Insulated Metal Substrate

Description: DBC (Direct Bonded Copper) is comprised of an insulating layer of ceramic substrate such as Al2O3 (aluminum oxide) and AlN (aluminum nitride) and copper connections to ensure electrical conductivity at high temperatures. For maximum reliability and performance, modules must exhibit excellent

• Features: Alumina / Aluminum Oxide, Specialty Ceramic
• Specialty Ceramic Type: Aluminum Nitride
• Applications: Battery / Fuel Cell, Construction & Building / Architectural, Electrical / HV Parts, Electronics / RF-Microwave
• Performance Features: Metallized / Silvered (Electrode, Mirror)

Description: telecommunications technology since it can be processed using both thick and thin film technologies. As a result, Aluminum Nitride ceramic is utilized as a substrate for semiconductors as well as high-power electronic devices, housings, and heat sinks. Typical Features Very high thermal

• Thermal Conductivity: 180 to 200 W/m-K
• Dielectric Strength: 20,000,000 V/m
• Material Type: Aluminum Nitride

Description: NP310E (NEMA CE) consists of a cotton canvas type fabric and electrically insulating phenolic resin system. NP310E is easy to machine and operates with less noise than metal. In addition, this material is not as abrasive as fiberglass alternatives when used in wear applications. NP310E can be

• Use Temperature: 239 to 257 F
• Coeff. of Thermal Expansion (CTE): 11.11111111111111 to 12.222222222222221 µin/in-F
• Water Absorption: 2 %
• Tensile Strength (Break): 9,000 to 11,000 psi

Description: Heat-Flex Hi-Temp 3500 is a multi-purpose, single component waterbased, acrylic, spray applied insulative coating.It contains an engineered composite of ceramic and silica microspheres to optimize thermal insulative properties. Single component Designed to be applied to hot substrates up to

• Wet / Applied Thickness: 0.018 to 0.0244 inch
• Cure / Dry Temperature: 77 F
• Operating / Use Temperature: 50 to 350 F
• Chemistry: Acrylic / Latex, Resin Base / Polymer Binder

Description: elevated temperatures to a tough strong solid with excellent long term durability and chemical resistance even when exposed to adverse environmental conditions. Adhesion to metals and other substrates is excellent. There is no cracking or separation of properly cured EP121CL resin from

• Viscosity: 1,000 to 3,000 cP
• Use Temperature: -80 to 500 F
• Coeff. of Thermal Expansion (CTE): 22.220000000000002 to 25 µin/in-F
• Tensile Strength (Break): 11,600 to 12,100 psi

Description: Toughened, two part epoxy Supreme 11ANHT withstands thermal cycling and is both thermally conductive and electrically insulative.

• Applied Thickness / Gap Fill: 0.002 to 0.004 inch
• Use Temperature: -112 to 400 F
• Thermal Conductivity: 2.88 to 3.1 W/m-K
• Coeff. of Thermal Expansion (CTE): 16.666666666666668 to 19.444444444444443 µin/in-F

Description: exposure to various chemicals and temperature cycling up to 250°F. Adhesion to both similar and dissimilar substrates is excellent. The hardened material is an electrical insulator. Color of part A is black; part B is amber, although other colors are available. Master Bond Polymer System

• Viscosity: 2,000 to 3,000 cP
• Use Temperature: -60 to 250 F
• Coeff. of Thermal Expansion (CTE): 22 µin/in-F
• Tensile Strength (Break): 10,000 psi

Description: with the same thickness and line width. Insulating Layer: The core technology of the aluminum substrate is the insulating layer, which primarily performs the roles of bonding, insulation, and heat conduction. Metal substrate: The type of metal chosen to serve as the

Description: Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration and shock.

• Applied Thickness / Gap Fill: 0.002 to 0.004 inch
• Viscosity: 3,000 to 6,000 cP
• Use Temperature: -100 to 400 F
• Tensile Strength (Break): 4,000 to 6,000 psi

Description: and packaging material integrated circuit substrate, electrolytic cell lining, metal matrix composite reinforcement body, active armor material, heat sink and heating element of high temperature furnace. In the electronics and power industries, insulating ceramics, such as insulators,

• Density: 3.8999975386044725 g/cc
• MOR / Flexural Strength: 47,862.15698787501 psi
• Compressive / Crushing Strength: 290,073.678714394 psi
• Material Type: Alumina / Aluminum Oxide

Description: achieve both of these goals simultaneously because it is an all dielectric film, unlike the patterned metal coatings used in the past. DSI Sunshade coatings can be applied to substrates as large as 2.5 ft x 10 ft. A low emissivity coating on the back surface reduces thermal load into

• Width: 120 inches
• Type: Coated, Hard Coat / Thin Film, Metallized
• Features: Dielectric / Insulating, Electrically Conductive, Thermally Insulating / Insulative
• Materials: Plastic / Polymer, Polyimide (e.g., Kapton^®)

