Die Bonder

Description: Overview The Palomar 6500 high precision component placement Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless, and medical applications. This eutectic and epoxy die

Description: Overview Palomar Technologies' 3880 Die Bonder component placement die attach system features a state of the art, integrated Z-Theta bidirectional 8-tool bond head, making it the fastest and most reliable multiple die-type bonder on the market. The machine’s

Description: Overview Developed for the demanding needs of the optoelectronics market, the 6532HP exceeds industry standards for placement accuracy and production speed. 1.5 micron high precision placement accuracy and speeds up to 1200 UPH means maximum throughput for you and your customers. Automated

Description: is essential in semiconductor packaging, where the bonding wire must be placed accurately on micro-sized pads.· In wire bonding, especially ultrasonic bonding, reducing vibration in the bonding tool is critical to achieve precise bonding. Applications Used in

Description: RF-SOE Disk drives Large complex hybrids RF and microwave devices High frequency passive and active components MCM power connections Fine pitch devices Running stitch interconnects (die-to-die) Ribbon bonding Low profile wire bonds

Description: Halogen lamps, max temp is 1560 °F in an oxidizing atmosphere

• Coeff. of Thermal Expansion (CTE): 2 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking
• Dielectric Strength: 500 kV/in

Description: These foam disks fill gaps in covered or recessed medallions and emblems.Extended liner tab permits easy removal.

Description: Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength.

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Two Component System
• Features: Electrically Conductive Compound (Adhesive, Grease)
• Form: Powder, Specialty / Other

Description: product design or simply choosing the best suited material for your specific application. It™s our goal to help you reach your performance objectives so you can be at your best. Capabilities Lathe Cutting Die Cutting Water Jet Cutting Slitting

• Die Cutting Method: Rotary Die Cutting, Steel Rule Die Cutting
• Location: North America, Canada Only, East Asia / Pacific Only
• Materials: Electrical Insulating Material, Foam / Sponge, Plastics, PVC, Rubber, Composites
• Services Offered: CAD / CAM Support, Design Assistance, Prototype, Short Run Production, High Volume Production, Inspection / Quality Control

Description: Acrylic foam tapes are high-performance bonding tapes are effective at reducing buzz, squeak, and rattle because they absorb vibrations at the tape’s core instead of at the bond line. In addition, these tapes are also often used to: Replace mechanical fasteners Attach

• Carrier / Backing Material: Acrylic / Acrylate, Foam, Plastic / Polymer

Description: -structural applications. One of the advantages of working with a vertically integrated converter such as JBC is that in addition to die cutting the double sided foam tapes offered by well-known material partners, we can also construct the tape itself – laminating the adhesive you need to the

• Carrier / Backing Material: Foam
• Features: Double-Sided, Transfer

Description: structural integrity under high thermal and mechanical stress makes them ideal for precise, high-performance applications. Applications: Wire bonding, die attach, and molding in the semiconductor industry.

• Type: Wedge Bonder

Description: LOCTITE® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. Electrically conductive Long work life Bonds difficult to wet

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 27.78 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking
• Industry: Electronics

Description: tip of EFO wands are polished base on over decade years special experience. So it make the spark consistent and the direction from the same point always. Application Die bonding process, Wire Bonding, flip-chip bonding and MEMS packaging , High-Precision Electronics such

• Automation: Automatic
• Type: Wedge Bonder

Description: SEALER, DIE CUT, POLYOLEFIN, HEAT CURING BONDABLE PATCH

Description: tesa 4965 is an 8 mil, high performance, adhesive two side permanent bonding tape. It is used for plastic, metal, and wood bonding where temperature resistance or clarity are key requirements. tesa 4965 is ideal for creating die-cut parts for mounting and bonding

• Adhesive: Specialty / Other
• Carrier / Backing Material: PET / Polyester, Plastic / Polymer
• Thickness: 0.0081 inches

Description: die; therefore, fewer reductions are necessary. The end product products smaller, more uniform ball size on the bonding pad and reduces bonding tool problems.

• Applications: Electronics / RF-Microwave
• Metal / Alloy Types: Other / Miscellaneous Nonferrous (UNS M)
• Shape / Form: Semi-finished Shape / Mill Stock, Bar Stock, Rod / Round Bar Stock

Description: Punches & Dies DIE AMPLI-BOND 69066

Description: Punches & Dies DIE AMPLI-BOND 69066 #8

Description: Punches & Dies DIE AMPLI-BOND 69051 #6

Description: Punches & Dies DIE AMPLI-BOND 69066 #2

Description: LOCTITE® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh. Electrically conductive High thermal conductivity Solvent-free formulation Low viscosity

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking
• Form: Specialty / Other
• Industry: Electronics

Description: BondSens - Platinum Temperature Sensors are manufactured according to DIN EN 60751 and have an operating temperature range of -50 °C to +150 °C. The miniaturized RTD is designed for automatic placement in high volume applications in DIE packages where long-term stability, a good

• Length: 0.0295 inch
• Nominal Resistance: 1000 R₀ @ 0° C
• Operating Temperature: -58 to 302 F
• Sensor Technology: Wire Wound

