Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Accuris
Description: Ceramic Dielectric Axial Capacitors (Glass Encapsulated)
-
Supplier: Wacker Chemical Corp.
Description: vulcanization almost constant properties between -40 °C and +180 °C low ion content transparent self adhesive Application encapsulation of optical components encapsulation of electronic components fully automatic molding process of optical parts
- Applications: Electronics / Microelectronics
- Applications & Features: Dielectric
- Index of Refraction: 1.41 #
- Material Density (Theoretical): 1.04 g/cc
-
Supplier: Epoxies Etc...
Description: The 20-2135 is a two component, low durometer, potting, casting and encapsulating compound. This system is unfilled and low in viscosity allowing for fast self-leveling. The 20-2135 will quickly encapsulate components and electronic devices. The 20-2135 has outstanding thermal cycling
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.5
- Elongation: 50 %
-
-
Supplier: Epoxies Etc...
Description: 20-2355 is an elastomeric polyurethane potting and encapsulating system. This unique formulation is unfilled and repairable. Its low viscosity, low durometer, and room temperature cure make it an ideal candidate for the potting of sensitive and delicate electronic components. 20-2355 has a
- Coeff. of Thermal Expansion (CTE): 127 µin/in-F
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.5
-
Supplier: Epoxies Etc...
Description: 20-2353 is a low durometer (Shore A 50) potting, casting, and encapsulating compound. This twopart system is engineered to provide low stress on electronic components and to resist moisture. 20- 2353 provides excellent hydrolytic stability, low moisture permeability, a low glass transition
- Coeff. of Thermal Expansion (CTE): 127 µin/in-F
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.5
-
Supplier: Epoxies Etc...
Description: internal stress and minimal shrinkage. It is an excellent choice for potting and encapsulating electronic modules, coils, and micro electronic networks that require thermal cycling extremes and low pressure on delicate components.
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3
- Dielectric Strength: 540 kV/in
-
Supplier: MacDermid Alpha Electronics Solutions
Description: substrates such as PET. Autostat D5010 provides uniform, pinhole-free, thin insulating or encapsulation films and enables a variety of crossover structures for low-voltage circuits. This dielectric ink is particularly well suited for fabricating multi-layer circuitry for membrane touch
- Industry: Electronics
- Substrate / Surface: Plastic, Other
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Single Component System
- Dielectric Strength: 533 kV/in
- Features: Electrical Insulation / Dielectric Material
-
Supplier: Accuris
Description: Blank Detail Specification for Fixed Metallized Polyethylene-Terepht halate Film Dielectric Chip Capacitors for Direct Current - Encapsulated
-
Supplier: Dymax
Description: layer. It has a low dielectric constant for high-frequency applications. This encapsulating material may be used in attaching FPCs to various substrates including PCB and glass. Dymax materials have no solvents added and cure upon exposure to light. Their ability to cure in seconds
- Cure Type / Technology: UV / Radiation Cured (also EB, Light)
- Form / Function: Encapsulant / Potting Compound
- Industry Applications: Other
- Viscosity: 4500 cP
-
Supplier: ACCRAbond, Inc.
Description: INSTAbond® 808 A two-component general purpose potting compound for electrical components. Properties include enhancement of mecahnical strength, low dielectrics, vibration and shock resistance of assembled components.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 350 kV/in
- Features: Electrical Insulation / Dielectric Material
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 0.9 kg Kit.This is a Dow product
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 457 kV/in
- Features: Electrical Insulation / Dielectric Material
-
Supplier: Wacker Chemical Corp.
Description: dielectric gel especially designed to seal, protect and preserve the electrical characteristics of delicate electronic components (e.g. bonded chips on hybrid components which are exposed to extreme external influences).
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 2.5
- Dielectric Strength: 559 kV/in
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 3-4150 Dielectric Gel Clear-Green is a two component, fast room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flexibility, stress relief, and offers excellent
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 381 kV/in
- Features: Electrical Insulation / Dielectric Material
-
Thermoset Adhesives - Dielectric Silicone Gel For Sealing Electrical Components -- ELASTOSIL® RT2100Supplier: Wacker Chemical Corp.