Description: Etched Foil Kapton flexible heaters are made with a thin metal foil (.001"), usually a nickel base alloy, as the resistance element. The resistance pattern to be etched is designed in CAD and transferred to the foil, which is laminated to the insulating substrate. The

• AC Voltage Required: 120 to 240 volts
• Watt Density: 3.25 to 13 W/in²
• Length: 24 to 120 inch
• Width: 0.5 to 3 inch

Description: electronic assemblies, with the capability to attach a metal can or lid onto a package. STAYCHIP F614-3A was specifically developed for superior adhesion to metal lid surfaces, epoxy laminate, or solder mask-coated substrates. Non-conductive and Electrically Insulating Ensures

• Features: Electrical Insulation / Dielectric Material, Electrically Conductive Compound (Adhesive, Grease)
• Industry: Electronics, Semiconductors / IC Packaging
• Cure / Technology: Thermosetting / Crosslinking

Description: This horizontal insulated metal substrate (IMS3) evaluation platform can be used to evaluate the electrical and thermal performance benefits of GaNPX bottom-side cooled e-modes in high-power applications. The optimized thermal and electrical designs provide an excellent

• Category: Development Board

Description: h-old 4281 is a 50 micron soft aluminium foil coated with a high quality silicone adhesive system and protected by fluoro-siliconized polyester liner. Designed for all applications where very high temperature resistance is required. The silicone adhesive system bonds well to a variety of

• Thickness: 0.0033464566929133858 inches
• Temperature Resistance: -70 C
• Features: Adhesive Tape, Foil Tape, Industrial Tape, Single-Sided Adhesive, Thermally Insulating / Insulative
• Backing: Metal Foil / Sheet

Description: LOCTITE M 7000A E&C, Thermosetting, Conductive Ink LOCTITE M 7000A BL E&C is a screen printable solvent-based dielectric ink for rigid substrates. Screen printable One component Dielectric Insulating High resistance to heat and humidity

• Cure / Dry Temperature: 329 F
• Substrate: Metal
• Industry: OEM / Industrial
• Form: Transfer Tape

Description: interleafed with a release liner. Specially designed to meet high strength, tear resistant sealing tape requirements. Provides excellent adhesion to substrate over wide temperature range. Diamond pattern matches most FSK boards and blankets.

• Thickness: 0.008 inches
• Peel Strength / Adhesion: 4.375 lbs/in
• Temperature Resistance: 4.444444444444445 to 93.33333333333333 C
• Adhesive: Acrylic

Description: LOCTITE ECCOBOND PH 1, Non-conductive Adhesive, Encapsulant LOCTITE® ECCOBOND PH 1 is a one component, non-conductive adhesive. It has excellent ink resistance and has good adhesion to metal substrates and polyimide. LOCTITE ECCOBOND PH 1 is designed for stencil/screen printing, pin

• Viscosity: 3,500 cP
• Coeff. of Thermal Expansion (CTE): 28.166666666666668 µin/in-F
• Features: Electrically Insulating / Dielectric

Description: Specially designed to meet high strength, tear resistant sealing tape requirements. Provides excellent adhesion to substrates over extreme temperature ranges.

• Thickness: 0.006 inches
• Peel Strength / Adhesion: 4.6875 lbs/in
• Temperature Resistance: -37.22222222222222 to 126.66666666666666 C
• Adhesive: Acrylic

Description: metal substrates. When heated, it will shrink to 50% of its supplied diameter to conform to the object it covers. Upon cooling, adhesive returns to its original state, forming a moisture-resistant bond between tubing and substrate.

• Diameter: 0.125 inch
• Length: 48 inch
• Operating Temperature: -55 to 110 C
• Shrink Temperature: 121 C

Description: designed to meet high strength, tear resistant sealing tape requirements. Provides excellent adhesion to substrates over extreme temperature ranges.

• Thickness: 0.006 inches
• Peel Strength / Adhesion: 4.6875 lbs/in
• Temperature Resistance: -37.22222222222222 to 126.66666666666666 C
• Adhesive: Acrylic

Description: Description Different types of IMS PCB? IMS (Insulated Metal Substrate) PCB which use metal as substrate material, usually we use Alu or Copper substrate. Below are FX PCB’s capabilities for IMS PCB Single-sided printed circuit boards Double-sided printed

Description: medium, or mass production at a reasonable cost on Aluminum PCB, and quality is always the key essential for us FX PCB passed the ISO9001 and the manufacturing process will strictly follow the quality control. Aluminum PCB Stackup The aluminum PCB substrate is a metal-based copper-clad

