Insulated Metal Substrate

Description: DBC (Direct Bonded Copper) is comprised of an insulating layer of ceramic substrate such as Al2O3 (aluminum oxide) and AlN (aluminum nitride) and copper connections to ensure electrical conductivity at high temperatures. For maximum reliability and performance, modules must exhibit

• Applications: Battery / Fuel Cell, Construction & Building / Architectural, Electrical / HV Parts, Electronics / RF-Microwave
• Material Type: Aluminum Nitride, Alumina / Aluminum Oxide, Specialty Ceramic
• Performance Features: Metallized / Silvered

Description: Aluminium Nitride (AlN) has an astonishingly high thermal conductivity of 180-200 W/m·K. Aluminium Nitride is particularly well suited for electrical engineering applications due to its excellent electrical insulating characteristics. Aluminium Nitride is an ideal material for uses

• Dielectric Strength: 2.00E7 V/m
• Material Type: Aluminum Nitride
• Thermal Conductivity: 180 to 200 W/m-K

Description: NP310E (NEMA CE) consists of a cotton canvas type fabric and electrically insulating phenolic resin system. NP310E is easy to machine and operates with less noise than metal. In addition, this material is not as abrasive as fiberglass alternatives when used in wear applications. NP310E

• Coeff. of Thermal Expansion (CTE): 11.11 to 12.22 µin/in-F
• Dielectric Strength: 300 to 550 kV/in
• Form / Shape: Film / Sheet
• Industry: General Industrial

Description: NP320E (NEMA LE) is used where better machining is needed compared to that offered by canvas grades This product consists of a fine-weave linen fabric and electrical grade of phenolic resin. Besides easy machining, NP320E operates with less noise than metal. In addition, this physical

• Coeff. of Thermal Expansion (CTE): 10 to 10.56 µin/in-F
• Dielectric Strength: 500 to 625 kV/in
• Form / Shape: Film / Sheet
• Industry: General Industrial

Description: substrates up to 350°F (177°C) Suitable to insulate substrates operating from -80°F up to 350°F(-62°C - 177°C) Easy airless spray application Very fast dry with minimal overspray risk Low odor, Low VOC Easy to repair

• Chemistry: Acrylic / Latex, Resin Base / Polymer Binder
• Cure / Dry Temperature: 77 F
• Features: Brush / Roll-on, Heat Resistant / High Temperature, Sprayable
• Form: Water Based

Description: of bonding, insulation, and heat conduction. Metal substrate: The type of metal chosen to serve as the insulating metal substrate is determined after careful examination of the metal substrate’s thermal expansion coefficient, thermal

Description: readily at elevated temperatures to a tough strong solid with excellent long term durability and chemical resistance even when exposed to adverse environmental conditions. Adhesion to metals and other substrates is excellent. There is no cracking or separation of properly cured EP121CL

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 22.22 to 25 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Dissimilar Substrates: Yes

Description: Machinable Glass Ceramic Rod Properties : Machinable Glass Ceramic rod with excellent compressive strength, high thermal insulating value, radiation immunity, and excellent dielectrical strength. Unlike plastics, whose temperature resistance and rigidity starts to fall off at as little at

• Material Type: Glass Ceramic, Silica / Silicate Materials
• Thermal Conductivity: 1.71 W/m-K

Description: DW 904-1 uses 1 mil polyester film coated with silicone adhesive. The silicone adhesive will release cleanly. This tape product is transparent for applications where optical clarity is important. APPLICATION INFORMATION These tapes are used in masking metal parts

• Features: Dielectric / Insulating
• Length: 216 ft
• Materials of Construction: PET / Polyester, Plastic / Polymer
• Temperature Resistance: 154 C

Description: , mud pumps, etc. Ceramic Plunger Properties Sheet: Alumina Content Unit 80-85% 90-96% > 99.5% 99% General Application Lower Cost Electrical & Mechanical High Strength, Wear Resistant, Electronic, Insulating, Mechanical, Structural & Metalizing Extremely High Purity

