Electronics Specialty Polymers and Resins
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Industry: Electronics; Electrical Power or High Voltage; Optoelectronics or Photonics
- Chemical System: Epoxy; Cycloaliphatic, 100% Solids
- Material Type: Thermally cured; CastingResin; Optical
- Filler: Unfilled
from Master Bond, Inc.
Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]
- Industry: Electronics; Electrical Power or High Voltage; Optoelectronics or Photonics
- Chemical System: Epoxy; 100% Solids
- Material Type: Thermally cured; CastingResin
- Filler: Unfilled
from Rieke Metals, Inc.
Poly(3-butylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 80% and 90% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Filler: Unfilled
- Material Type: Thermoplastic
- Form / Shape: Liquid
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Chemical System: Polyolefin
- Material Type: Thermoplastic; MoldingCompound
- Form / Shape: Pellets
from Toray Industries (America), Inc.
Toray's high-performance engineering plastic TORELINA ® resin boasts excellent heat resistance, flame retardancy and chemical resistance, physical strength, and its superb fluidity leads to outstanding dimensional precision. These characteristics make it ideal for a wide range of applications:... [See More]
- Industry: Automotive; Electronics
- Chemical System: Polyphenyline Sulfide
- Material Type: Thermoplastic; MoldingCompound
- Features: Flame Retardant
from MCG - Performance Polymers Division
BIO BASE ENGINEERING POLYMER. DURABIO ™ combines most of the advantageous properties of Polycarbonate (PC) and those of the Polymethacrylate (PMMA), with additionally the bio origin of raw material. KEY FEATURES. Excellent optical and mechanical properties. Superb light transmission and... [See More]
- Industry: Automotive; Electronics
- Chemical System: Isosorbide
- Material Type: Elastomer; FilmGrade; Optical
from Ensinger North America
PPE GF30 is a special 30% glass fibre reinforced product which is manufactured by Ensinger under the trade name TECANYL GF30. In comparison to unfilled TECANYL, the glass filled modification demonstrates optimized properties in a number of areas. It has a high rigidity, high mechanical strength,... [See More]
- Industry: Automotive; Electronics; Electrical Power or High Voltage
- Chemical System: Polyphenylene Ether (PPE)
- Material Type: Thermoplastic
- Filler: Glass or FRP
from 3M Advanced Materials Division
In 1969, astronauts boarded the Apollo 11 spacecraft wearing boots containing 3M ™ Dyneon ™ Fluoroelastomers. Today, these synthetic elastomeric materials are used in some of the toughest environments on earth. From hot-running automotive engines to harsh chemicals of semiconductor... [See More]
- Industry: Aerospace; Automotive; Electronics; Energy Conversion (Battery / Fuel Cell); Electrical Power or High Voltage; Marine; Sanitary; Military; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Oil &Gas Exploration
- Chemical System: Polypropylene; Polyamide; Fluoropolymer; Tertrafluoroethylene, Hexafluoropropylene
- Material Type: Elastomer; Thermoplastic; Thermally cured; ExtrusionGrade; FilmGrade; MoldingCompound; Optical
- Filler: Unfilled
from Rieke Metals, Inc.
Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Filler: Unfilled
- Material Type: Thermoplastic
- Form / Shape: Liquid
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Chemical System: Polyolefin
- Material Type: Thermoplastic; MoldingCompound
- Form / Shape: Pellets
from Ensinger North America
#8203;Offering a level of performance above polysulfones, Ensinger's industrial grade TECASON P has increased temperature, impact and chemical resistance properties, as well as excellent resistance to repeated steam sterilization (autoclave) cycles. Main Features: High strength. High thermal and... [See More]
- Industry: Electronics; Sanitary
- Chemical System: Polyphenylsulfone
- Material Type: Thermoplastic
- Deflection Temperature: 405
from Rieke Metals, Inc.
Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Filler: Unfilled
- Material Type: Thermoplastic
- Form / Shape: Liquid
from Rieke Metals, Inc.
Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Filler: Unfilled
- Material Type: Thermoplastic
- Form / Shape: Liquid
from Rieke Metals, Inc.
Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]
- Industry: Electronics; Semiconductors or IC Packaging
- Filler: Unfilled
- Material Type: Thermoplastic
- Form / Shape: Liquid