Low Density Epoxy

Description: 20-3036 is a light weight epoxy for potting, casting, and encapsulating electronic components and assemblies. It is formulated in a convenient 2:1 by weight mix ratio.

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Unfilled
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System

Description: 20-3035 is a low density, two component epoxy potting and encapsulating system. The weight of 20-3035 is less than half of most commercially available potting compounds.

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 23.89 µin/in-F
• Composition: Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: components or materials. G6E-FRP™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. G6E-FRP™ epoxy is low cost (compared with silver). A heating oven is highly recommended during curing. Uses for G6E-FRP™ epoxy include flexible

• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Flexible / Dampening
• Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
• Use Temperature: 77 to 248 F

Description: DESCRIPTION: G6E-HTNS™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS™ is developed

• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
• Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
• Use Temperature: 302 to 356 F

Description: DESCRIPTION: G6E-FXNS™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS™ is developed based on advanced proprietary

• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Flexible / Dampening
• Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
• Use Temperature: 302 F

Description: DESCRIPTION: G6E-SG™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG™ is formulated with proprietary nanomaterials

• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
• Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
• Use Temperature: 77 to 302 F

Description: ResinLab EP1294 Epoxy Adhesive Yellow is a two component, flame-retardant edge fill epoxy syntactic foam used to provide structural strength for applications like airfract interior honeycomb panels. Provides protection against salt spray, humidity, water, and other chemicals.

• Cure Type / Technology: Two Component System
• Elongation: 1 to 2 %
• Tensile Strength (Break): 2400 psi

Description: ResinLab EP1294 Epoxy Adhesive Yellow is a two component, flame-retardant edge fill epoxy syntactic foam used to provide structural strength for applications like airfract interior honeycomb panels. Provides protection against salt spray, humidity, water, and other chemicals.

• Cure Type / Technology: Two Component System
• Elongation: 1 to 2 %
• Tensile Strength (Break): 2400 psi

Description: ResinLab EP1294 Epoxy Adhesive Yellow is a two component, flame-retardant edge fill epoxy syntactic foam used to provide structural strength for applications like airfract interior honeycomb panels. Provides protection against salt spray, humidity, water, and other chemicals.

• Cure Type / Technology: Two Component System
• Elongation: 1 to 2 %
• Tensile Strength (Break): 2400 psi

Description: ResinLab EP1294 Epoxy Adhesive White is a two component, flame-retardant edge fill epoxy syntactic foam used to provide structural strength for applications like airfract interior honeycomb panels. Provides protection against salt spray, humidity, water, and other chemicals. Low

• Cure Type / Technology: Two Component System
• Elongation: 1 to 2 %
• Tensile Strength (Break): 2400 psi

Description: FIRETEX M90/02 provides up to four hours of fire protection, while providing a corrosion resistant protective coating for the design life of the asset. With low spray applied density, reduced film build requirements and high performance properties, FIRETEXT M90/02 is highly recommended

• Chemistry: Epoxy, Resin Base / Polymer Binder
• Cure / Dry Temperature: 50 to 104 F
• Features: Chemical / Oil Resistant, Heat Resistant / High Temperature, Wear Resistant (Abrasion / Erosion), Weather / UV Resistant
• Industry: OEM / Industrial

Description: Low self Inductance Heating. Various RF applications. RCD’s CEA Series features Ceragoldhigh-density multi-layer construction enabling an expanded range of values. Bodies are insulated with a proprietary flame retardant epoxy coating for superior environmental

• Capacitance Range: 3.00E-7 to 2.2 microF
• Capacitance Tolerance: 20 (+/- %)
• Capacitance Type: Fixed
• Configuration / Form Factor: Leaded Capacitor

Description: Epoxies, Etc's resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace

• Application: Industrial OEM, Other
• Bulk Density: 2.2 lbs/ft³
• Foam Type: Closed Cellular, Rigid
• Form / Shape: Casting Resin / Two-part (A+B Liquids)

Description: 3M™ Scotch-Weld™ Low Density Composite Surfacing Film AF 163 2XS is thermosetting, laminated metal foil films that adheres to cold and release coated tools.

• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Industry: Aerospace, OEM / Industrial
• Substrate / Material Compatibility: Composites

Description: 3M™ Scotch-Weld™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. High performance over a temperature range of -67F to 350F (-55C to 177C). Low density. Long worklife. Low volatile loss

• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Features: Leveling / Filling Compound
• Industry: Aerospace, OEM / Industrial
• Substrate / Material Compatibility: Other

Description: 3M™ Scotch-Weld™ Structural Core Splice Adhesive AF 3024 is a 250°F (121°C) to 350°F (176°C) curing, low density, expandable core splice adhesive film.High expansion (250%). Low sag during cure. Low volatile loss. High performance from -67°F to 350°F (-55°C to 176°C).

