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  • Sensoring for In-Die Tapping Applications
    All commercially-available In Die Tapping (IDT) designs today utilize some sort of spring-loaded misfeed protection system which is intended to protect the tap and, most importantly, the tapping device itself in the event of a: * No-hole condition due to a short feed of the material strip
  • Proximity sensors for stamping dies
    into the dies. Cylindrical sensors in spring-loaded lifters make sure materials are in proper position before dies close. With some die operations approaching 1,500 strokes/min, it is even more critical to ensure proper sensor placement and operation. Sensors monitor critical points in progressive
    ucked away on a Cambridge side street in the midst of the MIT campus sits one of the largest dedicated MEMS fabs on the planet. The building that once housed a Polaroid R &D facility now produces about a million die a week for Analog Devices' micromachined products division. When I visited
  • Characterizing a rapid thermal annealing process to improve sensor yield
    . In the acceleration sensor manufactured by Motorola's MEMS-1 die manufacturing group, three polysilicon plates are fabricated parallel to one another to form a dual, differential capacitive element (see Figure 1). The top and bottom plates are stationary, while the middle plate can move in the direction
  • FEA For The Shop Floor
    rolling, hydroforming, and stretchforming. Stretchforming and hydroforming can be simulated to accurately predict spring-back before building a die. In stretchforming, panels are stretched over a mandrel and then released, whereupon they spring back. These simulations allow properly forming panels
  • | Electronics Industry News for EEs & Engineering Managers
    ' survey shows TSMC rising A picture of the ebb and flow of the design, manufacturing and foundry industries is painted in a survey of attendees at this spring's Synopsys Users Group (SNUG) conference, compiled by E-mail Synopsys Users Group (ESNUG) moderator John Cooley. Tanner releases EDA tool for MEMS
  • MICRO:Top 40 - Page 2 (Nov '00)
    materials as needed. The valve opens rapidly, providing high sensitivity to changing pressure. A stainless-steel control spring does not contact the liquid. Relief or back pressure is adjustable between 5 and 100 psi, and maximum flow is 200 gal/min. Designed for wafer cleaning and thinning applications

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