Plasma Etcher

Description: First-of-its-kind design uses microwave oven to generate plasma cleaning medium Safely removes organic and many inorganic contaminants from a wide range of components and substrates Maintains low processing temperatures (25­-200°C controllable) Produces

• Application / Operation: General Cleaning / Surface Prep, Container / Bottle Cleaning, Degreasing, Sterilizing / Disinfecting
• Automation: None - Manual
• Cleaning Process / Operation: Solvent / Vapor Cleaning
• Internal Depth / Height: 3 inch

Description: Windows are chamber lids designed to transmit RF (radio frequency) and microwave energy into the plasma etch chamber while resisting erosion from the harsh plasma etch environment. An effective window has a low loss tangent (high transmittance) across RF and microwave

• Applications: Chemical / Materials Processing
• Material Type: Aluminum Nitride, Alumina / Aluminum Oxide, Carbide Materials, Silicon Carbide, Yttria, Specialty Ceramic
• Shape / Form: Fabricated / Custom Shape

Description: Based on our popular BT-1, it shares the same robust and reliable characteristics while providing yet another example of Plasma Etch surface modification innovation. The large all aluminum chamber accommodates a generously sized circular, rotating active processing surface has the

• Applications & Materials Processed: Research / Surface Analysis, Other
• Automated Loading: Yes
• Coating System Type: Factory / Free Standing
• Gas Control Unit: Yes

Description: Litmas is an all-in-one remote plasma source combining the power supply, LitmasMatch™ matching network, and plasma chamber into one compact chassis. Small-footprint point-of-use abatement solution Highly reliable, effective abatement with minimum utilities usage

• Applications: Specialty / Other
• Substrates / Surfaces: Semiconductors / Wafers
• Technology Type: RF Plasma (ICP)

Description: Litmas is an all-in-one remote plasma source combining the power supply, LitmasMatch™ matching network, and plasma chamber into one compact chassis. Small-footprint point-of-use abatement solution Highly reliable, effective abatement with minimum utilities usage

• Applications: Specialty / Other
• Substrates / Surfaces: Semiconductors / Wafers
• Technology Type: RF Plasma (ICP)

Description: CoorsTek advanced, high-purity ceramic components are built to withstand the extreme environments in plasma etch (or "dry" etch) chambers — including vapor phase chemical etchants, high voltage RF (radio frequency) and microwave plasma, volatile byproducts, and aggressive

• Applications: Chemical / Materials Processing
• Material Type: Aluminum Nitride, Alumina / Aluminum Oxide, Carbide Materials, Silicon Carbide, Yttria, Specialty Ceramic
• Shape / Form: Fabricated / Custom Shape

Description: -purity ceramic components are built to withstand the extreme environments in plasma etch (or "dry" etch) chambers — including vapor phase chemical etchants, high voltage RF (radio frequency) and microwave plasma, volatile byproducts, and aggressive cleaning cycles.

• Applications: Chemical / Materials Processing
• Material Type: Aluminum Nitride, Alumina / Aluminum Oxide, Carbide Materials, Silicon Carbide, Yttria, Specialty Ceramic
• Shape / Form: Fabricated / Custom Shape

Description: The K1050X is a modern, solid-state RF plasma barrel reactor designed to meet the requirements of research and development and small-scale production for a wide and varied range of plasma etching, plasma ashing and plasma cleaning applications. Key Features * Drawer type

• Reactor Design: Other Reactor Design

Description: Ceramic Focus Ring for Plasma Etch Equipment When aluminum alloy is selected as the chamber material of the etcher, it is easy to cause metal particle pollution. Instead, a dense anodic aluminum oxide layer is coated on the aluminum alloy to improve the corrosion resistance of

Description: Next generation devices at 20nm and below require double-patterning, 3D (three-dimensional) structures, and complex, high-precision processes that include protective layer formation and finishing techniques for new materials. Hitachi High-Tech developed the Conductor Etch System 9000 Series

• Applications: Etching - Plasma / Wet
• Mounting / Loading: Floor Mounted / Stand-alone

Description: Conductor Etch System M-600/6000 Series is targeted for deep silicon trench etch of power devices used in mobile systems, home electrical appliances, automobiles, trains, etc. Low temperature etch technology and TM (Time Modulation) bias technology together with the ECR

• Applications: Etching - Plasma / Wet
• Mounting / Loading: Floor Mounted / Stand-alone

Description: Magnetically Coupled Plasma) etch system provides superior performance in profile control as well as in higher etching rate and selectivity compared to conventional ion-milling processes. Applicable wafer diameter 150mm, 200mm

