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Supplier: Huawei Technologies Co., Ltd.
Description: Huawei OSN902 is a customized transmission device for Data Center Interconnection, and it supports large capacity, small volume, suitable for DCI transmission scenarios. OSN902 offers 10 GE/40 GE/100 GE service interfaces on the access side, 200G/400G large capacity, ultra-low power
- Area Network Type: Wide Area Network (WAN)
- Data Rate: 160000 Gbps
- Equipment Type: Switch
- Network Media: Wireless
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Supplier: Nokia
Description: High-scale interconnect for data center, WAN, and IP anyhaul networks Increase longevity for data center and WAN aggregation The Nokia 7250 IXR-6 and IXR-10 platforms deliver terabit-scale interconnectivity within data centers and across WANs in
- Equipment Type: Router
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Supplier: Nokia
Description: Scalable, secure, flexible DCI for the cloud era The Nokia 1830 Photonic Service Interconnect product family provides industry leading performance, scale, and simplicity for Data Center Interconnection (DCI) applications. The massive shift to cloud based IT services by private
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Supplier: Aries Electronics, Inc.
Description: FEATURES A cost-effective means of upgrading to SOJ or SOIC to DIP without changing your PCB layout Available on 0.400 [10.16] and 0.600 [15.24] centers For Adapters on 0.300 [7.62] centers, consult Data Sheet 18010 GENERAL SPECIFICATIONS
- Contact / Pin Type: Straight Pins
- Contact Plating: Other
- Contacts Pitch: 0.4000 to 0.6000 mm
- Mounting: Through-hole
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Supplier: Aries Electronics, Inc.
Description: FEATURES A cost-effective means of upgrading to SOIC without changing your PCB layout Available on 0.300 [7.62] centers For Adapters on 0.400 [10.16] or 0.600 [15.24] centers, consult Data Sheet 18011 GENERAL SPECIFICATIONS BOARD MATERIAL
- Contact Plating: Nickel Plating, Other
- Military Standards: Other
- Mounting: Through-hole
- Number of Contacts: 14 to 28
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Supplier: Aries Electronics, Inc.
Description: FEATURES A cost-effective means of upgrading to SOIC without changing your PCB layout Available on 0.300 [7.62] centers For Adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet 18011 GENERAL SPECIFICATIONS BOARD
- Contact Plating: Nickel Plating, Other
- Contacts Pitch: 0.4000 to 0.6000 mm
- Mounting: Through-hole
- Number of Contacts: 24 to 32
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Supplier: Aries Electronics, Inc.
Description: FEATURES A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout Available on 0.300 [7.62] centers For adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet 18011 GENERAL SPECIFICATIONS BOARD
- Contact Plating: Nickel Plating, Other
- Contacts Pitch: 0.4000 to 0.6000 mm
- Current Rating: 3 amps
- Mounting: Through-hole
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Supplier: CIENA Corporation
Description: Ciena’s Waveserver® stackable interconnect system combines a best-in-class coherent chipset with a data center operations model for cost-effective, web-scale Data Center Interconnect (DCI) applications. Web-scale DCI requires new solutions designed from the
- Data Rate: 400 Gbps
- Form Factor: Rack Mount
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Supplier: TE Connectivity
Description: : Standard Latch Color : Natural Latch Material : High Temperature Thermoplastic Module Key Type : Center PCB Retention Feature Material : Copper Alloy Retention Post Location
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 1 mm
- Current Rating: 0.5000 amps
- Mounting: Other
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Supplier: TE Connectivity
Description: : Natural Latch Material : Thermoplastic Module Key Type : Offset Left PCB Retention Feature Material : Brass Retention Post Location : Center Configuration Features
- Contact Plating: Other
- Contacts Pitch: 1 mm
- Current Rating: 0.7500 amps
- Mounting: Through-hole, Other
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Supplier: TE Connectivity
Description: : Natural Latch Material : High Temperature Thermoplastic Module Key Type : Offset Left Retention Post Location : Both Ends Configuration Features Center Key : Offset
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 1 mm
- Current Rating: 0.5000 amps
- Mounting: Other
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Supplier: TE Connectivity
Description: : Standard Latch Color : Natural Latch Material : High Temperature Thermoplastic Module Key Type : Center PCB Retention Feature Material : Copper Alloy Retention Post Location
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 1 mm
- Current Rating: 0.5000 amps
- Mounting: Other
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Supplier: Molex Signal Tech Industrial Ltd.
Description: The next generation of high-performance semiconductors—from advanced Consumer SoCs and GPUs to AI Accelerators and Data Center processors demands unprecedented bandwidth and speed. Yet as data rates climb, ensuring signal integrity during testing becomes exponentially more
- Contact Plating: Gold Plating
- Contact Resistance: 80 milliohms
- Contacts Pitch: 0.6500 to 0.8000 mm
- Current Rating: 3 to 3.7 amps
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Supplier: Data Connect Enterprise, Inc.
