Products & Services
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Supplier: Indium Corporation
Description: Traditional solders have reflow temperatures in the range of 183°C to 221°C. However, advancements in components, substrates, and electronics design have driven the need for solder that will reflow in the 115°C to 180°C range. Some of these key drivers include:
- Solder Alloy: Indium (In)
- Features: Other
- Product Form: Paste
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Supplier: Accuris
Description: SLEEVE, TERMINATION, ELECTRICAL, LOW TEMPERATURE, FLUXED SOLDER PREFORM, HEAT SHRINKABLE
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Supplier: Indium Corporation
Description: solder. Additionally, some very fine pitch temperature-sensitive applications now use pure indium or indium-silver-plated bumps. Indium Corporation provides fine powder solder paste for both wafer and substrate solder deposition, including low and ultralow alpha
- Solder Alloy: Lead Free
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Supplier: Newark, An Avnet Company
Description: Maker Paste - Low Temperature Lead-Free Prototyping Solder Paste
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Supplier: Newark, An Avnet Company
Description: SOLDERING TOOL, LOW STATIC CONSTRUCTION, NON-TEMPERATURE CONTROLLED ROHS COMPLIANT: NA
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Supplier: APITech
Description: Large Diameter Solder-In High-Temperature Filters can withstand 300°C installation temperatures. These EMI filters are ideal for low to medium impedance circuits where large amounts of capacitance to ground can be tolerated.
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Supplier: IPC International, Inc.
Description: Explains what a low residue flux is and how it compares to other fluxes. Describes changes to the existing hand soldering process and explains hand soldering theory with low residue fluxes. Discusses visual inspection criteria for solder joints and flux residues, wetting
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Supplier: RS Components, Ltd.
Description: Sn42Bi57Ag1 Low Temperature Solder Paste
- Process Capability: Soldering Equipment
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Supplier: MacDermid Alpha Electronics Solutions
Description: between the solder mask and solder, significantly minimizing the tendency for solder balling. Its thermally stable formulation also helps reduce solder bridging during dual wave soldering. ALPHA EF-6000 is designed to leave low-resistance residues, helping to limit
- Features: Soldering Flux / Rosin
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Supplier: Aries Electronics, Inc.
Description: FEATURES Low-Profile Collet Sockets with Solder Pin Tails For Wire Wrap Pins, see Data Sheet 12012 Choose from several size and plating options GENERAL SPECIFICATIONS BODY MATERIAL: black UL 94V-0 glass-filled 4/6 Nylon PIN BODY: Brass 360 1/2-hard per UNS C36000 ASTM B16/B16M-05 PIN
- Current Rating: 3 amps
- Operating Temperature: 125 C
- Number of Contacts: 2 to 64
- Contacts Pitch: 2.54 mm
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Supplier: Newark, An Avnet Company
Description: SOLDERING IRON, LOW VOLT, 120W, 24V; Supply Voltage VAC:24V; Output Power:120W; Heat Temperature Max:450°C; Product Range:-; Plug Type:- RoHS Compliant: NA
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ALPHA HRL3 Solid Solder is designed to enable low-temperature processes in selective and dip soldering applications. This alloy exhibits improved thermomechanical reliability compared to existing low-temperature alloys on the market. With the
- Solder Alloy: Lead Free
- Product Form: Paste
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Supplier: Newark, An Avnet Company
Description: SOLDERING IRON, LOW VOLT, 50W, 24V; Supply Voltage V AC:24V; Output Power:50W; Heat Temperature Max:450°C; Product Range:-; Plug Type:-; SVHC:No SVHC (27-Jun-2018) RoHS Compliant: Yes
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Supplier: MacDermid Alpha Electronics Solutions
Description: such as connector pins and cable termination interconnects. Industrial solder preforms are offered in a wide range of alloys, with melting temperatures spanning from as low as 47°C (117°F) to over 300°C (572°F). They can be supplied in tape-and-reel or bulk packaging. Bulk
- Features: Flux Cored Wire
- Solder Alloy: Lead Free
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Supplier: Indium Corporation
Description: Indium5.7LT is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using eutectic SnBi and SnBiAg alloys. This paste is a moderate residue product with exceptional wetting capabilities. The low activation temperature of Indium5.7LT, in combination
- Solder Alloy: Lead Free
- Features: Other
- Product Form: Paste
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Supplier: ODG (Origin Data Global)
Description: LEAD FREE LOW TEMPERATURE SOLDER
- Features: Other
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Supplier: Nordson EFD
Description: low-temperature and high-temperature reflow and leaded and lead-free alloys in all flux types and alloy particle sizes. Whether soldering electrical connections in recessed areas on PCBs or tabbing and stringing solar cells, EFD makes pastes that exceed soldering expectations.
