GaAs Wafer

Description: InGaAs/InP Epitaxial Wafers With 'SuperLong' Wavelengths from 1.7µm - 2.6µMarktech Optoelectronics offers the highest purity InGaAs/InP Epitaxial Wafers in the industry today. Sophisticated manufacturing processes have been put in place to customize and produce high quality Indium

Description: The FTI-1000 is a purpose-built ATE system designed for high-coverage wafer-level testing of power discrete devices, wide-bandgap components, and gate-driver-integrated power ICs. Suitable for both engineering characterization and high-volume wafer sort, the system integrates

• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: The FTI-1000 is a purpose-built ATE system designed for high-coverage wafer-level testing of power discrete devices, wide-bandgap components, and gate-driver-integrated power ICs. Suitable for both engineering characterization and high-volume wafer sort, the system integrates

• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: Wide bandgap SiC technology is opening up a whole new generation of high voltage power products for applications in transport, power transmission and green energy. M2 Wafer edition tests these upto 10kV on wafer before singulation, identifying defective product early and saving the

• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy Str 7Ckt

• Voltage Rating: 125 volts
• Current Rating: 2 amps
• Contact Resistance: 20 milliohms
• Operating Temperature: -40 to 105 C

Description: Fast scribing speeds; high yield rates; high production capacity Produces high-quality results with no residue or melt-back Fully-automatic processing; integrated coating application, wafer cutting, and cleaning functions Laser type: DPSS 355nm ultraviolet laser Laser power: ≥5W Cooling

• Laser Output Power: 0 to 5 watts
• Type: Complete / Turnkey System
• Laser Operation: Laser Cutting
• Options / Components: Laser Head / Focusing Unit, Laser Optics / Beam Delivery, Laser System Enclosure, Monitoring Sensors / System

Description: Wide bandgap SiC technology is opening up a whole new generation of high voltage power products for applications in transport, power transmission and green energy. M2 Wafer edition tests these upto 10kV on wafer before singulation, identifying defective product early and saving the

• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: The wafer edge grinders are designed to grind edge and circumference of a wide variety of wafers including silicon, compound semiconductors, such as, SiC, GaN, GaAs, and InP, oxide wafers, such as sapphire, quartz, LT, and LN, and glass, at high precision through

• Maximum Wafer / Part Size: 50.799972568014816 to 203.19989027205926 mm
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: The wafer surface inspection system LS series can detect defects on unpatterned wafers with a mirror-finished surface. Applied technology of laser scattering achieves high sensitivity and high throughput detection of small contaminants and various types of defects on wafer

• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Wafer Probing System

Description: Wafers and blanks are produced from crystals grown using the Kyropoulos method. Advantages of our wafers: high material purity: > 99.997%; low impurity content Ti: < 1 ppm; low dislocation density: < 103 cm-2; orientation tolerance: up to ± 0.05 degrees. Sapphire wafers for

• Thickness / Wall Thickness: 0.005905515 to 0.0393701 inch
• Diameter: 2 to 10 inch
• Width / O.D.: 2 to 10 inch
• Features: Dielectric Ceramics / Materials

Description: observation, it is particularly suitable for low-magnification microscopic observation and macro lens observation, such as void detection and pattern inspection of Si-bonded wafers, and inspection of damage to agricultural products.

Description: The NWL200 series is the first lineup of wafer loaders for inspection microscopes capable of loading 100 micron thin wafers. Thanks to a new chuck system, the NWL200 series achieves highly reliable loading suitable for inspection of next-generation semiconductors. Improved

• Maximum Wafer / Part Size: 200 mm
• Measurements: Defects / ADC
• Mounting / Loading: Floor Mounted / Stand-alone
• Features: Non-contact, Non-destructive, Other

Description: Temptronic ThermoChucks are conductive heating and cooling systems for wafer testing at temperature. Its primary use is for wafer testing in Probe Stations, as well as Laser Trim and Wafer Burn-in. A few specialized applications include Low leakage probing (fA level), and High

• Actuation: Electric
• Chuck Type: Wafer Chuck

Description: sori, site and global flatness. User-defined and ASTM/SEMI compliant scan patterns are used to generate full 3-dimensional (3D) wafer images. Customized data reports are available for viewing tabular data of each wafer measured with quick, easy export to your spreadsheet program.

• Maximum Wafer / Part Size: 300.00000000000006 mm
• Measurements: Area Mapping, Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
• Technology: Capacitance / EM Gage
• Mounting / Loading: Manual Loading

Description: A ceramic wafer chuck is a specialized tool employed in the semiconductor industry to hold wafers in a secure position. It functions as a stable platform that guarantees consistent contact and precise positioning of the wafer during many procedures, including lithography,

• Features: Alumina / Aluminum Oxide, Specialty Ceramic
• Applications: Chemical / Materials Processing, Electrical / HV Parts
• Specialty Ceramic Type: Silicon Carbide, Silicon Nitride, Tungsten Carbide (WC)
• Shape / Form: Wafer Carrier / Holder

Description: Butterfly valves for waterworks purposes, Part 1: Wafer and lugged

Description: EL-CAT Inc. is a stocking distributor of Silicon Wafers, Compound Semiconductors and other Crystal Materials for use in electronics.

