Products & Services
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Supplier: Xoxide
Description: Introducing Innovation Cooling's latest offering, the IC Perihelion! This high-performance ceramic thermal compound features a ceramic base with a high bulk loading of over 91% to prevent pump out due to thermal cycling. It is completely silicone-free and non-capacitive, and
- Features: Thermally Conductive
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Supplier: TFC Ltd.
Description: Loctite® Nordbak® 7218 Wearing Compound Ceramic filled two part epoxy to protect, rebuild and repair high wear areas. Outstanding abrasion and corrosion resistance.
- Features: Leveling / Filling Compound
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Supplier: Accuris
Description: CLEANING COMPOUND, PORCELAIN AND CERAMIC TILE
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Supplier: Accuris
Description: Insulation Compound, Electrical, Ceramic, Class L
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Supplier: Saint-Gobain Surface Conditioning Group
Description: All synthetic, natural, polycrystalline diamond and CBN powders can be utilized in the manufacturing of compounds. Compound (bases) are typically supplied as "WS" (water soluble), "OS" (oil soluble), or "UN" (universally soluble). However, many additional compound formulations
- Materials / Substrates Finished: Ceramics / Glass
- Compound / Abrasive Type: Diamond
- Type: Lapping, Polishing
- Grading System: Micron Graded
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Supplier: SAE International
Description: This specification covers class L, low dielectric constant (12 or under), ceramic, electrical, insulating compounds, for use in electronic, communications, and allied electrical equipments, and the grading thereof (see 6.1 ).
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Supplier: TFC Ltd.
Description: Loctite® Nordbak® 7230 High Temperature Wearing Compound Ceramic filled two part epoxy to protect, rebuild and repair high wear areas. Use to rebuild and protect chutes, pump housings, elbows, cyclones and material handling equipment in hot environments.
- Features: Leveling / Filling Compound
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Supplier: Accuris
Description: INSULATING COMPOUND, ELECTRICAL, CERAMIC CLASS L
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Supplier: Beijing Grish Hitech Co., Ltd.
Description: requirements. Diamond polish compound is mainly used in the polishing of molds, metallurgy, hard alloy, ceramics, etc.
- Grit Size: 0.5 to 50
- Materials / Substrates Finished: Ceramics / Glass
- Compound / Abrasive Type: Diamond
- Grading System: Micron Graded
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Supplier: Saint-Gobain Surface Conditioning Group
Description: All synthetic, natural, polycrystalline diamond and CBN powders can be utilized in the manufacturing of compounds. Compound (bases) are typically supplied as "WS" (water soluble), "OS" (oil soluble), or "UN" (universally soluble). However, many additional compound formulations
- Materials / Substrates Finished: Ceramics / Glass
- Compound / Abrasive Type: Diamond
- Type: Lapping, Polishing
- Grading System: Micron Graded
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Supplier: Accuris
Description: Insulating Compound, Electrical, Ceramic, Class L
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Supplier: M&I Materials Limited
Description: Apiezon Sealing Compound Q is a versatile, temporary vacuum sealing medium. It is a soft, putty like substance which is easily moulded by hand at ambient temperatures, yet firm enough to remain in position and is readily removed when no longer required.
- Use Temperature: 14 to 86 F
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: IES2000
Description: VBC is a water based damping compound for the treatment of vibrating metal, wood, glass, ceramic and most plastic surfaces. This material imparts vibration damping and a shift in the dominant frequency. The resulting structure borne noise reduction provides a means of improving the
- Thickness: 0.0625 to 0.1875 inch
- Description: Compound (Spray), Compound (Trowel)
- Mounting: Spray / Trowel
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Supplier: Advanced Abrasives Corp.
Description: Premasol Silicon Carbide Compound Available in multiple micron sizes from 1 µm to 80 µm water based, oil based or universal based. The closely controlled grading and particle shape results in high cutting rates and uniform finishes. Applications: Precision lapping of metal and ceramic
- Compound / Abrasive Type: Ceramic, Silicon Carbide
- Materials / Substrates Finished: Ceramics / Glass
- Type: Lapping
- Form: Liquid / Dispersion
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Supplier: Norton Abrasives
Description: Engineered to meet all OSHA and EPA safety requirements, these oil- and water-soluble diamond lapping compounds produce high finishes and tight final tolerances. Typical Applications Polishing for final dimensions of molds and dies Charging lapping plates and discs Tool polishing Honing fine
- Grit Size: 12 to 22
- Materials / Substrates Finished: Aluminum, Ceramics / Glass, Copper / Copper Alloys, Nickel / Nickel Plate, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium
- Compound / Abrasive Type: Diamond
- Type: Lapping, Polishing
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Supplier: R. S. Hughes Company, Inc.
