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Supplier: Epoxies Etc...
Description: 20-3036 is a light weight epoxy for potting, casting, and encapsulating electronic components and assemblies. It is formulated in a convenient 2:1 by weight mix ratio.
- Thermal Conductivity: 0.20191906 W/m-K
- Dielectric Strength: 390.0000000000004 kV/in
- Dielectric Constant (Relative Permittivity): 3.7
- Type: Electrical Insulation / Dielectric
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Supplier: Epoxies Etc...
Description: 20-3035 is a low density, two component epoxy potting and encapsulating system. The weight of 20-3035 is less than half of most commercially available potting compounds.
- Use Temperature: -40 to 266 F
- Thermal Conductivity: 0.18749627 W/m-K
- Coeff. of Thermal Expansion (CTE): 23.88888888888889 µin/in-F
- Tensile Strength (Break): 3,000 psi
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Supplier: Epoxies Etc...
Description: Epoxies, Etc's resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace industries.
- Bulk Density: 2.2 lbs/ft³
- Tensile Strength: 800 psi
- Thermal Conductivity: 0.121 BTU-in/hr-ft²-F
- Form / Shape: Casting Resin / Two-part (A+B Liquids)
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1294 Epoxy Adhesive Yellow is a two component, flame-retardant edge fill epoxy syntactic foam used to provide structural strength for applications like airfract interior honeycomb panels. Provides protection against salt spray, humidity, water, and other chemicals.
- Tensile Strength (Break): 2,400 psi
- Elongation: 1 to 2 %
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1287 Epoxy Adhesive Orange is a two compontent, flame-retardant edge fill epoxy syntactic foam used to provide structural strength for applications like airfract interior honeycomb panels. Provides protection against salt spray, humidity, water, and other chemicals.
- Tensile Strength (Break): 2,000 psi
- Elongation: 1 to 2 %
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1294 Epoxy Adhesive Yellow is a two component, flame-retardant edge fill epoxy syntactic foam used to provide structural strength for applications like airfract interior honeycomb panels. Provides protection against salt spray, humidity, water, and other chemicals.
- Tensile Strength (Break): 2,400 psi
- Elongation: 1 to 2 %
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1294 Epoxy Adhesive White is a two component, flame-retardant edge fill epoxy syntactic foam used to provide structural strength for applications like airfract interior honeycomb panels. Provides protection against salt spray, humidity, water, and other chemicals. Low
- Tensile Strength (Break): 2,400 psi
- Elongation: 1 to 2 %
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Description: FIRETEX M90/02 provides up to four hours of fire protection, while providing a corrosion resistant protective coating for the design life of the asset. With low spray applied density, reduced film build requirements and high performance properties, FIRETEXT M90/02 is highly recommended
- Wet / Applied Thickness: 0.12 to 1.12 inch
- Cure / Dry Temperature: 50 to 104 F
- Operating / Use Temperature: 10 to 55 F
- Features: Chemical / Oil Resistant, Heat Resistant / High Temperature, Wear Resistant (Abrasion / Erosion), Weather / UV Resistant
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Supplier: RCD Components, Inc.
Description: Low self Inductance Heating. Various RF applications. RCD’s CEA Series features Ceragoldhigh-density multi-layer construction enabling an expanded range of values. Bodies are insulated with a proprietary flame retardant epoxy coating for superior environmental protection and
- Capacitance Range: 0.0000003 to 2.2 microF
- Capacitance Tolerance: 20 (+/- %)
- DC Rated Voltage Range (WVDC): 25 to 100 volts
- Operating Temperature: -30 to 85 C
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Description: 3M™ Scotch-Weld™ Low Density Composite Surfacing Film AF 163 2XS is thermosetting, laminated metal foil films that adheres to cold and release coated tools.
- Industry: Aerospace, OEM / Industrial
- Substrate Compatibility: Composites
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System, Thermosetting / Crosslinking
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Description: Structural Two Part Extrudable Low Density Void Filler. Two part RT cure low density void filler designed for honeycomb construction of aircraft interiors - available in cartridges.
- Use Temperature: -65 to 212 F
- Industry: Aerospace, OEM / Industrial
- Chemical System: Epoxy (EP)
- Features: Flame Retardant (e.g. UL 94 Rated), Gap Filling Sealant / FIP Gasket, Leveling / Filling Compound, Other
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Description: 3M™ Scotch-Weld™ Structural Core Splice Adhesive AF 3024 is a 250°F (121°C) to 350°F (176°C) curing, low density, expandable core splice adhesive film.High expansion (250%). Low sag during cure. Low volatile loss. High performance from -67°F to 350°F (-55°C to 176°C).
