2 Part Silicone Potting Compounds

Description: TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a

• Chemical / Polymer System Type: Silicone
• Compound Type: Thermal Compound / Thermally Conductive
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound

Description: Techsil® RTV27909 is a clear and colorless, solvent free two-component silicone gel. It is a easily pourable and is kit matched in a handy 1:1 mixing ratio; 1kg Part A & 1kg Part B. RTV 27909 cures very quickly at room temperature by an addition reaction to a tacky

• Chemical / Polymer System Type: Silicone
• Form / Function: Encapsulant / Potting Compound
• Rubber Based / Elastomeric: Yes

Description: Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of

• Chemical / Polymer System Type: Silicone
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound
• Rubber Based / Elastomeric: Yes

Description: RTV627 is a two part silicone rubber compound from Momentive Performance Materials designed for potting and encapsulation applications. It is especially favoured where flammability is of concern. Supplied in a matched kit which is designed for use at a 1:1 ratio by weight

• Chemical / Polymer System Type: Silicone
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound
• Rubber Based / Elastomeric: Yes

Description: CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and

• Cure Type / Technology: Two Component System, Specialty / Other
• Dielectric Strength: 353 kV/in
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound

Description: CHT's QSil 12 is a 2-part, condensation cure, transparent, low viscosity, liquid silicone elastomer which cures at room temperature. QSil 12 is primarily intended for electronic and lighting potting applications. This material is typically mixed at a ratio of 100:5. Once

• Cure Type / Technology: Two Component System, Specialty / Other
• Dielectric Strength: 315 kV/in
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Elongation: 35 %

Description: thickness) Self-leveling, low viscosity for potting Good adhesion to plastics Low hardness (30 Shore A) Gels within 5 minutes Grey mixed color (Part A: Black; Part B: Off-White) High elongation (100%) Download LOCTITE SI 5640 Silicone Potting Compound Sell

• Features: Leveling / Filling Compound

Description: Alkoxy silicone liquid for potting that will cure at room temperature or at elevated temperatures. LOCTITE® SI 5620 is a clear, 2-part, alkoxy silicone liquid for potting that will cure at room temperature or at elevated temperatures. After mixing, the

• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
• Thermal Conductivity: 0.7600 W/m-K
• Use Temperature: 40 to 450 F
• Viscosity: 200 cP

Description: KSC12028 is a silicone RTV gel developed for electronic applications requiring a re-penetrable self-sealing, silicone gel product. KSC12028 is a two part, solvent free, 1:1 mix ratio silicone that when mixed cures in 12 hours at room temperature. Alternatively, KSC12028

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Single Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound

Description: CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow

• Compound Type: Thermal Compound / Thermally Conductive
• Cure Type / Technology: Two Component System, Specialty / Other
• Dielectric Strength: 600 kV/in
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

Description: CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat

• Compound Type: Thermal Compound / Thermally Conductive
• Cure Type / Technology: Two Component System, Specialty / Other
• Dielectric Strength: 460 kV/in
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

Description: Transparent, 2-part silicone potting compound offering quick curing performance. Highly flexible and resistant to thermal and mechanical shock. LOCTITE® SI 5623 is a transparent, 2-part, alkoxy silicone, potting compound liquid

• Thermal Conductivity: 0.6440 W/m-K
• Viscosity: 700 cP

Description: POTTING COMPOUND SILICONE 2 PART

• Form / Function: Encapsulant / Potting Compound

Description: WACKER SilGel® 611 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a soft silicone gel. WACKER SilGel® 611 A/B is a white colored modification of WACKER SilGel® 612 with higher hardness and reactivity. Special features

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound

Description: WACKER SilGel® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features two-part, 1 : 1 mixing ratio low viscosity rapid heat cure very low hardness (silicone

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
• Flame Retardant / UL 94V-0 Rated: Yes

Description: WACKER SILGEL® 613 is a pourable, addition-curing, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features two-part, 10 : 1 mixing ratio very low viscosity rapid curing at room temperature with

