Pin Grid Array

Description: FEATURES Aries offers a wide number of pin grid array configurations from which to choose Low-insertion-force contacts standard GENERAL SPECIFICATIONS PGM SERIES SOCKET BODY: black UL 94V-0 glass-filled 4/6 Nylon PGG SERIES SOCKET BODY

• Contact / Pin Type: Solder Tail Pins
• Contact Plating: Gold Plating, Nickel Plating, Other
• Contacts Pitch: 2.54 mm
• Current Rating: 3 amps

Description: 29 Series 1 1/4 x 1 1/4 Pin Grid Array Carrier with Clip

• Product Type: IC Socket

Description: Establishes the requirements and interactions necessary for Printed Board Assembly processes for interconnecting high performance/high pin count I/C packages. Included is information on design principles, material selection, board fabrication, assembly technology, testing strategy, and

Description: Rules for the preparation of detail specifications for In-Line and Pin-Grid Array Sockets

Description: Detail Specification Nonmechanically Actuated Flexible Carrier Sockets for Pin Grid Array for Use in Electronic Equipment

Description: Detail Specification for Production Ball Grid Array (BGA) High Pin Count (1089 Pins and Greater) Socket for Use in Electronic Equipment

Description: Accepts wide range of PGA packages from 8 X 8 through 15 X 15 Carrier can be molded from Electro-Static-Dissi pative (ESD) materials Designed to be used with automatic test handlers For other PGA requirements consult factory Molded for high temperature materials for applications up to 150°C For

• Product Type: IC Socket

Description: Blank Detail Specification for Adaptor - Carrier Quad Flat Pack to Pin Grid Array Sockets for Use in Electronic Equipment

Description: PIN GRID ARRAY SOCKET/HEADER

Description: PIN GRID ARRAY SOCKET 180PIN

Description: PIN GRID ARRAY SOCKET

Description: PIN GRID ARRAY SOCKET

Description: devices and transmitting data. The male board mount connector is suitable for passing through a panel or faceplate of the device and the female is perfect for terminating to the cable end. The 40 pin board to board connectors each have a 3X10 array of signal contacts on .100” (2,54 mm)

• Contact Plating: Gold Plating
• Mounting: Through-hole
• Product Type: IC Socket
• RoHS Compliant: Yes

Description: Our PLCC surface mount feet utilize J-leads to attach to the target system's SMT lands. They present an array of gold plated, .05" pitch MGA "mini-grid" pins. There are various part profiles and pin length configurations available.

• Center Spacing: Gold Plating
• Centers Pitch: 1.27 mm
• RoHS Compliant: Yes

Description: Pin grid array sockets with standard sol

• Product Type: IC Socket

Description: Pin grid array sockets with standard sol

• Product Type: IC Socket

Description: Our low insertion force Pin Grid Array (PGA) Sockets and Adapters are available in a variety of RoHS Compliant insulators with hundreds of screw-machined terminal choices. Virtually any PGA footprint can be accommodated, including interstitial patterns, and designs can be

• Contact / Pin Type: Low Profile Pins, Solder Tail Pins
• Contact Plating: Gold Plating, Other
• Contacts Pitch: 2.54 mm
• Features: Machined Pins

Description: 80C196KB - Microcontroller, 16-bit, MCS-96, 68-pin Pin Grid Array (PGA)

• Data Bus: 16 Bit
• IC Package Type: Other
• Life Cycle Stage: Other

Description: These BGA surface mount feet are easily attached to target boards using standard flux and reflow methods. They present an array of gold plated pins, typically our "mini-grid" (.05" pitch MGA) for pluggable connections to parts like probe boards and in-circuit emulator adapters.

• Features: Machined Pins
• Product Type: Package Adapters / Converters

Description: Aavid provides the broadest product line of heat sinks and thermal solutions for cooling integrated circuits such as Field Programmable Grid Arrays (FPGAs) and the surface mount packaging used for integrated circuits like Ball Grid Arrays (BGAs). Choose from a number of

• Device: Active Heat Sink

Description: The Grid-EYE sensors from Panasonic are designed for proximity detection by an IR array sensor. This compact package features and 8 x 8 IR sensor array. Grid-EYE high precision sensors are based on advanced MEMS technology. They utilise a grid of IR sensors to

Description: Omnidirectional heatsinks for Pin Grid Arrays (PGA) which are ideally suited to impingement cooling. These heatsinks provide 20% greater performance than extruded equivalents For Use With = PGA Length = 45.72mm Width = 44.58mm Height = 16.51mm Dimensions = 45.72 x 44.58 x

• Height: 16.51 mm
• Length: 45.72 mm
• Mounting: Clips, Other
• Thermal Resistance: 7.2 °C / W

