

• Pins: 10
• Features: Single-Supply

Microchip Technology, MCP33131-05-E/MS [See More]

• Package Type: Msop
• Resolution: 16

• Pins: 10
• Features: Single-Supply

Microchip Technology, MCP33131-10-E/MS [See More]

• Package Type: Msop
• Resolution: 16

• Pins: 10
• Features: Single-Supply

CMOS High-Speed 8-Bit A/D Converter [See More]

• Package Type: DIP; Dip
• Resolution: 8

• Pins: 20
• Features: Single-Supply

16-Bit, +5V, 200ksps ADC 10uA Shutdown [See More]

• Interface Type: SPI; Microwire; Micro wire, qspi, spi
• Pins: 10

• Package Type: μmax
• Resolution: 16

1-WIRE THRMOCPLE TO DIG CONV K TYPE [See More]

• Interface Type: 1-wire
• Pins: 10

• Package Type: Tdfn-ep
• Resolution: 14

MAX1237EUA+,A to D Converters - ADC [See More]

• Package Type: μmax
• Resolution: 12

• Pins: 8
• Features: Single-Supply

MAX1231BEEG+,A to D Converters - ADC [See More]

• Interface Type: Serial; SPI; Microwire; 3-wire spi, micro wire, qspi, serial
• Pins: 24

• Package Type: Qsop
• Resolution: 12

MAX146BCAP+,A to D Converters - ADC [See More]

• Package Type: SSOP; Ssop
• Resolution: 12

• Pins: 20
• Features: Single-Supply

MAX197BEWI+,A to D Converters - ADC [See More]

• Interface Type: Parallel; Parallel
• Pins: 28

• Package Type: SOIC; Soic
• Resolution: 12

MAX135CPI+,A to D Converters - ADC [See More]

• Interface Type: Parallel; Parallel
• Pins: 28

• Package Type: DIP; Dip
• Resolution: 15

MECL III was introduced in 1968. It replaced MECL I and MECL II with hgher power and faster speeds. Typical I ns edge speeds and propagation delays, along with greater than 500 mhz flip-flop toggle rates, make MECL III useful for high-speed test and communications equipment. [See More]

• Package Type: DIP (optional feature); Lead Flat Pack
• Pins: 14 to 16

• Screening Level: Commercial; Industrial
• Operating Temperature: -65 to 125

1-Channel Single ADC SAR 100ksps 18-bit Serial 16-Pin TSSOP Tube [See More]

• Interface Type: SPI; SPI
• Packing Method: Tube; Tube

• Package Type: SSOP; 16-TSSOP (0.173, 4.40mm Width)
• Pins: 16

ADC Single 15Msps 8-bit Parallel 24-Pin TSSOP T/R [See More]

• Interface Type: Serial; Parallel; SPI; Parallel
• Packing Method: Tape Reel; Tape & Reel (TR)

• Package Type: SSOP; 24-TSSOP (0.173, 4.40mm Width)
• Pins: 24

ADC Single SAR 1Msps 8-bit Serial 8-Pin VSSOP T/R [See More]

• Interface Type: SPI; SPI
• Packing Method: Tape Reel; Tape & Reel (TR)

• Package Type: 8-VFSOP (0.091, 2.30mm Width)
• Resolution: 1

ADC Single SAR 31ksps 8-bit Serial 8-Pin PDIP Rail [See More]

• Interface Type: Serial; SPI; SPI
• Packing Method: Tube; Tube

• Package Type: DIP; 8-DIP (0.300, 7.62mm)
• Resolution: 1

ADC Single SAR 500ksps 8-bit Serial 6-Pin SOT-23 T/R [See More]

• Interface Type: Serial; SPI; SPI, DSP
• Packing Method: Tape Reel; Tape & Reel (TR)

• Package Type: SOT-23-6
• Pins: 6

Analog to Digital Converters - ADC 8-Bit 1.25 MSPS Single Ch. [See More]

• Interface Type: Parallel; Parallel
• Dissipation: 43

• Resolution: 1
• Operating Temperature: -40 to 85

Octal Channel Single ADC SAR 20ksps 8-bit Serial 20-Pin TSSOP T/R [See More]

• Interface Type: SPI; SPI
• Packing Method: Tape Reel; Tape & Reel (TR)

• Package Type: SSOP; 20-TSSOP (0.173, 4.40mm Width)
• Pins: 20

Octal Channel Single ADC SAR 400ksps 12-bit Serial 20-Pin SOIC Tube [See More]

• Interface Type: SPI; SPI
• Packing Method: Tube; Tube

• Package Type: SOIC; 20-SOIC (0.295, 7.50mm Width)
• Pins: 20

Quad Channel Single ADC SAR 20ksps 8-bit Serial 14-Pin SOIC T/R [See More]

• Interface Type: SPI; SPI
• Packing Method: Tape Reel; Tape & Reel (TR)

• Package Type: SOIC; 14-SOIC (0.154, 3.90mm Width)
• Pins: 14

Single ADC Pipelined 105Msps 11-bit Parallel 52-Pin HTQFP EP Tray [See More]

• Interface Type: Parallel; LVDS - Parallel
• Packing Method: Tape Reel; Tray

• Package Type: QFP; 52-TQFP Exposed Pad
• Pins: 52

Single ADC SAR 200ksps 12-bit Serial 20-Pin LCCC Tube [See More]

• Interface Type: SPI; SPI
• Resolution: 1.5

• Pins: 20
• DNL: 0.0293

Single Channel Single ADC Pipelined 160Msps 14-bit Serial 40-Pin VQFN EP T/R [See More]

• Interface Type: JESD204A
• Packing Method: Tape Reel; Tape & Reel (TR)

• Package Type: 40-VFQFN Exposed Pad
• Pins: 40

Single Channel Single ADC SAR 400ksps 18-bit Serial 10-Pin VSON EP T/R [See More]

• Interface Type: SPI; SPI
• Packing Method: Tape Reel; Tape & Reel (TR)

• Package Type: 10-VFDFN Exposed Pad
• Pins: 10