Description: -squeak & vibration control, acrylic foams, internal gaskets, car emblems, high bond adhesives), manufacturers of electronic & medical devices, textiles & non-textiles, plastics & similar materials. Our customers convert die cut and kiss cut tapes from the world’s leading manufacturers

• Capacity / Operating Force: 35 tons
• Press Type: Clicker Press

Description: Standardizes the first order modeling of bond wires and the way bond wires are modeled in three dimensional electromagnetic field solvers. Describes the modeling of a bond wire from an integrated circuit die to a package lead in a ball or wedge type wire bond

Description: Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Unfilled
• Compound Type: Electrically Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It’s excellent

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Single Component System, Specialty / Other
• Dielectric Strength: 635 kV/in
• Elongation: 170 %

Description: used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices. Our

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 17.22 to 66.67 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Unfilled
• Compound Type: Thermally Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments,

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 22.22 to 106 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: properties are available. Rectifier diodes and thyristors are designed for the 1600V voltage class, covering a wide range of current ratings up to 770A , equivalent to a die size of more than 500mm2. Variable configurations of the thyristor gate (corner vs. center gate) enable an optimized

• Diode Applications: Rectifier Diode
• Diode Type: General Purpose (PN Junction Diodes)
• I_F: 6000 to 770000 mA

Description: Fiber-Reinforced Aluminum Oxide mounted points are engineered for blending, polishing and finishing dies, cavities, and much more. Features: Cotton fiber reinforced aluminum oxide 80 - 120 Benefits: Ideal for blending and finishing parts without changing geometry For most materials For

Description: LOCTITE ABLESTIK QMI509, Bismaleimide Resin, Die Attach, Silver filled Conductive Adhesive LOCTITE® ABLESTIK QMI509 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. This adhesive also exhibits a very low

• Coeff. of Thermal Expansion (CTE): 42.78 µin/in-F
• Thermal Conductivity: 2.8 W/m-K
• Viscosity: 8500 cP

Description: Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity and electrical insulation values, this system offers superior protection to

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 12.78 to 15 µin/in-F
• Composition: Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: Please note: SKY13434-002 is being discontinued and is not recommended for new designs.

• Actuator Type: Other
• Frequency Range: 100 to 6000 MHz
• Isolation (Port to Port): 24 to 30 dB
• Package Type: Surface Mount, Other

Description: Power Amplifier, 71 - 86 GHz. The MAAP-011106 is a bare die power amplifier that operates from 71 - 86 GHz. The amplifier provides 20 dB small signal gain. The input and output are matched to 50 O with bond wires to external board. It is designed for use as a power amplifier stage in

• Amplifier Type: Power Amplifier
• Frequency Range: 71000 to 86000 MHz
• Maximum Gain: 20 dB
• Output Intercept Point (IP³): 30 dBm

Description: Medium Power Amplifier, 71-86 GHz. The MAAM-011167 is a bare die power amplifier that operates from 71 - 86 GHz. The amplifier provides 18 dB small signal gain. The input and output are matched to 50 O with bond wires to external board. It is designed for use as a driver stage in

• Amplifier Type: Power Amplifier
• Frequency Range: 71000 to 86000 MHz
• Maximum Gain: 18 dB
• Maximum Operating Voltage: 4 volts

Description: KS130 is a fast curing silicone RTV adhesive rubber developed for the bonding of "difficult to bond" plastics like Tygon™.KS130 is a one part silicone that when applied to the substrate enables handling of the bonded assembly within an hour. When cured, the elastomer resists

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Single Component System
• Form / Function: Die Bonding Adhesive / Compound
• Industry Applications: OEM / Industrial

Description: Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures.

• Chemical / Polymer System Type: Polysulfide, Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 1.28E7 to 1.44E7 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: Macbond HTA410 Products provide high tack and peel on a wide variety of surfaces. Excellent for bonding to foams, porous materials such as fabrics and felts and other applications that require an aggressive acrylic adhesive. This product is designed with 2 release liners to provide ease of

• Features: Low Transfer / Extractable
• Width: 1524 mm

Description: The New & Improved T-85 is a pre-mixed epoxy-based heat transfer compound with higher temperature ratings and the highest possible bond strength for use in moist and corrosive environments. T-85 is typically utilized on pumps, valves and equipment where maximum bond strength for

• Cure Type / Technology: Single Component System
• Material Type: Die Bonding Adhesive / Compound, Grease / Paste
• Thermal Conductivity: 34.61 to 69.23 W/m-K
• Use Temperature: 32 to 450 F

Description: T-99 is a specialty high temperature heat transfer compound formulated to provide high thermal stability and bond strength up to 1204°C (2200°F). Unlike other grades of heat transfer compounds, it is also electrically non-conductive (when cured). It is supplied ready to use and may be applied

• Cure Type / Technology: Single Component System
• Material Type: Die Bonding Adhesive / Compound, Grease / Paste
• Thermal Conductivity: 25.96 to 51.92 W/m-K
• Use Temperature: 32 to 2200 F