Description: -distortion (DPD) coupler intended for 802.11ax applications and systems. The LNA and PA disable functions ensure low leakage current in off mode. An integrated logarithmic power detector is included to provide closed-loop power control within the system. The device is provided in a compact,

• Device Type / Applications: Front End
• IC Package Type: LGA, Other

Description: Advanced SEM E modular connector The SMASH connector offers extremely high robustness where signal integrity is required. Based on an aluminum shell with 1, 2 or 3 bays, the SMASH connector can house up to 450 contacts, with up to 150 contacts per bay. The chevron grid pattern (1

• Current Rating: 3 amps
• Gender: Male / Plug, Female / Jack
• Number of Contacts: 132 to 150 #

Description: Adaptics converting Quad-Flat No-Leads packages (QFN) to Pin Grid Array (PGA) format. Pitch = 0.8 mm, 2.54 mm End 1 = 32 Pin Female QFN End 2 = 32 Pin Male PGA End 1 Number of Contacts = 32 End 2 Number of Contacts = 32 End 1 Type = QFN End 2 Type = PGA End 1

• Contacts Pitch: 0.8000 to 2.54 mm
• Mounting: Through-hole
• Product Type: Package Adapters / Converters

Description: Adaptics converting Quad-Flat No-Leads packages (QFN) to Pin Grid Array (PGA) format. Pitch = 0.5 mm, 2.54 mm End 1 = 56 Pin Female QFN End 2 = 56 Pin Male PGA End 1 Number of Contacts = 56 End 2 Number of Contacts = 56 End 1 Type = QFN End 2 Type = PGA End 1

• Product Type: Package Adapters / Converters

Description: allowing simultaneous placement of all the solder preforms needed on connector pins, pin grid arrays (PGAs) and other multiple-pad/pin components. They solve both assembly and product design challenges by allowing users to specify fabrications in the most complex

• Form / Shape: Preform
• Soldering Filler Alloys: Indium (In), Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)

Description: Features Suitable for Pin-Grid Array and standard Ball Grid Array applications Airless Packaging Excellent solderability to all common surface metallizations No-clean residue Can be used for printing, dipping, and pin transfer deposition

• Approvals / Conformance: Other
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: 36 dBm peak. The ADRF5300 incorporates a negative voltage generator (NVG) to operate with a single positive supply of 3.3 V (VDD) applied to the VDD pin. The device employs CMOS- and low voltage transistor to transistor logic (LVTTL)-compatible controls. The ADRF5300 is packaged in a

• Actuator Type: SPDT, Other
• Frequency Range: 24000 to 32000 MHz
• Insertion Loss: 1.1 dB
• Isolation (Port to Port): 38 dB

Description: applications and systems. An integrated logarithmic power detector is included to provide closed-loop power control within the system. The device is housed in a 24-pin 3 x 5 mm Land Grid Array (LGA) package.

• Amplifier Type: Power Amplifier

Description: )-compatible controls. The ADRF5721 is pin compatible with the ADRF5731, the fast switching version, which operates from 100 MHz to 40 GHz. The ADRF5721 RF ports are designed to match a characteristic impedance of 50 Ohm. The ADRF5721 comes in a 16-terminal, 2.5 mm × 2.5 mm, RoHS compliant,

• Frequency Range: 9.00E-6 to 40 GHz
• Insertion Loss: 2 dB
• Number of Bits (for Digital Attenuators): 4
• Package Type: Other

Description: embedded Wafer Level Ball Grid Array (eWLB) package, which can be processed in standard SMT flow. For first evaluation of the BGT24LTR22 radar sensor, we offer the EVAL BGT24LTR22 board, which enables fast testing of the device and fast prototyping. Summary of Features

• Input (Supply) Voltage: 1.5 volts
• Operating Temperature: -40 to 85 C
• RoHS Compliant: Yes

Description: data transfer from the host to the DAC core. A serial peripheral interface (SPI) for device configuration as well as readback of status registers.The AD9739A is manufactured on a 0.18 µm CMOS process and operates from 1.8 V and 3.3 V supplies. It is supplied in a 160-ball chip scale ball grid

• IC Package Type: QFP
• Resolution: 10 bits

Description: power loss by low-voltage inhibit circuitry to prevent writes with voltage out of specification. The MR256A08B is the ideal memory solution for applications that must permanently store and retrieve critical data and programs quickly. The MR256A08BCMA35R is the 48-pin ball grid

• Access Time: 35 ns
• Bits per Word: 8 bits
• Density: 256 kbits
• IC Package Type: BGA

Description: than 20-years. Data is automatically protected on power loss by low-voltage inhibit circuitry to prevent writes with voltage out of specification. The MR256D08B is the ideal memory solution for applications that must permanently store and retrieve critical data and programs quickly. The

• Access Time: 45 ns
• Bits per Word: 8 bits
• Density: 256 kbits
• IC Package Type: BGA