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Supplier: Galco Industrial Electronics
Description: Heat Sink Compound, 2ml
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Supplier: Galco Industrial Electronics
Description: Heat Sink Compound, 2 Ounce Jar
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Supplier: Computer Network Accessories, Inc.
Description: Single application heatsink compound; White. 1 oz. soft pack. -40~204 (degrees C); Thermal Conductivity: 0.0009.
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Supplier: Allied Electronics, Inc.
Description: Heat Sink, 2.350 Specific Gravity Silicone Heat Sink Compound, Odorless, 1 Fl. Oz Tube All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons
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Supplier: Allied Electronics, Inc.
Description: Wrist Strap Ground Cords, Ground Cord Zinc oxide filled silicone grease with heat transfer properties. Does not soften under elevated temperatures. Will not dry and harden. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons
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Supplier: Allied Electronics, Inc.
Description: Wrist Strap Ground Cords, Ground Cord Non-contaminating Synthetic-Ester based, capable of moving 46% more heat than other compounds. Meets Belcore spec. K521334 and Mil spec. C-47113. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons
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Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
- Chemical System: Silicone
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Supplier: Newark, An Avnet Company
Description: HEAT SINK COMPOUND 1 LB. JAR
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Supplier: Newark, An Avnet Company
Description: HEAT SINK COMPOUND, TUBE, 4OZ; Dispensing Method:Tube; Volume:-; Weight:4oz; Product Range:-; Coating Applications:Heat Sinks, Power Transistors; Coating Type:Conductive; Colour:White RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: HEAT SINK COMPOUND, TUBE, 100G; Dispensing Method:Tube; Volume:-; Weight:100g; Product Range:- RoHS Compliant: Yes
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Supplier: Allied Electronics, Inc.
Description: Wrist Strap Ground Cords, Ground Cord Non-contaminating Synthetic-Ester based, capable of moving 46% more heat than other compounds. Meets Belcore spec. K521334 and Mil spec. C-47113. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons
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Supplier: Newark, An Avnet Company
Description: HEAT SINK COMPOUND, SYRINGE, 10G ROHS COMPLIANT: YES
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 340 Heat Sink Compound White is a one component, non-curing, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, low bleed, thermally conductive, and has high temperature stability. 360 g
- Kinematic Viscosity (@ 40°C): 542,000 cSt
- Thermal Conductivity: 0.67 W/m-K
- Density / Specific Gravity (@15.6°C, 60°F): 2 specific gravity
- Type: Grease / Gel
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Supplier: Accuris
Description: COMPOUND, SILICONE, HEAT SINK
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Supplier: Accuris
Description: Compound, Silicone, Heat Sink
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Standards and Technical Documents - COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE -- MIL-C-47113Supplier: Accuris
Description: COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
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Supplier: Accuris
Description: Compound, Heat Sink, Silicone and/or Non-Silicone
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Supplier: Richardson RFPD
Description: The thermal resistance from diode leads to chassis or heat sink is 12°C/watt, when unit is mounted with TYPE 120 Joint Compound. If a 10°C/watt chassis or sink to ambient impedance is available, the thermal resistance from the diode leads to ambient is reduced from about
- Height: 12.699993142003704 mm
- Thermal Resistance: 12 °C / W
- Features: Other
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Supplier: Rego Electronics Inc.
Description: lighter than solid copper, due to its internal chamber structure. In many cases, a vapor chamber based heat sink weighs the same as an extruded aluminum heat sink, but works much better than a copper heat sink. Design Guidelines Vapor Chamber Design
- Length: 400 mm
- Width: 400 mm
- Height: 3 mm
- Device: Vapor Cooler
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Supplier: FX PCB Co., Ltd.
Description: problem with the dissipation of heat loss from processors. There are various ways to connect a heat sink to the heat source. A separate metal heat sink must be made to fabricate a heat sink PCB. Then, producers will affix this heat
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Supplier: Radwell International
Description: HEAT SINK COMPOUND, SILICONE FREE, TUBE, 4OZ. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Techsil Limited
Description: MG Chemicals 860 Silicone Heat Transfer Compound is a low thermal resistance grease with a silicone base. It is electrically insulating, non-corrosive and used to improve the thermal interface contact conductivity between heat sinks, LEDs, motors, and heat
- Composition / Chemistry: Silicone
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Supplier: Ohmite Manufacturing Co.
Description: TL Series Modular Heat Sinkable Thick Film Power The TL Series add heat sinkable options to the thick film resistor family. The resistor element is packaged with plastic insulators, and quickconnect terminals in a symmetrical aluminum profile for easy heat sink mounting.
- Resistance Range: 0.3 to 4,000,000 ohms
- Power Rating: 26.99999999999997 to 274.99999999999966 watts
- Operating DC Voltage: 1,200 volts
- Dielectric Strength: 2.5 kilovolts
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Supplier: Nordson EFD
Description: Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to
- Use Temperature: -40 to 392 F
- Thermal Conductivity: 0.92 W/m-K
- Features: Air Setting / Film Drying, Specialty / Other, Thermally Conductive
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Richardson RFPD
Description: DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which
- Features: Thermal / Heat Conductive
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Description: The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K. ◆ Soft and elastic after curing, maintaining the required thickness and providing shock absorption. ◆
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 5 W/m-K
- Dielectric Constant (Relative Permittivity): 7.5
- Industry: Electronics
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Supplier: Wacker Chemical Corp.