- Applied Thickness / Gap Fill: 0.025 to 0.1 inch
- Use Temperature: -67 to 350 F
- Industry: Aerospace, OEM / Industrial
- Chemical System: Epoxy (EP)
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Description: 3M™ Scotch-Weld™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. High performance over a temperature range of -67F to 350F (-55C to 177C). Low density. Long worklife. Low volatile loss
- Use Temperature: -67 to 350 F
- Industry: Aerospace, OEM / Industrial
- Chemical System: Epoxy (EP)
- Features: Gap Filling Sealant / FIP Gasket, Leveling / Filling Compound, Other
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE EA 9825 AERO is a low-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350 °F (177 °C). It may also be used for fastener or attachment potting and panel edge reinforcing.
- Industry: Aerospace
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Supplier: Trelleborg Offshore
Description: density range for the foam is 26 - 29 pcf with low density resulting from a high packing factor for the Part C spheres and high density resulting from a low packing factor. Packing factor is defined as the fraction of volume, expressed as a percent, that the
- Bulk Density: 26 lbs/ft³
- Applications: Acoustics / Sound Proofing, Structural / Composites
- Form / Shape: Casting Resin / Two-part (A+B Liquids)
- Material / Composition: Ceramic Foam
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Supplier: Ohmite Manufacturing Co.
Description: 14AFR Current Sense resistors feature a high temperature ceramic body which affords the user higher power densities than similar products which utilize silicone based epoxy molding compounds. The internal construction involves a straight, low inductance,3-piece welded metal element at
- Resistance Range: 0.004 to 0.051 ohms
- Tolerance: 1 +/- %
- Temperature Coefficient (TCR): 150 to 1,100 ±ppm/°C
- Power Rating: 4 watts
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Supplier: Excel Cell Electronic USA Corp.
Description: Features 92/8 gold silver alloy on silver palladium contact type is suitable for low level switching application. Small size and light weight can provide high density P.C. Board mounting. 2.54mm Terminal Pitch. Low Coil Power Consumption of GS-T Type and high Coil Power
- Maximum Current: 2 amps
- Maximum AC Switching Voltage: 120 volts
- Maximum DC Switching Voltage: 24 volts
- Maximum AC Switching Power: 120 VA
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Supplier: Allied Electronics, Inc.
Description: Subminature Power Relays, 150 VDC⁄300 VAC Light Duty PC board relay with SPDT (1 Form C) contacts. Contact Material: Silver nickel. Enclosure: P.B.T. polyester. Terminals: Tinned copper. Weight: 3.5 grams. Subminiature Size for High-Density Packaging Coil Sensitivity to 114 mW Extremely
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Supplier: Allied Electronics, Inc.
Description: Subminature Power Relays, 150 VDC⁄300 VAC Light Duty PC board relay with SPDT (1 Form C) contacts. Contact Material: Silver nickel. Enclosure: P.B.T. polyester. Terminals: Tinned copper. Weight: 3.5 grams. Subminiature Size for High-Density Packaging Coil Sensitivity to 114 mW Extremely
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Supplier: Allied Electronics, Inc.
Description: Subminature Power Relays, 150 VDC⁄300 VAC Light Duty PC board relay with SPDT (1 Form C) contacts. Contact Material: Silver nickel. Enclosure: P.B.T. polyester. Terminals: Tinned copper. Weight: 3.5 grams. Subminiature Size for High-Density Packaging Coil Sensitivity to 114 mW Extremely
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Supplier: Douglas Electrical Components
Description: contaminants Low profile assembly Meets various MIL-spec standards for moisture resistance Chemically inert epoxy Hermetically seals to various materials Increase conductor density through the hermetic seal Design for harsh environments and hazardous locations Maintains signal
- Additional Services: Design Assistance
- Industry: Electrical / Electronics, Military / Law Enforcement
- Sealing Method Capabilities: Epoxies
- Features: North America, Northeast US Only, United States Only
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Supplier: Boyd
Description: designed specifically for low to medium power density applications. Custom Pressed Tube Liquid Cold Plates are available with either continuous tube styles or a manifold style to increase tube density within the liquid cold plate. Manifolds are brazed to tubes and tested for
- Length: 152.4 to 304.8 mm
- Width: 88.9 to 127 mm
- Weight: 400 to 900 g
- Material: Aluminum
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Supplier: Littelfuse, Inc.
