Encapsulant

Description: OLED Encapsulant LG Chem developed the OLED Encapsulant that is superior to the existing packing material. LG Chem developed the face seal OLED Encapsulant whose performance is superior to the existing packing materials, improving the lifespan of an OLED display element

• Features: Encapsulant / Potting Compound

Description: LOCTITE® 3141 Hysol Epoxy Resin, High Temperature is one part of a two part epoxy system to be used with a variety of LOCTITE Hysol hardeners. The system is formulated for high temperature potting and encapsulating applications.

• Chemical System: Epoxy (EP)

Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include

• Viscosity: 8,000 to 10,000 cP
• Use Temperature: -55 to 200 F
• Thermal Conductivity: 1.3 W/m-K
• Coeff. of Thermal Expansion (CTE): 111.11111111111111 µin/in-F

Description: Product Overview ALPHA HiTech EN21-4210F has a high hardness property, making it ideal for assembling components that require excellent reinforcement strength. The ALPHA HiTech EN21-4210 is a non-reworkable encapsulant product option. Product Features Excellent Adhesion Strength Imparts

• Water Absorption: 1 %
• Industry: Electronics, Semiconductors / IC Packaging

Description: 20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100 exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. This system is

• Viscosity: 1,600 cP
• Use Temperature: -67 to 266 F
• Coeff. of Thermal Expansion (CTE): 83.33333333333333 µin/in-F
• Tensile Strength (Break): 1,600 psi

Description: PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and bond

• Viscosity: 1,500 cP
• Use Temperature: -55 to 125 F
• Dielectric Constant (Relative Permittivity): 4.41 to 4.63
• Substrate Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic

Description: SOLAR ASCE™ is the brand name of our cross-linking polyolefin (PO) base encapsulating sheet. Mitsui Chemicals was the pioneer in developing a cross-linking type PO encapsulant and have been in high volume manufacturing for several years. The various properties from our unique material design

• Type: Film / Flexible Substrate
• Materials: Plastic / Polymer, Polyolefin (PE, HDPE, PP)

Description: REENTRY ENCAPSULANT KITS

Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature

• Viscosity: 400 cP
• Thermal Conductivity: 0.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 3,055.5555555555557 µin/in-F
• Dielectric Strength: 635.0000000000014 kV/in

Description: LOCTITE STYCAST ES 4322FC liquid epoxy encapsulant is for protection of semiconductor devices. It is a high flow material which requires a cavity flow control barrier to prevent excessive flow. It is used for the encapsulation of bare chips mounted to plastic substrates and potting of small

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound

Description: CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and 10% Deep Section Catalyst by

• Use Temperature: -65.2 to 500 F
• Thermal Conductivity: 0.31 W/m-K
• Dielectric Strength: 353.06000000000074 kV/in
• Viscosity: 9,000 cP

Description: STANDARD SPECIFICATION FOR IMPLANTABLE EPOXY ELECTRONIC ENCAPSULANTS

Description: Generic Requirements for Re-Enterable Encapsulants

Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid which is

• Viscosity: 3,000 to 3,500 cP
• Thermal Conductivity: 0.42 W/m-K
• Coeff. of Thermal Expansion (CTE): 4.444444444444445 µin/in-F
• Tensile Strength (Break): 333.584730521553 psi

Description: CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low

• Use Temperature: -94 to 482 F
• Thermal Conductivity: 1.17 W/m-K
• Elongation: 30 %
• Tensile Strength (Break): 117.47983987932957 psi

Description: ENCAPSULANT, SILICONE DIELECTRIC GEL

Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a similar range and

• Features: Encapsulating / Potting, Rubber Based / Elastomeric
• Chemical System: Silicone

Description: CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone

• Use Temperature: -67 to 399.2 F
• Thermal Conductivity: 0.88 W/m-K
• Elongation: 55 %
• Tensile Strength (Break): 118.93020827290154 psi

Description: 5203ML HIGH GEL REENTERABLE ENCAPSULANT

Description: 8333ML HIGH GEL REENTERABLE ENCAPSULANT

Description: This specification covers thermoset plastics based on diglycidyl ethers of bisphenol A and amino functional curing agents or amine catalysts for implantable epoxy electronic encapsulants. Encapsulants shall be classified depending on contact with tissues or physiological fluids.