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
• Flexible / Dampening: Yes

Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Single Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Die Bonding Adhesive / Compound

Description: WACKER SILGEL® 613 is a pourable, addition-curing, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features two-part, 10 : 1 mixing ratio very low viscosity rapid curing at room temperature with

• Chemical / Polymer System Type: Silicone
• Industry: Electronics, Energy Conversion (Battery/Fuel Cell/PV)

Description: HumiSeal® 2C51 Silicone High Strength Encapsulating Gel is a two component, fast-curing silicone encapsulating gel for printed circuit board applications. It is also used as a conformal coating for electronics. A room temperature cure, low viscosity and UV tracer allows for ease

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Two Component System
• Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound
• Viscosity: 250 cP

Description: HumiSeal® 2C51 Silicone High Strength Encapsulating Gel is a two component, fast-curing silicone encapsulating gel for printed circuit board applications. It is also used as a conformal coating for electronics. A room temperature cure, low viscosity and UV tracer allows for ease

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Two Component System
• Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound
• Viscosity: 500 cP

Description: used to improve moisture resistance. Two-part systems consist of a powder and liquid binder system. Materials set at room temperature in several hours, then cured at ~250 °F in 2-4 hours. Sil-Bond™, a silicone-ceramic potting compound for optimal moisture

• Chemical / Polymer System Type: Silicone, Ceramic / Inorganic Cement
• Composition: Filled
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound

Description: MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU•in/ft²•hr•°F [1.01-1.30 W/(m•K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics as

• Chemical / Polymer System Type: Silicone
• Composition: Unfilled
• Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: RTV-2 for protective potting, coating and encapsulation Properties Viscosity 150000 Hardness Sha 60 Description RTV Elastomer - Two components addition cure for encapsulation/protec tion of electronical systems and production of moulding parts Good heat stability in confined

• Chemical / Polymer System Type: Silicone
• Coeff. of Thermal Expansion (CTE): 5 µin/in-F
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: Dow DOWSIL™ EE-1010 Low Viscosity Encapsulant is a two component, 1:1 mix ratio silicone elastomer for the electronics industry. Benefits include a room temperature cure that can be accelerated with heat, and a long working time. Part A and Part B are different colors for easy

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Two Component System
• Dielectric Strength: 450 kV/in
• Form / Function: Encapsulant / Potting Compound

Description: AS1621 is a 1-part RTV, self-levelling silicone adhesive specially formulated for applications requiring a combination of good adhesion and excellent physical and low corrosive properties. Product Material = Silicone Package Type = Cartridge Package Size = 310 ml Cure Time = 24

• Form / Function: Specialty / Other, Encapsulant / Potting Compound
• Thermal Conductivity: 0.2000 W/m-K
• Use Temperature: -58 to 446 F

Description: RTV-2 for protective potting, coating and encapsulation Properties Viscosity 150000 Hardness Sha 60 Description RTV Elastomer - Two components addition cure for encapsulation/protec tion of electronical systems and production of moulding parts Good heat stability in confined

• Chemical / Polymer System Type: Silicone
• Compound Type: Liquid
• Dielectric Constant: 2.9
• Dielectric Strength: 457 kV/in

Description: the use of a primer. Product Material = Silicone Package Type = Cartridge Package Size = 310 ml Cure Time = 1 h Hardness = 33 Shore A Thermal Conductivity = 0.2W/mK Colour = Translucent Maximum Operating Temperature = +220°C Minimum Operating Temperature = -50°C Operating Temperature

• Form / Function: Specialty / Other, Encapsulant / Potting Compound
• Thermal Conductivity: 0.2000 W/m-K
• Use Temperature: -58 to 428 F

Description: (cross-linker) Gelest®OE 42: 1.42 Refractive Index 2-Part Silicone Elastomer Gelest OE 42 is a flexible, optically clear molding, encapsulation, and coating compound with a RI of 1.42. This RTV kit offers improved adhesion to substrates compared to . The low viscosity of

