Products & Services
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Supplier: Techsil Limited
Description: Offers self-adhesion properties Non-corrosive to metals and sensitive substrates Excellent dielectric properties Outstanding performance over a wide thermal range Technical Properties Uncured Consistency: Flowable Colour: Blue Tack-Free Time: 20 Mins Cured Shore Hardness: 45 Shore A
- Chemical / Polymer System Type: Silicone
- Features: Electrical Insulation / Dielectric Material, Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Supplier: Techsil Limited
Description: accelerated cure Non-corrosive to metals High elongation Good dielectric properties Excellent adhesion properties Technical Properties Uncured Consistency:Flowable Colour: Translucent Cured Shore Hardness: 28 Shore A Elongation: 370% Dielectric Strength: 23kv/ mm
- Chemical / Polymer System Type: Silicone
- Features: Electrical Insulation / Dielectric Material
- Industry: Electronics
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Supplier: Protavic America, Inc.
Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 µin/in-F
- Composition: Single Component System, Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Protavic America, Inc.
Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at
- Chemical / Polymer System Type: Specialty / Other
- Composition: Single Component System, Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrical Insulation / Dielectric Material, Thermal Insulation / Heat Insulating
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Supplier: Total Plastics, Inc.
Description: Dielectric Sheet is a cellular based laminate impregnated with thermosetting resins. Manufactured under high pressure and temperature into dense, uniform sheets having good electrical and mechanical properties. This material conforms to Nema XX thickness and flatness standard and is
- Material Type / Grade: UL Approved
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Supplier: Oak-Mitsui Technologies - FaradFlex®
Description: This material is a filled dielectric which contains a high Dk ceramic powder. The thicknesses available include 25 and 16um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor
- Features: Dielectric / Insulating
- Thickness: 6.30E-4 to 9.84E-4 inches
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Supplier: Epoxies Etc...
Description: This is a one component insulating epoxy. It is low in viscosity (400cps) and suitable for electronic applications requiring high dielectric properties. This system does not contain volatile organic compounds (VOC’s) and is designed for coating and impregnating applications.
- Chemistry: Epoxy, Resin Base / Polymer Binder
- Dielectric Strength: 9.06E7 V/m
- Features: Dielectric, Protective
- Form: Liquid
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Supplier: Bluestar Silicones USA Corp.
Description: Silicone resin for Electrical Insulation Properties Viscosity 180 Description Silicone varnish in aromatic solvant for protection of electrical equipments such as printed circuits and electronic assemblies Can be used without catalyst and without the need for hight temperature polymerisation
- Composition: Single Component System
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 2.7
- Dielectric Strength: 2032 kV/in
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Supplier: Epoxies Etc...
Description: 20-3061 is a 100% reactive epoxy resin system which does not contain any solvents or additives which downgrade physical, thermal, and electrical insulation properties. This is a filled low viscosity system which provides good flow and wet out characteristics. 20-3061 is designed for potting,
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 21.11 µin/in-F
- Composition: Two Component System, Filled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Epoxies Etc...
Description: 20-3060 is a 100% reactive resin which does not contain any solvents, diluents, plasticizers or additives which downgrade physical, thermal, and electrical insulation properties.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.51
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Supplier: Epoxies Etc...
Description: 20-3065 is a general purpose, low viscosity epoxy potting and encapsulating resin system. This system is a 100% reactive resin, which does not contain any solvents, plasticizers, or other additives, which downgrade physical, thermal, and electrical insulation properties.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Composition: Two Component System, Filled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Accuris
Description: STANDARD TEST METHOD FOR POLYIMIDE RESIN FILM FOR ELECTRICAL INSULATION AND DIELECTRIC APPLICATIONS
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Supplier: Accuris
Description: STANDARD SPECIFICATION FOR POLYIMIDE RESIN FILM FOR ELECTRICAL INSULATION AND DIELECTRIC APPLICATIONS
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Supplier: DuPont Plastics, Polymers & Resins
Description: Rynite® 530HTE NC010 is a 30% glass reinforced modified polyethylene terephthalate resin with excellent high temperature dielectric properties. When you're looking for the ultimate combination of stiffness, temperature performance, maximum dimensional stability, and a high gloss
- Coeff. of Thermal Expansion (CTE): 0.5000 µin/in-F
- Dielectric Constant: 4.1
- Dielectric Strength: 546 kV/in
- Elongation: 2.3 %
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Supplier: DuPont Plastics, Polymers & Resins
Description: Rynite® 830ER is 30% glass reinforced with excellent high temperature dielectric properties. Class H (180C). When you're looking for the ultimate combination of stiffness, temperature performance, maximum dimensional stability, and a high gloss finish in glass reinforced resins
- Industry: Electronics
- Tensile Modulus: 1595 ksi
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Plastic Sheet and Plastic Film - CHEMFILM Fluorinated Ethylene Propylene Resin Release Fim -- FEP-RF
Description: FEP Type RF, release film, is a clear or pigmented film manufactured from fluorinated ethylene propylene resin. FEP-RF is specifically desired for release applications. The non-stick surface, chemical resistance, and 205°C (400°F) usage temperature make Saint-Gobain's FEP an ideal
- Chemical / Polymer System Type: Specialty / Other
- Elongation: 300 %
- Filler Material: Unfilled
- Industry: General Industrial
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Electrical and Electronic Resins - Dielectric Silicone Gel For Sealing Electronics -- SEMICOSIL® 925Supplier: Wacker Chemical Corp.