Description: Devcon black potting & encapsulating compound is compatible with ceramic, concrete, metal and plastic materials with a 7 day cure time. Provides a 3 min working time. Works in a mix ratio of 4:1.
- Dielectric Strength: 350.0000000000002 kV/in
- Features: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: ceramics, typical of those found in electronic assemblies. RTV12C curing agent is mixed with RTV12A base compound producing a clear glass coloured cured rubber to provide see-through properties in greater thicknesses. Sold in a 20:1 mix ratio. 18.14kg A & 908gm C Product Benefits Good
- Features: Encapsulant / Potting Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Momentive brown TSE3826 potting & encapsulating compound is compatible with ceramic, glass, metal and plastic materials with a 7 day cure time.
- Dielectric Strength: 584.2000000000012 kV/in
- Features: Encapsulant / Potting Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Momentive clear TSE392 potting & encapsulating compound is compatible with ceramic, copper, glass and plastic materials with a 7 day cure time.
- Thermal Conductivity: 0.18 W/m-K
- Dielectric Strength: 558.8000000000012 kV/in
- Features: Encapsulant / Potting Compound
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Supplier: Titan Tool Supply, Inc.
Description: Titan Tool Supply's diamond lapping compound is composed of uniformly shaped diamond grains of all virgin powder, completely free from contamination. Applications Polishing Our diamond lapping compound obtains the finest finish on steel, carbide and ceramics. Diamond
- Compound / Abrasive Type: Diamond
- Type: Lapping
- Form: Powder
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Supplier: Advanced Abrasives Corp.
Description: cBN (Cubic Boron Nitride) Our high quality cBN cubic boron nitride powder is combined with our proprietary water, oil and universal carrier types to provide slurries, suspensions and compounds in abrasive sizes ranging from 0.125 µm to 60 µm.
- Compound / Abrasive Type: Ceramic
- Grading System: Micron Graded
- Features: Other
- Form: Paste / Cream
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Supplier: Titan Tool Supply, Inc.
Description: Titan Tool Supply's diamond lapping compound is composed of uniformly shaped diamond grains of all virgin powder, completely free from contamination. Applications Polishing Our diamond lapping compound obtains the finest finish on steel, carbide and ceramics. Diamond
- Compound / Abrasive Type: Diamond
- Type: Lapping
- Form: Powder
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Supplier: Techsil Limited
Description: ceramics, typical of those found in electronic assemblies. RTV12C curing agent is mixed with RTV12A base compound producing a clear glass coloured cured rubber to provide see-through properties in greater thicknesses. Sold in a 20:1 mix ratio. 4.54kg A & 227gm B Product Benefits Good
- Features: Encapsulant / Potting Compound
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Thermal Compounds and Thermal Interface Materials - Arctic Alumina Thermal Compound (14 gram) -- 408Supplier: Xoxide
Description: Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride: Arctic Alumina
- Features: Thermally Conductive
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Supplier: Techsil Limited
Description: ceramics, typical of those found in electronic assemblies. RTV12B curing agent is mixed with RTV12A base compound producing a clear blue glass coloured cured rubber to provide see-through properties in greater thicknesses. Sold in a 20:1 mix ratio. 907gm A & 45gm B Product Benefits
- Features: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: exhibits good wetting, cures at room temperature and develops strong, low shrinkage bonds to most materials including optical fibers, glass ceramics, most metals. It has excellent dimensional stability over a wide temperature range. This product is typically used in applications with an
- Viscosity: 25,000 cP
- Coeff. of Thermal Expansion (CTE): 37.77777777777778 µin/in-F
- Chemical System: Epoxy (EP)
- Features: Leveling / Filling Compound
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Supplier: Epoxies Etc...
Description: UV Cure 60-7114 is a low viscosity urethane adhesive, potting compound and coating. This UV Curable Resin is formulated to provide excellent water and chemical resistance. It is a good choice for potting electronic assemblies exposed to excessive moisture. UV Cure 7114 has very good adhesion
- Viscosity: 3,000 cP
- Use Temperature: -58 to 311 F
- Tensile Strength (Break): 1,500 psi
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Xoxide
Description: Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride: Arctic Alumina
- Features: Thermally Conductive
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Supplier: Acoustical Solutions, Inc.
