Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: FX PCB Co., Ltd.
Description: layer 4mil/4mil (1Oz) 3mil/3mil (1Oz) Annular Ring =4mil / BGA 0.15mm BGA 0.15mm BGA Tolerance of outline (board edge to board edge) +/-0.025mm / Tolerance of outline (Mark to board edge) +/-0.05mm +/-0.025mm Impedance control +/-10% / Drilling machine drilling
- Thickness: 0.0157 inches
- Type: Film / Flexible Substrate
-
Supplier: FX PCB Co., Ltd.
Description: layer 3mil/3mil (HOz) 2.5mil/2.5mil (HOz) outer layer 4mil/4mil (1Oz) 3mil/3mil (1Oz) Annular Ring =4mil / BGA 0.15mm BGA 0.15mm BGA Tolerance of outline (board edge to board edge) +/-0.025mm / Tolerance of outline (Mark to board edge) +/-0.05mm +/-0.025mm Impedance
- Thickness: 0.0118 inches
- Type: Film / Flexible Substrate
-
Supplier: FX PCB Co., Ltd.
Description: layer 3mil/3mil (HOz) 2.5mil/2.5mil (HOz) outer layer 4mil/4mil (1Oz) 3mil/3mil (1Oz) Annular Ring =4mil / BGA 0.15mm BGA 0.15mm BGA Tolerance of outline (board edge to board edge) +/-0.025mm / Tolerance of outline (Mark to board edge) +/-0.05mm +/-0.025mm Impedance
- Thickness: 0.0118 inches
- Type: Film / Flexible Substrate
-
-
Supplier: FX PCB Co., Ltd.
Description: : Items Mass Production Low Volume Layer of flex board Single and double panel 8L PCB Thickness =0.3mm / Line width/Line space Inner layer 3mil/3mil (HOz) 2.5mil/2.5mil (HOz) Outer layer 4mil/4mil (1Oz) 3mil/3mil (1Oz) Annular Ring =4mil / BGA 0.15mm BGA 0.15mm BGA
- Materials of Construction: Specialty / Other
- Thickness: 0.0039 inches
- Type: Film / Flexible Substrate
-
Supplier: Ironwood Electronics, Inc.
Description: These adapters provide surface mount lands for attaching the BGA device. They employ high temperature FR4/G10 substrate which allows package soldering and rework without damage. Gold plated press fit pins and short trace lengths insure high integrity in mechanical and electrical
- Product Type: Prototyping Adapters
- RoHS Compliant: Yes
-
Supplier: KEYENCE
Description: Angle Micron-level Defect Detection Surface Profiling Thin-film Thickness Coating Thickness BGA Profile Laser-Marking Depth
- Applications: Semiconductor Wafers, Packaged ICs / Ceramic Substrates
- Form Factor: Monitor / Instrument, Sensor / Sensing Element
- Measurement Capability: Shape / Flatness, Thickness - Film / Layer
- Mounting / Loading: Autoloading / In-line, Floor Mounted / Stand-alone
-
Supplier: Kyocera Corporation
Description: Organic Package Build-up Structure FC-BGA SHDBU Structure Type CPCORE Structure Type FC-CSP Substrates
- Mounting: SMT
-
Supplier: Advanced Technical Ceramics Company
Description: combination of proprietary thermal analysis tools, commercially available thermal analysis software and highly qualified engineering staff. Refractory Metal Standoffs For the ultimate in standoffs, AdTech can co-fire refractory metal "bumps" on BGAs or substrates that will retain their
- Backend Processing: Soldering / Pasting, Hermetic Sealing, Dicing, Other
- IC Package Type: BGA, MCM, LCCC, Other
- Location: North America, United States Only, Southern US Only
- Package Material: Ceramic, Other
-
Description: The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of
-
Supplier: CSA Group
Description: The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of
-
Supplier: Indium Corporation
Description: Epoxy fluxes are often used in no-clean SMT component attach applications. The solder bumps on wafer level CSP, micro BGA or BGA packages are dipped in epoxy fluxes, or the flux is applied to the substrate via a jetting process. The assembly is then reflowed, and the epoxy flux
- Fluxes & Cleaners: Soldering Flux / Rosin
- Form / Shape: Paste
-
Supplier: Standex-Meder Electronics
Description: Ultraminiature surface mount (SMD) low-profile CRR Series Reed Relay with high insulation resistance (IR) typical 10^13 O. Instrumentation grade relay comes in a rugged thermoset overmolded package with ceramic substrate. Supplied in tape and reel according to IEC 286/part 3. Ball grid array
- Break Time (Release Time): 0.0500 milliseconds
- Coil Resistance: 70 to 150 ohms
- DC Coil Voltage: 3 to 5 volts
- Make Time (Operate Time): 0.6000 milliseconds
-
Supplier: Indium Corporation
Description: Ball-Attach Flux WS-446-NRD is a water-soluble ballattach flux designed for use in pin-transfer applications for ball attachment to substrates (BGA manufacturing). Its rheology is specifically designed for use with even the smallest gravity-fed spheres. WS-446-NRD has an activator
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
-
Supplier: Samsung Electro-Mechanics
Description: This substrate consists of a rigid substrate and a flex substrate, and the flexibility of the flex component allows for 3-D circuit connection to take place. As there is no need to use connectors between modules, this substrate is advantageous in terms of miniaturization.