Description: dielectric gel especially designed to seal, protect and preserve the electrical characteristics of delicate electronic components (e.g. bonded chips on hybrid components which are exposed to extreme external influences).
- Chemical / Polymer System Type: Silicone
- Composition: Single Component System
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 2.5
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Supplier: ELANTAS North America LLC
Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): Up to 3.2
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Description: IEC 62631-3-12:2024 specifies a method of test for the determination of volume resistance and volume resistivity of electrical insulation materials by applying a DC voltage. It covers casting resins described in IEC 60455-3-1, IEC 60455-3-2, IEC 60455-3-3, IEC 60455-3-4, IEC 60455-3-8 and
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Supplier: ELANTAS North America LLC
Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 25 to 75 µin/in-F
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
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Electrical and Electronic Resins - Dielectric Silicone Gel For Sealing Electronics -- SEMICOSIL® 912Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 912 is a pourable, addition-curing, 2-part silicone rubber that cures to a soft silicone gel when mixed with ELASTOSIL® CAT PT, ELASTOSIL® CAT PT-F or ELASTOSIL® CAT UV. Special features two-part, 10 : 1 mixing ratio low viscosity modular system allows flexible adjustment of pot life and
- Chemical / Polymer System Type: Silicone
- Composition: Two Component System
- Cure Type / Technology: UV / Radiation Cured (also EB, Light)
- Dielectric Constant (Relative Permittivity): 2.7
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Supplier: ASTM International
Description: This specification establishes the requirements for the material, dimensions and tolerances, and property values of polymeric resin films, in sheet or strip form, for use in electrical insulation and dielectric applications. Type I are flexible unsupported films for general purpose,
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP19HTLV is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnates and liners. It feature remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Single Component System, Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.9
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP19HTFL is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnates and liners. It is a one part, non mix system with "unlimited" working life at room temperature as it cures readily only at elevated
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Single Component System, Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.9
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Supplier: Accuris
Description: STANDARD SPECIFICATION FOR POLYMERIC RESIN FILM FOR ELECTRICAL INSULATION AND DIELECTRIC APPLICATIONS - INCLUDES STANDARD + REDLINE (PDF)
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Supplier: ASTM International
Description: Test Method for Polyimide Resin Film for Electrical Insulation and Dielectric Aplication (Withdrawn 1995)
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Supplier: ASTM International
Description: 1.1 This specification covers requirements for the material, dimensions and tolerances, and property values of film, in sheet or strip form, with or without heat-sealable coatings. 1.2 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for
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Supplier: ASTM International
Description: 1.1 This specification covers requirements for the material, dimensions and tolerances, and property values of film, in sheet or strip form, with or without heat-sealable coatings. 1.2 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for
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Supplier: Master Bond, Inc.
