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Supplier: Texas Instruments
Description: CC3100MOD SimpleLink Wi-Fi CC3100 Internet-on-a-chip Wireless Network Processor module
- Number of Transmitters: 17 #
- Bias / Operating Current: 0.715 mA
- TJ: -20 to 70 C
- Technology: Wi-Fi / WiMAX / Wi-Mesh
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Supplier: Texas Instruments
Description: CC3200MOD SimpleLink Wi-Fi CC3200 Internet-on-a-chip Wireless MCU module
- Number of Transmitters: 17 #
- Bias / Operating Current: 0.875 mA
- TJ: -20 to 70 C
- Technology: Wi-Fi / WiMAX / Wi-Mesh
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Supplier: Texas Instruments
Description: CC3200 SimpleLink? Wi-Fi? and Internet-of-Things solution, a Single-Chip Wireless MCU 64-VQFN -40 to 85
- Number of Transmitters: 18 #
- Bias / Operating Current: 0.69 mA
- TJ: -40 to 85 C
- Features: RoHS Compliant
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Description: Wireless sensor networks (WSN) are generating increasing interest from industry and research. This is driven by the availability of inexpensive, low-powered miniature components such as processors, radios and sensors which are sometimes integrated on a single chip. The idea of the
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Supplier: QUALCOMM, Incorporated
Description: Low-energy Qualcomm® Wi-Fi Solution The QCA4012 is a low power MCU with an integrated Wi-Fi platform for the Internet of Things that contains a low-power dual-band Qualcomm® Wi-Fi connectivity solution on a single chip. QCA4012 Specs Wi-Fi Wi-Fi Standards 802.11n 802.11a/b/g Wi-Fi
- Data Rate: 10,000 kbps
- Interface: I2C, SPI, UART, USB
- Package Type: QFN
- Technology: Wi-Fi / WiMAX / Wi-Mesh
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Supplier: QUALCOMM, Incorporated
Description: Low-Energy Wi-Fi Dual-Band 802.11a/b/g/n SoC The QCA4004 is an intelligent platform for the Internet of Things that contains a low-power Wi-Fi connectivity solution on a single chip. It includes a number of TCP/IP-based connectivity protocols along with SSL, allowing a low-cost,
- Data Rate: 10,000 kbps
- Interface: I2C, SPI, UART
- Package Type: QFN
- Technology: Wi-Fi / WiMAX / Wi-Mesh
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Supplier: Texas Instruments
Description: CC3100 SimpleLink? Wi-Fi and Internet-of-Things solution for MCU Applications 64-VQFN -40 to 85
- TJ: -40 to 85 C
- Features: Other, RoHS Compliant
- Technology: Wi-Fi / WiMAX / Wi-Mesh
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Network and Communication Chips - LM936-0650, Bluetooth Smart Module with Wireless Charging -- 17631Supplier: TOP-electronics USA
Description: LM936-0650, Bluetooth Smart Module with Wireless Charging The LM936 is a low-power Bluetooth Smart module that integrates key peripherals and components that are commonly used in sensors, medical devices, wearables, and other devices in the Internet of Things (IOT) domain. It utilises
- Technology: Bluetooth
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Supplier: Infineon Technologies AG
Description: AIROC™ CYW20736 Bluetooth® LE system on chip The Infineon CYW20736 is an advanced Bluetooth® Low Energy SoC that supports a wireless charging profile. The CYW20736 is designed to support the entire spectrum of Bluetooth® Low Energy use cases for the medical, home automation, accessory,
- TJ: -30 to 85 C
- Technology: Bluetooth
- Features: Other, RoHS Compliant
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Supplier: Intelligraphics, Inc.
Description: Designed specifically for Qualcomm®Atheros QCA98xx chip based Wi-Fi PCIe adapters, The IGX AR11AC delivers the most powerful, flexible, and integrated Wi-Fi solution available. This IGX advanced wireless driver suite provides fast, seamless roaming, enabling wireless devices to
- Licensing: Perpetual
- Use: Professional
- Deployment: Standalone
- Operating System: Windows
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Supplier: Infineon Technologies AG
Description: 1x1 Dual-band Wi-Fi 5 (802.11ac) + Bluetooth® 5.0 combo Infineon’s AIROC™ CYW43455 single-chip combo device features 1x1 dual-band 2.4 GHz and 5 GHz Wi-Fi 5 (802.11ac) and Bluetooth® 5.0. The CYW43455 single-chip device provides the highest level of integration for Internet of
- TJ: -30 to 85 C
- Technology: Bluetooth
- Features: Other, RoHS Compliant
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Supplier: L-com, Inc.
