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Supplier: QUALCOMM, Incorporated
Description: Qualcomm® Bluetooth® Low Energy Solutions Environmental Sensor Board The Environmental Sensor Board is a plug-in expansion board for development with the CSR1011 development board or the CSR101x Starter development kit and is designed to help developers create next generation MEMS
- Technology: Bluetooth
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Supplier: QUALCOMM, Incorporated
Description: family includes eight SoC devices – five (QCC3001 – QCC3005) which support Bluetooth headset applications, and three (QCC3006 – QCC3008) for Bluetooth speaker applications. Coupled with the audio development kit (ADK) and tools, these devices provide a flexible platform for designing
- Technology: Bluetooth
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Supplier: QUALCOMM, Incorporated
Description: CSR8311 is a Bluetooth v4.1 single-chip radio and baseband IC for automotive applications. CSR8311’s dual-mode radio enables it to connect to the billions of Bluetooth products already on the market, as well as a new generation of Bluetooth low energy devices. The CSR8311
- Bluetooth Compliance: Other
- Bluetooth Component: Bluetooth® Single Chip Solutions
- Interface: I2C, PCM, UART, USB
- Power Class: Class I, Class II, Class III
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Supplier: Utmel Electronic Limited
Description: - Bluetooth Modules ROHS
- Technology: Bluetooth
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Supplier: Utmel Electronic Limited
Description: Module Bluetooth Modules ROHS
- Technology: Bluetooth
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Supplier: QUALCOMM, Incorporated
Description: The CSR8510 chipset is a Bluetooth v4.0 single-chip radio and baseband IC for PCs and consumer electronics devices. CSR8510 Specs Bluetooth Bluetooth Version Bluetooth 4.0 Bluetooth Technology Bluetooth Low Energy Dual
- IC Package Type: WLCSP, QFN
- Interface: USB
- Technology: Bluetooth
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Network and Communication Chips - LM936-0650, Bluetooth Smart Module with Wireless Charging -- 17631Supplier: TOP-electronics USA
Description: . Features: Either standalone Bluetooth Smart or can act as a radio in Bluetooth Smart Ready HCI mode Complies with Bluetooth Core Specification version 4.1 On-chip support for common keyboard and mouse interfaces Powerful ARM Cortex-M3 32-bit processor
- Technology: Bluetooth
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Supplier: Utmel Electronic Limited
Description: DIP-18 Bluetooth Modules ROHS
- Technology: Bluetooth
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Supplier: Infineon Technologies AG
Description: Bluetooth® LE 5.4 MCU with industry’s best range, Dual ARM Cortex M33s qualified for automotive and industrial applications and CAN FD/LIN The AIROC™ CYW89829 Bluetooth® LE MCU is Infineon’s latest automotive qualified addition to the AIROC™ CYW20829
- TJ: -40 to 105 C
- Technology: Bluetooth
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Supplier: Utmel Electronic Limited
Description: USB BL654 NRF52840 BLUETOOTH 5
- Technology: Bluetooth
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Supplier: TOP-electronics USA
Description: LM506, Bluetooth USB Adapter 4.0 Dual Mode Class 2 Host Controller Interface (HCI) via USB Interface The LM506 Bluetooth Smart Ready adapter is a small, simple and highly compatible solution. A plug and play USB adapter, it is compatible with Linux, MAC OSX and Windows XP – 10
- Technology: Bluetooth
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Supplier: TOP-electronics USA
Description: LM961-0651, Bluetooth 4.1 Smart Ready Dual-Mode Module, packed in trays of 60pcs Standalone (With Embedded Bluetooth v4.1 Stack) The LM961 Bluetooth® Dual Mode module is a powerful, versatile and cost effective solution designed for use as a GAP Central (master) or GAP
- Technology: Bluetooth
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Supplier: TOP-electronics USA
Description: LM961-0650, Bluetooth 4.1 Smart Ready Dual-Mode Module Standalone (With Embedded Bluetooth v4.1 Stack) The LM961 Bluetooth® Dual Mode module is a powerful, versatile and cost effective solution designed for use as a GAP Central (master) or GAP Peripheral (slave) device
- Technology: Bluetooth
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Supplier: Infineon Technologies AG
Description: -free Bluetooth® stack compatible with Bluetooth® 5.0 in a 12.0 × 16.3 × 1.70 mm SMT package form-factor. This device is certified to FCC, ISED, MIC, and CE regulations. The CYBT-413055-02 supports peripheral functions (ADC and PWM), UART, I2C, and SPI communication, and
- Bluetooth Component: Bluetooth® EDR Chip
- Features: RoHS Compliant
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Supplier: Infineon Technologies AG
Description: AIROC™ CYW20706 Bluetooth® & Bluetooth® LE system on chip The AIROC™ CYW20706 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low
- Features: RoHS Compliant
- IC Package Type: Other
- TJ: -30 to 85 C
- Technology: Bluetooth
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Supplier: Infineon Technologies AG
Description: -02 supports peripheral functions (ADC and PWM), UART, I2C, and SPI communication, and a Bluetooth® audio interface. This device provides all necessary components required to operate Bluetooth® LE and/or BR/EDR communication standards with a Maximum TX output power of +12
- Bluetooth Component: Bluetooth® EDR Chip
- Features: RoHS Compliant
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Supplier: Microchip Technology, Inc.