Description: Henkel Loctite STYCAST 2741 Black, formerly Emerson and Cuming, is a two component, room temperature or heat curing, filled epoxy encapsulant that is used for cementing, sealing, and embedding electronic components, plastics, metal, and ceramics. It offers flexibility and crack resistance at

• Viscosity: 20,000 to 40,000 cP
• Thermal Conductivity: 0.33 W/m-K
• Dielectric Strength: 406.40000000000083 kV/in
• Substrate Compatibility: Ceramic / Glass, Metal, Plastic

Description: Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.

• Viscosity: 30,000 to 50,000 cP
• Use Temperature: -76 to 194 F
• Coeff. of Thermal Expansion (CTE): 19,444,444.444444444 to 22,222,222.22222222 µin/in-F
• Tensile Strength (Break): 2,600 to 2,800 psi

Description: 1979ML HIGH GEL REENTERABLE ENCAPSULANT

Description: Dow SYLGARD™ 164 Silicone Elastomer Gray is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, thermal

• Viscosity: 8,925 cP
• Thermal Conductivity: 0.64 W/m-K
• Dielectric Strength: 482.600000000001 kV/in
• Features: Electrical Power / HV, Encapsulating / Potting

Description: IEC 62788-1 2:2016 provides a method and guidelines for measuring the volume resistivity of materials used as encapsulation, edge seals, front-sheets, backsheets, or any other insulating material in a photovoltaic (PV) module. The test is performed on dry, humid or wet preconditioned samples. In

Description: Dow SYLGARD™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. 200 mL Cartridge. This is a Dow

• Viscosity: 8,775 cP
• Thermal Conductivity: 0.62 W/m-K
• Dielectric Strength: 482.600000000001 kV/in
• Features: Electrical Power / HV, Encapsulating / Potting

Description: Dow SYLGARD™ 170 Silicone Elastomer is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, moderate thermal

• Viscosity: 3,400 cP
• Thermal Conductivity: 0.39 W/m-K
• Dielectric Strength: 482.600000000001 kV/in
• Features: Electrical Power / HV, Encapsulating / Potting

Description: WACKER SILGEL® 613 is a pourable, addition-curing, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features two-part, 10 : 1 mixing ratio very low viscosity rapid curing at room temperature with ELASTOSIL® CAT PT-F very low hardness (silicone gel)

• Viscosity: 150 cP
• Index of Refraction: 1.404
• Industry: Automotive, Electrical Power / HV, Electronics, OEM / Industrial, Optical Grade / Material
• Features: Encapsulating / Potting, Flexible / Dampening, Liquid, RTV / Room Temperature Curing, Rubber Based / Elastomeric

Description: IEC 62788-1 2:2016 provides a method and guidelines for measuring the volume resistivity of materials used as encapsulation, edge seals, front-sheets, backsheets, or any other insulating material in a photovoltaic (PV) module. The test is performed on dry, humid or wet preconditioned samples. In

Description: SILICONE, ENCAPSULANT, ROOM TEMPERATURE CURING, FOR SPACE APPLICATIONS

Description: (Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant ) LOCTITE ECCOBOND 933 one component epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimized stress effects on components and wiring during thermal

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound

Description: (Known as HYSOL STYCAST U2535 Polyurethane Encapsulant ) LOCTITE STYCAST U 2535 PTB two component flexible polyurethane encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings.

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound

Description: MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation.

• Applied Thickness / Gap Fill: 1 inch
• Viscosity: 1,000 cP
• Use Temperature: -67 to 392 F
• Dielectric Strength: 500.00000000000006 kV/in

Description: IEC 62788-1-7:2020 is designed as a more rigorous qualification test, using accelerated UV exposure at elevated temperature to determine whether polymeric encapsulants can suffer loss of optical transmittance. IEC 61215-2 already includes a UV preconditioning test (MQT 10), however, the