• Applications: Etching - Plasma / Wet
• Mounting / Loading: Floor Mounted / Stand-alone

Description: Built as an extension of our MK-II platform, it offers you the same repeatability, reliability and long life, as well as low maintenance costs. The Reactive Ion Etch (RIE) electrode offers the highest directional plasma effect. Etching with our roll to roll plasma etcher

• Applications & Materials Processed: Research / Surface Analysis, Other
• Gas Control Unit: Yes
• Integral Process Controller: Yes
• Materials Processed (Deposit or Substrate): Metal, Compound Semiconductors / GaAs, Tungsten / Refractory Metal, Other

Description: makers and material / tool suppliers. Hitachi High-Tech's etch system provides superior profile controllability and CD uniformity within wafer with a new microwave ECR (Electron Cyclotron Resonance) plasma etching chamber, high speed wafer temperature control, and high vacuum exhaust

• Applications: Etching - Plasma / Wet
• Mounting / Loading: Floor Mounted / Stand-alone

Description: Our welded aluminum vacuum chamber encloses a generous 500 square inches of active plasma processing surface. Surface modification with Plasma Etch yields increased bond strength and cleanliness of most any surface material.

• Applications & Materials Processed: Research / Surface Analysis, Other
• Coating System Type: Laboratory / Benchtop
• Gas Control Unit: Yes
• Integral Process Controller: Yes

Description: Litmas is an all-in-one remote plasma source combining the power supply, LitmasMatch™ matching network, and plasma chamber into one compact chassis. Small-footprint point-of-use abatement solution Highly reliable, effective abatement with minimum utilities usage

• Oxidizer Type: Other
• Temperature Range: 41 to 104 F

Description: As in all Plasma Etch systems a capacitive parallel plate design is used for the most effective plasma generation. Competitive units with glass/quartz barrel chambers cannot penetrate the vacuum containment vessel and therefore are restricted to inductive coupling using an RF

• Coating System Type: Laboratory / Benchtop
• Features: Integral Process Controller?
• Materials Processed (Deposit or Substrate): Metal, Compound Semiconductors / GaAs, Tungsten / Refractory Metal, Other
• Technology / Process: Plasma Etching / Cleaning

Description: % bandwidth. The CLX 2500 provides 2500 watts of power. The solid-state design provides low cost of ownership with high reliability. Applications: The CLX series is designed to meet the performance demand in RF-driven plasma systems for semiconductor processing. Applications include

• DC Output Power: 2500 watts
• Features: Adjustable Frequency
• Form Factor: Rack Mount
• Output Frequency: 0.0200 to 2 MHz

Description: provides low cost of ownership with high reliability. Applications: The CX series is designed to meet the performance demand in RF-driven plasma systems for semiconductor processing. Applications include etch, RIE, parallel plate, ICP, RF sputtering, CVD and PVD, as well as induction

• DC Output Power: 600 watts
• Form Factor: Rack Mount
• Output Frequency: 2 to 30 MHz

Description: provides low cost of ownership with high reliability. Applications: The CX series is designed to meet the performance demand in RF-driven plasma systems for semiconductor processing. Applications include etch, RIE, parallel plate, ICP, RF sputtering, CVD and PVD, as well as induction

• DC Output Power: 600 watts
• Features: Adjustable Frequency
• Form Factor: Rack Mount
• Output Frequency: 2 to 30 MHz

Description: % bandwidth. The CLX 1000 provides 1000 watts of power. The solid-state design provides low cost of ownership with high reliability. Applications: The CLX series is designed to meet the performance demand in RF-driven plasma systems for semiconductor processing. Applications include

• DC Output Power: 1000 watts
• Features: Adjustable Frequency
• Form Factor: Rack Mount
• Output Frequency: 0.0200 to 2 MHz

Description: Emerald green industrial plating tape for disposition, plasma, lamination, alkaline, etch, photo develop with great chemical resistance. Features/Application s: disposition plasma lamination alkeline etch photo develop

• Adhesive: Silicone
• Type: Single-Sided Adhesive

Description: • Eliminated Freons and their replacement chemicals • Can operate in heating or cooling modes • Programmed for Lam Research analog and (single channel, single channel dual output or dual output Master/Slave) Applied Materials CHX plasma etcher interfaces

• Application / Industry: Industrial, Laboratory / Scientific
• Condenser Cooling System: Water-Cooled
• Cooling Capacity: 1.2 kW
• Installation: Indoor