Description: locations to the security control center to deploy a surveillance system, or relaying the wireless signal from the urban to the suburban to provide wireless internet service to rural residents simultaneously. With the WDAP-8350, an outdoor wireless infrastructure can be
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Supplier: Infineon Technologies AG
Description: Wi-Fi 6 1x1 Dual-Band Low Power solution The AIROC™ CYW55532 is a single stream dual-band (2.4/5 GHz) Wi-Fi 6 solution. CYW55532 supports easy onboarding, extended range, network robustness, Matter over Wi-Fi, and advanced security. It is designed to address the needs of the Internet of
- TJ: -40 to 85 C
- Technology: Bluetooth
- Features: Other, RoHS Compliant
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Supplier: Infineon Technologies AG
Description: Wi-Fi 6 1x1 Single-Band Low Power solution The AIROC™ CYW55531 is a single stream single-band (2.4 GHz) Wi-Fi 6 solution. CYW55531 supports easy onboarding, extended range, network robustness, Matter over Wi-Fi, and advanced security. It is designed to address the needs of the Internet of
- TJ: -40 to 85 C
- Technology: Bluetooth
- Features: Other, RoHS Compliant
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Supplier: Eteily Technologies India Pvt. Ltd.
Description: Reliable 2.4GHz ISM Band Chip Antenna for Seamless Wireless Connectivity A 2.4GHz ISM Band Chip Antenna is a compact and efficient antenna designed to operate within the 2.4 GHz frequency range, which is part of the Industrial, Scientific, and Medical (ISM) Band. The 2.4 GHz
- Form Factor / Mounting: Internal / Chip
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Supplier: Eteily Technologies India Pvt. Ltd.
Description: An 3G 3dBi Spring Magnetic Antenna is typically used for communication in wireless systems operating in the 3G frequency band, which is commonly used for applications like LoRa (Long Range), IoT (Internet of Things), RFID (Radio Frequency Identification), and other wireless
- Gain: 3 dB
- Form Factor / Mounting: Internal / Chip
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Supplier: Linx Technologies
Description: Product Description The CER Series LTE ceramic chip antenna is a compact, high efficiency antenna designed to be easily integrated into wireless telecommunication devices. Operating in all common 4G/3G/2G LTE bands, it has better efficiency and gain at lower cellular bands compared to
- Primary Frequency Range: 690 to 2,700 MHz
- Operating Temperature: -40 to 185 F
- Applications: Cellular / PCS Terminal
- Form Factor / Mounting: Internal / Chip
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Supplier: Microchip Technology, Inc.
Description: The IS1678 is a fully‐certified Bluetooth® (BR/EDR/LE) IC for designers who want to easily add dual mode Bluetooth wireless capability to their products. Delivering local connectivity for the Internet of Things (IoT), the IS1678 IC bridges your product to Smart Phones and Tablets for
- Interface: I2C
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Supplier: Nordic Semiconductor ASA
Description: programmable buttons and visual feedback is provided through RGB LEDs. Connectivity features include a USB interface powered by the nRF5340 System-on-Chip (SoC), which also supports Bluetooth Low Energy (LE) for specific use cases. Additionally, the nRF7002 Wi-Fi companion IC enhances Wi-Fi
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Supplier: QUALCOMM, Incorporated
Description: The CSR102x chipset product family is optimized for specific applications in the Internet of Things, including wireless remote controls, simple smart watches, home automation solutions and beacons where balancing performance, battery life and price point is critical. The new CSR102x
- Technology: Bluetooth
- Features: Bluetooth® Single Chip Solutions, Other
- Package Type: LGA, QFN
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Supplier: ZBA, Inc.
Description: computing experience more convenient. Use the Bluetooth USB adaptor on your Windows enabled notebook and desktop computers to print files to a Bluetooth enabled printer, dial up networking to the Internet, via a wireless modem (mobile phone) or another PC. You can share or access files
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Supplier: ZBA, Inc.
Description: computing experience more convenient. Use the Bluetooth USB adaptor on your Windows enabled notebook and desktop computers to print files to a Bluetooth enabled printer, dial up networking to the Internet, via a wireless modem (mobile phone) or another PC. You can share or access files
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Supplier: Samsung Electro-Mechanics
Description: A Wi-Fi combo module is a short-distance wireless communication module that provides wireless Internet or communication between devices. Small and thin parts as well as a miniaturization package method are applied to provide high-density and miniaturized module solutions.
