Thermally Conductive Casting Resins
from Master Bond, Inc.
Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The optimum... [See More]
- Features: Thermally Conductive; Electrically Conductive Compound
- Chemical System: Epoxy
- Type: Thermally cured
- Filler: Metal or MIM
from Master Bond, Inc.
Key Features. Free flowing viscosity. High temperature resistance. Exceptionally long open time. Passes NASA low outgassing. Product Description. Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system has a... [See More]
- Features: Thermally Conductive
- Chemical System: Epoxy
- Type: Thermally cured; Optical
- Industry: Aerospace; Electronics; Electrical Power or High Voltage; Optoelectronics or Photonics; OEM or Industrial; Semiconductors or IC Packaging
from Epoxies Etc...
70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat resistance than most commercially... [See More]
- Features: Thermally Conductive
- Chemical System: Epoxy
- Type: Thermally cured
- Filler: Metal or MIM
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Features: Thermally Conductive; Electrically Conductive Compound
- Chemical System: Epoxy
- Type: Thermally cured
- Filler: Metal or MIM; Silver
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Features: Flame Retardant; UL; Thermally Conductive
- Filler: Unfilled
- Type: Thermally cured
- Industry: Electronics
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Features: Flame Retardant; UL; Thermally Conductive
- Filler: Unfilled
- Type: Thermally cured
- Industry: Electronics