- Features: Other
- Product Form: Paste
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Supplier: Metcal
Description: The PS-900 packs power and provides exceptional thermal control into a small benchtop footprint. Features and Benefits: SmartHeat® temperature control Ergonomic, lightweight handle Rugged cast aluminum housing Added plating thickness to tips Low cost, quick-change heater coil
- Equipment Type: Complete System
- Process Capability: Soldering Equipment
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE LM 100, no clean flux, RoHS-compliant, Designed for use with low temperature Pb-free solder alloys LOCTITE® LM 100 is a RoHS-compliant solder paste designed for use with low-temperature, Pb-free alloys. Formulated to provide excellent dispensability,
- Product Form: Paste
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Supplier: Metcal
Description: New Dual Port Simultaneous Soldering and Rework System highly effective for soldering applications including: lead-free, high mass components or boards, thermally sensitive components requiring low operating temperature, high volume production soldering and touch-up soldering
- Equipment Type: Complete System
- Process Capability: Rework / Desoldering, Soldering Equipment
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Supplier: Indium Corporation
Description: Indium9.72 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. Normally used with high
- Features: Other
- Product Form: Paste
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Nexperia B.V.
Description: capability due to clip-bonding technology Small and flat lead SMD plastic package High temperature Tj ≤ 175 °C Suitable for both reflow and wave soldering Applications Low voltage rectification High efficiency DC-to-DC conversion Switch mode power supply Reverse polarity protection
- VF: 360 to 0.36 volts
- VR: 40 volts
- IR: 0.000013 mA
- Tj: 175 C
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Supplier: Nexperia B.V.
Description: capability due to clip-bonding technology Small and flat lead SMD plastic package High temperature Tj ≤ 175 °C Suitable for both reflow and wave soldering Applications Low voltage rectification High efficiency DC-to-DC conversion Switch mode power supply Reverse polarity protection
- VF: 320 to 0.32 volts
- VR: 40 volts
- Tj: 175 C
- IFSM: 50 amps
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Supplier: Nexperia B.V.
Description: capability due to clip-bonding technology Small and flat lead SMD plastic package High temperature Tj ≤ 175 °C Suitable for both reflow and wave soldering Applications Low voltage rectification High efficiency DC-to-DC conversion Switch mode power supply Reverse polarity protection
- VF: 330 to 0.33 volts
- VR: 40 volts
- Tj: 175 C
- IFSM: 50 amps
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Supplier: Nexperia B.V.
Description: capability due to clip-bonding technology Small and flat lead SMD plastic package High temperature Tj ≤ 175 °C Suitable for both reflow and wave soldering Applications Low voltage rectification High efficiency DC-to-DC conversion Switch mode power supply Reverse polarity protection
- VF: 310 to 0.31 volts
- VR: 40 volts
- Tj: 175 C
- IFSM: 70 amps
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Supplier: MacDermid Alpha Electronics Solutions
Description: the lowest melting point and the narrowest pasty range during melting and re-solidification, maximizing resistance to thermal-cycle-based fatigue in traditional low-temperature alloy applications. The alloy also yields very low voiding in Ball Grid Array (BGA) solder
- Solder Alloy: Lead Free
- Product Form: Paste
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Supplier: PACE
Description: The ST 25 soldering system from PACE improves quality, reduce costs and eliminate the maintenance and calibration hassles associated with other soldering systems. The ST 25 maximizes heat delivery at low, safe temperatures and eliminates the need for calibration. Heavy-duty metal
- Equipment Type: Gun / Iron / Torch
- Process Capability: Soldering Equipment
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Supplier: Lake Shore Cryotronics, Inc.
