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Supplier: Accuris
Description: Ceramic Dielectric Axial Capacitors (Glass Encapsulated)
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Supplier: Wacker Chemical Corp.
Description: +180 °C low ion content transparent self adhesive Application encapsulation of optical components encapsulation of electronic components fully automatic molding process of optical parts
- Index of Refraction: 1.41 #
- Transmission: 85 %
- Material Density (Theoretical): 1.0400000000000003 g/cc
- Features: Dielectric, Specialty / Other
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Supplier: Accuris
Description: Blank Detail Specification for Fixed Metallized Polyethylene-Terephthalate Film Dielectric Chip Capacitors for Direct Current - Encapsulated
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Supplier: Epoxies Etc...
Description: convenient mix ratio and excellent dielectric properties.
- Viscosity: 600 to 2,600 cP
- Use Temperature: -40 to 266 F
- Coeff. of Thermal Expansion (CTE): 126.66666666666666 µin/in-F
- Tensile Strength (Break): 150 psi
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Supplier: Dymax
Description: Dymax 9008 is engineered for chip encapsulation on flex circuits cures upon exposure to UV/Visible light and is designed for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board applications. Dymax 9008 encapsulant forms flexible, highly moisture-resistant
- Viscosity: 4,500 cP
- Features: Encapsulant / Potting Compound, Other
- Cure / Technology: UV / Radiation Cured (also EB, Light)
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Supplier: Epoxies Etc...
Description: 20-2353 is a low durometer (Shore A 50) potting, casting, and encapsulating compound. This twopart system is engineered to provide low stress on electronic components and to resist moisture. 20- 2353 provides excellent hydrolytic stability, low moisture permeability, a low glass transition
- Viscosity: 175 to 4,000 cP
- Use Temperature: -40 to 257 F
- Coeff. of Thermal Expansion (CTE): 126.66666666666666 µin/in-F
- Tensile Strength (Break): 150 psi
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Electrical and Electronic Resins - Flexible polyurethane potting & encapsulating compound -- 20-2135Supplier: Epoxies Etc...
Description: The 20-2135 is a two component, low durometer, potting, casting and encapsulating compound. This system is unfilled and low in viscosity allowing for fast self-leveling. The 20-2135 will quickly encapsulate components and electronic devices. The 20-2135 has outstanding thermal cycling properties, a
- Viscosity: 1,200 to 1,950 cP
- Use Temperature: -58 to 248 F
- Tensile Strength (Break): 150 psi
- Elongation: 50 %
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Supplier: Epoxies Etc...
Description: 20-3065 is a general purpose, low viscosity epoxy potting and encapsulating resin system. This system is a 100% reactive resin, which does not contain any solvents, plasticizers, or other additives, which downgrade physical, thermal, and electrical insulation properties.
- Use Temperature: -94 to 356 F
- Thermal Conductivity: 0.64902555 W/m-K
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Tensile Strength (Break): 7,000 psi
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Supplier: Accuris
Description: CAPACITOR, FIXED, CERAMIC DIELECTRIC, SWITCH MODE POWER SUPPLY (GENERAL PURPOSE AND TEMPERATURE STABLE), STANDARD RELIABILITY AND HIGH RELIABILITY, ENCAPSULATED, HORIZONTALLY STACKED, STYLE PS02
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 808 A two-component general purpose potting compound for electrical components. Properties include enhancement of mecahnical strength, low dielectrics, vibration and shock resistance of assembled components.
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Accuris
Description: CAPACITORS, FIXED, CERAMIC DIELECTRIC, SWITCH MODE POWER SUPPLY (GENERAL PURPOSE AND TEMPERATURE STABLE), STANDARD RELIABILITY AND HIGH RELIABILITY, ENCAPSULATED, VERTICALLY STACKED, STYLE PS05
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Supplier: MacDermid Alpha Electronics Solutions
Description: Flexible dielectric inks for printing insulating areas between flexible circuit tracks. Product Overview Autostat D5010 is a screen-printable, UV-curable dielectric ink. This ink can be used as a crossover dielectric layer to fabricate multi-layer conducting circuits on polymer
- Industry: Electronics
- Features: Other
- Substrate: Plastic
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Supplier: Bluestar Silicones USA Corp.