• Thickness: 0.01968503937007874 to 0.1968503937007874 inches
• Materials: Aluminum Foil / Cladding, Copper Foil / Cladding
• Features: Specialty / Other

Description: ThreeBond TB152 1 is a multi-purpose, high strength, fast setting chloroprene rubber adhesive. It is suitable for bonding a wide range of substrates including metals, rubbers and plastics, giving a high initial bond strength after setting. TB1521 is widely used as a contact adhesive in

Description: PCE-CT 27FN is a Coating Thickness Gauge that takes non-destructive measurements of nonmagnetic coating, insulating layer and dry film thickness (DFT) on metal substrates such as steel and aluminum. Ideal for surface testing, automotive paint inspection, material testing and

• Range: 0 to 0.049212625 inch
• Graduation / Resolution: 0.00000393701 inch
• Resolution: 0.00000393701 inch
• Features: Coating Thickness

Description: 10-3003 HV is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. 10-3003 HV is also very safe to use due to the absence of harmful solvents and toxic chemicals in the

• Viscosity: 15,000 cP
• Use Temperature: -94 to 212 F
• Thermal Conductivity: 0.4326837 W/m-K
• Tensile Strength (Break): 10,500 psi

Description: Machinable Glass Ceramic Rod Properties : Machinable Glass Ceramic rod with excellent compressive strength, high thermal insulating value, radiation immunity, and excellent dielectrical strength. Unlike plastics, whose temperature resistance and rigidity starts to fall off at as little at 150°C,

• Density: 2.4799984348048953 g/cc
• Thermal Conductivity: 1.71 W/m-K
• MOR / Flexural Strength: 15,663.978650577275 psi
• Compressive / Crushing Strength: 73,678.71439345607 psi

Description: 10-3001 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. 10-3001 is also very safe to use due to the absence of harmful solvents and toxic chemicals in the formulation.

• Thermal Conductivity: 0.4326837 W/m-K
• Tensile Strength (Break): 30,000 psi
• Dielectric Strength: 550.0000000000008 kV/in
• Dielectric Constant (Relative Permittivity): 3.11

Description: primerless adhesion to many substrates (glass, ceramics, metals, plastics and powder coatings) recommended service temperature range: -50 °C to +180 °C long-term stability against weathering, moisture and UV radiation electrically insulating

• Viscosity: 90,000 to 1,250,000 cP
• Use Temperature: -58 to 356 F
• Tensile Strength (Break): 304.5773626501137 psi
• Elongation: 300 %

Description: Trickle resin system for impregnation or protective overcoat

• Viscosity: 3,000 to 6,000 cP
• Use Temperature: 356 F
• Dielectric Strength: 1,700.0000000000002 kV/in
• Dielectric Constant (Relative Permittivity): 3.8

Description: EasyPACK™ 2B Modules with TRENCHSTOP™ IGBT3, Emitter Controlled 3 diode and PressFIT / NTC. Summary of Features Increased blocking voltage capability to 650V Low Switching Losses Low VCEsat Trench IGBT 3 Al2O3 Substrate with Low Thermal Restistance High Power Density Integrated NTC

• V_CES: 650 volts
• V_CE(on): 1.45 volts
• I_C(max): 75 amps
• Transistor Grade / Operating Range: Automotive

Description: 10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion.

• Viscosity: 800 to 2,000 cP
• Use Temperature: -58 to 302 F
• Thermal Conductivity: 0.4326837 W/m-K
• Tensile Strength (Break): 10,500 psi

Description: Machinable Glass Ceramic Characteristics: The most outstanding characteristic of Machinable Glass Ceramic Disc is that it can be processed by turning, milling, planing, grinding, drilling, sawing and tapping with standard metal processing tools and equipment. It can be processed into products

• Density: 2.4799984348048953 g/cc
• Thermal Conductivity: 1.71 W/m-K
• MOR / Flexural Strength: 15,663.978650577275 psi
• Compressive / Crushing Strength: 73,678.71439345607 psi

Description: Power Bridge Rectifier|•Glass passivated silicon chips|•Fast-on terminals for pcb solder or plug on connections|•Sturdy insulated metal base plate|•Low thermal impedance through use of direct copper bonded aluminum substrate|•Blocking voltage up to 1800V|•High surge currents|•UL

• I_F: 50,000 mA
• Rectifier Configuration / Technology: Bridge
• Features: Other, Rectifier Diode

Description: IDRM = 380 A Low inductive design ≤ 8 nH Low RDS (on) Low switching losses Low Qg and Crss New semiconductor material - silicon carbide Tvj,op = 175°C Benefits 4.25 kV DC 1 second insulation Compact design High power density AlN Substrate with low thermal resistance Integrated NTC temperature

• Transistor Grade / Operating Range: Automotive
• Features: IGBT, MOSFET, Other
• Packing Method: Shipping Tube / Stick Magazine