• Dielectric Strength: 7.87E6 to 8.86E6 V/m
• Material Type: Alumina / Aluminum Oxide, Zirconia
• Shape / Form: Fabricated / Custom Shape

Description: is etched into the copper and located in the substrate. It also provides a very short impedance path for the charge to the device from directly beneath it. Examples: Memory module substrates, Folded Stacked Die packages, CA TV Filters, Power modules, Chip package substrates, RF

• Features: Dielectric / Insulating
• Thickness: 6.30E-4 to 9.84E-4 inches

Description: capacitor with its vias, pad, and traces. By using Faradflex the device is etched into the copper and located in the substrate. It also provides a very short impedance path for the charge to the device from directly beneath it. Examples: Memory module substrates, Folded Stacked Die

• Features: Dielectric / Insulating
• Thickness: 3.15E-4 to 4.72E-4 inches

Description: exposure to various chemicals and temperature cycling up to 250°F. Adhesion to both similar and dissimilar substrates is excellent. The hardened material is an electrical insulator. Color of part A is black; part B is amber, although other colors are available. Master Bond Polymer System

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 22 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Dielectric Constant (Relative Permittivity): 4.1

Description: Description Different types of IMS PCB? IMS (Insulated Metal Substrate) PCB which use metal as substrate material, usually we use Alu or Copper substrate. Below are FX PCB’s capabilities for IMS PCB Single-sided printed circuit boards Double

Description: one to ten ounces. Insulating Layer: A dielectric layer made of a substance that is both electrically and thermally conducting. Base Aluminum Layer: This layer is mostly made of a metal substrate made of copper or aluminum. Although there are several thicknesses

• Materials of Construction: Aluminum Foil / Cladding, Copper Foil / Cladding, Specialty / Other
• Thickness: 0.0197 to 0.1969 inches

Description: satellite technology. It can achieve both of these goals simultaneously because it is an all dielectric film, unlike the patterned metal coatings used in the past. DSI Sunshade coatings can be applied to substrates as large as 2.5 ft x 10 ft. A low emissivity coating on the back

• Features: Dielectric / Insulating, Electrically Conductive, Thermally Insulating / Insulative
• Film Material: Plastic / Polymer, Polyimide (e.g., Kapton®)
• Hard Coat / Thin Film: Yes
• Types: Coated, Metallized

Description: integrity. Features & Benefits Specially designed to meet high strength, tear resistant sealing tape requirements. Provides excellent adhesion to substrates over extreme temperature ranges.

• Adhesive: Acrylic
• Backing: Glass / Fiberglass, Metal Foil / Sheet, Paper
• Features: UV / Weather Resistant
• Peel Strength / Adhesion: 4.69 lbs/in

Description: a 100 gram batch. This product bonds well to a wide variety of substrates including metals, glass, composites and many plastics and rubbers. Electrical insulation properties are outstanding.

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Two Component System, Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking
• Dielectric Constant (Relative Permittivity): 3.5

Description: barrier integrity. Features & Benefits Specially designed to meet high strength, tear resistant sealing tape requirements. Provides excellent adhesion to substrates over extreme temperature ranges.

• Adhesive: Acrylic
• Backing: Metal Foil / Sheet
• Features: UV / Weather Resistant
• Peel Strength / Adhesion: 4.69 lbs/in

Description: /scrim/Kraft backing with a specially formulated adhesive interleafed with a release liner. Specially designed to meet high strength, tear resistant sealing tape requirements. Provides excellent adhesion to substrate over wide temperature range. Diamond pattern matches most FSK boards and

• Adhesive: Acrylic
• Backing: Metal Foil / Sheet
• Peel Strength / Adhesion: 4.38 lbs/in
• Temperature Resistance: 4.44 to 93.33 C

Description: electrical insulation, optical clarity and commendable chemical resistance. Since LED light sources do not generate as much heat as UV ones, LED401LV can be used to bond heat sensitive substrates.