• Applied Thickness / Gap Fill: 0.0250 to 0.1000 inch
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Industry: Aerospace, OEM / Industrial
• Substrate / Material Compatibility: Other

Description: 3M™ Scotch-Weld™ Structural Core Splice Adhesive AF 3028 is a 250°F to 350°F (121°C to 176°C) curing, low density, expandable core splice adhesive film. Scotch-Weld AF 3028 adhesive was designed for filling mismatch areas or reinforcing and splicing honeycomb core.

• Applied Thickness / Gap Fill: 0.0500 inch
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Industry: Aerospace, OEM / Industrial
• Substrate / Material Compatibility: Other

Description: CircuitSeal™ is the process of hermetically sealing and encapsulating connectors and electronic circuits within a low-outgassing, chemically inert hermetic epoxy. By encapsulating the circuit board, connector, or flex circuit, customers have increased design flexibility to design a

• Additional Services: Design Assistance
• Industry: Electrical / Electronics, Military / Law Enforcement
• Location: North America, United States Only, Northeast US Only
• Sealing Method Capabilities: Epoxies

Description: LOCTITE EA 9825 AERO is a low-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350 °F (177 °C). It may also be used for fastener or attachment potting and panel edge reinforcing.

• Industry: Aerospace

Description: equivalent serial resistance (ESR) Low power loss Low dielectric absorption Optimized for high frequencies up to several MHz Increasing capacitance with DC bias up to operating voltage High capacitance density Minimized dielectric loss at high

• Capacitance Range: 1.5 microF
• Capacitance Tolerance: 20 (+/- %)
• DC Rated Voltage Range (WVDC): 700 volts
• Electrostatic Capacitors: Ceramic

Description: equivalent serial resistance (ESR) Low power loss Low dielectric absorption Optimized for high frequencies up to several MHz Increasing capacitance with DC bias up to operating voltage High capacitance density Minimized dielectric loss at high

• Capacitance Range: 10 microF
• Capacitance Tolerance: 20 (+/- %)
• DC Rated Voltage Range (WVDC): 500 volts
• Electrostatic Capacitors: Ceramic

Description: equivalent serial resistance (ESR) Low power loss Low dielectric absorption Optimized for high frequencies up to several MHz Increasing capacitance with DC bias up to operating voltage High capacitance density Minimized dielectric loss at high

• Capacitance Range: 0.5000 microF
• Capacitance Tolerance: 20 (+/- %)
• DC Rated Voltage Range (WVDC): 900 volts
• Electrostatic Capacitors: Ceramic

Description: 14AFR Current Sense resistors feature a high temperature ceramic body which affords the user higher power densities than similar products which utilize silicone based epoxy molding compounds. The internal construction involves a straight, low inductance,3-piece welded metal

• Category / Application: Current Sensing Resistor
• Configuration: Single Resistor
• Mounting / Packaging: Axial Leads
• Operating Temperature: -55 to 275 C

Description: plates are designed specifically for low to medium power density applications. Custom Pressed Tube Liquid Cold Plates are available with either continuous tube styles or a manifold style to increase tube density within the liquid cold plate. Manifolds are brazed to tubes and

• Device: Liquid Cooler/Cold Plate
• Length: 152 to 305 mm
• Material: Aluminum, Other Materials
• Weight: 400 to 900 g

Description: Features 92/8 gold silver alloy on silver palladium contact type is suitable for low level switching application. Small size and light weight can provide high density P.C. Board mounting. 2.54mm Terminal Pitch. Low Coil Power Consumption of GS-T Type and

• Break Time (Release Time): 4 milliseconds
• Coil Nominal DC Power: 0.2000 watts
• Coil Resistance: 45 to 2880 ohms
• DC Coil Voltage: 3 to 24 volts

Description: performance Optional rugged epoxy encapsulated V-SHIELD® package with integral metalized EMI shield NO use of Host of circuit protection features High power density: > 30 W/in3 Fixed switching frequency

• DC Input Voltage: 15 to 50 volts
• DC Output Current: 0.0 to 4.2 amps
• DC Output Power: 30 watts
• DC Output Voltage: 5 to 15 volts