-
Supplier: Standex-Meder Electronics
Description: different switching matrices. Standard with ball grid array (BGA). Designed in an FR-4 substrate and rugged thermoset overmold body able to withstand reflow temperatures.
- Coil Resistance: 185 ohms
- DC Coil Voltage: 5 volts
- Mounting: PC Board
- Normally Open (NO): 1
-
Supplier: Standex-Meder Electronics
Description: The CRF Series is an ultraminiature 7GHz (RF) high frequency reed relay design in a low-profile surface mount (SMD) package. The RF reed relay features a high insulation resistance (IR) typical 10^13 O. This instrumentation grade relay comes in a rugged thermoset overmolded package with ceramic
- Break Time (Release Time): 0.0500 milliseconds
- Coil Resistance: 70 to 150 ohms
- DC Coil Voltage: 3 to 5 volts
- Make Time (Operate Time): 0.6000 milliseconds
-
Supplier: Indium Corporation
Description: Offers high yields in BGA bumping process Suitable for both Pb-Free or Sn/Pb applications Introduction Ball Attach Flux NC-506 is a low viscosity thixotropic no-clean flux designed for use in ball attachment to substrates (BGA manufacturing). It is especially useful in
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
-
Supplier: Umicore Metal Deposition Solutions
Description: , Code A/B Compatible with standard BGA requirements Easy maintenance and high stability of the electrolyte Applications Rigid and flexible printed circuit boards Semiconductors BGA applications Ceramic and metallic substrates
-
Supplier: RS Components, Ltd.
Description: Isolator µModule Technology is a new development platform from Linear Technology that allows the reliable integration of multiple technologies onto a single substrate PCB. The high level of integration achieved combines inductive/magnetic isolation, discrete components, ICs and power
- Analog Input Channels: 6 #
- Form Factor: Panel / Chassis Mount
- Operating Temperature: -40 to 185 F
-
Supplier: Indium Corporation
Description: on a wide range of surfaces Introduction Ball Attach Flux WS-3600 is a thixotropic flux designed for use in pin transfer applications for ball attachment to substrates (BGA manufacturing). Its rheology is specifically designed for use with even the smallest gravity-fed spheres
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant LOCTITE® ECCOBOND UF 3513HF epoxy underfill encapsulant is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 33.56 µin/in-F
- Viscosity: 3300 cP
-
Description: IEC 62137-1-5:2009 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the
-
Supplier: CSA Group
Description: IEC 62137-1-5:2009 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the
-
Supplier: RS Components, Ltd.
Description: Isolator µModule Technology is a new development platform from Linear Technology that allows the reliable integration of multiple technologies onto a single substrate PCB. The high level of integration achieved combines inductive/magnetic isolation, discrete components, ICs and power
- Analog Input Channels: 6 #
- Form Factor: Panel / Chassis Mount
- Operating Temperature: -40 to 185 F
-
Supplier: AVX Corporation
Description: array (BGA), and land-grid array (LGA) devices. Many devices can be offered on multiple substrates including silicon, quartz, glass, alumina, and others. We can provide Copper, low resistance, high frequency interconnects.
- Category / Application: Industrial, Medical, Telecom Resistor
- Configuration: Resistor Chip Array
- Mounting / Packaging: Surface Mount (SMT / SMD)
- Resistance Range: 5 to 5.00E7 ohms
-
Supplier: Ushio America, Inc.
Description: Currently Ushio’s proximity/projection exposure systems for flexible substrates have a track record of over 800 units. Highly efficient high-resolution exposure is achieved by a projector lens that makes full use of our specially developed high-output lamp and our established
-
Supplier: MacDermid Alpha Electronics Solutions
Description: -temperature alloy applications. The alloy also yields very low voiding in BGA solder joints, even when a traditional SAC alloy sphere is used. All components used with SnBi solders must be lead-free to eliminate the formation of tin/lead/bismuth intermetallics, which have a melting point
-
Supplier: Ushio America, Inc.
