Low Temperature Solder

Description: Traditional solders have reflow temperatures in the range of 183°C to 221°C. However, advancements in components, substrates, and electronics design have driven the need for solder that will reflow in the 115°C to 180°C range. Some of these key drivers include

• Alloy: Indium (In), Other
• Form / Shape: Paste

Description: -silver plated solder. Additionally, some very fine pitch temperature-sensitiv e applications now use pure indium or indium-silver-plated bumps. Indium Corporation provides fine powder solder paste for both wafer and substrate solder deposition, including low and

• Lead Free: Yes

Description: alloys), and its long-term reliability make this alloy desirable for lid sealing applications. Braze Alternative: Eutectic AuSn, with a tensile strength of 275 MPa (40,000 pounds/square inch), provides a great alternative to brazes when high strength must be achieved at soldering

• Alloy: Other
• Form / Shape: Preform
• Lead Free: Yes

Description: Several low melting point Indalloy® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent

• Alloy: Indium (In)
• Form / Shape: Paste

Description: for low-temperature and high-temperature reflow and leaded and lead-free alloys in all flux types and alloy particle sizes. Whether soldering electrical connections in recessed areas on PCBs or tabbing and stringing solar cells, EFD makes pastes that exceed soldering

• Approvals / Conformance: Other
• Form / Shape: Paste

Description: A low-temperature lead-free alloy designed to exhibit improved thermomechanical reliability and soldering performance. Product Overview ALPHA HRL3 Solid Solder is designed to enable low-temperature processes in selective and dip soldering applications. This alloy

• Lead Free: Yes

Description: . Extensive List of Lead and Lead-Free Alloys Available with or without Integrated Flux Coating or Core Easily Implemented into Any Solder Process Ultra-Low Temperature Alloys Available Primarily used for fuse function.

• Lead Free: Yes

Description: LOCTITE LM 100, no clean flux, RoHS-compliant, Designed for use with low temperature Pb-free solder alloys LOCTITE® LM 100 is a RoHS-compliant solder paste designed for use with low-temperature, Pb-free alloys. Formulated to provide excellent dispensability,

• Form / Shape: Paste

Description: LOCTITE MP 218, Solder paste, High activity, Soft residue, Colorless, Sn/Pb soldering LOCTITE® MP 218 is a high activity, soft residue, colorless solder paste with pin-testable flux that displays resistance to high temperature and humidity environments. Suitable for a

• Form / Shape: Paste, Other

Description: LOCTITE GC 10, No-clean and Halogen-free Solder Paste, a RoHS-compliant, Excellent resistance in high humidity, Pb-free soldering LOCTITE® GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long

• Form / Shape: Paste

Description: piece metal does not melt. In the past, nearly all solders contained lead, but environmental concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes. Belmont offers a range of high, medium, and low temperature soldering alloys to

• Alloy: Tin-Lead (Sn-Pb)
• Form / Shape: Wire

Description: piece metal does not melt. In the past, nearly all solders contained lead, but environmental concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes. Belmont offers a range of high, medium, and low temperature soldering alloys to

• Alloy: Other
• Form / Shape: Other

Description: LEAD FREE LOW TEMPERATURE SOLDER

• Equipment Type: Other

Description: piece metal does not melt. In the past, nearly all solders contained lead, but environmental concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes. Belmont offers a range of high, medium, and low temperature soldering alloys to

• Alloy: Other
• Form / Shape: Wire

Description: piece metal does not melt. In the past, nearly all solders contained lead, but environmental concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes. Belmont offers a range of high, medium, and low temperature soldering alloys to

• Alloy: Other
• Form / Shape: Wire

Description: Features Cadmium free, low temperature, food grade, solder for high strength on stainless steels, and dissimilar metals. Deposits closely match stainless, and stay bright after prolonged service. Use with All-State Duzall flux or All-state 430 flux.

• Alloy: Other
• Form / Shape: Wire

Description: The PS-900 packs power and provides exceptional thermal control into a small benchtop footprint. Features and Benefits: SmartHeat® temperature control Ergonomic, lightweight handle Rugged cast aluminum housing Added plating thickness to tips Low cost, quick-change heater coil

• Equipment Type: Soldering Equipment

Description: LOW TEMPERATURE LEAD FREE SOLDER

• Equipment Type: Other

Description: shadowed areas where light is unable to penetrate. The secondary thermal cure can be done in conventional box or convection conveyor ovens. Non-conductive Single component Photocurable High Tg Fast UV cure Cures in shadowed areas Low temperature cure

• Form / Shape: Paste

Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp

• Alloy: Tin-Silver (Sn-Ag)
• Form / Shape: Wire

Description: MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp

• Alloy: Tin-Silver (Sn-Ag)
• Form / Shape: Wire

Description: New Dual Port Simultaneous Soldering and Rework System highly effective for soldering applications including: lead-free, high mass components or boards, thermally sensitive components requiring low operating temperature, high volume production soldering and

• Brazing & Soldering: Rework / Desoldering
• Equipment Type: Soldering Equipment

Description: Enables low temperature SMT assembly technology to minimize rework in multiple reflow applications. Product Overview ALPHA CVP-520 is designed for near-eutectic low-temperature alloys such as SnBi0.4Ag, enabling peak reflow profiles between 155°C and 190°C. The flux

Description: SLEEVE, TERMINATION, ELECTRICAL, LOW TEMPERATURE, FLUXED SOLDER PREFORM, HEAT SHRINKABLE

Description: The ST 25 soldering system from PACE improves quality, reduce costs and eliminate the maintenance and calibration hassles associated with other soldering systems. The ST 25 maximizes heat delivery at low, safe temperatures and eliminates the need for calibration.