Description: The BM71 is a small form factor, Bluetooth Low Energy module measuring only 9 x 11.5 x 2.1 mm. The BM71 module is designed for easy implementation into a broad range of applications. It delivers up to 2.5x throughput improvement and more secure connections vs. Bluetooth 4.1 based
- IC Package Type: Other
- Pin Count: 16 #
- Technology: Bluetooth
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Supplier: Microchip Technology, Inc.
Description: , Europe, Japan, Korea, Taiwan and China Easy to use ASCII command interface for communication with the host microcontroller Mobile Application supported in Microchip Bluetooth Data (MBD) Latest Firmware Revision: 1.40 Supports LE Secure Connections levels 1
- IC Package Type: Other
- Pin Count: 33 #
- Technology: Bluetooth
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Supplier: Microchip Technology, Inc.
Description: Bluetooth 5 Certified Easy to use ASCII command interface for communication with the host microcontroller Module certified for use in USA, Canada, Brazil, Europe, Japan, Korea, Taiwan and China Mobile Application supported in Microchip Bluetooth Data (MBD) Latest
- IC Package Type: Other
- Pin Count: 16 #
- Technology: Bluetooth
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Supplier: Microchip Technology, Inc.
Description: The BM70 Bluetooth Low Energy module is designed for easy implementation into a broad range of applications. It delivers up to 2.5x throughput improvement and more secure connections vs. Bluetooth 4.1 based products. Developers can easily interface to the device via a standard UART
- IC Package Type: Other
- Pin Count: 33 #
- Technology: Bluetooth
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Supplier: Qorvo
Description: The GP570 IEEE 802.15.4/Bluetooth® Low Energy (LE) Communications Controller provides a fully integrated solution for ultra-low power wireless communications, with fully integrated IEEE 802.15.4 and Bluetooth Low Energy software stacks that enable fast and simple
- Features: RoHS Compliant
- IC Package Type: Other
- Technology: Bluetooth
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Supplier: VAST STOCK CO., LIMITED
Description: Bluetooth Modules (802.15.1) Bluetooth mod MOTG
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Supplier: Texas Instruments
Description: Bluetooth Controller 76-VQFNP-MR
- Data Rate: 3000 kbps
- Features: RoHS Compliant
- IC Package Type: Other
- Number of Transmitters: 12 #
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Supplier: Abracon, LLC
Description: RoHS/RoHS II Compliant Series: ABBTM Type: Transceiver; Bluetooth® Classic Frequency: 2.4 GHz For Use With: ABBTM-NVC-MDCS56 Supplied Contents: Board(s) Part Status: EOL
- Features: RoHS Compliant
- Operating Frequency: 2400 MHz
- Technology: Bluetooth
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Supplier: Sena Technologies
Description: Built-in antenna included, easy to use windows configuration tool available
- Bias / Operating Current: 70 mA
- Data Rate: 230 kbps
- Device Type: Transceiver, Other
- Features: RoHS Compliant
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Supplier: RS Components, Ltd.
Description: SoC,Blue Gecko,Bluetooth,BLE, BGA125 - Wireless Components & Modules - Bluetooth Modules
- Technology: Bluetooth
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Supplier: Radicom Research, Inc.