Description: Master Bond Supreme 11AOHTLP is a two component epoxy resin system for high performance bonding, sealing and coating. It is user friendly with a convenient one to one mix ratio by weight or volume. It cures at room temperature or more rapidly at elevated temperatures. The optimum cure is
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Features: Electrical Insulation / Dielectric Material, Thermal Compound / Interface (Thermally Conductive)
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Description: Saint-Gobain has been an innovator in the industrial application of fluorocarbon resins for over 40 years. We have pioneered many sophisticated and novel film and tape products using a multi-laminar casting process. Cast PTFE based material is made up of very thin layers which have been
- Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF)
- Elongation: 400 %
- Filler Material: Unfilled
- Industry: General Industrial
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP39MHT is a low viscosity, two component, epoxy resin system for high performance potting, encapsulation, sealing and bonding. It cures readily at ambient temperatures to an exceptionally tough and thermally stable thermosetting polymer featuring outstanding
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.95
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Description: CHEMFILM® FEP Type FS film is made from high molecular weight fluorinated ethylene propylene resin for applications where high flex life and stress-crack-resista nt performance are required, such as tank linings and diaphragms. It temperature performance range and resistance to
- Chemical / Polymer System Type: Specialty / Other
- Elongation: 300 %
- Filler Material: Unfilled
- Industry: General Industrial
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 2M2M is Dimethoxydimethylsil ane of high purity. Special features high purity low metal content low chloride content low methanol content Application SEMICOSIL® 2M2M was developed for the semiconductor industry, e.g. as precursor for low dielectric constant interlayer
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Molding Resin
- Industry: Industrial
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 928 F is a pourable, thermally curable, addition-curing, one-part fluoro silicone rubber that cures to a soft silicone gel. Special features one-part, ready-to-use thixotropic behavior rapid heat cure very low hardness (gel) outstanding resistance to chemicals Application Embedding of
- Chemical / Polymer System Type: Silicone
- Composition: Single Component System
- Cure Type / Technology: Thermosetting / Crosslinking
- Form: Liquid
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Supplier: MacDermid Alpha Electronics Solutions
Description: Ultra high-performance polyurethane offering exceptional protection in various environments with excellent electrical properties. Product Overview UR5118 is a highly water-resistant, RF polyurethane resin developed as an ultra-high-performan ce encapsulation and potting
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Industry: Semiconductors / IC Packaging, Electronics
- Use: Encapsulant / Potting Compound
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Cleaning Agents and Surface Treatments - Environmentally Preferred Dielectric Solvent -- Electron-22Supplier: Ecolink, Inc.
Description: , allowing it to be used safely on all types of electrical apparatus. With its high flash point, ELECTRON-22 provides an unprecedented degree of user safety. ELECTRON-22 Environmentally Preferred Dielectric Solvent is strong enough to remove grease, fuel oil, carbon and organic resins
- Features: VOC Compliant
- Solvent / Solvent-based: Yes
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Supplier: Ecolink, Inc.
Description: , allowing it to be used safely on all types of electrical apparatus. ELECTRON (A) Environmentally Preferred Dielectric Solvent is strong enough to remove grease, fuel oil, carbon and organic resins yet safe on most plastic and rubber surfaces. Unlike other solvents, ELECTRON (A) can
- Features: VOC Compliant
- Solvent / Solvent-based: Yes
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Supplier: Techsil Limited
Description: parts against arc and corona as well as protecting them from corrosion and moisture. MG 4226 offers a high dielectric strength (4100 V/mil (dry); 3000 V/mil (wet)), with excellent moisture resistance and an excellent finish. Tack free time is 10 minutes and the service temperature range is
- Industry: Electronics
- Use: Impregnating Resin
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Supplier: Techsil Limited
Description: generator parts against arc and corona as well as protecting them from corrosion and moisture. Product Benefits High dielectric strength- 4 100 V/mil (dry); 3 000 V/mil (wet) Excellent moisture resistance Excellent finish - tough, flexible, glossy, and durable transparent coat Good adhesion
- Industry: Electronics
- Use: Impregnating Resin
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Supplier: Aremco Products, Inc.
Description: Dielectric, moisture resistant, thermocouples
- Coeff. of Thermal Expansion (CTE): 4 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Strength: 250 kV/in
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Supplier: Polyplastics USA, Inc.
Description: thermal expansion coefficient give the resin superior dimensional stability. Electrical properties are also superior, and only small changes in electrical properties are exhibited as a result of moisture absorption. Dielectric breakdown voltage is also high. Both crystalline and non
- Chemical / Polymer System Type: Polyester (PET, PBT)
- Coeff. of Thermal Expansion (CTE): 11.11 to 38.89 µin/in-F
- Deflection Temperature (@ 264 psi, 1.8 MPa): 410 F
- Dielectric Strength: 584 kV/in
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Supplier: Hapco, Inc.
Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI
- Compound Type: Casting Resin
- Dielectric Constant: 4.4 to 4.7
- Dielectric Strength: 631 kV/in
- Elongation: 13 %
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Supplier: AGC Chemicals Americas, Inc.
Description: resistance Amorphous, corrosion-free, and safe for the environment and human body Applications Dehumidifying agent Filler for inkjet print paper 3D printer resins Thickening agent for paints Specialized paint for electronic
- Applications: Coatings / Paint, Cosmetics / Personal Care, Fibers / Textiles, Plastics / Composites, Other
- Form: Powder
- Function: Catalyst, Conditioner / Texture Modifier, Dispersing Agent / Deflocculant
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Supplier: Aremco Products, Inc.
