Products & Services
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Supplier: Rego Electronics Inc.
Description: A vapor chamber is a high-end thermal management device that can rapidly spread heat from a small source to a large platform of area. A properly designed vapor chamber with heat sink can improve the thermal performance by 10- 30% over copper, and heat pipe based
- Device: Vapor Cooler
- Height: Up to 3 mm
- Length: Up to 400 mm
- Width: Up to 400 mm
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Supplier: Galco Industrial Electronics
Description: Heat Sink Compound, 2ml
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Supplier: Galco Industrial Electronics
Description: Heat Sink Compound, 2 Ounce Jar
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Supplier: Accuris
Description: COMPOUND, SILICONE, HEAT SINK
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Supplier: Accuris
Description: Compound, Silicone, Heat Sink
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Supplier: Ellsworth Adhesives
Description: Techspray Silicone Free Heat Sink Compound is used to cool thermistors, calrods, thermocouple wells, and other electrical components. It is non-ozone depleting, easy to apply, and will not harden, separate, or crack. 4 oz Tube.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 0.7000 W/m-K
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Supplier: Computer Network Accessories, Inc.
Description: Single application heatsink compound; White. 1 oz. soft pack. -40~204 (degrees C); Thermal Conductivity: 0.0009.
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Supplier: Nordson EFD
Description: Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to
- Chemical / Polymer System Type: Specialty / Other
- Composition: Unfilled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
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Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
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Supplier: Accuris
Description: COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
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Supplier: Accuris
Description: Compound, Heat Sink, Silicone and/or Non-Silicone
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Supplier: Radwell International
Description: HEAT SINK COMPOUND, SILICONE FREE, TUBE, 4OZ. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability. 142 g
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Dielectric Strength: 210 kV/in
- Thermal Conductivity: 0.6700 W/m-K
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability. 9 kg
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Dielectric Strength: 210 kV/in
- Thermal Conductivity: 0.6700 W/m-K
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Supplier: Dynatron Corp.
Description: CPU Support : Intel® Sandy Bridge EP/EX Processors (for Narrow ILM Mounting Only) up to TDP 150 Watts CPU Socket : 2011 (Narrow Type, 56 x 94mm mounting pitch) Solution : New innovation 60x60x28mm PWM fan, Copper heatsink with pre-print Shin-Etsu G751 thermal compound for 2U Server
- Device: Active Heat Sink
- Fan Airflow: 40.5 SCFM
- Fan Noise: 47.5 dB
- Fan Speed: 7000 rpm
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Supplier: Richardson RFPD
Description: The thermal resistance from diode leads to chassis or heat sink is 12°C/watt, when unit is mounted with TYPE 120 Joint Compound. If a 10°C/watt chassis or sink to ambient impedance is available, the thermal resistance from the diode leads to ambient is reduced from about
- Height: 12.7 mm
- Mounting: Other
- Thermal Resistance: 12 °C / W
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Supplier: Richardson RFPD
Description: The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05°C/W for a 0.001 in film with an area of one square
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05°C/W for a 0.001 in film with an area of one square
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which
- Compound Type: Thermally Conductive
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 340 Heat Sink Compound White is a one component, non-curing, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, low bleed, thermally conductive, and has high temperature stability. 360 g
- Density / Specific Gravity (@15.6°C, 60°F): 2 specific gravity
- Kinematic Viscosity (@ 40°C): 542000 cSt
- Thermal Conductivity: 0.6700 W/m-K
- Type / Function: Lubricant
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Supplier: Techsil Limited
Description: MG Chemicals 860 Silicone Heat Transfer Compound is a low thermal resistance grease with a silicone base. It is electrically insulating, non-corrosive and used to improve the thermal interface contact conductivity between heat sinks, LEDs, motors, and heat
- Chemistry / Constituents: Silicone
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Supplier: FX PCB Co., Ltd.
Description: Heat Sink Dissipation The following methods are used by heatsink PCBs to dissipate heat: Heat transfer compounds Metal heat-conducting plate Higher copper thickness Metal core Heat transfer compounds The heat transfer
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Supplier: Xoxide
Description: Sink Dimensions (mm): 74 (l) x 125 (w) x 153 (h) INCLUDED: GC-2 Thermal Compound & Installation Kit for AMD & Intel sockets Life time MTTF at 40C (h): 50 000 Noise Level (dBA): 12 - 25.5 Static Pressure (mmAq): 1.6 Warranty (years): 5
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Encapsulants and Potting Compounds - Thermally Conductive Silicone Compound -- SEMICOSIL® 970 TC A/BSupplier: Wacker Chemical Corp.
Description: flowable almost constant properties between -40 °C and +180 °C primerless adhesion Application versatile interface material for heat sink applications for the electronics industry thermally conductive adhesive material applicable as thin interface layer between PCB and metal housings
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Xoxide
Description: -X means it not only cools your CPU, but also drives air to your surrounding components helping to cool items such as your RAM, MOSFETS, chipset heat sink, and even the back of your graphics card! The Extreme-X CPU Cooler from Enzotech enters the cooling market like a storm,
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Supplier: Dynatron Corp.