Description: °C, no power derating necessary Output voltage trim up +10% or down -20% Six-sided metal cases for improved EMI and mechanical/environme ntal performance Optional rugged epoxy encapsulated V-SHIELD® package with integral metalized EMI shield No use of Host of circuit protection features High

• DC Input Voltage: 15 to 50 volts
• DC Output Current: 0.0 to 3 amps
• DC Output Power: 15 watts
• DC Output Voltage: 3.3 to 15 volts

Description: °C to +100 °C, no power derating necessary Six-sided metal cases for improved EMI performance and mechanical/environme ntal performance Optional rugged epoxy encapsulated V-SHIELD® package with integral metalized EMI shield No use of Host of circuit protection features High power

• DC Input Voltage: 15 to 50 volts
• DC Output Current: 0.0 to 2.1 amps
• DC Output Power: 15 watts
• DC Output Voltage: 5 to 15 volts

Description: Increasing capacitance with DC bias up to operating voltage High capacitance density Minimized dielectric loss at high temperatures High reliability Construction RoHS-compatible PLZT ceramic (lead lanthanum zirconium titanate) Copper inner electrodes Silver outer electrodes Silver coated

• Capacitance Range: 0.2500 microF
• Capacitance Tolerance: 20 (+/- %)
• Configuration / Form Factor: Leaded Capacitor
• DC Rated Voltage Range (WVDC): 900 volts

Description: Is a syntactic foam kit that produces a multi-sphere foam with a typical density of 26 - 29 pcf (pounds per cubic foot). The rated service depth of the foam is 3,300 feet (1,000 m). The kit consists of three parts: Part A: Epoxy resin mixed with hollow glass microspheres. Part B:

• Application: Acoustics / Sound Proofing, Structural / Composites, Other
• Bulk Density: 26 lbs/ft³
• Foam Type: Closed Cellular, Rigid
• Form / Shape: Casting Resin / Two-part (A+B Liquids)

Description: liquid cold plates feature copper or stainless steel tubing mechanically interlocked into aluminum plates. These cost effective liquid cold plates are designed specifically for low to medium power density applications. Standard Aavid Hi-Contact™ tube liquid cold plates feature a joint

• Device: Liquid Cooler/Cold Plate
• Height: 14 to 15.2 mm
• Length: 57.2 to 610 mm
• Material: Aluminum, Other Materials

Description: instant dry universal ink performance low coatweight primer; one - pass EspriJET TC Premium Matte/ Fine Art Series off-machine coating applications waterfast improved color gamut/density low coatweight

• Industry: Identification / Marking

Description: . High stability with low loss characteristics,Towe r block shape allows for high packing density,Epoxy sealed flame retardant case,Resistant to cleaning fluids Series = EXFS Capacitance = 330pF Tolerance = ±1% Voltage = 63V dc Mounting Type = Through Hole Construction = Radial

• Applications: Telecom, Other
• Capacitance Range: 3.30E-4 microF
• Capacitance Tolerance: 1 (+/- %)
• Electrostatic Capacitors: Polystyrene

Description: . High stability with low loss characteristics,Towe r block shape allows for high packing density,Epoxy sealed flame retardant case,Resistant to cleaning fluids Capacitance = 3.3nF Series = EXFS Tolerance = ±1% Voltage = 63V dc Mounting Type = Through Hole Construction = Radial

• Applications: Telecom, Other
• Capacitance Range: 0.0033 microF
• Capacitance Tolerance: 1 (+/- %)
• Electrostatic Capacitors: Polystyrene

Description: . High stability with low loss characteristics,Towe r block shape allows for high packing density,Epoxy sealed flame retardant case,Resistant to cleaning fluids Capacitance = 10nF Series = EXFS Tolerance = ±1% Voltage = 63V dc Mounting Type = Through Hole Construction = Radial

• Applications: Telecom, Other
• Capacitance Range: 0.0100 microF
• Capacitance Tolerance: 1 (+/- %)
• Electrostatic Capacitors: Polystyrene

Description: . High stability with low loss characteristics,Towe r block shape allows for high packing density,Epoxy sealed flame retardant case,Resistant to cleaning fluids Capacitance = 100pF Series = EXFS Tolerance = ±1% Voltage = 63V dc Mounting Type = Through Hole Construction = Radial

• Applications: Telecom, Other
• Capacitance Range: 1.00E-4 microF
• Capacitance Tolerance: 1 (+/- %)
• Capacitance Type: Fixed