Description: temperature: 0°C - +70°C Small size: RB8762(SMD): 17.5 x 15.0 mm (LxW) RB8762EVK: 17.0 x 27.6 mm (LxW) No powerful host processor required Firmware upgradeable through serial port Integrated ARM processor and on chip memory for complete Bluetooth Smart device
- Mounting / Form Factor: Printed Circuit Board (PCB)
- Network / Bus: Bluetooth®
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Supplier: Richardson RFPD
Description: The BX3105 Wi-Fi and Bluetooth 4.2 pre-certified module offers simple and fast integration with free unlimited FOTA and built-in cloud connectivity from AirVantage®, ideal for quickly and cost effectively adding wireless communication. This module support 802.11 b/g/n and
- Device Type: Receiver
- Technology: GPS
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Supplier: ZBA, Inc.
Description: ZBA Inc. USB Adaptor, is a Class 1 USB Bluetooth adapter iscompliant with Bluetooth Specification 2.0 and USB Specification 1.1, Based on the Cambridge Silicon Radio Single Chip Silicon Solution. Standard USB male type A connector provides the USB signals for the adaptor.
- Data Rate: 723 kbps
- Device Type: Serial Data Converter
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Supplier: ZBA, Inc.
Description: The ZBA BT44-147 is a Bluetooth Module based on CSR\'s Bluecore 4 chip. The BT44-147 has been designed to be embedded into a variety of end user equipment including medical devices, industrial data communication equipment and automotive applications. It supports a fully
- Applications: Mobile / Wireless Systems
- Communication Interface: Serial Interface
- Data Rate: 2000 to 3000 kbps
- Features: Antenna Connector
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Supplier: RS Components, Ltd.
Description: The Microchip RN42 Class 2 Bluetooth Module is a small form factor, low power and simple to integrate solution for adding Bluetooth communications into designs. The RN42 is fully certified, supports multiple interface protocols and features low power consumption making it an
- Bluetooth Compliance: Bluetooth® SIG 1.1 Compliant, Bluetooth® SIG 1.2 Compliant, Bluetooth® SIG 2.0 Compliant, Other
- Interface: SPI, UART, Other
- Power Class: Class II
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Supplier: DigiKey
Description: AUTOMOTIVE SIMPLELINK BLUETOOTH
- Bias / Operating Current: 6.1 to 11.7 mA
- Data Rate: 1000 kbps
- Device Type: Transceiver
- IC Package Type: Other
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Supplier: LEGIC Identsystems
Description: pre-programmed. Encrypted end-to-end communication with customer- and application-specific management systems is supported. The 8 x 8 mm System-in-Package integrates two ARM processors, Bluetooth, NFC, passive components and SE chip. The LEGIC security platform: The 6000
- Operating Temperature: -40 to 85 C
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Supplier: ODG (Origin Data Global)
Description: IC AMP BLUETOOTH 6-TSON
- IC Package Type: Other
- Supply Voltage: Other
- Technology: Bluetooth, Other
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Supplier: Qorvo
Description: The Qorvo GP712 System-on-Chip is an IEEE 802.15.4 multi-stack multi-channel communications controller for integration into a Zigbee® node. It is compliant with the IEEE Standard 802.15.4, providing robust spread spectrum data communication with a secure encrypted data flow, and
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Designers often face challenges when quickly evaluating Bluetooth® Low Energy solutions while ensuring reliable performance and seamless integration. Efficient prototyping tools are critical to reduce (read more)
Browse Network and Communication Chips Datasheets for Nova Technology(HK) Co.,Ltd -
Mobile and wearable devices require seamless, reliable connectivity across multiple protocols. Engineers face challenges integrating Wi-Fi, Bluetooth, GNSS, FM, and IR into compact designs while maintaining high performance, stable signals (read more)
Browse Network and Communication Chips Datasheets for Nova Technology(HK) Co.,Ltd -
transceiver, featuring Bluetooth® 5, Thread (802.15.4), and ANT protocols. This versatile board allows engineers to quickly prototype wireless applications, reducing development time and enabling seamless testing across multiple connectivity (read more)
Browse Network and Communication Chips Datasheets for Nova Technology(HK) Co.,Ltd -
Selecting the right Ethernet PHY directly impacts system power efficiency, EMI stability, board space, and long-term reliability. We compare three widely used 10/100 Mbps PHY chips to help engineers identify the best fit for (read more)
Browse Network and Communication Chips Datasheets for Win Source Electronics -
SoftDevice S112 is a memory-optimized Bluetooth® Low Energy protocol stack for the nRF52805, nRF52810, nRF52811, nRF52820 and nRF52832 System-on-Chips (SoCs). Up to 4 connections as a Peripheral can be run concurrently with a Broadcaster. It is Bluetooth 5.1 qualified and supports the (read more)