Description: CPU Support : Intel® Nehalem-EX Xeon® Processor 7500 Series CPU Socket : 1567 Solution : Copper passive heatsink with pre-print Shin-Etsu G751 thermal compound for 1U server
- Height: 26.5 mm
- Length: 90 mm
- Material: Copper
- Weight: 490 g
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Supplier: Xoxide
Description: compound Air Flow (CFM): 25.8 Bearing: Ball Bearing Cable Length (mm): 250 Current (A): 0.20 DC Voltage (V): 12 Fan Dimensions (mm): 75 (dia) x 15 (h) Fan Speed (RPM): 1200 - 2600 Heat Sink Dimensions (mm): 95 (l) x 93.5 (w) x
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Supplier: Xoxide
Description: 4 Dual Heat Pipes Award Winning NH-U Design NF-B9 Premium Fan Included High Compatibility SecuFirm™ Multi-Socket Mounting System Noctua NT-H1 High-End Thermal Compound Specifications: Socket Compatibility: Intel
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Supplier: Dynatron Corp.
Description: CPU Support : Intel® Sandy Bridge EP/EX Processors (for Narrow ILM Mounting Only) CPU Socket : 2011 (NarrowType, 56 x 94mm mounting pitch) Solution : Copper passive heatsink with pre-print Shin-Etsu G751 thermal compound for 1U & Blade server
- Height: 25.5 mm
- Length: 106 mm
- Material: Copper
- Weight: 550 g
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Supplier: Ohmite Manufacturing Co.
Description: housings. The in line mounting profile makes the TL Series easily adaptable to most heat sink systems. Thermal compound is always recommended when heat sinking. Power rating 275 watts with proper heatsink Resistance range 0.3-4 meg ohms 10 % Tolerance standard,
- Category / Application: Power Resistor, Other
- Configuration: Single Resistor
- Features: Heat Sink
- Operating DC Voltage: 1200 volts
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Supplier: Fujipoly® America Corp.
Description: transfer from heat generating device to heat spreader or heat sink. FEATURES: Fill large gaps while providing superior thermal transfer. Conformable with very low compression forces. Excellent vibration absorption capabilities. Maintains all
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Material Form: Gap Filling Compound
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Supplier: Fujipoly® America Corp.
Description: transfer from heat generating device to heat spreader or heat sink. FEATURES: Fill large gaps while providing superior thermal transfer. Conformable with very low compression forces. Excellent vibration absorption capabilities. Maintains all
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Material Form: Gap Filling Compound
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Supplier: Corsair Memory
Description: cooling performance. 38mm double-thick radiator The physics are simple: larger radiators have more surface area, and more surface area means more efficient heat transfer. The H70 CORE radiator is twice as thick as our standard radiator to provide excellent cooling potential. The
- Device: Liquid Cooler/Cold Plate
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Supplier: Plansee SE
Description: With our molybdenum and tungsten, we make sure that power diodes, thyristors and transistors keep their cool. With their outstanding thermal conductivity, electrical conductivity and material purity, our base plates reliably dissipate heat away from the active device. Avoiding stress
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Supplier: Corsair Memory
Description: into complex modular watercooling systems with half a dozen components to get serious CPU cooling performance. Each Hydro Series Liquid CPU Cooler is a sealed, closed-loop system that comes pre-filled and never needs refilling. Even the thermal compound is pre-applied. You'll be up and
- Device: Liquid Cooler/Cold Plate
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Supplier: Corsair Memory
Description: modular watercooling systems to get serious CPU cooling performance. Each Hydro Series Liquid CPU Cooler is a sealed, closed-loop system that comes pre-filled and never needs refilling. Tubing is constructed from low-evaporation FEP for a long lifespan. Even the thermal compound is pre
- Device: Liquid Cooler/Cold Plate, Cold Plate
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Supplier: Corsair Memory
Description: modular watercooling systems to get serious CPU cooling performance. Each Hydro Series Liquid CPU Cooler is a sealed, closed-loop system that comes pre-filled and never needs refilling. Tubing is constructed from low-evaporation FEP for a long lifespan. Even the thermal compound is pre
- Device: Liquid Cooler/Cold Plate, Cold Plate
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Description: CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ? Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ? Available in various thicknesses from 0.3 to 12.0 mm. ? Features natural tackiness for easy application and rework. ? High
- Compound Type: Thermally Conductive
- Dielectric Strength: 0.0025 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Elongation: 10 %
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi. ? Minimum interface thickness can reach as
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 1 W/m-K
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi. ? Minimum interface thickness can reach as
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 4 W/m-K
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Description: The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K. ? Soft and elastic after curing, maintaining the required thickness and providing shock absorption. ?