Description: Dielectric, high strength, heaters, sensors
- Coeff. of Thermal Expansion (CTE): 4.5 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Strength: 200 kV/in
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Supplier: Accuris
Description: Dielectric and resistive properties of solid insulating materials Part 3-12: Determination of resistive properties (DC methods) - Volume resistance and volume resistivity - Method for casting resins
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Supplier: Ecolink, Inc.
Description: it to be used safely on all types of electrical apparatus. With its high flash point, ELECTRON provides an unprecedented degree of user safety. ELECTRON Environmentally Preferred Dielectric Solvent is strong enough to remove grease, fuel oil, carbon and organic resins yet safe on most
- Features: VOC Compliant
- Solvent / Solvent-based: Yes
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Supplier: Ecolink, Inc.
Description: , allowing it to be used safely on all types of electrical apparatus. With its high flash point, ELECTRON 296 provides an unprecedented degree of user safety. ELECTRON 296 Environmentally Preferred Dielectric Solvent is strong enough to remove grease, fuel oil, carbon and organic
- Features: VOC Compliant
- Solvent / Solvent-based: Yes
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Supplier: Polyplastics USA, Inc.
Description: As was mentioned in the history column, commercial production of polyphenylene sulfide (PPS) was commenced in 1973 by U.S. company Phillips Petroleum. Demand has expanded over the years on account of the resin's high heat resistance. However, the material came to be known as a brittle one
- Chemical / Polymer System Type: Polysulphide
- Coeff. of Thermal Expansion (CTE): 5.56 to 22.22 µin/in-F
- Compound Type: Molding Resin
- Deflection Temperature (@ 264 psi, 1.8 MPa): 509 F
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Supplier: Aremco Products, Inc.
Description: High dielectric, use in apps to 2600 °F, moisture & acid resistant
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrical Insulation / Dielectric Material
- Form: Liquid
Find Suppliers by Category Top
Featured Products Top
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DOWNLOAD DIELECTRIC BROCHURE LAST-A-FOAM® DIELECTRIC FOAM SERIES last-a-foam rf2200LAST-A-FOAM® RF (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
DIELECTRIC BROCHURE DIELECTRIC MATERIALS General Plastics offers a variety of LAST-A-FOAM® (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
Miniature & ultra-miniature, flexible CO-AX cables. All cables are run with very flexible bare copper conductors, .008" to .005" PP resin for good dielectric properties, a 44 AWG braided tinned copper shield, 90% minimum coverage, a .012" to .010" white (read more)
Browse Coaxial Cables and Triaxial Cables Datasheets for BRIM Electronics, Inc. -
" to .005" PP resin for good dielectric properties, a 44 AWG braided tinned copper shield, 90% minimum coverage, a .012" to .010" white 90°C PVC jacket overall. MAX. OPER. VOLTAGE: 100V RMS. OPER. TEMP.: -40°C to +80°C Dielectric Strength: 1000V RMS. STD. P-U: 1000' IN STOCK NOW! CONTACT MATTHEW AARON @ TEL: 201-796-2886, E-MAIL: info@brimelectronics.com. (read more)
Browse Coaxial Cables and Triaxial Cables Datasheets for BRIM Electronics, Inc. -
Unique low-inductance internal construction methods combined with low-loss metallized polypropylene film dielectric provide high ripple current capability and lower ESL. Stud or insert terminal options offer design flexibility in a rugged UL94V-0-rated flame (read more)
Browse Film Capacitors Datasheets for Cornell Dubilier -
including aerospace, communications and microwave modules. At the heart of every Syfer resin sealed ceramic filter is a multilayer ceramic element, manufactured using our unique 'Wet Process'. Dielectric materials used include the ultra-stable C0G and stable X7R types - Z5U/Y5V is not used. This (read more)
Browse EMI Filters and RFI Filters Datasheets for Knowles Precision Devices -
compounds allow for 800V+, higher PDIV, flexibility and lower dielectric constant. Follow us on: (read more)
Browse Datasheets for AGC Chemicals Americas, Inc. -
Resistance: Ensuring reliability in humid conditions. Low Dielectric Constant (Dk) and Dissipation Factor (Df) These advantages make BT resin PCB material suitable for HDI (High-density interconnect) Multilayer PCBs and advanced packaging substrates (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
Temperature: Capable of functioning in environments up to 125°C (UL rated at 85°C). Exceptional Dielectric Strength: Rated at 4000V AC, ensuring reliable insulation and performance. Certifications: X1/Y2 capacitor certified by leading (read more)
Browse Capacitors Datasheets for Shenzhen Weidy Industrial Development Co., Ltd. -
excellent insulation and dielectric stability Self-Healing Design: Automatically recovers from minor dielectric breakdowns, enhancing reliability (read more)
Browse Film Capacitors Datasheets for Shenzhen Weidy Industrial Development Co., Ltd.
