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Supplier: Accuris
Description: STANDARD SPECIFICATION FOR POLYIMIDE RESIN FILM FOR ELECTRICAL INSULATION AND DIELECTRIC APPLICATIONS
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Supplier: Accuris
Description: Standard Specification for Polymeric Resin Film for Electrical Insulation and Dielectric Applications
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Supplier: Accuris
Description: STANDARD TEST METHOD FOR POLYIMIDE RESIN FILM FOR ELECTRICAL INSULATION AND DIELECTRIC APPLICATIONS
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Supplier: ASTM International
Description: Test Method for Polyimide Resin Film for Electrical Insulation and Dielectric Aplication (Withdrawn 1995)
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Supplier: Accuris
Description: STANDARD SPECIFICATION FOR POLYMERIC RESIN FILM FOR ELECTRICAL INSULATION AND DIELECTRIC APPLICATIONS - INCLUDES STANDARD + REDLINE (PDF)
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Supplier: Bluestar Silicones USA Corp.
Description: Silicone resin for Electrical Insulation Properties Viscosity 180 Description Silicone varnish in aromatic solvant for protection of electrical equipments such as printed circuits and electronic assemblies Can be used without catalyst and without the need for hight temperature polymerisation
- Dielectric Strength: 2,032.0000000000043 kV/in
- Dielectric Constant (Relative Permittivity): 2.7
- Use: Conformal Coating
- Features: Electrical Insulation / Dielectric, Electronics (PCB / SMT Assembly)
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Supplier: ASTM International
Description: This specification establishes the requirements for the material, dimensions and tolerances, and property values of polymeric resin films, in sheet or strip form, for use in electrical insulation and dielectric applications. Type I are flexible unsupported films for general purpose,
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Supplier: Epoxies Etc...
Description: This is a one component insulating epoxy. It is low in viscosity (400cps) and suitable for electronic applications requiring high dielectric properties. This system does not contain volatile organic compounds (VOC’s) and is designed for coating and impregnating applications.
- Dielectric Strength: 90,551,181.10236202 V/m
- Features: Dielectric, Protective
- Industry: Electronics
- Chemistry: Epoxy, Resin Base / Polymer Binder
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Supplier: Total Plastics, Inc.
Description: E96516 as a self-extinguishing material. Dielectric Sheet has low moisture absorption and good dielectric strength. It also has good dimensional stability and is easy to fabricate. Consider Dielectric sheet when using glass polyester for indoor applications. Electrical
- Form / Shape: Film / Sheet
- Features: UL Approved
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Supplier: Epoxies Etc...
Description: 20-3065 is a general purpose, low viscosity epoxy potting and encapsulating resin system. This system is a 100% reactive resin, which does not contain any solvents, plasticizers, or other additives, which downgrade physical, thermal, and electrical insulation properties.
- Use Temperature: -94 to 356 F
- Thermal Conductivity: 0.64902555 W/m-K
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Tensile Strength (Break): 7,000 psi
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Supplier: Epoxies Etc...
Description: 20-3061 is a 100% reactive epoxy resin system which does not contain any solvents or additives which downgrade physical, thermal, and electrical insulation properties. This is a filled low viscosity system which provides good flow and wet out characteristics. 20-3061 is designed for potting,
- Use Temperature: -76 to 320 F
- Thermal Conductivity: 0.33172417 W/m-K
- Coeff. of Thermal Expansion (CTE): 21.11111111111111 µin/in-F
- Tensile Strength (Break): 8,250 psi
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Supplier: Epoxies Etc...