Description: and +180 °C primerless adhesion Application versatile interface material for heat sink applications for the electronics industry thermally conductive adhesive material applicable as thin interface layer between PCB and metal housings of electric control units heat ablation in
- Viscosity: 25,000 to 120,000 cP
- Thermal Conductivity: 0.8 W/m-K
- Tensile Strength (Break): 580.147357428788 psi
- Elongation: 90 %
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Description: CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application and rework. ◆ High
- Use Temperature: 320 F
- Thermal Conductivity: 45 W/m-K
- Tensile Strength (Break): 4.35110518071591 psi
- Elongation: 10 %
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ◆ Low thermal impedance, with a minimum of 0.015 ℃*in²/W at 30psi. ◆ Minimum interface thickness can reach as
- Use Temperature: 302 F
- Thermal Conductivity: 4 W/m-K
- Industry: Electronics
- Features: Grease / Paste, Thermal / Heat Conductive
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Supplier: RS Components, Ltd.
Description: Heat sink compound,35ml syringe
- Thermal Conductivity: 0.65 W/m-K
- Form / Shape: Grease / Paste
- Features: Specialty / Other, Thermally Conductive
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Featured Products Top
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. Designs will vary but in essence all involve some form of heat sink to dissipate the heat away from the active components. It is the interface between the heat sink and component that calls for the use of thermal transfer compounds - without their use any air gaps that exist will act as an (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for CHT USA Inc. -
Newest Silicone Gap Filler Transfers Heat and Absorbs Electromagnetic Waves Fujipoly® introduces a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
When placed between high-power, heat generating components and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This maximizes heat transfer and dissipation, thereby improving overall performance (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
ideal balance of softness and rigidity, offer an innovative solution for heat management in automotive wireless chargers. Compared to metal heat sinks, thermal conductive silicone pads are lightweight, thin, and flexible, allowing them to adhere tightly to heat-generating areas for seamless (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Thermal materials are innovative solutions designed to address heat transfer issues. They function between heat sources and heat sinks to enhance thermal conductivity, improve cooling efficiency, and ensure optimal device performance. There are various types of thermal materials, including (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
heat sink hinder the transfer of heat,thereby affecting the cooling performance. Silicone insulator pads are silicone polymer elastomers reinforced with fiberglass as the base material.These pads effectively reduce the thermal resistance between electronic components and heat sinks while (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
SARCON® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m°K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating components and a nearby heat sink or spreader (read more)
Browse Conductive Compounds Datasheets for Fujipoly® America Corp. -
-generating components and heat sinks, reducing air pockets and improving heat transfer efficiency. In AI smart speakers, they help manage heat from chips, amplifiers, and memory modules in tight internal spaces. In (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
High-performance CPUs and GPUs generate significant heat, and effective cooling depends on more than just the heatsink. Thermal paste plays a key role by filling the tiny air gaps between the chip and the heat sink, helping heat move out of the component more efficiently. This formula is (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
any size or proprietary shape for the perfect component fit. Once installed, the uniquely formulated silicone rubber material efficiently transfers heat from a heat-generating electronic component to a nearby heat sink. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp.
Conduct Research Top
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Managing Heat Transfer With Potting Compounds
and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control
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Thermal Grease vs Thermal Pad
Thermal grease is a thermally conductive compound designed to be used as an interface between heat sinks and heat sources. The main purpose of thermal grease is to eliminate air gaps or micro spaces between the heat sink and heat source. The top surface of a heat source is not perfectly flat.
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What are Thermal Interface Materials (TIMs)
Thermal Interface Materials (TIMs) or Thermal Compounds, is a general reference used to describe any material used between two parts to improve the thermal transfer between those two parts. A thermal interface material (TIM) is inserted between the heat source and the heat dissipation device (e.g.
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Indicates content that may require registration and/or purchase.
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1978-1 - Techspray - Heat Sink Compound | Galco Industrial Electronics
1978-1, Techspray, Chemicals, Heat Sink Compound , Silicone Free Heat Sink 1 lb .
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Steady-State Computer Simulations of Package Sealing Methods
103 inch* - “C/W for aluminum 2024-T4 to copper contacts loaded with heat sink compound .
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Heat Sink Physical Installation Procedure
• Hardware Required: Heat sink compound .
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ELEVENTH INTERNATIONAL THERMAL CONDUCTIVITY CONFERENCE, ALBUQUERQUE, NEW MEXICO, SEPTEMBER 28--OCTOBER 1, 1971.
11 5 5 - 1 2 15 p.m. H. P Hwang and J. R. Ciminera, IBM Corp A Transient Technique Employing Computer Aided Graphics to Measure Thermal Conductivity of Heat Sink Compounds 12 20 - 12 40 p.m. T. L. Perelman, R …
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https://uwspace.uwaterloo.ca/bitstream/handle/10012/2856/kjgibbin2006.pdf?sequence=1
Dow Corning 340 heat sink compound was used at one interface as indicated in Fig. 2.7.
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CR4 - Thread: Thermal Glue Replacement
Are you sure that it is supposed to have thermal "glue" and not thermal " heat sink compound "?
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ARS | Publication request: Reducing contact resistance errors in measuring thermal conductivity of porous media
This experiment evaluated the use of grease-like materials called heat sink compounds on the needle to improve heat transfer and obtain more accurate thermal conductivity values.
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Journal of Energy > Thermal Contact Conductance of Flat-Plate Solar Collector Materials
Tests were conducted both for bare metal contacts and for aluminum/copper junctions in which Dow Corning (340) silicone heat sink compound was applied to the interface in an attempt to improve the heat transfer at the junction.