Conduct Research Top
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Dielectric Materials for Use in Radomes
to eliminate dielectric framework scattering and wall insertion loss. [5]. Fabrication of such radomes generally involves layup or prepreg methods where a resin reinforced laminate material is bound to low or medium density polyurethane foam. Choice of layup or prepreg materials can vary depending
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Electrolube's Polyurethane Resin A Success for Tier 1 Automotive Supplier
Electrolube proposed looking at a thermally conductive resin with lower viscosity and better flow properties, to be able to fill even the smallest gaps in the unit more effectively. Furthermore, the customer also needed high dielectric strength, excellent protection to automotive fluids and support
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Polyurethane Resin Vs Silicone Resin Conformal Coating Material For Electronics
and offer increased dielectric resistance and protection against humidity, fungus, heat, corrosion, and contaminants like dust and dirt. Conformal coatings also enhance the operational integrity of the devices.
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Advantages of Laser Microscopes for Measuring the Roughness of Copper Foil used in 5G PCBs
Nicknamed the mother of electronic products, printed circuit boards (PCBs) are critical to modern electronic devices in just about every industry. A key step in manufacturing PCBs is bonding copper foil to a dielectric resin substrate. Before bonding, the copper surface is intentionally roughened
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Laser Direct Structuring LCP for Mobile Antenna Applications
The rapid growth and global demand for wireless. communication and increasing need for more functionality in smart phones have created a need for advanced engineering resin to meet new antenna requirements for mobile devices. This paper discusses performance of new laser direct structuring LCP
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Silicone Based Insulation Material for High Speed/Voltage Rotating Machines
. However, many medium and high voltage rotating machinery applications do not utilize resin rich silicone based insulation because of concerns about dielectric integrity and voltage endurance, especially with highly thermally conductive designs. Arlon has recently developed improvements in highly
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Silicone Based Electrical Insulation Material for High Speed/Voltage Rotating Machines
. However, many medium and high voltage rotating machinery applications do not utilize resin rich silicone based insulation because of concerns about dielectric integrity and voltage endurance, especially with highly thermally conductive designs. Arlon has recently developed improvements in highly
More Information Top
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Development of sequential build-up multilayer printed wiring boards in Japan
Key Words: High-density interconnect (HDI), resin-coated copper foil, photoimageable dielectric resin , thermally cured dielectric resin, single lamination process, subtractive process, additive process, filled via, conductive paste through hole connection, embedded passives boards .
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Americam Society of Composites: 29th Technical Conference
where V is the voltage applied to the dielectric resin , I is the current flowing through the resin, and δ is the loss angle of the resin.
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Advanced Flip Chip Packaging
(b) On both side of the core, a dielectric resin is applied by vacuum laminator and cured in a half way.
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Materials for Advanced Packaging
For the most part their cost and performance properties mirror those of the dielectric resins of the same chemical family.
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Printed Circuits Handbook, Sixth Edition > INTRODUCTION TO HIGH-DENSITY INTERCONNECTION (HDI) TECHNOLOGY
Liquid dielectric resin is coated more or less the same way as in photovia.
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Improving circuit speed through resin chemistry (a polycyanate resin for high speed PWB applications)
Experimental Low Dielectric Resin / Glass Laminate .
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MRS Online Proceedings Library - Development of porous SiLK™ Semiconductor Dielectric Resin for the 65 nm and 45 nm Nodes - Cambridge Journals Online
• Development of porous SiLK™ Semiconductor Dielectric Resin for the 65 nm and 45 nm NodesDevelopment of porous SiLK™ Semiconductor Dielectric Resin for the 65 nm and 45 nm Nodes .
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Low dielectric material for multilayer printed wiring boards
For example, polytetrafluoroethylene (PTFE) and polybu- tadiene (PB) are well-known low dielectric resins [3].
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Fabrication of a large-scale Ni stamp using a multi-level SU-8 photoresist mold for advanced printed circuit board manufacturing
First, a dielectric resin was laminated on the substrate and imprinted using the multi-level Ni stamp at a temperature above the glass transition temperature (Tg) of the dielectric resin.
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