Encapsulant

Description: Encapsulants

• Coeff. of Thermal Expansion (CTE): 10 µin/in-F
• Viscosity: 20000 cP

Description: TECHNOMELT PA 638, Polyamide, Molding compound thermoplastic TECHNOMELT® PA 638 high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of fragile

• Chemical / Polymer System Type: Polyamide
• Form / Function: Encapsulant / Potting Compound
• Use Temperature: 40 to 212 F
• Viscosity: 4000 cP

Description: TECHNOMELT AS 8998, Hot Melt Polyolefin, Masking TECHNOMELT® AS 8998 peelable hot melt adhesive is recommended for use for masking off areas that needs protection before conformal coating applications. It is formulated to have excellent slump resistance up to 100 °C. TECHNOMELT AS 8998 is compatible

• Cure Type / Technology: Thermoplastic / Hot Melt
• Form / Function: Encapsulant / Potting Compound
• Viscosity: Up to 4000 cP

Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include

• Chemical / Polymer System Type: Silicone
• Coeff. of Thermal Expansion (CTE): 111 µin/in-F
• Composition: Filled
• Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive

Description: PTS-46323™ is a two-component ONE TO ONE MIX RATIO silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible

• Chemical / Polymer System Type: Silicone
• Composition: Filled
• Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include

• Chemical / Polymer System Type: Silicone
• Coeff. of Thermal Expansion (CTE): 111 µin/in-F
• Composition: Filled
• Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive

Description: LOCTITE STYCAST 2651, Dielectric Grade, Epoxy, Encapsulant LOCTITE® STYCAST 2651 is a dielectric grade epoxy encapsulant designed for general purpose applications and has excellent adhesion to a wide variety of substrates. LOCTITE STYCAST 2651 can be used with a variety of catalysts.

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 67.78 µin/in-F
• Cure Type / Technology: Two Component System
• Viscosity: 225000 cP

Description: OLED Encapsulant LG Chem developed the OLED Encapsulant that is superior to the existing packing material. LG Chem developed the face seal OLED Encapsulant whose performance is superior to the existing packing materials, improving the lifespan of an OLED display element

• Form / Function: Encapsulant / Potting Compound

Description: PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and bond

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Composition: Filled
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Two Component System

Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a similar range and is

• Chemical / Polymer System Type: Silicone
• Form / Function: Encapsulant / Potting Compound
• Rubber Based / Elastomeric: Yes

Description: This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system. These elastomeric systems are suitable for a variety of

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Coeff. of Thermal Expansion (CTE): 111 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: LOCTITE STYCAST ES 4322FC liquid epoxy encapsulant is for protection of semiconductor devices. It is a high flow material which requires a cavity flow control barrier to prevent excessive flow. It is used for the encapsulation of bare chips mounted to plastic substrates and potting of small

• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound

Description: Henkel Loctite STYCAST 2 CN Clear, formerly Emerson and Cuming, is a two component, room temperature curing, silicone encapsulant that is used for potting, replacing, and repairing applications. It offers good visibility, high temperature properties, repairability, and flexibility. 1 qt Can.

• Chemical / Polymer System Type: Silicone
• Form / Function: Encapsulant / Potting Compound
• Viscosity: 1700 cP

Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid which is

• Chemical / Polymer System Type: Silicone
• Coeff. of Thermal Expansion (CTE): 4.44 µin/in-F
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System

Description: CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and 10% Deep Section Catalyst by

• Cure Type / Technology: Two Component System, Specialty / Other
• Dielectric Strength: 353 kV/in
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound

Description: UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE).