Description: ELASTOSIL® RT 2100 is a room temperature vulcanizing silicone rubber. It is especially useful for electrical insulation applications such as potting, encapsulating, embedding, sealing and environmental protection. ELASTOSIL® RT 2100 is simple to handle and offers a balanced property profile.
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 3.8 to 4
- Dielectric Strength: 515 kV/in
- Elongation: 130 %
-
Supplier: Wacker Chemical Corp.
Description: extremely fast curing with Catalyst UV low hardness excellent tackiness Application Encapsulation of electronic components for the automotive and power electronics industries.
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, UV / Radiation Cured (also EB, Light)
- Dielectric Constant (Relative Permittivity): 2.7
- Dielectric Strength: 584 kV/in
-
Supplier: Accuris
Description: CAPACITOR, FIXED, CERAMIC DIELECTRIC, SWITCH MODE POWER SUPPLY (GENERAL PURPOSE AND TEMPERATURE STABLE), STANDARD RELIABILITY AND HIGH RELIABILITY, ENCAPSULATED, HORIZONTALLY STACKED, STYLE PS02
-
Supplier: Accuris
Description: CAPACITORS, FIXED, CERAMIC DIELECTRIC, SWITCH MODE POWER SUPPLY (GENERAL PURPOSE AND TEMPERATURE STABLE), STANDARD RELIABILITY AND HIGH RELIABILITY, ENCAPSULATED, VERTICALLY STACKED, STYLE PS05
-
Supplier: Bluestar Silicones USA Corp.
Description: RTV-2 for protective potting, coating and encapsulation Properties Viscosity 150000 Hardness Sha 60 Description RTV Elastomer - Two components addition cure for encapsulation/protec tion of electronical systems and production of moulding parts Good heat stability in confined
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 5 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
-
Supplier: Master Bond, Inc.
Description: Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications.
- Applied Thickness / Gap Fill: 0.0030 to 0.0060 inch
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Non-corrosive Cure, Thermal / Heat Conductive
-
Supplier: Master Bond, Inc.
Description: Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme
- Applied Thickness / Gap Fill: Over 0.2500 inch
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.6
- Dielectric Strength: Over 45 kV/in
-
Supplier: Master Bond, Inc.
Description: Supreme 121AOND is a thermally conductive, electrically insulative epoxy with superior physical strength properties and a high glass transition temperature. It has a paste consistency and a long working life.
- Applied Thickness / Gap Fill: 0.0030 to 0.0050 inch
- Coeff. of Thermal Expansion (CTE): 25 to 27.78 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
-
Description: Fiber Optic Temperature Sensor with All-Dielectric Connector for Distribution Transformers. Key Features Innovative all-dielectric connectivity solution eliminates cumbersome cable handling Sensing body encapsulated in uniform protective tubing provides a compact
- Basic Element Used: Fiber Optic
- Diameter or Width Range: 1.1 inch
- Probe Configuration: Flexible Probe
- Sensed Temperature: -40 to 446 F
-
Supplier: DuPont Electronics & Imaging
Description: polyimide film for high speed digital and high frequency flexible circuit applications. Its use in flex interconnect applications provide exceptional electrical performance. Copper Clad Features: Certified to IPC 4203A/13 Available in dielectric thicknesses of 2, 3, and
- Chemical / Polymer System Type: Specialty / Other
- Dielectric Constant (Relative Permittivity): 2.3 to 2.6
- Features: Electrically Insulating / Dielectric, Encapsulating / Potting
- Industry: Electronics, OEM / Industrial
-
Supplier: Techsil Limited
Description: RTV627 is a two part silicone rubber compound from Momentive Performance Materials designed for potting and encapsulation applications. It is especially favoured where flammability is of concern. Supplied in a matched kit which is designed for use at a 1:1 ratio by weight or volume
- Compound Type: Encapsulating / Potting
- Industry: Electronics
- Use Temperature: -60 to 204 F
-
Supplier: Techsil Limited
Description: RTV627 is a two part silicone rubber compound from Momentive Performance Materials designed for potting and encapsulation applications. It is especially favoured where flammability is of concern. Supplied in a matched kit which is designed for use at a 1:1 ratio by weight or volume
- Compound Type: Encapsulating / Potting
- Industry: Electronics
- Use Temperature: -60 to 204 F
-
Supplier: Techsil Limited
Description: Momentive RTV60 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also
- Compound Type: Encapsulating / Potting
- Industry: Electronics
- Use Temperature: -54 to 260 F
-
Supplier: Techsil Limited
Description: Momentive RTV60 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also
- Compound Type: Encapsulating / Potting
- Use Temperature: -54 to 260 F
-
Supplier: OMEGA Engineering, Inc.