Description: 20-3652 is a filled epoxy casting, potting, and encapsulating resin system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3652 is easily machined and exhibits outstanding adhesion to metals, ceramics and plastics. When cured with Catalyst #190 and
- Use Temperature: -85 to 320 F
- Thermal Conductivity: 0.66344834 W/m-K
- Tensile Strength (Break): 9,000 psi
- Dielectric Strength: 449.9999999999993 kV/in
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Supplier: ELANTAS North America LLC
Description: enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Use Temperature: 311 F
- Elongation: 8 %
- Tensile Strength (Break): 5,600 psi
- Dielectric Strength: 550 kV/in
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Supplier: ELANTAS North America LLC
Description: enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Use Temperature: 311 F
- Thermal Conductivity: 0.4 to 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 27.77777777777778 to 94.44444444444444 µin/in-F
- Elongation: 5 %
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Supplier: Oak-Mitsui Technologies - FaradFlex®
Description: This material is a filled dielectric which contains a high Dk ceramic powder. The thicknesses available include 25 and 16um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and
- Thickness: 0.0006299212598425197 to 0.000984251968503937 inches
- Features: Dielectric / Insulating
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C, low
- Viscosity: 690 cP
- Dielectric Strength: 533 kV/in
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: AGC Chemicals Americas, Inc.
Description: body Applications Dehumidifying agent Filler for inkjet print paper 3D printer resins Thickening agent for paints Specialized paint for electronic materials Additive for film for anti-blocking, dielectric strength improvement, and gas barrier Additives for plastics to increase hardness
- Function: Catalyst, Conditioner / Texture Modifier, Dispersing Agent / Deflocculant
- Applications: Coatings / Paint, Cosmetics / Personal Care, Fibers / Textiles, Plastics / Composites
- Features: Other
- Form & Features: Powder
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Description: composite molding over a wide range of resin systems. High elongation and a smooth, low-gel film surface allow FEP to conform to complex mold contours and produce a smooth part finish. Perforated film is available to control out gassing and resin bleed. Pigmented film aids in
- Overall Thickness: 0.0005 to 0.03 inch
- Overall Width: 48 inch
- Tensile Strength (Break): 3,500 psi
- Tensile Modulus: 70 ksi
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP19HTFL is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnates and liners. It is a one part, non mix system with "unlimited" working life at room temperature as it cures readily only at elevated
- Use Temperature: -60 to 350 F
- Tensile Strength (Break): 8,500 psi
- Elongation: 10 to 15 %
- Dielectric Strength: 870.0000000000001 kV/in
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Supplier: Protavic America, Inc.
Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.
- Viscosity: 20,000 to 30,000 cP
- Coeff. of Thermal Expansion (CTE): 13.88888888888889 µin/in-F
- Substrate Compatibility: Ceramic / Glass
- Features: Die Bonding Adhesive / Compound, Electrical Insulation / Dielectric, Gel, Other, Thermal / Heat Conductive, Unfilled
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Supplier: Protavic America, Inc.
Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at
- Features: Die Bonding Adhesive / Compound, Electrical Insulation / Dielectric Material, Gap Filling Sealant / FIP Gasket, Liquid, Specialty / Other, Thermal Insulation / Heat Insulating, Unfilled
- Industry: Electrical Power / HV, Electronics, OEM / Industrial, Semiconductors / IC Packaging
- Cure / Technology: Single Component System, Thermosetting / Crosslinking
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Supplier: DuPont Plastics, Polymers & Resins
Description: Rynite® 830ER is 30% glass reinforced with excellent high temperature dielectric properties. Class H (180C). When you're looking for the ultimate combination of stiffness, temperature performance, maximum dimensional stability, and a high gloss finish in glass reinforced resins,
- Tensile Modulus: 1,595.4052329291699 ksi
- Industry: Electronics
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Supplier: Ecolink, Inc.
Description: Description ELECTRON (A) Environmentally Preferred Dielectric Solvent is an exceptional solvent degreaser formulated without chlorinated solvents or other hazardous ingredients. The base for ELECTRON (A) is a unique high-grade oil distillate, which provides its dielectric strength,
- Type: Solvent / Solvent-based
- Features: VOC Compliant
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Supplier: Master Bond, Inc.