Description: RTV-2 for protective potting, coating and encapsulation Properties Viscosity 150000 Hardness Sha 60 Description RTV Elastomer - Two components addition cure for encapsulation/protection of electronical systems and production of moulding parts Good heat stability in confined
- Use Temperature: -94 to 572 F
- Thermal Conductivity: 0.31 W/m-K
- Coeff. of Thermal Expansion (CTE): 5 µin/in-F
- Tensile Strength (Break): 507.628937750189 to 870.221036143182 psi
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Supplier: Master Bond, Inc.
Description: Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications.
- Applied Thickness / Gap Fill: 0.003 to 0.006 inch
- Viscosity: 35,000 to 95,000 cP
- Use Temperature: -100 to 350 F
- Thermal Conductivity: 0.72 to 1.44 W/m-K
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Electrical and Electronic Resins - Dielectric Silicone Gel For Sealing Electronics -- SEMICOSIL® 925Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features Low ion content Low volatile content Low viscosity Good mechanical damping properties Application SEMICOSIL® 925 is a dielectric gel especially designed to seal, protect and preserve the
- Viscosity: 700 cP
- Dielectric Strength: 558.8000000000012 kV/in
- Dielectric Constant (Relative Permittivity): 2.5
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting Compound, Flexible / Dampening
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Supplier: Wacker Chemical Corp.
Description: ELASTOSIL® RT 2100 is a room temperature vulcanizing silicone rubber. It is especially useful for electrical insulation applications such as potting, encapsulating, embedding, sealing and environmental protection. ELASTOSIL® RT 2100 is simple to handle and offers a balanced property profile.
- Thermal Conductivity: 2.2 W/m-K
- Elongation: 130 %
- Dielectric Strength: 515 kV/in
- Dielectric Constant (Relative Permittivity): 3.8 to 4
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Supplier: Master Bond, Inc.
Description: Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme
- Applied Thickness / Gap Fill: 0.25 inch
- Use Temperature: -100 to 400 F
- Tensile Strength (Break): 6,000 to 7,000 psi
- Dielectric Strength: 45 kV/in
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Supplier: Master Bond, Inc.
Description: Key Features Free flowing viscosity High temperature resistance Exceptionally long open time Passes NASA low outgassing Product Description Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system has a
- Viscosity: 10,000 to 25,000 cP
- Use Temperature: -80 to 550 F
- Thermal Conductivity: 0.5769116 to 0.7211395 W/m-K
- Tensile Strength (Break): 5,300 to 7,500 psi
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Description: Fiber Optic Temperature Sensor with All-Dielectric Connector for Distribution Transformers. Key Features Innovative all-dielectric connectivity solution eliminates cumbersome cable handling Sensing body encapsulated in uniform protective tubing provides a compact sensor Well-defined
- Sensed Temperature: -40 to 446 F
- Diameter or Width Range: 1.1 inch
- Basic Element Used: Fiber Optic
- Probe Configuration: Flexible Probe
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Supplier: Master Bond, Inc.
Description: Key Features Low viscosity Strong adhesive Excellent physical properties, enhanced durability and toughness Low shrinkage upon cure Product Description Master Bond UV15-7NV-2 is a one component, UV curable polymer system for high performance bonding, sealing, coating and encapsulation. It has
- Operating / Use Temperature: -80 to 300 F
- Industry: Automotive, Electronics, OEM / Industrial
- Substrate: Ceramic / Porcelain, Glass, Metal, Plastic
- Features: Chemical / Oil Resistant, Dielectric, Protective, Specialty / Other, Wear Resistant (Abrasion / Erosion)
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Supplier: Datatronics™
Description: Feature Toroidal Core Transformers Encapsulated Molded Case Used for Line Coupling, Matching and Isolation Dielectric Withstanding Voltage: 500 VDC
- Power Rating: 0.5 watts
- Maximum Secondary Voltage Rating: 300 volts
- Output Voltage: 300 volts
- Power Rating (Watts): 0.5 watts
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Supplier: Allied Electronics, Inc.
