Electric Power Casting Resins
from Master Bond, Inc.
Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
- Chemical System: Epoxy
- Type: Thermally cured
- Use Temperature: -60 to 250
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Industry: Electrical Power or High Voltage; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally cured
- Filler: Mineral or Inorganic
from Ellsworth Adhesives
Resin Designs 040109-1 HV Silicone Casting is a two component, room temperature curing system that is used for sealing and casting applications. It is flexible, solvent free, high viscosity, and has excellent electrical and mechanical properties. 1:1 mix ratio by volume. 50 mL Mixpac. [See More]
- Industry: Electrical Power or High Voltage
- Use Temperature: -76 to 257
- Chemical System: Silicone
- Viscosity: 20000 to 300000
from Master Bond, Inc.
Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing and casting. This new two component epoxy resin compound which cures... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
- Chemical System: Epoxy
- Type: Thermally cured; Optical
- Use Temperature: -60 to 250
from Master Bond, Inc.
Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
- Chemical System: Epoxy
- Type: Thermally cured
- Use Temperature: -60 to 250
from Master Bond, Inc.
Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Military; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
- Chemical System: Polyurethane; Epoxy
- Type: Thermally cured
- Features: Electrically Conductive Compound
from Master Bond, Inc.
Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system offers a uniquely attractive combination of application and performance properties including... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
- Chemical System: Epoxy
- Type: Thermally cured; Optical
- Use Temperature: -60 to 250
from Master Bond, Inc.
Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive and does... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
- Chemical System: Epoxy
- Type: Thermally cured; Optical
- Features: Thermal Insulation
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Industry: Electronics; Electrical Power or High Voltage; Optoelectronics or Photonics
- Chemical System: Epoxy
- Type: Thermally cured; Optical
- Filler: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1)... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
- Chemical System: Epoxy
- Type: Thermally cured; Optical
- Use Temperature: -452 to 250
from Master Bond, Inc.
Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
- Chemical System: Epoxy
- Type: Thermally cured; Optical
- Features: Thermal Insulation
from Master Bond, Inc.
Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
- Chemical System: Epoxy
- Type: Thermally cured; Optical
- Filler: Mineral or Inorganic
from Master Bond, Inc.
Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]
- Industry: Electronics; Electrical Power or High Voltage; Optoelectronics or Photonics
- Chemical System: Epoxy
- Type: Thermally cured
- Filler: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP30HV is a low viscosity, two component epoxy system for high performance bonding, sealing, coating and casting. It is formulated to cure at room temperature or more rapidly at elevated temperatures. It has an easy to use, non-critical 4 to 1 mix ratio by weight. This... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Sanitary; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
- Chemical System: Epoxy
- Type: Thermally cured; Optical
- Use Temperature: -60 to 300
from Master Bond, Inc.
Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
- Chemical System: Epoxy
- Type: Thermally cured
- Features: Electrically Conductive Compound
from Master Bond, Inc.
Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The optimum... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Optoelectronics or Photonics; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
- Chemical System: Epoxy
- Type: Thermally cured
- Filler: Metal or MIM
from Master Bond, Inc.
Key Features. Free flowing viscosity. High temperature resistance. Exceptionally long open time. Passes NASA low outgassing. Product Description. Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system has a... [See More]
- Industry: Aerospace; Electronics; Electrical Power or High Voltage; Optoelectronics or Photonics; OEM or Industrial; Semiconductors or IC Packaging
- Chemical System: Epoxy
- Type: Thermally cured; Optical
- Features: Thermally Conductive
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Industry: Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
- Chemical System: Epoxy
- Type: Thermally cured
- Filler: Metal or MIM; Silver