Description: Master Bond Supreme 11AOHTLP is a two component epoxy resin system for high performance bonding, sealing and coating. It is user friendly with a convenient one to one mix ratio by weight or volume. It cures at room temperature or more rapidly at elevated temperatures. The optimum cure is
- Use Temperature: -100 to 400 F
- Industry: Aerospace, Electronics, OEM / Industrial
- Substrate Compatibility: Ceramic / Glass, Composites, Dissimilar Substrates, Metal, Plastic
- Features: Electrical Insulation / Dielectric, Optoelectronics / Photonics, Thermal / Heat Conductive
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 2M2M is Dimethoxydimethylsilane of high purity. Special features high purity low metal content low chloride content low methanol content Application SEMICOSIL® 2M2M was developed for the semiconductor industry, e.g. as precursor for low dielectric constant interlayer
- Industry: Industrial
- Features: Molding Resin, Specialty / Other
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features Low ion content Low volatile content Low viscosity Good mechanical damping properties Application SEMICOSIL® 925 is a dielectric gel especially designed to seal, protect and preserve the
- Viscosity: 700 cP
- Dielectric Strength: 558.8000000000012 kV/in
- Dielectric Constant (Relative Permittivity): 2.5
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting Compound, Flexible / Dampening, Liquid
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Supplier: DuPont Plastics, Polymers & Resins
Description: Rynite® 530HTE NC010 is a 30% glass reinforced modified polyethylene terephthalate resin with excellent high temperature dielectric properties. When you're looking for the ultimate combination of stiffness, temperature performance, maximum dimensional stability, and a high gloss finish
- Coeff. of Thermal Expansion (CTE): 0.5 µin/in-F
- Tensile Strength (Break): 24,511.2258513663 psi
- Tensile Modulus: 1,551.8941811220102 ksi
- Elongation: 2.3 %
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Description: IEC 62631-3-12:2024 specifies a method of test for the determination of volume resistance and volume resistivity of electrical insulation materials by applying a DC voltage. It covers casting resins described in IEC 60455-3-1, IEC 60455-3-2, IEC 60455-3-3, IEC 60455-3-4, IEC 60455-3-8 and
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Insulating Varnishes and Impregnating Resins - One Component, Storage Stable Epoxy Resin -- EP19HTLVSupplier: Master Bond, Inc.
Description: Master Bond Polymer System EP19HTLV is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnates and liners. It feature remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at
- Use Temperature: -60 to 300 F
- Tensile Strength (Break): 10,200 psi
- Elongation: 3.5 %
- Dielectric Constant (Relative Permittivity): 3.9
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Description: CHEMFILM® FEP Type FS film is made from high molecular weight fluorinated ethylene propylene resin for applications where high flex life and stress-crack-resistant performance are required, such as tank linings and diaphragms. It temperature performance range and resistance to chemical attack
- Overall Thickness: 0.0005 to 0.03 inch
- Overall Width: 48 inch
- Tensile Strength (Break): 3,500 psi
- Tensile Modulus: 70 ksi
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Supplier: Techsil Limited
Description: Non-corrosive to metals and sensitive substrates Excellent dielectric properties Outstanding performance over a wide thermal range Technical Properties Uncured Consistency: Flowable Colour: Blue Tack-Free Time: 20 Mins Cured Shore Hardness: 45 Shore A Elongation: 230% Dielectric
- Features: Electrical Insulation / Dielectric, Thermal / Heat Conductive
- Industry: Electronics
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: Techsil Limited
Description: metals High elongation Good dielectric properties Excellent adhesion properties Technical Properties Uncured Consistency:Flowable Colour: Translucent Cured Shore Hardness: 28 Shore A Elongation: 370% Dielectric Strength: 23kv/ mm
- Features: Electrically Insulating / Dielectric
- Industry: Electronics
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: ASTM International
Description: level. Subsequently, all four types may be subdivided into Grade 1, which is made only from virgin resin, and Grade 2, which may be made using reprocessed resin, or a mixture of virgin and reprocessed resin. Appropriately sampled specimens shall be tested and conform accordingly
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Supplier: MacDermid Alpha Electronics Solutions
Description: dielectric constant, making it perfect for sensors. UR5118 is an excellent choice for applications subject to Radio Frequency (RF) transmissions, such as sensors in marine, automotive, or aerospace applications. Product Features Excellent Electrical Properties Low Dielectric Constant
- Use Temperature: -76 to 257 F
- Thermal Conductivity: 0.2 W/m-K
- Dielectric Strength: 457.20000000000095 kV/in
- Dielectric Constant (Relative Permittivity): 3.1
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1325 Black is a one component, heat curing, thixotropic epoxy that is used for potting, damming, staking, and bonding circuit board components, metals, and plastics. It offers low shrinkage, good dielectric properties and environmental protection. 1 gal Pail.