Description: Tailored specifically for applications requiring Power MOSFETs to operate in their current saturation regions, these unique devices feature low thermal resistances, high power density, and extended Forward Bias Safe Operating Areas (FBSOA). When Power MOSFETs are utilized in
- Polarity: N-Channel
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Supplier: Nexperia B.V.
Description: IFSM capability High power density Reduced system costs System miniaturization Reduced EMI Qualified according to AEC-Q101 in SMD package with epoxy mold compound and recommended for use in automotive applications Applications Traction inverter DC-DC converter Onboard charger
- Features: Other, Schottky Barrier Diodes
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Supplier: VPT, Inc.
Description: EMI performance and mechanical/environmental performance Optional rugged epoxy encapsulated V-SHIELD® package with integral metalized EMI shield No use of Host of circuit protection features High power density: > 20 W/in3 Fixed switching frequency
- DC Input Voltage: 15 to 50 volts
- DC Output Voltage: 5 to 15 volts
- DC Output Current: 0 to 2.1 amps
- DC Output Power: 15.000000000000002 watts
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Supplier: Boyd
Description: or stainless steel tubing mechanically interlocked into aluminum plates. These cost effective liquid cold plates are designed specifically for low to medium power density applications. Standard Aavid Hi-Contact™ tube liquid cold plates feature a joint-free continuous tube press-fit
- Length: 57.2 to 609.6 mm
- Width: 57.2 to 177.8 mm
- Height: 14.000000000000002 to 15.200000000000001 mm
- Material: Aluminum
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Supplier: Electronic Concepts, Inc.
Description: STANDARD CONFIGURATIONS Wrap and Epoxy End Fill Where high insulation resistance, high Q, extreme stability, close tolerance, low dielectric absorption and dissipation factor are required. As pioneers in the use of Polypropylene as a capacitor dielectric, Electronic Concepts, Inc. has
- Capacitance Range: 0.01 to 10.000000000000002 microF
- Capacitance Tolerance: 10 (+/- %)
- DC Rated Voltage Range (WVDC): 150 to 600 volts
- Operating Temperature: -55 to 105 C
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Supplier: Esprix Technologies
Description: color gamut/density low coatweight EspriJET PS Paper Sizing Matte Series size press applications waterfast improved color gamut/density internal to paper substrate Custom Polymer Synthesis of Ink Jet Materials is Available ALKOX®: Polyethylene Oxide High purity Silica free Water
- Features: Identification / Marking
- Form: Ink
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Supplier: Douglas Electrical Components
Description: Connector Types MIL-spec connectors including MIL-DTL-38999, MIL-DTL-5015, MIL-DTL-26482, MIL-DTL-24308, and MIL-DTL-83513 D-sub hermetic connectors for vacuum applications Micro-D hermetic connectors Regular and standard density (HDM) High density (HDD) Nano-D Coaxial connectors (SMA,
- Temperature Range: 200 C
- Features: Electrical
- Feedthrough Mount: Flange Mount
- Electrical Feedthrough Type: Thermocouple
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Supplier: Douglas Electrical Components
Description: simplify customer installation. Talk to us about your application(s) and we can start the process to find suitable designs to hermetically seal your electrical connection. Features PERFORMANCE CAPABILITIES NASA ASTM-E-595 certified low-outgassing epoxy (0.33% TML, 0.00% CVCM) < 1×10-9
- Contact Size (AWG): 16 AWG
- Number of Contacts: 21 #
- Connector Type: BNC, MHV, SMA
- Features: Coaxial Connector, Military Connector
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Supplier: Douglas Electrical Components
Description: simplify customer installation. Talk to us about your application(s) and we can start the process to find suitable designs to hermetically seal your electrical connection. Features PERFORMANCE CAPABILITIES NASA ASTM-E-595 certified low-outgassing epoxy (0.33% TML, 0.00% CVCM) < 1×10-9
- Contact Size (AWG): 20 AWG
- Number of Contacts: 128 #
- Connector Type: BNC, MHV, SMA
- Features: Coaxial Connector, Military Connector
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