Description: The Model 3002 TCB interconnects two modems located in proximity of each other. Data is buffered and re-clocked to ensure its integrity when the modems are clocked independent of each other. The TCB enables users to connect a tail circuit to a modem sharing device or to a modem that
- Connector: DB25
- Data Rate: 64 kbps
- Mounting / Form Factor: Other
- Network / Bus: Other
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Supplier: TelephoneStuff.com
Description: Cable Runway Patch Panel Rack is a miniature two-post rack that can be attached to CPI Cable Runway. Cable Runway Patch Panel Rack saves rack-mount space in a rack or cabinet that stores computer and data storage equipment by placing patch panels or interconnect equipment above the
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Supplier: Hubbell Incorporated
Description: 2 METER 10 GBPS/25 GBPS FIBER CHANNEL, BACKBONE/HORIZONTAL DISTRIBUTION INTERCONNECT, DATA CENTER EQUIPMENT INTERCONNECT APPLICATION DUPLEX STYLE SINGLE MODE, ZIPCORD FIBER TYPE ZIRCONIA CERAMIC FERRULE MATERIAL LC/APC CONNECTOR AT ONE END
- Application: Networking
- Cable Length: 6.56 ft
- Product Type: Patch Cable / Cord
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Supplier: Hubbell Incorporated
Description: 5 METER 10 GBPS/25 GBPS FIBER CHANNEL, BACKBONE/HORIZONTAL DISTRIBUTION INTERCONNECT, DATA CENTER EQUIPMENT INTERCONNECT APPLICATION DUPLEX STYLE SINGLE MODE, ZIPCORD FIBER TYPE ZIRCONIA CERAMIC FERRULE MATERIAL LC/APC CONNECTOR AT ONE END
- Cable Length: 16.4 ft
- Product Category: Cable Assembly
- Product Type: Patch Cable / Cord
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Supplier: Hubbell Incorporated
Description: 5 METER 10 GBPS/25 GBPS FIBER CHANNEL, BACKBONE/HORIZONTAL DISTRIBUTION INTERCONNECT, DATA CENTER EQUIPMENT INTERCONNECT APPLICATION DUPLEX STYLE SINGLE MODE, ZIPCORD FIBER TYPE ZIRCONIA CERAMIC FERRULE MATERIAL SCA CONNECTOR AT ONE END
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Supplier: Broadcom Inc.
Description: The Avago AFBR-79EBPZ is a 40 Gigabit Ethernet (40G) bidirectional (BiDi) multimode fiber (MMF) QSFP+ transceiver module designed for high-speed data center interconnect and enterprise networking applications. Based on proprietary 2x20G BiDi optics, the module enables four Tx
- Cable Type: Multimode
- Connector Type: LC
- Data Rate: 10.31 Gbps
- Maximum Optical Output Power: 35.44 dBm
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Supplier: Larch Networks
Description: Orama X25N from Larch Networks is the next generation network visibility solution. It delivers robustness and flexibility that meets the ever-evolving needs of the data center. Orama X25N bridges the gap between todays ultra-high speed networks and existing management, monitoring and
- Equipment Type: Other
- Form Factor: Rack Mount
- Number of Ports: 58 #
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Supplier: Juniper Networks Inc.
Description: The compact, agile, and full-featured MX80 3D Universal Edge Router is ideally suited for enterprise and service provider applications in facilities with limited space and power. MX80 routers are optimized for enterprise WAN, Data Center Interconnect (DCI), branch aggregation,
- Data Rate: 160 Gbps
- Equipment Type: Router
- Form Factor: Rack Mount
- Number of Ports: 4 #
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Supplier: Huawei Technologies Co., Ltd.
Description: Huawei’s NetEngine9000 series core router (NE9000) is Huawei’s flagship core router created for large-scale Data Center Interconnect (DCI), super core nodes on the carrier backbone network, metro core, and core nodes on large-scale enterprise networks. The NE9000 supports the
- Area Network Type: Wide Area Network (WAN)
- Data Rate: 36.16 Gbps
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Supplier: L-com, Inc.
Description: Integrated HD15 with two Mini DIN 6 connectors allows easy KVM connections Keyboard, Video and Mouse (KVM) connection between CPU and device Application Multiple server access and control Security monitoring Data center management KVM interconnect applications
- Application: Audio, Video
- Cable Assembly Gender: Male-Male
- Cable Length: 3 ft
- Product Type: KVM Cable
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Supplier: L-com, Inc.
Description: incoming cables securing your connections Used to connect fiber optic cables with ST connectors Rugged steel construction ensures durability Standard design works with any 19" equipment rack offering multivendor support Application Data center management High EMI/RFI applications MAN
- Height: 1
- Number of Ports: 16
- Port Type: ST
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Supplier: CIENA Corporation
Description: Ciena’s 5170 Service Aggregation Switch addresses the increasing need for high-bandwidth services at the edge of the network. Capable of delivering up to 100GbE to enterprises, mobile backhaul sites, and data center interconnect applications, the 1RU device provides a
- Data Rate: 1 to 10 Gbps
- Form Factor: Rack Mount
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Supplier: Nokia
Description: from getting into the wrong hands, thus preventing business loss and interruption. The 1830 SMS generates quantum safe keys for both optical (1830 PSS) and microwave (9500 MPR) transport platforms to secure a wide range of applications and services, including: Data center
- Server Type: Applications / File Server
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Supplier: CableOrganizer.com, Inc.