Description: the 1.0 um to 2.6um range, using InP material as the base substrate. Marktech is currently producing these high reliability wafers in 2", 3" and 4" diameters. Among the applications for these wafers are photo detectors, linear arrays and image sensors. Photo detectors processed using

• Active Area Diameter or Length: 0.30000000000000004 mm
• Photodiode Material: Indium Gallium Arsenide
• Features: Other
• Photodiode Type: PIN Photodiode

Description: Rigaku's WaferX 300 represents the culmination of 25 years of experience in the X-ray fluorescence analysis of thin films on silicon wafers. Specifically developed as an in-process metrology tool, the system incorporates "bridge tool" technology — servicing 6", 8", as well as the latest 12"

• Maximum Wafer / Part Size: 150.00000000000003 to 300.00000000000006 mm
• Measurements: Composition, Thickness - Film / Layer
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: ICC supply material blanks, as cut,lapped and 2” to 8” wafers. Include optical,mirror and semiconductor grade silicon material.

• Features: Specialty / Other

Description: MDT's magnetic sensor foundry has the capability to fabricate 6 inch (currently)/8 inch(in plan) wafers at 0.5-micron (μm).Unlike other wafer foundries in Mainland China, MDT's foundry specializes in magnetic device wafer fabrication, providing professional service with the

• Processes: 0.50µm Process
• Services: Design / Engineering, Pilot / Scale-Up, Production, R & D / Development

Description: End effectors, also referred to as semiconductor handling "blades", are the robot's hand to handle and move semiconductor wafers between positions. So end effectors must be dimensionally precise and thermally stable, while having a smooth, abrasion-resistant surface to safely handle

• Features: Alumina / Aluminum Oxide, Carbide Materials, Silica / Silicate Materials, Specialty Ceramic
• Specialty Ceramic Type: Aluminum Nitride, Quartz, Silicon Carbide, Yttria
• Applications: Chemical / Materials Processing, Wear Parts / Tooling
• Shape / Form: Wafer Carrier / Holder

Description: Quartz boat is a loader which can be inserted by silicon wafer. So it is applied in semiconductor area. The cleaning process for quartz boat is very strictly. The boat should be dipped in concentration of 4-5% HF solutions keeped for 4 hours. Then soaked in DI water for 1 hours. Quartz boat,

• Shape / Form: Fabricated / Custom Shape
• Glass Type: Quartz
• Features: Specialty / Other

Description: Product-Wafer Metrology Made Affordable Process engineers want film thickness measurements fast and without a lot of hassle. Our innovative Thickness Imaging™ technology allows Filmetrics to offer easy recipe set up and industry-leading throughput, at a mere fraction of the cost of competing

• Measurements: Area Mapping
• Applications: CVD / PVD Films, Semiconductor Wafers
• Mounting / Loading: In-situ / System Mounted
• Form Factor: Monitor / Instrument

Description: Silicone Nitride Ceramic Wafer Material Description : Silicon nitride ceramic material has high hardness, low density, wear resistance and high temperature resistance. The rolling body is made of silicon nitride ceramic, while the other components are paired with bearing steel to form

• Density: 3.1999979803934133 g/cc
• Thermal Conductivity: 15 to 20 W/m-K
• Coeff. of Thermal Expansion (CTE): 3.3 µm/m-C
• MOR / Flexural Strength: 87,022.1036143182 psi

Description: Designer for laboratory testing and sampling, Technic’s portable tabletop wafer plating test cell features all the tools needed to simulate full scale production. Specifications 16” long, 12” wide, 14” deep constructed from ½” thick natural polypropylene with flange anode rod as required for

• Applications: Research / Surface Analysis, Semiconductor Manufacturing

Description: Wafer substrates are bonded to the semiconductor layers of LED chips. With molybdenum and molybdenum-copper wafer substrates, PLANSEE offers the optimum material for a reliable heat dissipation in LED chips. The uniform thermal expansion of the wafer substrate, sapphire

Description: Karl Kruse is a worldwide leading franchised distributor (ISO: 9001-2008 certified). A service provider specializing in the supply and material management of electronic components, since 1951. We are an innovative company who is dedicated to collaborating with customers and partners to develop and

• Features: Operational Amplifiers

Description: φ150mm ) silicone wafer , thickness 675 um . They want this part in 99% alumina ceramic . We don’t have the standard wafer boats for customer wafer size , but we custom made it . Before this projects , we have made a 99% alumina horizontal wafer boat , it is for

• Material Type: Carbide Materials, Silicon Carbide
• Shape / Form: Fabricated / Custom Shape

Description: Features Water-soluble Viscosity suitable for 150–300 mm wafers as a damming flux No residue after multiple reflow/cleaning cycles Uniform bump shape Halogen-free Suitable for SnPb and Pb-free, and high temperature applications Non-corrosive to underbump metallization Introduction

• Features: Other
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer

Description: IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer

Description: Design Wafer-type globe valve in super compact DN face-to-face length, slanted seat, bonnetless, with flange alignment holes for centering, dead-end service and downstream dismantling, insulating cap with anti-condensation feature as standard, position indicator, soft main and back seat;

• Valve Size: 0.787402 to 7.87402 inch
• Pressure Rating: 232.06032 psi
• Media Temperature: 14 to 248 F
• Number of Ports/Ways: 2

Description: FEATURES1. Face to Face dimensions as per as perANSI B16.10150# Narrow / EN558-2 Series 20.2. Suitable for mounting betweenANSI B16.5 150#flanges3. Testing as perAPI 598 / EN12266-14. Stem connection and integrated actuator mountingflange as perISO5211.5. Spring loaded stem seal.6. Elastomeric

• Valve Size: 5 inch
• Number of Ports/Ways: 2
• Features: API, ISO
• Valve Type: Butterfly Valves, Shut Off Valves