• Coeff. of Thermal Expansion (CTE): 36.11 to 38.89 µin/in-F
• Composition: Single Component System, Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
• Dielectric Constant (Relative Permittivity): 3.9

Description: substrates. Applications: Heating elements manufacturers Thermal insulation High temperature masking operations

• Adhesive: Silicone
• Backing: Metal Foil / Sheet
• Temperature Resistance: -70 C
• Thickness: 0.0033 inches

Description: help Boyd identify what PSA or adhesive is best for an application, like mating substrate polymer type, surface contact, dwell time or potential environmental exposures. The success or failure of an adhesive is much more dynamic than simply the strength of the adhesive. Boyd is an adhesives

• Adhesive: Acrylic, Pressure Sensitive (PSA)
• Backing: Cloth - Woven Fabric, Foam, Metal Foil / Sheet, Plastic / Polymer, Acrylic / Acrylate, PVC / Vinyl, Rubber, Silicone
• Features: Anti-static / ESD Control, Electrically Conductive, EMI / RFI Shielding, UV / Weather Resistant
• Type: Adhesive Tape, Cloth Tape, Industrial Tape

Description: LOCTITE ECCOBOND PH 1, Non-conductive Adhesive, Encapsulant LOCTITE® ECCOBOND PH 1 is a one component, non-conductive adhesive. It has excellent ink resistance and has good adhesion to metal substrates and polyimide. LOCTITE ECCOBOND PH 1 is designed for stencil/screen printing, pin

• Coeff. of Thermal Expansion (CTE): 28.17 µin/in-F
• Features: Electrically Insulating / Dielectric
• Viscosity: 3500 cP

Description: prevent corrosion, especially in critical applications that require good dielectric properties. G624 offers superior corrosion protection to many metal substrates. Proven compatibility with a wide range of plastics and elastomeric materials. Conforms to SAE AS-8660 (formerly

• Chemistry / Constituents: Silicone, Synthetic / Semi-synthetic

Description: 10-2000 is a one component, moisture curing polyurethane adhesive designed for bonding and laminating. It may also be used to impregnate glass cloth and create a pipe repair system. FEATURES: • Solvent Free • No Mixing Required • Resists Moisture, Solvents and Heat • High Strength to a Variety of

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Composition: Single Component System
• Cure Type / Technology: Reactive / Moisture Cured
• Form: Grease / Paste

Description: particles ranging from 0.25-0.28µm in mean diameter, depending on the grade, that impregnate substrates like fiberglass cloth and metals to impart PTFE properties. Dispersions may contain additional surfactants for stability and wetting properties. Granular powders: Fine powders that

• Features: Thermally Insulating
• Filler Material: Unfilled
• Industry: Automotive

Description: particles ranging from 0.25-0.28µm in mean diameter, depending on the grade, that impregnate substrates like fiberglass cloth and metals to impart PTFE properties. Dispersions may contain additional surfactants for stability and wetting properties. Granular powders: Fine powders that

• Elongation: 350 %
• Features: Thermally Insulating
• Filler Material: Unfilled
• Industry: Automotive

Description: LOCTITE ABLESTIK QMI536, Bismaleimide Resin, Die Attach, Fluoropolymer Filled Non-conductive Adhesive LOCTITE® ABLESTIK QMI536 is a Fluoropolymer filled non-conductive adhesive for attachment of integrated circuits and components to advanced substrates, including PBGAs, CSPs, array

• Coeff. of Thermal Expansion (CTE): 54.44 µin/in-F
• Cure Type / Technology: Single Component System
• Features: Electrically Insulating / Dielectric
• Substrate / Material Compatibility: Plastic

Description: packages and electronic assemblies, with the capability to attach a metal can or lid onto a package. STAYCHIP F614-3A was specifically developed for superior adhesion to metal lid surfaces, epoxy laminate, or solder mask-coated substrates. Non-conductive and Electrically