Description: Dielectric Strength 2000 V/mil Fungus Resistance MIL-V-173-2
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Supplier: Allied Electronics, Inc.
Description: Dielectric Strength 2000 V/mil Fungus Resistance MIL-V-173-2
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Supplier: Allied Electronics, Inc.
Description: Urethane Coating Type UR: Resistant to Moisture, Chemicals, and Abrasion. Thermal Resistance to 248°F with Dielectric Strength of 640 Volts/mil
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Supplier: Techsil Limited
Description: RTV627 is a two part silicone rubber compound from Momentive Performance Materials designed for potting and encapsulation applications. It is especially favoured where flammability is of concern. Supplied in a matched kit which is designed for use at a 1:1 ratio by weight or volume. Potential
- Use Temperature: -60 to 204 F
- Industry: Electronics
- Features: Encapsulating / Potting, Rubber Based / Elastomeric
- Chemical System: Silicone
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Supplier: Techsil Limited
Description: RTV627 is a two part silicone rubber compound from Momentive Performance Materials designed for potting and encapsulation applications. It is especially favoured where flammability is of concern. Supplied in a matched kit which is designed for use at a 1:1 ratio by weight or volume. Potential
- Use Temperature: -60 to 204 F
- Industry: Electronics
- Features: Encapsulating / Potting, Rubber Based / Elastomeric
- Chemical System: Silicone
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Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a similar range
- Features: Encapsulating / Potting, Rubber Based / Elastomeric
- Chemical System: Silicone
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Resins and Compounds - Elastomer - RTV 2 - Polyaddition Heat Curing - Black -- Bluesil™ Esa 7252 A/BSupplier: Bluestar Silicones USA Corp.
Description: Elastomer - RTV 2 - polyaddition heat curing - Black Solventless, Very low viscosity, Quick curing, Long potlife, Excellent dielectric performances, High thermal and Fire resistance (UL 94 V0) Properties Viscosity 3200 Hardness Sha 48 Description Potting and encapsulation of electronic
- Thermal Conductivity: 0.42 W/m-K
- Tensile Strength (Break): 333.584730521553 psi
- Elongation: 170 %
- Dielectric Strength: 457.20000000000095 kV/in
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Supplier: Richardson RFPD
Description: MPEB are non-inductively wound with metallized polyester film as dielectric and electrode, and encapsulated in plastic cases, and sealed with epoxy resin. They are suitable for all applications as for DMPE type requiring rectangular shape.
- Capacitance Range: 15.000000000000002 microF
- Capacitance Tolerance: 10 (+/- %)
- DC Rated Voltage Range (WVDC): 100 volts
- AC Rated Voltage (WVAC): 100 volts
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Featured Products Top
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Knowles Syfer's SFSW series feed-through EMI filters are designed for soldering directly to a chassis or panel and are suitable for hole diameters of 3.5 mm (0.138"). Featuring a metal body and a hermetic seal on one end with epoxy encapsulation on the other, they offer superior filtering (read more)
Browse EMI Filters and RFI Filters Datasheets for Knowles Precision Devices -
of meltable liner. With it's meltable inner/adhesive liner it not only insulates, it can also encapsulate giving a watertight fit. Won't crack or peel. It's non-corrosive, has excellent resistance to soldering irons, oils, solvents, acids, alkalis, fuels, hydraulic fluids, and fungus, and it's flame (read more)
Browse Tubing Datasheets for BRIM Electronics, Inc. -
encapsulation, it ensures consistent electrical performance under high-frequency and heavy-load conditions. Designed for compact yet robust integration into power electronics, lighting, and signal circuits (read more)
Browse Capacitors Datasheets for Shenzhen Weidy Industrial Development Co., Ltd. -
Potting Materials for Electronic Applications ELANTAS offers a broad range of potting and encapsulation materials for electronic protection (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
dielectric integrity for today’s high performance modules. Bectron®and ELAN-Tron®products have been used in a wide variety of automotive and industrial electronics applications for many (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC -
resins and encapsulants is specially formulated to provide optimum protection and dielectric integrity for today’s high performance modules. Bectron®and ELAN-Tron®products have been used in a (read more)
Browse Conformal Coatings Datasheets for ELANTAS North America LLC -