- Technology: Wi-Fi / WiMAX / Wi-Mesh
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Description: Manufacturing, Smart Factory, Sensor Networks, Data Analysis Computer Vision and Pattern Recognition, Motion and Video Analysis, New trends in wired and wireless communication, System-on-Chip (SoC), Robotics, Electronics Instrumentation using CAD Tools, Business Intelligence,
- Industry: Automation and Robotics, Electronics and Semiconductor, Networking and Computing
- Type: Conference
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Supplier: Nordic Semiconductor ASA
Description: direct Wi-Fi communication for internet connectivity, it seamlessly integrates with Nordic’s nRF91 Series cellular SiPs. This brings together the capabilities of the nRF7000 with the nRF91 Series, providing developers with a powerful combination of GNSS, cell-based, and SSID-based Wi-Fi
- Operating Frequency: 2,400 MHz
- Features: Other
- Technology: Wi-Fi / WiMAX / Wi-Mesh
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Supplier: Telit IoT Solutions, Inc.
Description: high-speed wireless connectivity combined with embedded multi-constellation high-sensitivity positioning GPS + GLONASS receiver Voice friendly with VoLTE - Voice over LTE support Internet friendly with integrated TCP/IP and UDP/IP stacks Simple drop-in migration and technology design
- Operating Frequency: 700 to 1,900 MHz
- Data Rate: 50,000 to 100,000 kbps
- TJ: -40 to 85 C
- Pin Count: 144 #
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Supplier: QUALCOMM, Incorporated
Description: and throughput optimization, and other customizable features, the MDM9207-1 can connect a growing array of devices and systems within the Internet of Things. It’s all in a highly integrated package engineered with scalability across the chipset platform to reduce bill-of-materials (BOM)
- Operating Frequency: 1,300 MHz
- Data Rate: 5,000 to 10,000 kbps
- Technology: Bluetooth, CDMA, GSM, Wi-Fi / WiMAX / Wi-Mesh
- Features: Bluetooth® EDR Chip, Other
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Supplier: Semtech Corp.
Description: Semtech's LoRa RF platform (SX127X product family) is a 2-way wireless solution that complements M2M cellular infrastructure, and provides a low-cost way to connect battery operated and mobile devices to the network infrastructure. By combining our LoRa RF transceiver products with our LoRa
- Operating Frequency: 137 to 1,020 MHz
- Data Rate: 300 kbps
- Features: Other
- Device Type: Transceiver
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Supplier: TOP-electronics USA
Description: rich set of Internet protocols, industry-standard interfaces (USB/UART/I2C/Status Indicator) and abundant functionalities (USB drivers for Windows 7/8/8.1/10, Linux and Android) extend the applicability of the module to a wide range of M2M applications such as wireless POS, smart
- Technology: Ethernet
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Supplier: Telit IoT Solutions, Inc.
Description: drop-in migration and technology upgrade path to 3G high-speed performance for designs currently using the GL865-DUAL V3 Ideal for fleet management and track-and-tracing application with easy to follow reference designs for pairing with Telit GPS and GPS/GLONASS receivers Internet application
- Operating Frequency: 900 to 2,100 MHz
- Data Rate: 9.6 kbps
- TJ: -40 to 85 C
- Technology: 3G Standard
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Supplier: Telit IoT Solutions, Inc.
Description: reference designs pairing with Telit GPS and GPS / GLONASS receivers Internet application friendly with integrated TCP/IP and UDP/IP stacks Voice-capable for applications requiring digital (DVI) interface Complete SMT platform for m2m solutions running the customer application inside the
- Operating Frequency: 850 to 1,900 MHz
- Data Rate: 5,760 to 7,200 kbps
- TJ: -40 to 85 C
- Technology: 3G Standard
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Supplier: Telit IoT Solutions, Inc.