Description: , sealing, encapsulating, assembling, bonding. Is a thick or thin film of cement required? This dictates whether or not an air set or a chemical set cement can be used. 2. Thermal Considerations What is the maximum temperature that the cement must withstand? What degree of thermal
- Coeff. of Thermal Expansion (CTE): 2.6 to 12.4 µin/in-F
- Cure Type / Technology: Single Component System, Two Component System
- Dielectric Constant (Relative Permittivity): 3 to 7
- Dielectric Strength: 1.3 to 101 kV/in
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 8387BM, Epoxy, Encapsulant LOCTITE® ABLESTIK 8387BM single component adhesive is designed for high throughput encapsulation applications. Non-conductive Black pigmentation for blocking stray light
- Cure Type / Technology: Single Component System
- Features: Electrical Insulating / Dielectric
- Viscosity: 9200 cP
-
Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone coating & encapsulating compound
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing, Reactive / Moisture Cured
- Elongation: 245 to 300 %
- Features: Electrical Insulation / Dielectric Material, Non-corrosive Cure
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK NCA 9300UV, Acrylate, Non-conductive adhesive, Single component, Photocurable LOCTITE® ABLESTIK NCA 9300UV single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a
- Cure Type / Technology: UV / Radiation Cured (EB, Light), Single Component System
- Features: Electrically Insulating / Dielectric, Encapsulating / Potting
- Viscosity: 70000 cP
-
Supplier: Aremco Products, Inc.
Description: , zirconium oxide, and zirconium silicate, offer unique properties with respect to operating temperature, thermal conductivity, dielectric and mechanical strength.
- Industry: Electronics
- Material Type: Conformal / Encapsulating Coating
- Use Temperature: 1150 F
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant LOCTITE® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive Good elongation strength Moderate tear
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Features: Electrical Insulation / Dielectric
- Tensile Strength (Break): 580 psi
Find Suppliers by Category Top
Featured Products Top
-
powder encapsulation enhances safety and durability. Key Features: Metallized polyester film Non-inductive winding structure Small size with good self-healing capabilities Flame-retardant epoxy powder encapsulation (read more)
Browse Film Capacitors Datasheets for Shenzhen Weidy Industrial Development Co., Ltd. -
Knowles Syfer's SFSW series feed-through EMI filters are designed for soldering directly to a chassis or panel and are suitable for hole diameters of 3.5 mm (0.138"). Featuring a metal body and a hermetic seal on one end with epoxy encapsulation on the other, they offer superior filtering (read more)
Browse EMI Filters and RFI Filters Datasheets for Knowles Precision Devices -
of meltable liner. With it's meltable inner/adhesive liner it not only insulates, it can also encapsulate giving a watertight fit. Won't crack or peel. It's non-corrosive, has excellent resistance to soldering irons, oils, solvents, acids, alkalis, fuels, hydraulic fluids, and fungus, and it's flame (read more)
Browse Tubing Datasheets for BRIM Electronics, Inc. -
encapsulation, it ensures consistent electrical performance under high-frequency and heavy-load conditions. Designed for compact yet robust integration into power electronics, lighting, and signal circuits (read more)
Browse Capacitors Datasheets for Shenzhen Weidy Industrial Development Co., Ltd. -
Potting Materials for Electronic Applications ELANTAS offers a broad range of potting and encapsulation materials for electronic protection (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
dielectric integrity for today’s high performance modules. Bectron®and ELAN-Tron®products have been used in a wide variety of automotive and industrial electronics applications for many (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC -