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 7.5
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Industrial
Description: adjacent metal case or heat sink. Options and Configurations Spacer Beads - No spacer beads, 0.007" spacer beads Pot Life - 15 min Cartridges - 50cc, 400cc Kits - 1200cc, 10 gallon Custom made configurations available upon request Benefits
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 0.0050
- Material Form: Gap Filling Compound
- Thermal Conductivity: 1 W/m-K
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Supplier: Boyd
Description: services in the industry. Aavid, Thermal Division of Boyd Corporation provides solutions and services across all industries, utilizing both traditional cooling solutions and breakthrough technologies ranging from standard heat sinks to fully custom two phase or liquid systems. Aavid,
- Compound Type: Thermally Conductive
- Material Form: Gap Filling Compound
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Supplier: Henkel Corporation - Industrial
Description: material provides a balance of cured material properties and good compression set (memory). The result is a soft, form-in place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 0.0070
- Material Form: Gap Filling Compound
- Thermal Conductivity: 2 W/m-K
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Featured Products Top
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. Designs will vary but in essence all involve some form of heat sink to dissipate the heat away from the active components. It is the interface between the heat sink and component that calls for the use of thermal transfer compounds - without their use any air gaps that exist will act as an (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for CHT USA Inc. -
Newest Silicone Gap Filler Transfers Heat and Absorbs Electromagnetic Waves Fujipoly® introduces a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
When placed between high-power, heat generating components and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This maximizes heat transfer and dissipation, thereby improving overall performance (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
ideal balance of softness and rigidity, offer an innovative solution for heat management in automotive wireless chargers. Compared to metal heat sinks, thermal conductive silicone pads are lightweight, thin, and flexible, allowing them to adhere tightly to heat-generating areas for seamless (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Thermal materials are innovative solutions designed to address heat transfer issues. They function between heat sources and heat sinks to enhance thermal conductivity, improve cooling efficiency, and ensure optimal device performance. There are various types of thermal materials, including (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
heat sink hinder the transfer of heat,thereby affecting the cooling performance. Silicone insulator pads are silicone polymer elastomers reinforced with fiberglass as the base material.These pads effectively reduce the thermal resistance between electronic components and heat sinks while (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
SARCON® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m°K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating components and a nearby heat sink or spreader (read more)
Browse Conductive Compounds Datasheets for Fujipoly® America Corp. -
-generating components and heat sinks, reducing air pockets and improving heat transfer efficiency. In AI smart speakers, they help manage heat from chips, amplifiers, and memory modules in tight internal spaces. In (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
High-performance CPUs and GPUs generate significant heat, and effective cooling depends on more than just the heatsink. Thermal paste plays a key role by filling the tiny air gaps between the chip and the heat sink, helping heat move out of the component more efficiently. This formula is (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
any size or proprietary shape for the perfect component fit. Once installed, the uniquely formulated silicone rubber material efficiently transfers heat from a heat-generating electronic component to a nearby heat sink. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp.
Conduct Research Top
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Managing Heat Transfer With Potting Compounds
and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control
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Thermal Grease vs Thermal Pad
Thermal grease is a thermally conductive compound designed to be used as an interface between heat sinks and heat sources. The main purpose of thermal grease is to eliminate air gaps or micro spaces between the heat sink and heat source. The top surface of a heat source is not perfectly flat.
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What are Thermal Interface Materials (TIMs)
Thermal Interface Materials (TIMs) or Thermal Compounds, is a general reference used to describe any material used between two parts to improve the thermal transfer between those two parts. A thermal interface material (TIM) is inserted between the heat source and the heat dissipation device (e.g.
More Information Top
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1978-1 - Techspray - Heat Sink Compound | Galco Industrial Electronics
1978-1, Techspray, Chemicals, Heat Sink Compound , Silicone Free Heat Sink 1 lb .
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Steady-State Computer Simulations of Package Sealing Methods
103 inch* - “C/W for aluminum 2024-T4 to copper contacts loaded with heat sink compound .
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Heat Sink Physical Installation Procedure
• Hardware Required: Heat sink compound .
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ELEVENTH INTERNATIONAL THERMAL CONDUCTIVITY CONFERENCE, ALBUQUERQUE, NEW MEXICO, SEPTEMBER 28--OCTOBER 1, 1971.
11 5 5 - 1 2 15 p.m. H. P Hwang and J. R. Ciminera, IBM Corp A Transient Technique Employing Computer Aided Graphics to Measure Thermal Conductivity of Heat Sink Compounds 12 20 - 12 40 p.m. T. L. Perelman, R …
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https://uwspace.uwaterloo.ca/bitstream/handle/10012/2856/kjgibbin2006.pdf?sequence=1
Dow Corning 340 heat sink compound was used at one interface as indicated in Fig. 2.7.
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CR4 - Thread: Thermal Glue Replacement
Are you sure that it is supposed to have thermal "glue" and not thermal " heat sink compound "?
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ARS | Publication request: Reducing contact resistance errors in measuring thermal conductivity of porous media
This experiment evaluated the use of grease-like materials called heat sink compounds on the needle to improve heat transfer and obtain more accurate thermal conductivity values.
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Journal of Energy > Thermal Contact Conductance of Flat-Plate Solar Collector Materials
Tests were conducted both for bare metal contacts and for aluminum/copper junctions in which Dow Corning (340) silicone heat sink compound was applied to the interface in an attempt to improve the heat transfer at the junction.