Die Bonding

Description: placement accuracy, making component assembly practical and cost-effective. A specialized configuration of the 6500 Die Bonder for wafer scale packaging eutectic die bonding is also available. Wafer Scale Packaging (WSP) Wafer Scale Packaging (WSP) eutectic die attach on

Description: essential in semiconductor packaging, where the bonding wire must be placed accurately on micro-sized pads.· In wire bonding, especially ultrasonic bonding, reducing vibration in the bonding tool is critical to achieve precise bonding. Applications Used in

Description: DIE AMPLI-BOND 69066 3/0

Description: DIE AMPLI-BOND 69066 1/0

Description: SEALER, DIE CUT, POLYOLEFIN, HEAT CURING BONDABLE PATCH

Description: (die-to-die) Ribbon bonding Low profile wire bonds

Description: performance. This machine is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs, and high-reliability devices. Intelligent Interactive Graphical Interface® (i2Gi®) offers the required management for modern wire bonding, from part design and

Description: Halogen lamps, max temp is 1560 °F in an oxidizing atmosphere

• Use Temperature: 2,700 F
• Coeff. of Thermal Expansion (CTE): 2 µin/in-F
• Dielectric Strength: 500.00000000000006 kV/in
• Features: Ceramic / Glass, Ceramic / Inorganic Cement, Electrical Insulation / Dielectric, OEM / Industrial, Other, Thermal Compound / Interface (Thermally Conductive), Thread Locker / Retainer

Description: tesa 4965 is an 8 mil, high performance, adhesive two side permanent bonding tape. It is used for plastic, metal, and wood bonding where temperature resistance or clarity are key requirements. tesa 4965 is ideal for creating die-cut parts for mounting and bonding

• Thickness: 0.0081 inches
• Backing: PET / Polyester, Plastic / Polymer
• Features: Specialty / Other

Description: Please note: SKY13434-002 is being discontinued and is not recommended for new designs.

• Frequency Range: 100 to 6,000 MHz
• Isolation (Port to Port): 24 to 30 dB
• Features: Other
• Package Type: Surface Mount

Description: Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength.

• Use: Die Bonding Adhesive / Compound
• Features: Electrically Conductive, Specialty / Other
• Industry: Electronics
• Chemical System: Epoxy (EP)

Description: Punches & Dies DIE AMPLI-BOND 69066

Description: Standardizes the first order modeling of bond wires and the way bond wires are modeled in three dimensional electromagnetic field solvers. Describes the modeling of a bond wire from an integrated circuit die to a package lead in a ball or wedge type wire bond configuration.

Description: Materion Microelectronics & Services bonding wire and ribbon is manufactured using a proprietary hydrostatic extrusion process, providing a cleaner and more uniform wire. The extrusion process eliminates imperfections due the extreme pressure that envelops the metal as it passes through the

• Shape / Form: Bar Stock, Rod / Round Bar Stock, Semi-finished Shape / Mill Stock
• Applications: Electronics / RF-Microwave
• Features: Non-ferrous - Any Type, Other / Miscellaneous Nonferrous (UNS M)

Description: design or simply choosing the best suited material for your specific application. It™s our goal to help you reach your performance objectives so you can be at your best. Capabilities Lathe Cutting Die Cutting Water Jet Cutting Slitting Cut-to-Length Application of Pressure Sensitive Adhesive

• Services Offered: CAD / CAM Support, Design Assistance, High Volume Production, Inspection / Quality Control, Prototype, Short Run Production
• Features: Canada Only, East Asia / Pacific Only, North America
• Materials: Composites, Electrical Insulating Material, Foam / Sponge, PVC, Plastics, Rubber
• Die Cutting Method: Rotary Die Cutting, Steel Rule Die Cutting

Description: Product Overview ALPHA Argomax 8021 Film offers a ready-to-laminate solution that removes the need for printing, dispensing, and drying process steps. Optimized for use in Die Transfer Film (DTF) processes, it supports a wide range of surfaces and is customized for fast, easy die and

• Thick Film Type: Conductor
• Applications: Die Bonding, Electronics / Microelectronics
• Material: Silver / Silver Alloy

Description: Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room

• Use Temperature: -452.47 to 250 F
• Features: Aerospace, Anti-static / ESD Control, Automotive, Ceramic / Glass, Composites, EMI / RFI Shielding Material, Electrical Insulating / Dielectric, Electrically Conductive, Marine, Metal, OEM / Industrial, Other, Plastic, Porous Surfaces, Rubber / Elastomer, Specialty / Other, Tooling / Mold Material
• Use: Die Bonding Adhesive / Compound
• Industry: Electrical Power / HV, Electronics, Semiconductors / IC Packaging

Description: enables low temperature, high reliability copper to copper interconnects for Die-to-Die (D2D), Die-to-Wafer (D2W), and Wafer-to-Wafer (W2W) bonding. Product Features Novel One-Part Additive System NOVAFAB NANOTWIN Cu is a ready-to-use solution designed for use with

• Chemical / Composition: High Purity, Tin Plating

Description: These foam disks fill gaps in covered or recessed medallions and emblems.Extended liner tab permits easy removal.