SH200, SH250, SH254 & SHTF tubings have excellent resistance to weathering, chemicals (oils, fuels, solvents, acids, alkalis, fluids), and fungus, are non-corrosive, low water absorption (.01%), will not burn nor support combustion, have high dielectric strength (850V/MIL dry), low die (read more)
Browse Tubing Datasheets for BRIM Electronics, Inc. -
Custom Electrical Insulation & Dielectric Materials Follow us on: Facebook YouTube (read more)
Browse Industrial Coatings Datasheets for ELANTAS North America LLC -
. (250 kg) Multiple taps if required Dielectric strengths (hipot) from 30kV AC to 20kV DC Grade 5 or 6 encapsulation to meet MIL PRF 27 Wire sizes ranging from 1-45 AWG or copper foil up to 0.050” (1.27 mm) with multiple layers for higher currents and (read more)
Browse Inductors, Coils, and Chokes Datasheets for Triad Magnetics -
dielectric properties. For power management systems, which are critical to the operation and safety of EVs, our potting materials provide robust encapsulation that safeguards against thermal cycling, vibration, and electrical interference. This ensures long-term reliability, even in the harshest (read more)
Browse Conformal Coatings Datasheets for ELANTAS North America LLC
Conduct Research Top
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Tech Tip 25 - Dielectric Properties of Epoxies
between two conductors (as in cross over and multi-layered circuits) and for encapsulating circuits. Dielectric properties, specifically for epoxy adhesives, refer to the electrical properties of a material.
More Information Top
Indicates content that may require registration and/or purchase.
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Pulsed Dielectric Breakdown of Aluminum Oxide (ALOX) Filled Epoxy Encapsulants: Effects of Formulation and Electric Stress Concentration
Aluminum oxide (ALOX) filled epoxy is the dielectric encapsulant in shock driven high- voltage power supplies.
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Biotechnology, Chemical and Materials Engineering
With n = 1 dielectrics encapsulating , the NW dimer corresponds to a “naked” dimer without encapsulating, which was placed directly in vacuum.
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Principles of Waveform Diversity and Design
Electromag- netic practitioners, who generally lack the computational resources to solve generic problems like the one presented herein, may predict that the received power in the dielectric encapsulated dipole will be much less than when the receiving dipole is operating in …
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Physics of Multiantenna Systems and Broadband Processing
Electromagnetic practitioners, who generally lack the computational resources to solve generic problems like the one presented above, may predict that the received power in the dielectric encapsulated dipole will be much less than when the receiving dipole is operating in free …
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Fabrication of GaAs Devices
Simple multistep treatments, such as sulphidation followed by metal-ion reactions followed by dielectric encapsulation , appear to be a research area worthy of further investigation.
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The Effects Of Rapid Thermal Annealing On Si-Implanted GaAs
This loss can be minimized by the use of dielectric encapsulation , by annealing in a controlled atmosphere with As overpressure, or by proximity annealing with GaAs in close contact to another GaAs wafer or an inert substrate.
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http://dspace.mit.edu/openaccess-disseminate/1721.1/79724
This communication uses a low temperature (130°C) High Density Plasma Chemical Vapor Deposition (HDPCVD) for dielectric encapsulation of polymer cladded Si rings to make them suitable for device layer deposition.
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Rapid thermal annealing of si implanted gaas
7 The RTA of implanted GaAs has been done using dielectric encapsulation , 8'9 proximity annealing 1~or capless annealing, n'4 Variations in the latter two techniques include the annealing in either inert ambients 1~ or else with an over pressure of As.
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Electrooptic Inspection of Vector Leakage in Radiofrequency Multichip Modules
Two additional DUTs are used to compare the effect of di- electric encapsulation on electromagnetic emissions.
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Silver metallization for advanced interconnects
There is a threshold potential for the onset of corrosion, and that threshold de- pends upon the dielectric encapsulating layer and humidity of the ambient.