- Viscosity: 500,000 cP
- Thermal Conductivity: 0.36 W/m-K
- Tensile Strength (Break): 4,800 psi
- Elongation: 1 %
Find Suppliers by Category Top
Featured Products Top
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DOWNLOAD DIELECTRIC BROCHURE LAST-A-FOAM® DIELECTRIC FOAM SERIES last-a-foam rf2200LAST-A-FOAM® RF (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
DIELECTRIC BROCHURE DIELECTRIC MATERIALS General Plastics offers a variety of LAST-A-FOAM® (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
Miniature & ultra-miniature, flexible CO-AX cables. All cables are run with very flexible bare copper conductors, .008" to .005" PP resin for good dielectric properties, a 44 AWG braided tinned copper shield, 90% minimum coverage, a .012" to .010" white (read more)
Browse Coaxial Cables and Triaxial Cables Datasheets for BRIM Electronics, Inc. -
" to .005" PP resin for good dielectric properties, a 44 AWG braided tinned copper shield, 90% minimum coverage, a .012" to .010" white 90°C PVC jacket overall. MAX. OPER. VOLTAGE: 100V RMS. OPER. TEMP.: -40°C to +80°C Dielectric Strength: 1000V RMS. STD. P-U: 1000' IN STOCK NOW! CONTACT MATTHEW AARON @ TEL: 201-796-2886, E-MAIL: info@brimelectronics.com. (read more)
Browse Coaxial Cables and Triaxial Cables Datasheets for BRIM Electronics, Inc. -
Unique low-inductance internal construction methods combined with low-loss metallized polypropylene film dielectric provide high ripple current capability and lower ESL. Stud or insert terminal options offer design flexibility in a rugged UL94V-0-rated flame (read more)
Browse Film Capacitors Datasheets for Cornell Dubilier -
including aerospace, communications and microwave modules. At the heart of every Syfer resin sealed ceramic filter is a multilayer ceramic element, manufactured using our unique 'Wet Process'. Dielectric materials used include the ultra-stable C0G and stable X7R types - Z5U/Y5V is not used. This (read more)
Browse EMI Filters and RFI Filters Datasheets for Knowles Precision Devices -
compounds allow for 800V+, higher PDIV, flexibility and lower dielectric constant. Follow us on: (read more)
Browse Datasheets for AGC Chemicals Americas, Inc. -
Resistance: Ensuring reliability in humid conditions. Low Dielectric Constant (Dk) and Dissipation Factor (Df) These advantages make BT resin PCB material suitable for HDI (High-density interconnect) Multilayer PCBs and advanced packaging substrates (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
excellent insulation and dielectric stability Self-Healing Design: Automatically recovers from minor dielectric breakdowns, enhancing reliability (read more)
Browse Film Capacitors Datasheets for Shenzhen Weidy Industrial Development Co., Ltd. -
and chemists at Osborne Industries have over 35 years experience with reinforced thermoset resins to withstand the most challenging applications. One example is a blower housing used on a cotton picker. The humidity of cotton fields, combined with the abrasion inside the blower, causes metal (read more)
Browse Plastic Molding Services Datasheets for Osborne Industries, Inc.
