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  • Achieving High Accuracy Pattern Recognition for Die Bonding
    When it comes to microelectronics and photonics packaging assembly, components such as die are placed onto packages. All automated die bonding systems require some type of vision processing for the machine to accurately locate. the component before picking and placing the part. Because
  • Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination
    This paper presents a case history of a failure analysis performed on a die bond adhesion failures. Silicone contamination caused intermittent adhesive failures at the die back metallization/conductive epoxy interface. The source of the silicone contamination was identified as the adhesive film
  • Two Solutions to Static Problems in Semiconductor Die Bonder Operation
    One phase of the semiconductor manufacturing process involves a die bonding machine. Several manufacturers produce this type of equipment with similar designs for the actual bonding operation. A fine gold wire (approximately 2 mil. in diameter) is attached from the semiconductor component
  • Die Attach Adhesives Impact Product Quality Well Beyond Manufacturing
    Die attach adhesives serve a critical role in semiconductor assembly and throughout the product lifecycle. Beyond their ability to form a tight bond between die and various substrates, these adhesives...
  • Brazing a steel die into a wire drawing guide [PFS]
    A two-turn helical coil is used for brazing the assembly. Two different bonding agents are tested for the brazing application. The first bonding agent used is braze paste...
  • Brazing a steel die into a wire drawing guide [IH]
    A two-turn helical coil is used for brazing the assembly. Two different bonding agents are tested for the brazing application. The first bonding agent used is braze paste...
  • Brazing a carbide into a wire drawing die [IH]
    A two-turn helical coil is used for brazing the assembly. Two different bonding agents are tested for the brazing application. The first bonding agent used is braze paste. The assembly is heated to 1382 ºF (750 ºC) and is brazed in 45 seconds....
  • Brazing a carbide into a wire drawing die [PFS]
    A two-turn helical coil is used for brazing the assembly. Two different bonding agents are tested for the brazing application. The first bonding agent used is braze paste. The assembly is heated to 1382 ºF (750 ºC) and is brazed in 45 seconds....

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