Description: machined, tube shaping and bending, nesting fixturing dies, and internal and external support of thin walled tools and parts. This solder is not recommended for general temperature sensor lead attachment due to its low joint strength. Does not shrink, but exhibits expansion upon
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders Soldering is a process in which two or more
- Features: Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders Soldering is a process in which two or more
- Features: Other
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE MP 218, Solder paste, High activity, Soft residue, Colorless, Sn/Pb soldering LOCTITE® MP 218 is a high activity, soft residue, colorless solder paste with pin-testable flux that displays resistance to high temperature and humidity environments. Suitable for a large
- Features: Other
- Product Form: Paste
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Supplier: ASTM International
Description: temperatures below their melting points; blocking for support and removable borders; radiation shielding; fusible plugs; fuses; tube bending; and punch setting. This specification shall include those alloys having liquidus temperature not exceeding the melting point of the tin lead
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Supplier: Palomar Technologies, Inc
Description: temperature controller is combined with customized programmable logic controller (PLC) to provide automatic process control. The 1200 table top furnace is ideal for small labs and R&D facilities. Void-free solder joints are most reliably obtained through a carefully controlled and
- Process Temperature: 450 C
- Height: 482.59973939614076 mm
- Width / Tube O.D.: 774.6995816622259 mm
- Length (Chamber / Tube): 634.9996571001852 mm
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Supplier: Pyromation
Description: Heat-tracing temperature sensors are made for use in systems that measure the surface temperature of process pipe that is carrying products whose temperatures must be controlled to prevent freeze-up, or to maintain a viscosity level so that the inner medium will flow. These
- Sensitive Length: 3 inch
- Probe Configuration: Angled Probe
- Probe Features: Available as an Assembly
- Process Connection: Braze, Weld or Solder
Find Suppliers by Category Top
Featured Products Top
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ALPHA OM-565 HRL3 low temperature solder paste is designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 °C and superior wettability to minimize post reflow defects (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
ALPHA OM-220 innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies. ALPHA OM-220 permits cascaded / hierarchical soldering, as well as novel hermetic sealing solutions. This (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
ALPHA HRL3 is a lead-free, low temperature, high reliability alloy for use application where low temperature processing is desired. ALPHA HRL3 is available in solder sphere format for ball mount application. The alloy was designed to exhibit improved drop shock and thermal (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for applications such as fine feature printing, low temperature processing, and many others. Alpha's® solder pastes are available in a wide range of alloy offerings, including low-Ag SACX (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
, high reliability and repeatability within a wide temperature range from -200 °C up to 1000 °C. Because of very small dimensions and low thermal mass, the thin-film temperature sensors exhibit a very short response time. IST sensor products from the FlipChip Series (read more)
Browse Temperature Sensor Chips Datasheets for Innovative Sensor Technology IST USA Division -
only offers enhanced performance for EVs, but also contributes to the creation of more sustainable and eco-friendly automotive systems. Examples of this are low-temperature solder and silver sintering that can play a role in carbon emission reduction. Clark Dai, one of Mac (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
electric vehicle (EV) sector, has intensified the need for high-performance materials like Argomax. Its advanced nano-particle technology enables low-temperature and low-pressure sintering, resulting in highly homogeneous sinter joints. This innovation allows for the development of smaller, lighter (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
lower soldering temperatures and to protect other temperature sensitive PCB components. An additional key feature is that the solder tails are located outside of the insulator material in order to facilitate visual inspection. These strong, lightweight holders also employ reliable spring tension for low (read more)
Browse Battery Holders Datasheets for Keystone Electronics Corp. -
The pressure transducer PHPS8500 is a pressure and temperature sensing device specially developed for ultra-low pressure ranges and demanding space constrictions. High (read more)
Browse Pressure Sensors Datasheets for Angst+Pfister Sensors and Power -
integrity • Suitable for mission-critical systems Copper Solder Paste Welding • Service life approximately 10 years (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd
Conduct Research Top
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Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
This paper touches on identifying favorable flux properties, down-selecting low solids fluxes for lead-free selective wave soldering, the selective soldering process itself, and testing criteria. Topics reviewed will be the flux selection, optimizing the selective soldering process by varying
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LED Lamp Soldering
Since the transparent resin has a low softening temperature (glass transition temperature), carefully control the temperature when soldering. The following precautions should be observed when soldering lead type LED lamps.
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Flow Solder Machines
position feedback from highly accurate, continuous, absolute output. * Low temperature coefficient for stable output with varying operational temperature. * Superior EMI and noise immunity ensure trouble free operation in a wide range of applications. * Simultaneous multiple position sensing
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Low Pass Filter Mounting Information
ASSEMBLY CONSIDERATION Solder paste type 3 Use 0.005 inch stencil thickness Nitrogen purge is recommended during solder reflow This is a lead free part. A low temperature, leaded solder profile is shown. A lead free profile may be used. This is a recommendation based on third party testing. Each
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Wirewound vs. Film Resistors for Precision Applications
, they are stable (15-50ppm/yr) maintaining their precision over time because they are made with stable materials. Their TCR (Temperature Coefficient of Resistance) is low (<10ppm/°C) and can be controlled by selecting special wire alloys. (Usually, you need the lowest TCR, but a higher TCR has special interest
More Information Top
Indicates content that may require registration and/or purchase.
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Lead-Free Electronic Solders
Sn–Zn low temperature solder .
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Fundamentals of Lead-Free Solder Interconnect Technology
K. Suganuma, K. S. Kim, Sn-Zn low temperature solder , Springer, pp. 121–127, 2007.
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Lead-Free Solder Interconnect Reliability
Free, Low Temperature Solder Composi- .
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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
4) Sn–Bi series: The Sn–Bi alloy is a widely used low temperature solder , its phase diagram is shown in Fig. 1.9 [6].
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Advanced MEMS Packaging > Advanced MEMS Wafer-Level Packaging
Wafer bonding by low temperature soldering .” .
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Nano-Bio- Electronic, Photonic and MEMS Packaging
H. Jiang, K. Moon, C. P. Wong, “Tin/silver/copper alloy nanoparticles for low temperature sol- der pastes interconnect”, 2008 IEEE 58th Electronic Components & Technology Conference, May 27–30, 2008; 1400–1404.