Conduct Research Top
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Dielectric Materials for Use in Radomes
to eliminate dielectric framework scattering and wall insertion loss. [5]. Fabrication of such radomes generally involves layup or prepreg methods where a resin reinforced laminate material is bound to low or medium density polyurethane foam. Choice of layup or prepreg materials can vary depending
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Electrolube's Polyurethane Resin A Success for Tier 1 Automotive Supplier
Electrolube proposed looking at a thermally conductive resin with lower viscosity and better flow properties, to be able to fill even the smallest gaps in the unit more effectively. Furthermore, the customer also needed high dielectric strength, excellent protection to automotive fluids and support
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Polyurethane Resin Vs Silicone Resin Conformal Coating Material For Electronics
and offer increased dielectric resistance and protection against humidity, fungus, heat, corrosion, and contaminants like dust and dirt. Conformal coatings also enhance the operational integrity of the devices.
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Advantages of Laser Microscopes for Measuring the Roughness of Copper Foil used in 5G PCBs
Nicknamed the mother of electronic products, printed circuit boards (PCBs) are critical to modern electronic devices in just about every industry. A key step in manufacturing PCBs is bonding copper foil to a dielectric resin substrate. Before bonding, the copper surface is intentionally roughened
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Laser Direct Structuring LCP for Mobile Antenna Applications
The rapid growth and global demand for wireless. communication and increasing need for more functionality in smart phones have created a need for advanced engineering resin to meet new antenna requirements for mobile devices. This paper discusses performance of new laser direct structuring LCP
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Silicone Based Insulation Material for High Speed/Voltage Rotating Machines
. However, many medium and high voltage rotating machinery applications do not utilize resin rich silicone based insulation because of concerns about dielectric integrity and voltage endurance, especially with highly thermally conductive designs. Arlon has recently developed improvements in highly
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Silicone Based Electrical Insulation Material for High Speed/Voltage Rotating Machines
. However, many medium and high voltage rotating machinery applications do not utilize resin rich silicone based insulation because of concerns about dielectric integrity and voltage endurance, especially with highly thermally conductive designs. Arlon has recently developed improvements in highly
More Information Top
Indicates content that may require registration and/or purchase.
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Development of sequential build-up multilayer printed wiring boards in Japan
Key Words: High-density interconnect (HDI), resin-coated copper foil, photoimageable dielectric resin , thermally cured dielectric resin, single lamination process, subtractive process, additive process, filled via, conductive paste through hole connection, embedded passives boards .
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Americam Society of Composites: 29th Technical Conference
where V is the voltage applied to the dielectric resin , I is the current flowing through the resin, and δ is the loss angle of the resin.
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Advanced Flip Chip Packaging
(b) On both side of the core, a dielectric resin is applied by vacuum laminator and cured in a half way.
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Materials for Advanced Packaging
For the most part their cost and performance properties mirror those of the dielectric resins of the same chemical family.
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Printed Circuits Handbook, Sixth Edition > INTRODUCTION TO HIGH-DENSITY INTERCONNECTION (HDI) TECHNOLOGY
Liquid dielectric resin is coated more or less the same way as in photovia.
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Improving circuit speed through resin chemistry (a polycyanate resin for high speed PWB applications)
Experimental Low Dielectric Resin / Glass Laminate .
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MRS Online Proceedings Library - Development of porous SiLK™ Semiconductor Dielectric Resin for the 65 nm and 45 nm Nodes - Cambridge Journals Online
• Development of porous SiLK™ Semiconductor Dielectric Resin for the 65 nm and 45 nm NodesDevelopment of porous SiLK™ Semiconductor Dielectric Resin for the 65 nm and 45 nm Nodes .
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Low dielectric material for multilayer printed wiring boards
For example, polytetrafluoroethylene (PTFE) and polybu- tadiene (PB) are well-known low dielectric resins [3].
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Fabrication of a large-scale Ni stamp using a multi-level SU-8 photoresist mold for advanced printed circuit board manufacturing
First, a dielectric resin was laminated on the substrate and imprinted using the multi-level Ni stamp at a temperature above the glass transition temperature (Tg) of the dielectric resin.