• Coeff. of Thermal Expansion (CTE): 19.44 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.5
• Dielectric Strength: 450 kV/in
• Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting

Description: strength. The ALPHA HiTech EN21-4210 is a non-reworkable encapsulant product option. Excellent Adhesion Strength Imparts Waterproofing Properties Resists Migration in Flux Residue Halogen-Free Complies with RoHS Directive 2015/863/EU

• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging

Description: ENCAPSULANT, SILICONE DIELECTRIC GEL

Description: WACKER SilGel® 611 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a soft silicone gel. WACKER SilGel® 611 A/B is a white colored modification of WACKER SilGel® 612 with higher hardness and reactivity. Special features two-part, 1 : 1 mixing ratio low

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound

Description: 20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100 exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. This system is also

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Coeff. of Thermal Expansion (CTE): 83.33 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temperature Curing, Two Component System
• Dielectric Constant (Relative Permittivity): 4.1

Description: MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation.

• Applied Thickness / Gap Fill: Over 1 inch
• Chemical / Polymer System Type: Silicone
• Composition: Unfilled
• Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive

Description: SOLAR ASCE™ is the brand name of our cross-linking polyolefin (PO) base encapsulating sheet. Mitsui Chemicals was the pioneer in developing a cross-linking type PO encapsulant and have been in high volume manufacturing for several years. The various properties from our unique material

• Materials of Construction: Plastic / Polymer, Polyolefin (PE, HDPE, PP)
• Type: Film / Flexible Substrate

Description: SILICONE POTTING COMPOUND 1KG GR

• Form / Function: Encapsulant / Potting Compound
• Thermal Conductivity: 2.8 W/m-K
• Use Temperature: Over -13 F

Description: Loctite 348 orange one-part potting & encapsulating compound. Formerly known as Loctite Chipbonder.

• Form / Function: Encapsulant / Potting Compound

Description: IEC 62788-1 2:2016 provides a method and guidelines for measuring the volume resistivity of materials used as encapsulation, edge seals, front-sheets, backsheets, or any other insulating material in a photovoltaic (PV) module. The test is performed on dry, humid or wet preconditioned samples. In the

Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a similar range and is

• Compound Type: Encapsulating / Potting

Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond R-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond™ R-30-6 Series

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Cure Type / Technology: Two Component System
• Form / Function: Encapsulant / Potting Compound
• Viscosity: 11000 to 17000 cP

Description: DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Specialty / Other
• Form / Function: Encapsulant / Potting Compound
• Viscosity: 62500 cP

Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 20.56 to 83.89 µin/in-F
• Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability

• Compound Type: Thermally Conductive
• Cure Type / Technology: Two Component System, Specialty / Other
• Dielectric Strength: 470 kV/in
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

Description: INSTAbond® 808LV A general purpose epoxy encapsulant that features good electrical and mechanical properties for applications requiring low viscosity or higher flow properties.

• Chemical / Polymer System Type: Epoxy (EP)
• Form / Function: Encapsulant / Potting Compound

Description: Dow DOWSIL™ ME-4132 Silicone Encapsulant Black is a one component encapsulant that has high purity, excellent adhesion, low modulus of elasticity, and no byproducts during cure. It is primarily used for the micro- and optoelectronic packing industry. 453 g Bottle.

• Compound Type: Encapsulating / Potting
• Cure Type / Technology: Single Component System
• Dielectric Strength: 508 kV/in
• Elongation: 138 %

Description: DuPont™ Pyralux® HXI is DuPont™ Kapton® black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It offers thinner construction than Pyralux® HXC, but similar mechanical and process properties. It is coated on one side with a proprietary B-staged

• Chemical / Polymer System Type: Specialty / Other
• Compound Type: Electrical Insulation / Dielectric
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound

Description: KSC12028 is a silicone RTV gel developed for electronic applications requiring a re-penetrable self-sealing, silicone gel product. KSC12028 is a two part, solvent free, 1:1 mix ratio silicone that when mixed cures in 12 hours at room temperature. Alternatively, KSC12028 can be cured in approximately

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Single Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound

Description: Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,

• Chemical / Polymer System Type: Silicone, Ceramic / Inorganic Cement
• Composition: Filled
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Form / Function: Encapsulant / Potting Compound