Description: fiber optic system serves as an enclosure and/or patching location for a variety of applications. Its innovative design facilitates transitions between backbone cabling and distribution switching in data centers or telecommunications closets.
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Supplier: Data Connect Enterprise, Inc.
Description: The 3310 Mark II is a Video Conferencing Optical Extender (VCOE). It is designed to extend the distance between endpoints of video conferencing systems over fiber optic cable in a variety of applications. It is used for interconnecting CODEC equipment to the public switched network equipment
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Supplier: F5 Networks, Inc.
Description: Securely connect public clouds to data centers. F5 Application Connector connects public clouds to your application service infrastructure within cloud interconnects or data centers. This enables the use of public cloud resources as part of your compute
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Supplier: Broadcom Inc.
Description: . Emulex is trusted by data centers the world-over, with more than 12 million HBA ports shipped and installed to date. The PCI Express (PCIe) 3.0 LPe16000B Gen 5 Fibre Channel (16GFC) Host Bus Adapter (HBA) provides outstanding input/output operations per second (IOPS) performance—20%
- Connective Technology: PCI Express
- Form Factor: Board-level Unit
- Number of Terminating Connections: 1 to 21
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Supplier: Broadcom Inc.
Description: : Increased data center IT agility and scalability through deployment of a secure multitenant cloud Optimized server hardware utilization by scaling high density virtualization Deliver user-controlled bandwidth partitioning across workloads and management services
- Data Rate: 6.40E7 kbps
- Host Bus: Other
- Number of Ports: 1
- Operating System: Linux?, Other
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Supplier: Arista Networks, Inc.
Description: Data centers demand high performance networking solutions. The Arista 7010T offers a purpose built high performance and power efficient solution for high density data center deployments. The Arista 7010T series delivers line rate switching at layer 2 and layer 3 to enable
- Data Rate: 176 Gbps
- Equipment Type: Switch
- Form Factor: Rack Mount
- Number of Ports: 4 to 48 #
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Fujipoly® Zebra® Gold 8000A elastomeric connectors transfers both data and power between parallel components and circuit boards while exhibiting a remarkably low electrical resistance of less than 25mΩ. This interconnect component is constructed from a low (read more)
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improved energy efficiency without sacrificing reliability. With workloads expanding from cloud computing to AI-driven analytics, interconnect technology must evolve to handle rapid growth in bandwidth, power demands, and thermal output. As data center demands surge, Heilind Electronics highlights (read more)
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for OEM customization TARGET APPLICATIONS Data centers Networking Storage High-speed interconnects within and between switches, routers and transport equipment (read more)
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Offering robust mechanical stability, Amphenol Lynx mezzanine connectors feature scalable configurations. These connectors are perfect for data centers, telecom, and industrial applications that require reliable high-density interconnects. (read more)
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Stacked QSFP-DD 112G Connectors and Cages TE Connectivity (TE) stacked quad small form factor pluggable double density (QSFP-DD) 112G connectors and cages are the next generation of data infrastructure interconnect (read more)
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Cloud Computing and Data Center Interconnect (DCI) When network density increases and margins for error shrink, this 25G DWDM SFP28 module helps engineers move more data, farther and faster—using the same compact SFP footprint. (read more)
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The ever-growing demand for data, driven by the proliferation of smartphones and mobile devices, is pushing data center networks to adopt faster interfaces like 200 GbE, 400 GbE, and even 800 GbE. This trend extends to communication equipment interconnects with the adoption of PCI Express Gen6 (read more)
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uncertainty. Robust end-to-end portfolio that touches each part of data center operations from server to infrastructure. Vibrant ecosystem to partner with design partners. Passive copper solutions provide a cost-effective pathway to achieve performance (read more)
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Enabling Direct Connections: How Our Cross-Connect Solutions Have Evolved
Cross-connects are vital for performance and reliability, often the lifeblood of connectivity in networks and data centers. Because they 're so versatile, cross-connects can be used for many purposes: to create a consolidation point, a small telecom room interconnect or a large data center
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Optical Networking Best Practices Handbook
technologies have been moving from their telecom origin into the enterprise. For example, in data centers today, all storage area networking is based on fiber interconnects with speeds ranging from 1 to 10 Gbps. As the transmission bandwidth requirements increase and the costs of the emerging optical
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over its key interconnect technology. At issue is what will become the backplane for server blades an emerging class of Internet data center computers based on plug-and-play adapter
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4 Features to Look for in a Wall-Mount Cross Connect
Convert To PDF. Whether you're using a cross connect as a consolidation point, a small telecom room interconnect or a large data center cross connect, it's important to find a system that can hold everything you need. While cross connects can go into a rack, a wall-mount cross connect lets you take
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