Laser Drilling / Perforating Laser Processing Equipment
from CRYSTECH, Inc.
KDP Pockels Cell: Based on KDP crystal (isomorphic to KDP with deuterium substitution enhancing electro-optical properties). It has high electro-optical coefficients, wide transparent band (0.2 - 2.1 μm), high damage threshold and good crystal uniformity for large-aperture and... [See More]
- Laser Operation: Welding; Micromachining; Drilling; Cutting; Soldering / Brazing; Marking; Kiss Cutting / Scribing
- Options / Components: Laser Optics or Beam Delivery Components; Galvanometer or Switching Mirror; Polarizer; Q-Switching
- Type: Component or Subsystem
- Laser Type: Pulsed
from CRYSTECH, Inc.
RTP Q-Switch: Based on RTP crystal (isomorphous to KTP), it features large electro-optical coefficient, high damage threshold, wide transparent range (0.35 - 3.5 μm), non-deliquescence, low loss, and suits high repetition frequency. No gray tracks under intense laser. Two crystals are 90°... [See More]
- Laser Operation: Welding; Micromachining; Drilling; Cutting; Soldering / Brazing; Marking; Kiss Cutting / Scribing
- Options / Components: Laser Optics or Beam Delivery Components; Galvanometer or Switching Mirror; Polarizer; Q-Switching
- Type: Component or Subsystem
- Laser Type: Pulsed
from LPKF Laser & Electronics North America
New Design. The LPKF ProtoLaser S4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. Integration of the control PC is optional. Cost-Effectiveness Built In. The ProtoLaser S4 is a valuable tool in the electronics lab. It can quickly and... [See More]
- Laser Operation: Drilling; Cutting
- Options / Components: Cabinet; Laser Optics or Beam Delivery Components; Laser head or focusing module
- Type: Complete or Turnkey System
- Workpiece Material: Electronics / Wafers
from Nutfield Technology
Nutfield Technology ’s D-20 is a fully digital, encoder-based XY-axis scan head that is ideal for applications requiring the ultimate in accuracy and stability. High resolution encoders provide accuracy and insensitivity to environmental factors for a wide range of applications. Nutfield... [See More]
- Laser Operation: Welding; Micromachining; Drilling; Kiss Cutting / Scribing
- Options / Components: Laser Optics or Beam Delivery Components; Laser head or focusing module
- Type: Component or Subsystem
- Workpiece Material: Conductive / Metals; Plastic, Wood, Composites or Other Non-Conductive Materials; Materials Processing, Surface Treatment, Laser Ablasion
from BLM GROUP USA Corporation
The high speed laser tube cutting cell, multi-axis laser system and robotic module can be configured to process a wide range of 3D formed tubes ( bent, end formed, hydro formed etc) and complete tubular space frames assemblies. This new process supersedes a lot of previous traditional operations... [See More]
- Laser Operation: 3D Laser Processing or 5-Axis Machining; Tube; Drilling; Cutting
- Options / Components: Motorized Head, Guidance Module or Robotic Arm; Cabinet; Monitoring System or Sensors; Laser Optics or Beam Delivery Components; Laser head or focusing module; Air or gas cooling
- Type: Complete or Turnkey System
- Workpiece Material: Conductive / Metals
from Trotec Laser, Inc.
R Series lasers were designed and developed by Trotec laser using Austrian engineering standards. The R400 features an ergonomic 40.5" x 24.8" working area, CO2 laser power up to 100W, sophisticated and intuitive workflow software, and the highest safety measures - providing the industry with a... [See More]
- Laser Operation: Drilling; Cutting; Marking; Kiss Cutting / Scribing
- Options / Components: Motorized Head, Guidance Module or Robotic Arm; Gantry Tables or Conventional Orthogonal systems; Rotary Table / Rotary Axis (optional feature); Cabinet; Monitoring System or Sensors; Fume Extractors (optional feature); Laser Optics or Beam Delivery Components; Laser head or focusing module; BeamPipe; PointingDiode; Air or gas cooling
- Type: Complete or Turnkey System
- Workpiece Material: Conductive / Metals; Plastic, Wood, Composites or Other Non-Conductive Materials; Electronics / Wafers; Medical; Acrylic Foils & films Glass Wood Paper Leather Stone Textiles
from LPKF Laser & Electronics North America
The LPKF ProtoLaser 3D was developed specifically for prototyping three-dimensional circuitry. System design is based on the proven ProtoLaser concept used for printed circuit board prototyping. The work platform has dimensions of 500 mm x 500 mm and the system features z-axis travel of 200 mm. An... [See More]
- Laser Operation: 3D Laser Processing or 5-Axis Machining; Drilling; Cutting
- Options / Components: Cabinet; Laser Optics or Beam Delivery Components; Laser head or focusing module
- Type: Complete or Turnkey System
- Workpiece Material: Electronics / Wafers
from Trotec Laser, Inc.
The R Series, designed by Trotec, is a safe, and affordable laser cutter. Available with a 51.1" x 35.4" working area and CO2 power options up to 100W, the R500 laser cutter features a sophisticated and intuitive workflow that provides new businesses with a reliable, cost-effective, and locally... [See More]
- Laser Operation: Drilling; Cutting; Marking; Kiss Cutting / Scribing
- Options / Components: Motorized Head, Guidance Module or Robotic Arm; Gantry Tables or Conventional Orthogonal systems; Cabinet; Monitoring System or Sensors; Fume Extractors (optional feature); Laser Optics or Beam Delivery Components; Laser head or focusing module; BeamPipe; PointingDiode; Air or gas cooling
- Type: Complete or Turnkey System
- Workpiece Material: Conductive / Metals; Plastic, Wood, Composites or Other Non-Conductive Materials; Electronics / Wafers; Medical; Acrylic Foils & films Glass Wood Paper Leather Stone Textiles
from LPKF Laser & Electronics North America
Universal Usability. The LPKF ProtoLaser U4 uses a UV laser source. Many material groups are easy to process at these wavelengths – without additional tools, masks, or films. The LPKF ProtoLaser U4 builds on the success of its predecessor and expands its range of applications with targeted... [See More]
- Laser Operation: Drilling; Cutting
- Options / Components: Cabinet; Laser Optics or Beam Delivery Components; Laser head or focusing module
- Type: Complete or Turnkey System
- Workpiece Material: Electronics / Wafers
from Trotec Laser, Inc.
The Rayjet 300 is a midsize laser engraver with a powerful CO2 laser source. It allows you to engrave, mark, and cut a variety of materials and thicknesses with ease. The Rayjet 300 offers a working area of 29" x 17" in a 60W or 80W model. The Rayjet laser line, invented by Trotec, offers safe,... [See More]
- Laser Operation: Drilling; Cutting; Marking; Kiss Cutting / Scribing
- Options / Components: Motorized Head, Guidance Module or Robotic Arm; Gantry Tables or Conventional Orthogonal systems; Rotary Table / Rotary Axis (optional feature); Cabinet; Monitoring System or Sensors; Fume Extractors (optional feature); Laser Optics or Beam Delivery Components; Laser head or focusing module; BeamPipe; PointingDiode; Air or gas cooling
- Type: Complete or Turnkey System
- Workpiece Material: Conductive / Metals; Plastic, Wood, Composites or Other Non-Conductive Materials; Electronics / Wafers; Medical; Acrylic Foils & films Glass Wood Paper Leather Stone Textiles