Description: parts and coatings for parts requiring exceptional corrosion resistance. Applying a PlasmaResist™ coating to compatible ceramic and metal components creates a corrosively inert barrier of pure yttria. Plasma resistance High stability Heat resistance Various application methods Example

• Applications: Other
• Coeff. of Thermal Expansion (CTE): 7.9 to 8.2 µm/m-C
• Dielectric Strength: 1.65E7 V/m
• MOR / Flexural Strength: 14504 to 62366 psi

Description: Semitron® MPR 1000 shapes possess excellent heat resistance and low rates of erosion in plasma chambers. Due to these characteristics, it is often chosen for vacuum chamber applications within etch, CVD, and ion implant sub segmentations in the semiconductor and electronics industry.

• Industry: Electronics, Semiconductors / ICs, Other
• Tensile Modulus: 1000 ksi
• Tensile Strength (Break): 15000 psi

Description: with unique nano-filler to reduce erosion rates. The nano-filled material provides a chemical inertness only seen in much more costly FFKM grades and been developed for plasma ash or resist strip, chlorine and CxFy based etch processes. Nanofluor® grades provide some of the

• Hardness Rating (Shore A Scale): 65 durometer, 70 durometer, 75 durometer, 80 durometer
• O-ring Sizes: "AS568" standard sizes (001-475), "AS568-" boss gasket sizes (901- and up), British Standard metric sizes
• Synthetic Rubber Materials (Thermosets): Fluoroelastomer (FKM), Perfluoroelastomer (FFKM, FFPM)

Description: with unique nano-filler to reduce erosion rates. The nano-filled material provides a chemical inertness only seen in much more costly FFKM grades and been developed for plasma ash or resist strip, chlorine and CxFy based etch processes. Nanofluor® grades provide some of the

• Hardness Rating (Shore A Scale): 65 durometer, 70 durometer, 75 durometer, 80 durometer
• O-ring Sizes: "AS568" standard sizes (001-475), "AS568-" boss gasket sizes (901- and up), British Standard metric sizes, JIS standard sizes
• Synthetic Rubber Materials (Thermosets): Fluoroelastomer (FKM), Perfluoroelastomer (FFKM, FFPM)

Description: benchmarked against the leading elastomer sealing materials. Y75G was proven to have excellent resistance to aggressive oxygen and fluorine based plasmas. The material has been formulated to be used in critical locations where the seal can be directly exposed to the chemical environment such

Description: of Condensation and Moisture Between LCD, OLED or Plasma Display and Overlay Types of Filter Coatings/Etchings Antireflective (AR) Single-Sided (recommended for bonded filters) Double-Sided (recommended for non-bonded filters) Antiglare (AG) Chemically Etched Mechanically Etched

• Coating: Antireflection, Filter, ITO, Protective, Other
• Regional Preference: North America, United States Only, Northeast US Only
• Substrate Materials: Glass, Polymer
• Wavelength Range: Visible, IR, Other

Description: Gardacid P 4462/1 is a liquid sulfuric acidic pickling product used to remove laser and plasma cutting scale and rust from ferrous substrates. Gardacid P 4462/1 can also be used to clean and etch aluminum substrates. A fluoride additive is sometimes used with aluminum. The carefully

• Type: Etchant / Pickle, Rust / Corrosion Remover, Surface Treatment
• pH: Strong Acid / Mineral Acid Cleaner (0 to 2 pH)

Description: a prefix of H or A are high throughput pumps incorporating a hybrid pumping mechanism for higher gas flow. These are optimized for processes such as plasma etch. We also offer repair service.

Description: Features Class D amplifiers up to 2MHz High voltage pulsed DC AM transmitters Plasma deposition/etch Series Gate Resistance (Rg) <0.1 ohm Tr and Tf times of <10ns Industry's Lowest Gate Charge Fast switching, uniform signal propagation Pulse power applications Fast switching, reduced

Description: The m924 (4channel) and m922 (2channel) Semiconductor OEM modules are the newest Luxtron products for Etcher and Wafer Fab equipment temperature monitoring of Electrostatic Chucks, Chambers and other devices. The m920 Series modules are high performance solutions that are flexible, reliable

• Device Category: Sensor / Transducer
• Electrical Outputs: Current, Serial
• Operating Temperature: 32 to 140 F
• Technology: Optical Pyrometer

Description: sample size, acid composition, etch cycle, testing environment, and instrument protocol. Variations in these parameters may be used, but may effect the recovery efficiency or retention of metals during processing. In practice, this test method is used for sample weights of 25 to 5000 g. For