Browse Communications Software Datasheets for Nordic Semiconductor ASA -
temperature measuring applications. Modules of Communication Wi-Fi modules such as KSS8895MQXIA Ethernet chips offer wired connectivity while KZZ8895MQXIA chips enable wireless connections. Power Management The TPS82130SILRDC-DC converter is an efficient power management (read more)
Browse Microcontrollers (MCU) Datasheets for ODG (Origin Data Global) -
Digital processing chips are everywhere—from smartphones and appliances to MRI systems and industrial equipment. The rise of the Internet of Things has only increased the use of Wi-Fi, Bluetooth, and other high-frequency communications. With this growth comes a greater risk of (read more)
Browse Antennas Datasheets for A.H. Systems Inc. -
beginners and background projects. Q2: Can I use ATMega328p MCU for wireless communication? Its wireless capabilities require external Bluetooth (HC-05) or Wi-Fi (ESP8266) modules. These connect through any of UART, SPI or I2C interfaces. Q3: How much memory (read more)
Browse Thyristors Datasheets for ODG (Origin Data Global) -
Essential pin planning guidelines for the nRF54L Series
Efficient pin planning is a critical first step in any successful embedded system design, especially when power consumption and flexibility are key. Properly assigning the SoC’s available pins to various peripherals is crucial for ensuring not only correct operation but also maintaining ultra-low-power operation. While...
(read more)
Browse Network and Communication Chips Datasheets for Nordic Semiconductor ASA -
Nordic powers robust low-power dual-band Wi-Fi 6 with nRF54LM20A and nRF70 Series
Nordic Semiconductor is enabling full-featured Wi-Fi 6© applications on the nRF54LM20A SoC, paired with the nRF70 Series companion ICs. This powerful combination provides developers with the hardware and software tools needed to evaluate multi-protocol stack support and build next-generation con...
(read more)
Browse Network and Communication Chips Datasheets for Nordic Semiconductor ASA
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
, June 20. Interoperability issues dog Bluetooth's rise Bluetooth wireless technology was rolled out in the form of chips, modules and systems at the Bluetooth Congress this past week. CDMA emerges as Asia's choice for 3G services Asian telecommunications companies are poised to launch services
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Isonics says study confirms thermal improvements in silicon-28 material Rambus to seek range of licensing deals after settling with Hitachi Oki plans CMOS single-chip Bluetooth solution TI to buy wireless chip supplier Alantro for $300 million in stock Motorola completes $30 million purchase
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Ultrasonic testing system based on Bluetooth technology
MSP430F microcontroller is used as systems main control unit and ROK101007 Bluetooth communication chip for wireless data transmission.
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Agent alliance formation using ART-networks as agent belief models
Task 3: “ Bluetooth communication chip design” .
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Agent Technologies, Infrastructures, Tools, and Applications for E-Services
Task 3: “ Bluetooth communication chip design” .
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Microsystem for signal processing applications
A Bluetooth communication chip for wireless data transmission and a DiscOnChip module are under construction.
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Unleashing the power of wearable devices in a SIP infrastructure
To conserve power on the WatchPad the external Bluetooth communications chip is turned off as often and for as long as possible.
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Zeevo choose LTRIM Power Management IP
MONTREAL – September 20, 2004 - LTRIM Technologies, an innovative leader in CMOS analog virtual components and tunable resistor technologies, today announced that Zeevo, a leading provider of single- chip Bluetooth communications solutions and transceiver chips for quality audio over Bluetooth, has licensed …
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Development of Bluetooth Communications for LEGO-Based Mobile Robot Laboratories
Finally, a precise voltage regulator must be used to provide the TTL tension level (3.3volts) to feed different elements of the communications system ( Bluetooth chip , IR receiver, etc.).
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Advanced Design and Manufacturing Technology III
Here UART mode is selected to communicate with Bluetooth chip .
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The Design of On-line Mobile Robot over Bluetooth Technology
The concretely scheme is as follows: first the dolly seeks chip communicates with Bluetooth chip via a full-duplex .
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CR4 - Thread: ZigBee vs Bluetooth
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