Description: Ushio provides specialized steppers for cutting-edge packaging applications employed in servers and PCs, and in portable devices such as smart phones and tablet PCs. The stepper is intended for package substrates using a stage corresponding to the panel size and Ushio’s proprietary large
-
Supplier: Samsung Electro-Mechanics
Description: High-density interconnection (HDI) substrates have high-density circuits that make it possible for electronic parts mounted on a PCB to send and recieve electrical signals between themselves. The products are used for mounting the main parts of mobile devices and transmitting their
Find Suppliers by Category Top
Featured Products Top
-
. High Quality Standards: We adhere to strict quality control processes, including AOI, X-Ray, and function test Complex Assemblies Available: We specialize in assembling, like BGA soldering, micro-BGAs, and 0201 (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
(1Oz) Annular Ring ≥4mil / BGA 0.15mm BGA 0.15mm BGA Tolerance of (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
As the market shifts towards substrate BGA, QFN, and DFN assemblies, the future of SOIC and low pin-count PLCCs will be significantly impacted. Rochester's investment in QFN/DFN assemblies ensures continued support for long-term system companies and flexibility, with footprint compatibility and minor board changes. Learn how we are solving another component of the obsolescence puzzle for our global customers. (read more)
Browse Uncategorized Products Datasheets for Rochester Electronics -
There are many pieces to any semiconductor product “puzzle” that can result in obsolescence. As the industry shifted to offshore assembly, Rochester Electronics has invested in both lead frame assemblies as well as substrate-based QFN and BGA assemblies onshore to provide continued long-term support. (read more)
Browse Uncategorized Products Datasheets for Rochester Electronics -
Enables use of lower cost substrates & components Reduction of warpage (component & substrate) vs SAC process Excellent electrical reliability; passes JIS Z 3197 & J-STD-004B SIR testing Exhibits low voiding characteristics; passes IPC Class 3 voiding on BGA components Halide-free & zero-halogen compliant (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions
Conduct Research Top
-
An Overview Of BGA Underfill Process And Non Conductive Via Fill
Flip chip packaging exposes chips to mechanical stress because of extensive coefficient thermal expansion mismatch between the silicon chips and the substrate. When there is a high thermal load, the mismatch stresses the chips, thus making reliability a concern. Manufacturers use single underfill
-
Best Top 10 BGA Underfill Epoxy Adhesives And Underfill Encapsulants Manufacturers In China
Underfill epoxy adhesives offer good protection against ionic residues and unwanted substances. One of the key things that the underfill helps to achieve is better adhesion of components onto the substrate and shock protection. Today, the formulations include no flow underfills. This eliminates
-
EETimes.com | Electronics Industry News for EEs & Engineering Managers
accelerate the development of true system-in-packaging (SIP) products by several years, has learned. The company--Substrate Technologies Inc. (STI)--has begun producing what it calls "built-up " BGA substrates for high-performance chip-packaging applications. The Carrollton, Tex.-based company
-
Ceramics Capillary for Improving Wire Bonding Efficiency
or substrate. Today, even there are more advanced packaging technologies (QFP, PFP, PGA, BGA, etc.) invented, the wire bonding technology is still the mainstream deployed in the semiconductor packaging industry. Wire bonding is generally considered to be a cost-effective and widely applicable interconnection
More Information Top
Indicates content that may require registration and/or purchase.
-
Aluminum decal for transferring solder spheres during electronic package assembly
This paper introduces a novel method for transferring solder spheres to BGA substrates or flip chip wafers that uses a decal made from aluminum foil.
-
Advanced Flip Chip Packaging
They are Case42.5 with 42.5 mm square BGA substrate , Case35 with 35 mm square BGA substrate and Case10 with 10 mm square BGA substrate as a case that is a several times higher density than other two cases.
-
Effect of Reflow Profiles on the Board Level Drop Reliability of Pb-Free (SnAgCu) BGA Assemblies
The BGA components assembled to the board were daisy-chained packages that contained the actual active die, but the electrical path was only through the BGA substrate and the die was not a part of the circuit.
-
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
We will also discuss how the coefficients of thermal expansion of flip chip BGA substrates at different fabri- cation stages are measured using ESPI, and how the out-of-plane deformation of different types of flip chip packages is measured using the …
-
Advanced Wirebond Interconnection Technology
… Improve Wire Bond Reliability Non-conformance to Die Design Report 4.6.4: Assembly and Package Design Guidelines 4.6.4.1: 4.6.4.2: 4.6.4.3: Pad Design Rules on CSP and BGA Substrates The Cost Impact of …
-
Automated Solder Inspection Technique for BGA-Mounted Substrates by Means of Oblique Computed Tomography
Fig. 7 shows the result of the correction performed for the OCT image which captured the actual BGA substrate .
-
Wafer-Level Chip-Scale Packaging
Post the 3 M acquisition of the Gore & Associates’ IC substrate business, also located in Eau Claire, Wisconsin, he continued working on the manufacturing technol- ogy development of organic flip chip/BGA and wire bond/ BGA substrates .
-
Effect of Trace Diamond Nanoparticle Addition
on the Interfacial, Mechanical, and Damping
Properties of Sn-3.0Ag-0.5Cu Solder Alloy
Plain lead-free solder joints and solder joints containing diamond particles were characterized in terms of interfacial microstructures and hardness on ball grid array ( BGA ) substrates with different surface finishes as a function of the number of reflow cycles.
-
Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package
In this work, the interfacial reactions and shear properties of the In-48Sn solder joints with the differ- ent surface finishes of the BGA substrate after bonding were investigated for the application of the In-48Sn solder in MOEM packages.
-
Flip-chip BGA applied high-density organic substrate
The V1 indicates driver’s waveforms, the V3 indicates transmitted waveforms through BGA substrate , the V2 indicates chip end cross talk noise, and the V4 indicates hall end cross talk noise, In the case A, the large cross talk noise is caused that …