• Chemical / Polymer System Type: Polystyrene
• Elongation: 90 to 150 %
• Features: Optical Grade
• Index of Refraction: 1.42

Description: Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable it to be cast in larger sections up to 2-3 inches thick. Super Gel 9

• Chemical / Polymer System Type: Polyurethane (PU, PUR), Silicone, Epoxy (EP)
• Composition: Unfilled
• Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System

Description: Packaging Under Nitrogen 2-Part 1:1 Kit 1 kg kit – contains 500 g part A (base), 500 g part B (cross-linker) 6 kg kit – contains 3000 g part A (base), 3000 g part B (cross-linker) Gelest®OE41: 1.41 Refractive Index 2-Part Silicone

• Chemical / Polymer System Type: Polystyrene
• Elongation: 140 to 200 %
• Features: Optical Grade
• Index of Refraction: 1.41

Description: (cross-linker) Gelest®OE 43: 1.43 Refractive Index 2-Part Silicone Elastomer Gelest OE 43 is a flexible, optically clear molding, encapsulation, and coating compound with a RI of 1.43. This RTV kit offers improved adhesion to substrates compared to PP2-OE41. The

• Chemical / Polymer System Type: Polystyrene
• Elongation: 75 to 100 %
• Features: Optical Grade
• Index of Refraction: 1.43

Description: -linker) Gelest®OE 50: 1.50 Refractive Index Silicone Elastomer Gelest OE 50 is a flexible, optically clear molding, encapsulation, and coating compound with a RI of 1.49. The higher refractive index of PP2-OE50 can act as cladding in optical waveguide applications. The low

• Chemical / Polymer System Type: Polystyrene
• Features: Optical Grade
• Index of Refraction: 1.49
• Material Type / Grade: Elastomer / Rubber

Description: - Plastic and rubber parts. Ideal for 1-10,000 parts. Filtration - Adhesives and potting compounds for gasketing, spiral filters, stacked filters, hollow fiber filters, and many more. Tooling - Molds, dies, fixtures, foundry patterns and core boxes. Electrical Insulation

• Application: Adhesive / Silicone, Coatings / Paint
• Container Size: 22712 to 45425 cc
• Container Type: Can / Pail / Drum
• Dispensing Type: Fill ("Potting")

Description: 2-part, fast-cure, low viscosity, self-leveling silicone potting compound designed for applications requiring a fast cure. LOCTITE® SI 5611 is a grey, 2-part, fast-cure, low viscosity, self-leveling silicone potting compound

Description: 1.1 The specification covers a two-part flowable space grade room temperature vulcanizing (RTV) silicone rubber adhesive or compound. The material is specifically designed for applications requiring extreme low temperature, low outgassing and minimal volatile condensibles under

Description: Hi-temp, prevents dusting of fibrous insulation materials

• Chemical / Polymer System Type: Silicone
• Composition: Filled
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking

Description: Exceptional electrical, moisture & chemical resistance

• Chemical / Polymer System Type: Silicone
• Composition: Filled
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking

Description: KSC2040 is a thermally conductive silicone RTV adhesive rubber developed for heat sink applications. KSC2040 is a 1-part silicone that when applied to the substrate enables adhesion to parts and heat transfer of the bonded assembly within minutes. When cured, the

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Single Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Die Bonding Adhesive / Compound

Description: KS130 is a fast curing silicone RTV adhesive rubber developed for the bonding of "difficult to bond" plastics like Tygon™.KS130 is a one part silicone that when applied to the substrate enables handling of the bonded assembly within an hour. When cured, the elastomer resists

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Single Component System
• Form / Function: Die Bonding Adhesive / Compound
• Industry Applications: OEM / Industrial

Description: Non-corrosive, single component silicone coating & encapsulating compound

• Chemical / Polymer System Type: Silicone
• Composition: Unfilled
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Single Component System