Description: Sound Damping Compound is a water based damping compound for the treatment of vibrating metal, wood, glass, ceramic and most plastic surfaces. This material imparts vibration damping and a shift in the dominant frequency. The resulting structure borne noise reduction provides a
- Substrate: Aluminum, Anodized, Ceramic / Porcelain, Glass, Metal, Plastic, Steel, Wood
- Dispensing Method: Brush / Roll-on, Sprayable
- Features: Coating, Other, Specialty / Other
- Location / Orientation: Exterior, Interior
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Supplier: Master Bond, Inc.
Description: of substrates including metals, glass, ceramics, wood, rubber, and many plastics. Once cured, EP21BAS is an excellent electrical insulator. This exceptionally versatile system is widely used in the electronic, electrical, optoelectronic and medical device industries. The cured polymer
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 27 µin/in-F
- Tensile Strength (Break): 7,500 psi
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Supplier: MacDermid Alpha Electronics Solutions
Description: Provides the ultimate in thermal conductivity with a very wide temperature range obtained by using silicone base oils. Product Overview HTSP Silicone Heat Transfer Compound Plus is a modified "Plus" version of Electrolube’s successful HTS, offering superior thermal conductivity and a wide
- Use Temperature: 392 F
- Thermal Conductivity: 3 W/m-K
- Type: Electrical Insulation / Dielectric
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: R. S. Hughes Company, Inc.
Description: Momentive clear RTV12A potting & encapsulating compound is compatible with ceramic, metal and plastic materials with a 72 hr cure time.
- Dielectric Strength: 400.000000000001 kV/in
- Features: Encapsulant / Potting Compound
- Cure / Technology: Room Temp. Cure / Vulcanizing
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Supplier: Epoxies Etc...
Description: UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an
- Viscosity: 5,000 cP
- Substrate Compatibility: Ceramic / Glass, Dissimilar Substrates, Metal
- Features: Die Bonding Adhesive / Compound, Elastomeric, Encapsulanting / Potting, Flexible / Dampening, Gap Filling Sealant / FIP Gasket, Liquid, UV / Radiation Cured (EB, Light), Unfilled
- Industry: Electronics, OEM / Industrial
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Supplier: Advanced Abrasives Corp.
Description: Premalox Cer-Preme 100 Cerium Oxide Compound Powder Cer-Preme 100 Cerium Oxide Compound Powder was developed using our Cer-Preme 99.95% pure cerium oxide powder. It is ideally suited for polishing ophthalmic lenses and optical glass. With a particle size between 0.5 and 1.5 microns,
- Material Type: Ceria / Cerium Oxide
- Applications: Optics / Optical Grade
- Features: Other
- Shape / Form: Powder / Aggregate (Grain / Grog)
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Supplier: Advanced Abrasives Corp.
Description: Premalox Cer-Preme 35 Cerium Oxide Compound Powder Cer-Preme 35 Cerium Oxide Compound Powder was developed using our Cer-Preme 99.95% pure cerium oxide powder. It is ideally suited for polishing ophthalmic lenses and optical glass. With a particle size between 0.5 and 1.5 microns,
- Material Type: Ceria / Cerium Oxide
- Applications: Optics / Optical Grade
- Features: Other
- Shape / Form: Powder / Aggregate (Grain / Grog)
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Featured Products Top
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Suitable for fields such as cadmium zinc telluride, zinc sulfide, zinc selenide crystals, metallography, optical crystals, seals, sealing rings, metal hard alloys, sapphire, silicon carbide, and superhard ceramics. (read more)
Browse Abrasive Compounds and Abrasive Slurries Datasheets for Beijing Grish Hitech Co., Ltd. -
don’t allow for direct contact of the heat source and cold surface. Thermal gap fillers are different from thermal greases, which are designed to break down contact resistance, rather than fill gaps. Traditional gap fillers often use ceramic fillers, such as aluminum oxide or boron nitrite (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
Ducoya’s exceptional balance of physical properties propels it beyond the limits of traditional materials. Outperforming standard substances such as metallics, ceramics and polymers such as alternate polyimides PEEK and PAI (polyamide-imide), Ducoya® stands as a beacon of (read more)
Browse Resins and Compounds Datasheets for Duvelco Limited -
: Hybrid Matrix: Acrylic polymers provide the bond strength, while embedded ceramic powders ensure a low-impedance thermal path (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
material being cured, it can also be readily cured in sections up to 1/8 inch thick. It bonds well to similar and dissimilar substrates, including most plastics, metals and ceramics. Additionally, this compound has superior adhesion to glass, polycarbonates and acrylics. LED401 offers excellent (read more)
Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Master Bond, Inc. -
1014 ohm-cm. EP5LTE-100 bonds well to a wide variety of substrates including metals, glass, composites, ceramics and many plastics. It has good resistance to water and damp heat. The compound has an unlimited working life at room temperature and requires a heat cure at (read more)
Browse Leveling and Filling Compounds Datasheets for Master Bond, Inc. -
250°F. This high performance system delivers a tensile strength of 5,000-7,000 psi and a compressive strength of 18,000-20,000 psi. It bonds well to a variety of substrates such as metals, composites, ceramics, and many plastics. This dimensionally stable compound has low shrinkage upon curing (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
, glass, composites, ceramics and many plastics. It withstands a variety of chemicals such as water, oils, fuels and cleaning agents. This high temperature resistant system is serviceable over the wide temperature range of -60°F to +400°F. As a one part compound, EP3HTS-LO offers (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
flexibility and adhesion to substrates such as PCBs, ceramics, lead frames, flex circuits, and silicon. Its low modulus and low glass-transition temperature help absorb mechanical stress, reducing strain on delicate wire bonds and fine interconnects. Dual-Cure Processing Flexibility (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
temperatures. The minimum curing schedule is 20-30 minutes at 250°F or 5-10 minutes at 300°F. This is a filled system with low shrinkage upon curing and sound dimensional stability. It bonds well to a wide variety of substrates used in electronics including metals, composites, ceramics and many (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc.