Description: Diode and thyristor bare die products CAL (Controlled Axial Lifetime) freewheeling diodes are available in 600V/650V, 1200V, and 1700V voltage classes with current ratings up to 200A. Depending on the target application’s frequency, variants with custom designed switching properties are

• I_F: 6,000 to 770,000 mA
• I_FSM: 36 to 9,450 amps
• Features: General Purpose (PN Junction Diodes), Rectifier Diode

Description: Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400

• Viscosity: 200,000 to 250,000 cP
• Use Temperature: -80 to 600 F
• Tensile Strength (Break): 9,000 to 10,000 psi
• Dielectric Constant (Relative Permittivity): 4.3

Description: noise-less operation), single cylinder mechanical stop adjustment for precise cutting accuracy (+/- .01mm), quick die change, ease of use, quick change-over, and modular design. High structural quality, accurate die cutting precision, silence, power and excellent relation between

• Capacity / Operating Force: 35 tons
• Equipment Type: Clicker Press

Description: LOCTITE® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. Electrically conductive Long work life Bonds difficult to wet surfaces

• Coeff. of Thermal Expansion (CTE): 27.77777777777778 µin/in-F
• Water Absorption: 1.1 %
• Use: Die Bonding Adhesive / Compound
• Industry: Electronics

Description: Acrylic foam tapes are high-performance bonding tapes are effective at reducing buzz, squeak, and rattle because they absorb vibrations at the tape’s core instead of at the bond line. In addition, these tapes are also often used to: Replace mechanical fasteners Attach decals emblems Join

• Backing: Acrylic / Acrylate, Foam, Plastic / Polymer

Description: Product Overview A hybrid silver sintered die attach paste designed for high-power semiconductor packages with metallized dies. It features exceptional thermal conductivity, low resin bleed-out, and minimal condensable organics, ensuring outstanding package reliability in demanding

• Features: Automotive, Thermal / Heat Conductive
• Use: Die Bonding Adhesive / Compound
• Industry: Electronics, Semiconductors / IC Packaging
• Form / Shape: Grease / Paste

Description: LOCTITE ABLESTIK QMI509, Bismaleimide Resin, Die Attach, Silver filled Conductive Adhesive LOCTITE® ABLESTIK QMI509 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. This adhesive also exhibits a very low

• Viscosity: 8,500 cP
• Thermal Conductivity: 2.8 W/m-K
• Coeff. of Thermal Expansion (CTE): 42.77777777777778 µin/in-F

Description: Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity and electrical insulation values, this system offers superior protection to electronic

• Use Temperature: -100 to 400 F
• Thermal Conductivity: 1.7307 to 2.0192 W/m-K
• Coeff. of Thermal Expansion (CTE): 12.780000000000001 to 15 µin/in-F
• Tensile Strength (Break): 6,500 psi

Description: Fiber-Reinforced Aluminum Oxide mounted points are engineered for blending, polishing and finishing dies, cavities, and much more. Features: Cotton fiber reinforced aluminum oxide 80 - 120 Benefits: Ideal for blending and finishing parts without changing geometry For most materials For

Description: LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It’s excellent

• Viscosity: 150,000 cP
• Use Temperature: -58 to 356 F
• Thermal Conductivity: 2 W/m-K
• Use: Die Bonding Adhesive / Compound

Description: Product Overview ATROX® CD 560-1 offers excellent substrate compatibility and low Resin Bleed-Out (RBO), ensuring reliable bonding to Pre-Plated Frame (PPF) and copper lead frames. It provides a long pot life of over 24 hours at room temperature and maintains a 12-month shelf life when stored

• Use: Die Bonding Adhesive / Compound
• Features: Electrically Conductive Compound (Adhesive, Grease)
• Industry: Electronics, Semiconductors / IC Packaging
• Form / Shape: Film / Sheet, Grease / Paste

Description: applications. One of the advantages of working with a vertically integrated converter such as JBC is that in addition to die cutting the double sided foam tapes offered by well-known material partners, we can also construct the tape itself – laminating the adhesive you need to the foam you

• Features: Double-Sided Adhesive
• Backing: Foam
• Adhesive: Transfer

Description: Power Amplifier, 71 - 86 GHz. The MAAP-011106 is a bare die power amplifier that operates from 71 - 86 GHz. The amplifier provides 20 dB small signal gain. The input and output are matched to 50 Ω with bond wires to external board. It is designed for use as a power amplifier stage in transmit

• Frequency Range: 71,000 to 86,000 MHz
• Maximum Gain: 20 dB
• Output Power( P_1dB): 23 dBm
• Output Intercept Point (IP³): 30 dBm

Description: Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures.

• Use Temperature: -80 to 550 F
• Thermal Conductivity: 2.2 to 2.9 W/m-K
• Coeff. of Thermal Expansion (CTE): 12,777,777.777777778 to 14,444,444.444444444 µin/in-F
• Tensile Strength (Break): 7,000 to 8,000 psi

Description: Pin-point rework areas on printed circuit boards with Brady's inspection arrows. The vinyl cloth material provides a tight bond, yet may be easily removed without leaving an adhesive residue.

Description: Medium Power Amplifier, 71-86 GHz. The MAAM-011167 is a bare die power amplifier that operates from 71 - 86 GHz. The amplifier provides 18 dB small signal gain. The input and output are matched to 50 Ω with bond wires to external board. It is designed for use as a driver stage in transmit

• Frequency Range: 71,000 to 86,000 MHz
• Maximum Gain: 18 dB
• Output Power( P_1dB): 21 dBm
• Minimum Operating Voltage: 4 volts