• Cure Type / Technology: Thermosetting / Crosslinking
• Features: Electrically Conductive, Electrically Insulating / Dielectric
• Industry: Electronics, Semiconductors / IC Packaging

Description: LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds even in cryogenic conditions. Please refer to the TDS for

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Two Component System
• Features: Electrically Insulating / Dielectric
• Industry: Optical Grade / Material

Description: 3M™ VHB™ 4952 is a black, 0.025" (0.6 mm) tape with a modified acrylic adhesive and a very conformable, acrylic foam core. This provides an extraordinarily strong double sided foam tape that adheres to a broad range of substrates including aluminum, stainless steel, galvanized steel

• Adhesive: Acrylic, Pressure Sensitive (PSA)
• Features: Dielectric / Insulating, Permanent
• Peel Strength / Adhesion: 1.06 lbs/in
• Width: 0.5000 to 2 inches

Description: TSE3221S is a heat curable translucent silicone adhesive designed for sealing and coating applications. This grade adheres well to a variety of substrates such as metals, plastics, ceramic and glass without the use of a primer. Potential applications include sealing and coating for

• Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
• Features: Electrically Insulating / Dielectric
• Industry: Electronics

Description: Offers self-adhesion properties Non-corrosive to metals and sensitive substrates Excellent dielectric properties Outstanding performance over a wide thermal range Technical Properties Uncured Consistency: Flowable Colour: Blue Tack-Free Time: 20 Mins Cured Shore Hardness: 45 Shore A

• Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
• Features: Electrically Insulating / Dielectric, Thermal / Heat Conductive
• Industry: Electronics

Description: LOCTITE M 7000A E&C, Thermosetting, Conductive Ink LOCTITE M 7000A BL E&C is a screen printable solvent-based dielectric ink for rigid substrates. Screen printable One component Dielectric Insulating High resistance to heat and humidity

• Cure / Dry Temperature: 329 F
• Form: Transfer Tape
• Industry: OEM / Industrial
• Substrate / Surface: Metal

Description: ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals and engineered plastics. Proven applications are bonding MRI magnets

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Dielectric Constant (Relative Permittivity): 4.3
• Features: Electrically Insulating / Dielectric

Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Dielectric Constant (Relative Permittivity): 4.3
• Features: Electrically Insulating / Dielectric, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated)

Description: potting or joining substrates with shadow areas. UV Cure 60-7170 may also be heat cured as a secondary cure operation. UV Cure 60-7170 is not affected by oxygen and will not have a sticky or greasy surface. The surface is rigid, smooth, and glossy when properly cured. UV Cure 7170 bonds to

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: UV / Radiation Cured (EB, Light), Single Component System
• Dielectric Strength: 425 kV/in
• Features: Electrically Insulating / Dielectric, Encapsulating / Potting

Description: 60 Ton capacity on a 30" x 38" maximum sheet size on a variety of substrates. Including Formex, Polyesters, Polycarbonates, Adhesives, Teflon, Vinyl, Rigid PVC, Nomex, and others. Typically tolerances are plus or minus .010 for Overlay Applications.

• Die Cutting Method: Steel Rule Die Cutting
• Location: North America, United States Only, Southwest US Only
• Materials: Electrical Insulating Material, EMI/RFI Shielded Foil / Laminate, Fabric, Felt, Fiber / Cork / Paper, Foam / Sponge, Laminate, Metals / Alloys, Plastics, PVC, Rubber, Composites
• Services Offered: CAD / CAM Support, Design Assistance, Prototype, Short Run Production, High Volume Production, Inspection / Quality Control

Description: provides long term circuit protection from -55ºC. to 125ºC.. The material bonds well to most metals, ceramics and plastics as well as to epoxy and paper phenolic circuit boards and, when necessary, allows repair by cutting away material in the area of the affected component

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Dielectric Constant (Relative Permittivity): 6.85 to 7.6
• Features: Electrically Insulating / Dielectric, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Flexible / Dampening, Thermal / Heat Insulating, UL Approved