BGA Substrate

Description: FAST FLOW,LOW TEMPERATURE CURE,REWORKABLE EPOXY UNDERFILL FOR BGA AND CSP DEVICES. HIGH ADHES AND RIGID CIRCUIT SUBSTRATES - 10 CC ML

Description: 3mil/3mil (1Oz) Annular Ring ≥4mil / BGA 0.15mm BGA 0.15mm BGA Tolerance of outline (board edge to board edge) +/-0.025mm / Tolerance of outline (Mark to board edge) +/-0.05mm +/-0.025mm Impedance control +/-10% / Drilling machine drilling ≥8mil 6mil laser drilling 5mil/6mil

• Thickness: 0.011811023622047244 inches
• Type: Film / Flexible Substrate

Description: 3mil/3mil (1Oz) Annular Ring ≥4mil / BGA 0.15mm BGA 0.15mm BGA Tolerance of outline (board edge to board edge) +/-0.025mm / Tolerance of outline (Mark to board edge) +/-0.05mm +/-0.025mm Impedance control +/-10% / Drilling machine drilling ≥8mil 6mil laser drilling 5mil/6mil

• Thickness: 0.011811023622047244 inches
• Type: Film / Flexible Substrate

Description: 2.5mil/2.5mil (HOz) Outer layer 4mil/4mil (1Oz) 3mil/3mil (1Oz) Annular Ring ≥4mil / BGA 0.15mm BGA 0.15mm BGA Tolerance of outline (Board edge to board edge) +/-0.025mm / Tolerance of outline (Mark to board edge) +/-0.05mm +/-0.025mm Impedance control +/-10% / Drilling Machine

• Thickness: 0.003937007874015748 inches
• Type: Film / Flexible Substrate
• Features: Specialty / Other

Description: Organic Package Build-up Structure FC-BGA SHDBU Structure Type CPCORE Structure Type FC-CSP Substrates

• Mounting: SMT

Description: The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of

Description: The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of

Description: for use in pin-transfer applications for ball attachment to substrates (BGA manufacturing). Its rheology is specifically designed for use with even the smallest gravity-fed spheres. WS-446-NRD has an activator system powerful enough to promote wetting on the most demanding

• Features: Other
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Epoxy fluxes are often used in no-clean SMT component attach applications. The solder bumps on wafer level CSP, micro BGA or BGA packages are dipped in epoxy fluxes, or the flux is applied to the substrate via a jetting process. The assembly is then reflowed, and the epoxy flux

• Joining Process / Product Form: Paste
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: Ultraminiature surface mount (SMD) low-profile CRR Series Reed Relay with high insulation resistance (IR) typical 10^13 Ω. Instrumentation grade relay comes in a rugged thermoset overmolded package with ceramic substrate. Supplied in tape and reel according to IEC 286/part 3. Ball grid array

• Normally Open (NO): 1
• Normally Closed (NC): 1
• Maximum AC Switching Voltage: 170 volts
• Maximum DC Switching Voltage: 170 volts

Description: This substrate consists of a rigid substrate and a flex substrate, and the flexibility of the flex component allows for 3-D circuit connection to take place. As there is no need to use connectors between modules, this substrate is advantageous in terms of miniaturization.

Description: different switching matrices. Standard with ball grid array (BGA). Designed in an FR-4 substrate and rugged thermoset overmold body able to withstand reflow temperatures.

• Normally Open (NO): 1
• DC Coil Voltage: 5 volts
• Coil Resistance: 185 ohms
• Poles: Four Pole (4P)

Description: LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant LOCTITE® ECCOBOND UF 3513HF epoxy underfill encapsulant is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other

• Coeff. of Thermal Expansion (CTE): 33.55555555555556 µin/in-F
• Viscosity: 3,300 cP
• Chemical System: Epoxy (EP)

Description: IEC 62137-1-5:2009 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the

Description: spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on

Description: electrolyte Applications Rigid and flexible printed circuit boards Semiconductors BGA applications Ceramic and metallic substrates

Description: electrolyte Applications Rigid and flexible printed circuit boards Semiconductors BGA applications Ceramic and metallic substrates

Description: stable enough for everything from life-sustaining implantable to battlefield operations. AVX can provide most designs in surface mount (SMT), wire bondable, ball grid array (BGA), and land-grid array (LGA) devices. Many devices can be offered on multiple substrates including silicon,

• Resistance Range: 5 to 50,000,000 ohms
• Category / Application: Industrial, Medical, Telecom Resistor
• Configuration: Resistor Chip Array
• Mounting / Packaging: Surface Mount (SMT / SMD)

Description: Thickness BGA Profile Laser-Marking Depth

• Features: Autoloading / In-line, Non-contact, Non-destructive, Other
• Form Factor: Controller, Monitor / Instrument, Sensor / Sensing Element
• Applications: Flat Panel Displays, Packaged ICs / Ceramic Substrates, Semiconductor Wafers
• Mounting / Loading: Floor Mounted / Stand-alone, In-situ / System Mounted

Description: available thermal analysis software and highly qualified engineering staff. Refractory Metal Standoffs For the ultimate in standoffs, AdTech can co-fire refractory metal "bumps" on BGAs or substrates that will retain their shape through multiple solder reflow operations. Materials

• Type: BGA, LCCC, MCM
• Material: Ceramic
• Backend Processing: Dicing, Hermetic Sealing, Soldering / Pasting
• Features: North America, Other, Southern US Only, United States Only

Description: Currently Ushio’s proximity/projection exposure systems for flexible substrates have a track record of over 800 units. Highly efficient high-resolution exposure is achieved by a projector lens that makes full use of our specially developed high-output lamp and our established reputation in

Description: The alloy also yields very low voiding in BGA solder joints, even when a traditional SAC alloy sphere is used. All components used with SnBi solders must be lead-free to eliminate the formation of tin/lead/bismuth intermetallics, which have a melting point under 100°C. Eliminates the Need for

Description: Ushio provides specialized steppers for cutting-edge packaging applications employed in servers and PCs, and in portable devices such as smart phones and tablet PCs. The stepper is intended for package substrates using a stage corresponding to the panel size and Ushio’s proprietary large-area