Description: applications for the European OEM and Aftermarket Automotive with full ISO TS16949 quality processes Internet application friendly with integrated TCP/IP and UDP/IP stacks Voice-capable for applications requiring either analog or digital (DVI) interfaces Over-the-Air firmware update (OMA-DM
- Operating Frequency: 900 to 2,100 MHz
- Data Rate: 384 to 3,600 kbps
- TJ: -40 to 85 C
- Sensitivity: -107 to -108.00000000000001 dBm
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Supplier: TOP-electronics USA
Description: delivers maximally 150Mbps downlink and 50Mbps uplink data rates based on LTE network, and additionally supports wireless communication via IEEE 802.11 a/b/g/n (IEEE 802.11 b/g/n for SC20-CE/-W R1.0) and BT4.1 LE (BT4.2 on Android 7). It is ideal for both industrial and consumer applications
- Technology: Bluetooth
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Skyworks is pleased to introduce the SKY66118-11 and the SKY66407-11, 2.4 GHz front-end modules (FEMs) for Bluetooth® Internet of Things (IoT) applications including smartwatches, trackers, connected home systems, wireless and gaming headsets and more. These low power solutions (read more)
Browse Bluetooth ® Chips Datasheets for Skyworks Solutions, Inc.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
adds PCI to DynaMite chip set for ADSL systems Alcatel Microelectronics steps up to SOC platform Xilinx chief sees proliferation of FPGAs during this decade Mitsubishi aims flash 8-bit MCU at smart batteries Fairchild launches unit to focus on Internet, wireless applications Lucent to buy VTC's
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
IP trading center planned to serve Japan designers Mitsubishi Corp., Nikkei Business Publications Inc. and Toshiba Corp. have joined forces to set up an Internet-based intellectual property trading center in an effort to ignite the core and system-chip business in Japan. The trio will announce
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Sampling shift spurs digital receiver gains A new sampling technique may lead to simpler single-chip radio receivers that can be produced without special filters. The circuit technique, described at the International Conference of Signal Processing Applications and Technology here, allows sampling
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
. Based on Ampro's EnCore platform, the modules will be designed for Internet- and other network-connected embedded systems. Japan's chip industry to launch reconstruction program Cree takes stake in Xemod; inks deal to develop RF devices DURHAM, N.C. -- Cree Inc. has taken an equity stake and formed
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Taiwan chip makers negotiating fab plans in China Cirrus' Maverick chip powers Internet audio appliance Are benchmarks for network processors feasible? SSMC purchases $33 million of Lam metal-etch tools Samsung orders SVG's ProCell cluster tool Commerce tariff review drastically reduces Winbond's
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Systems Conference this week an Internet-based service for deploying and managing open source platforms. Wireless video set to run on DSPs As Sprint PCS and other carriers ready wireless video applications for delivery later this year, chip companies are racing to optimize MPEG-4 and other key audio
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
in Asylum Telecom Motorola Inc. announced Friday (April 22) its Motorola Ventures investment arm has made a strategic minority investment in Asylum Telecom LLC, a global provider of turnkey Internet-based communication solutions. Ericsson reports profit but remains cautious on 2005 Swedish wireless
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
and price turbulence for granted. Heard on the Beat (June 15) Heard on the Beat (June 15) Commentary & analysis of week's chip news Philips Semi to post Q2 operating loss; fab utilization at 40-45% AMSTERDAM -- Royal Philips Electronics N.V. today said its semiconductor division revenues are expected
More Information Top
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Maintaining Low Power Consumption on Chips is Critical to Drive Wireless Internet on a Chip Technology
Firstpass Semiconductor AB, based in Stockholm, and US-based Firstpass Technologies Inc. have developed a single chip wireless Internet phone using CMOS Technology.
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Gordy gave me your name : Article : Nature
His bio said he came up with the wireless Internet chip .
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IDF Fall 2003 -- Paul Otellini Keynote
It is our first single chip Wireless - Internet -on-a-Chip.
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Demystifying China’s Economy Development
… with the small- est part of costs is in assembly plant in Shenzhen, while more than 100 kinds of components with high profits are respectively microchips made by Germany and South Korea, mobile phones chips for wireless Internet or cell phone signals …
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CR4 - Thread: Manually Selecting Which Network to Connect to Web in Multi-Network System
You might be interested in: WiFi and WiMAX Wireless Chips , Internet Service Providers (ISPs), Bluetooth® Chips .
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D&R Headline News: SoC (System on Chip), Silicon IP, Semiconductor IP, Software IP, Verification IP, Core, Design Reuse
• Maintaining Low Power Consumption on Chips is Critical to Drive Wireless Internet on a Chip Technology .
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Presentation Secrets of Steve Jobs: How to Be Insanely Great in Front of Any Audience > SCENE 5: Draw a Road Map
Later this year it plans to roll out chips using a new wireless Internet standard, WiMax, which can send a signal over several miles." 4 .
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Simula Research Laboratory
The Networks and Distributed Systems department conducts research on a wide range of communication networks, from networks on chips to Internet backbones and wireless networks.
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