Conduct Research Top
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Ceramic-Backed Elbows and Ceramic-Lined Elbows Data Sheet
The "CERAM-BACK-ELBOW"TM has a jacket across the back of the core elbow which is approximately 1/2" of ceramic compound. This compound has a Mohs hardness of 9+, second only to diamond which has a Mohs hardness of 10. The ceramic jacket and core elbow is then wrapped with an exterior material
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Why Use Ceramic Pressure Sensors
Industry professionals employ pressure sensors in a variety of applications, ranging from aerospace to oil and gas to utilities. In many cases, they are subjected to harsh operating and environmental conditions, such as high pressures, corrosive compounds, and temperature extremes. For use
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Thin Film Materials Technology: Sputtering of Compound Materials
Thin Film Materials Technology: Sputtering of Compound Materials. Rich in coverage of both historical developments and the newest experimental and technological information about ceramic thin films, this invaluable resource explains sputter deposition technology in thin film production applications.
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Factors that Affect the Thermal Conductivity of AlN Ceramic Substrates
First of all, let's overview AlN Ceramics. AlN is a covalently bonded compound with a stable structure and hexagonal wurtzite structure without the existence of other allotypes. Its crystal structure is the AlN4 tetrahedron produced by the disproportionation of aluminum atoms and adjacent nitrogen
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Five Factors to Consider when Molding PEEK
be reached on most standard injection moulders with cylinder heaters without the need for modifications. If modifications are required these are usually for the heater bands or thermocouples/controllers. We suggest you use ceramic heater bands as they provide the most consistent processing. Additionally
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Indicates content that may require registration and/or purchase.
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Extrusion in Ceramics
Rheology and Extrudability of Ceramic Compounds . . . . . . . . . . . . . .
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Ceramic Materials: Processes Properties and Applications
Ceramic Compounds : Ceramic Materials . . . . . . . . . . . . . .
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Manual for Technical product design
Furthermore, soldering is and sweats technique with that the cermet compounds can be produced.
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ZCP2012IBSCCGJ
forging dies are made of metal- ceramic compounds .
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ZCP2012IBSC101
forging dies are made of metal- ceramic compounds .
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Manual for Technical product design
Furthermore, soldering is and sweats technique with that the cermet compounds can be produced.
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The influence of composition on hardness of grinding wheels with a reduced cBN concentration
DOI: 10.3103/S1063457615010074 Keywords: reduced concentration, cubic boron nitride, vitrified bond, composition of an abrasive– ceramic compound .
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Advanced Engineering and Materials
During the process, evaporated metals and metal alloys enter the plasma state to combine with the ionised process gas (nitrogen) and eventually condense on the substrate surface, as part of ceramic compounds .
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Low cost ceramic moulding composites: materials and manufacturing technology
Moulding of the CDMC was carried out normally a week after the compounding made and it was later found that the shelf life of the ceramic compound could be extended to as long as six mouths, depending on the seals of the …
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Precursor‐derived Covalent Ceramics *
Precursor synthesis, polymerization and cross-linking provide a means to vary the specific properties of the pre- ceramic compounds such as composition, solubility, fusibili- ty or viscosity extensively providing a versatility in process- ing and shaping capabilities similar to that enjoyed with …