Description: , cleanliness and complex material combination needs. Boyd has the ability to join and bond plastics and specific parts by ultrasonic welding or RF welding, depending on the source material. Efficient Rotary Die-Cutter Our advanced rotary die cut converting core competencies

• Die Cutting Method: Rotary Die Cutting, Steel Rule Die Cutting
• Location: North America, United States Only, Southwest US Only, Midwest US Only
• Materials: Foam / Sponge, Laminate, Plastics, Rubber
• Services Offered: CAD / CAM Support, Design Assistance, Prototype, Short Run Production, High Volume Production

Description: KS715 is a fast curing, high strength, silicone RTV adhesive rubber product engineered for applications requiring fast development of physical properties and excellent adhesion. When cured, the elastomer resists weathering, ozone, moisture, UV and high temperatures. KS715 works well in manual and

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Single Component System
• Form / Function: Die Bonding Adhesive / Compound
• Industry Applications: OEM / Industrial

Description: KS915 is a high strength, high temperature silicone RTV engineered for applications requiring fast development of physical properties and excellent adhesion. KS915 offers the highest temperature resistance of any acetoxy cure silicone currently available. When cured, the elastomer is resistant to

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Single Component System
• Form / Function: Die Bonding Adhesive / Compound
• Viscosity: Up to 500000 cP

Description: 3M® VHB™ tape is a double-sided acrylic foam tape designed to quickly adhere to materials and strengthen those bonds over time. VHB tape’s permanent bonding strength and resistances to temperatures and environmental factors make it a good option for: Joining

• Backing: Plastic / Polymer, Acrylic / Acrylate
• Type: Double-Sided

Description: MacBond Acrylic High-Tack Transfer Tape offers a low-profile thickness, features a solvent-free acrylic adhesive that is pH-neutral to avoid yellowing and offers added firmness for ease in handling, die-cutting, and finishing. It offers excellent conformability to rough or uneven

• Coating Type: Transfer
• Materials of Construction: Acrylic / Acrylate
• Thickness: 0.0020 inches

Description: MacBond Acrylic High-Tack Transfer Tape offers a low-profile thickness, feature a solvent-free acrylic adhesive that is pH-neutral to avoid yellowing and offers added firmness for ease in handling, die-cutting, and finishing. It offers excellent conformability to rough or uneven

• Coating Type: Transfer
• Materials of Construction: Acrylic / Acrylate
• Thickness: 0.0020 inches

Description: MacBond Acrylic High-Tack Transfer Tape offers a low-profile thickness, feature a solvent-free acrylic adhesive that is pH-neutral to avoid yellowing and offers added firmness for ease in handling, die-cutting, and finishing. It offers excellent conformability to rough or uneven

• Coating Type: Transfer
• Materials of Construction: Acrylic / Acrylate
• Thickness: 0.0040 inches

Description: Silvertech PT-1™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Two Component System
• Features: Electrically Conductive Compound (Adhesive, Grease)
• Industry: Electronics

Description: V764 is a 1/8" thick, firm high density 15# PVC foam, ideal for die cutting, vibration dampening and metal to metal sealing. Its high internal strength provides good abrasion resistance. Norseal® V760 series.

• Adhesive: Specialty / Other
• Carrier / Backing Material: Plastic / Polymer, PVC / Vinyl
• Thickness: 0.1250 inches

Description: Tundish nozzles, 835MB model is good for ceramics to quartz bonding

• Coeff. of Thermal Expansion (CTE): 4 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking
• Dielectric Strength: 245 kV/in

Description: 60# White Glassine Paper Liner Recommended Applications Bonding heavy-duty hanger hooks in an indoor environment Joining & mounting of nameplates POP displays and graphics Temporary placement of component die cuts for

• Adhesive: Rubber
• Carrier / Backing Material: Foam
• Features: Double-Sided
• Peel Strength / Adhesion: 7.69 lbs/in

Description: IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if

Description: 3M™ Die-Cuttable Tape DC2015PET is a 1.5 mm (0.060 in) thick, black foam tape with a clear, low-stretch, polyester liner that has been silicone coated on both sides. This tape is designed for the attachment of nameplates, badges and emblems to the exterior of vehicles. Provides high

• Features: Double-Sided

Description: acids, oil, and grease. The foam has excellent conformability and compressibility which allows it to adhere well to textured and irregular surfaces, and can easily be die cut. Applications: Mounting nameplates, signs, small die cast parts, mirrors, maps, etc. These foam tapes can be

• Adhesive: Rubber
• Carrier / Backing Material: Foam
• Features: Double-Sided
• Peel Strength / Adhesion: 6.25 lbs/in

Description: .Provides high initial adhesion, promotes successful application of narrow width, individual-lettered badges and features minimal edge-weld, helping to reduce in-plant rework. Great for die-cutting - unique handling properties enable minimal edge-welding, which helps improve the

• Features: Double-Sided

Description: initial adhesion, promotes successful application of narrow width, individual-lettered badges and features minimal edge-weld, helping to reduce in-plant rework. Great for die-cutting - unique handling properties enable minimal edge-welding, which helps improve the die-cutting process,