resins and encapsulants is specially formulated to provide optimum protection and dielectric integrity for today’s high performance modules. Bectron®and ELAN-Tron®products have been used in a (read more)
Browse Conformal Coatings Datasheets for ELANTAS North America LLC -
SH200, SH250, SH254 & SHTF tubings have excellent resistance to weathering, chemicals (oils, fuels, solvents, acids, alkalis, fluids), and fungus, are non-corrosive, low water absorption (.01%), will not burn nor support combustion, have high dielectric strength (850V/MIL dry), low die (read more)
Browse Tubing Datasheets for BRIM Electronics, Inc. -
Custom Electrical Insulation & Dielectric Materials Follow us on: Facebook YouTube (read more)
Browse Industrial Coatings Datasheets for ELANTAS North America LLC -
. (250 kg) Multiple taps if required Dielectric strengths (hipot) from 30kV AC to 20kV DC Grade 5 or 6 encapsulation to meet MIL PRF 27 Wire sizes ranging from 1-45 AWG or copper foil up to 0.050” (1.27 mm) with multiple layers for higher currents and (read more)
Browse Inductors, Coils, and Chokes Datasheets for Triad Magnetics
Conduct Research Top
-
Tech Tip 25 - Dielectric Properties of Epoxies
between two conductors (as in cross over and multi-layered circuits) and for encapsulating circuits. Dielectric properties, specifically for epoxy adhesives, refer to the electrical properties of a material.
More Information Top
Indicates content that may require registration and/or purchase.
-
Pulsed Dielectric Breakdown of Aluminum Oxide (ALOX) Filled Epoxy Encapsulants: Effects of Formulation and Electric Stress Concentration
Aluminum oxide (ALOX) filled epoxy is the dielectric encapsulant in shock driven high- voltage power supplies.
-
Biotechnology, Chemical and Materials Engineering
With n = 1 dielectrics encapsulating , the NW dimer corresponds to a “naked” dimer without encapsulating, which was placed directly in vacuum.
-
Principles of Waveform Diversity and Design
Electromag- netic practitioners, who generally lack the computational resources to solve generic problems like the one presented herein, may predict that the received power in the dielectric encapsulated dipole will be much less than when the receiving dipole is operating in …
-
Physics of Multiantenna Systems and Broadband Processing
Electromagnetic practitioners, who generally lack the computational resources to solve generic problems like the one presented above, may predict that the received power in the dielectric encapsulated dipole will be much less than when the receiving dipole is operating in free …
-
Fabrication of GaAs Devices
Simple multistep treatments, such as sulphidation followed by metal-ion reactions followed by dielectric encapsulation , appear to be a research area worthy of further investigation.
-
The Effects Of Rapid Thermal Annealing On Si-Implanted GaAs
This loss can be minimized by the use of dielectric encapsulation , by annealing in a controlled atmosphere with As overpressure, or by proximity annealing with GaAs in close contact to another GaAs wafer or an inert substrate.
-
http://dspace.mit.edu/openaccess-disseminate/1721.1/79724
This communication uses a low temperature (130°C) High Density Plasma Chemical Vapor Deposition (HDPCVD) for dielectric encapsulation of polymer cladded Si rings to make them suitable for device layer deposition.
-
Rapid thermal annealing of si implanted gaas
7 The RTA of implanted GaAs has been done using dielectric encapsulation , 8'9 proximity annealing 1~or capless annealing, n'4 Variations in the latter two techniques include the annealing in either inert ambients 1~ or else with an over pressure of As.
-
Electrooptic Inspection of Vector Leakage in Radiofrequency Multichip Modules
Two additional DUTs are used to compare the effect of di- electric encapsulation on electromagnetic emissions.
-
Silver metallization for advanced interconnects
There is a threshold potential for the onset of corrosion, and that threshold de- pends upon the dielectric encapsulating layer and humidity of the ambient.