• Equipment Type: Soldering Equipment

Description: New Dual Port Simultaneous Soldering and Rework System highly effective for soldering applications including: lead-free, high mass components or boards, thermally sensitive components requiring low operating temperature, high volume production soldering and

• Brazing & Soldering: Rework / Desoldering
• Equipment Type: Soldering Equipment

Description: A zero-halogen, low-temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175°C. Product Overview ALPHA OM-565 HRL3 low-temperature solder paste is designed to mitigate warpage induced defects in temperature-sensitiv e chip

Description: Large Diameter Solder-In High-Temperature Filters can withstand 300°C installation temperatures. These EMI filters are ideal for low to medium impedance circuits where large amounts of capacitance to ground can be tolerated.

Description: Soldering tip tinner for lead-free soldering. Cleaning only possible in hot state of the soldering tip. For regeneration of oxidized tips. Quick and easy effects at low temperature. Environmentally friendly, halogen and lead-free and free of rosin. Extend the life

Description: No water necessary. No temperature drop as with conventional sponges. Made of low abrasive brass shavings. For Tip Cleaner without stand see RS 413-6484 Type = Tip Cleaner For Use With = Xytronic Soldering Irons

Description: No water necessary. No temperature drop as with conventional sponges. Made of low abrasive brass shavings. For Tip Cleaner without stand see RS 413-6484 Type = Replacement Pad For Use With = Xytronic Soldering Irons

Description: For the de-soldering of small discrete and multi leg dual in line packages. Can be driven from all Weller electronically controlled power units and rework stations. Dual heating elements with 2 independent temperature sensors provide the tips with constant temperature. Tips are

Description: The IST AG 200 °C Series offers an excellent long-term stability and fast response time with low self-heating within a temperature range of -50 °C to +200 °C.? The 200 °C Series is offered in various standard lengths with Cu/Ag- single or stranded wire with PTFE -insulation

• Length: 0.0630 to 0.3937 inch
• Nominal Resistance: 100 to 1000 R₀ @ 0° C
• Operating Temperature: -58 to 392 F
• Sensor Technology: Wire Wound

Description: The IST AG 150 °C Series offers excellent long-term stability and fast response time with low self-heating within a temperature range of -50 °C to +150 °C. ?The IST AG 150 °C series is developed with an insulated enameled Cu-wire, which enables easy integrating into

• Length: 0.0630 to 0.1181 inch
• Nominal Resistance: 100 to 1000 R₀ @ 0° C
• Operating Temperature: -58 to 302 F
• Sensor Technology: Wire Wound

Description: The IST AG 150 °C Series offers an excellent long-term stability and simple linearization within a temperature range of -60 °C to +150 °C.? The directly welded wires offer an outstanding robustness and are optimal for soldering, welding and crimping. The 150 °C Series is

• Length: 0.0906 to 0.1969 inch
• Nominal Resistance: 100 to 1000 R₀ @ 0° C
• Operating Temperature: -76 to 302 F
• Sensor Technology: Wire Wound

Description: , holding small parts to be machined, tube shaping and bending, nesting fixturing dies, and internal and external support of thin walled tools and parts. This solder is not recommended for general temperature sensor lead attachment due to its low joint strength. Does not shrink,

Description: within a ceramic or glass capsule. Since most resistance temperature detectors and resistance thermometers have a low initial resistance, often 100 ohms, and have a small change in resistance per unit of temperature range, the resistance of the lead wire is often compensated for

• Base, Noble and Refractory Metal Type: K
• Configuration: Grounded Thermocouple, Ungrounded Thermocouple
• Element Configuration: Single Element
• Probe Configuration: Angled Probe

Description: Overview The SST 1200 is a table top vacuum and pressure furnace designed for process development and low volume production of flux-free and void-free soldered joints in microelectronic packages and components. The station is easy to use and designed for a wide variety of

• Application: Brazing / Soldering, Curing, Other
• Configuration: Top Loading
• Controller Type: Programmable
• Height: 483 mm

Description: Indium can be used to create solder “bumps” for microelectronic chip attachments and also as gaskets for pressure and vacuum sealing purposes. When used as a washer between a silicon diode or other temperature sensors and refrigerator cold stages, indium foil increases the thermal

Description: -sensitiv e materials including solder pastes. Features Compact design eliminates the need for machine enclosures Precise process control within +/- 0.1°C Benefits Low operating costs are pennies per day compared to larger machine

• Control Technique: Limit / Set Point Control
• Form Factor: Panel / Chassis Mount
• Media: Liquid, Other
• User Interface: Knobs / Switches / Meter

Description: FEATURES Low-Profile Collet Sockets with Solder Pin Tails For Wire Wrap Pins, see Data Sheet 12012 Choose from several size and plating options GENERAL SPECIFICATIONS BODY MATERIAL: black UL 94V-0 glass-filled 4/6 Nylon PIN BODY

• Contact / Pin Type: Low Profile Pins, Solder Tail Pins
• Contact Plating: Gold Plating, Nickel Plating, Other
• Contacts Pitch: 2.54 mm
• Current Rating: 3 amps

Description: • Measures Temperature of Solder Iron Tips • Low Cost • Use in Conjunction with any of OMEGA's Handheld readout units • Solder Temperature Tester to Ensure Quality Solder Joints

Description: MULTICORE LM100 no clean flux solder paste is designed for use with low temperature Pb-free solder alloys. LM100 is formulated to provide excellent dispensability, printability and solderability through various reflow profiles.

• Fluxes & Cleaners: Soldering Flux / Rosin

Description: The ST 300 can be used to remove any SMD and for installing components that can be positioned manually. The ST 300 is a self-contained system with analog (dial) controls for temperature and airfl ow. The heavy-duty, durable metal housing ensures years of service and the sloped face of the

• Equipment Type: Soldering Equipment
• Output Temperature: 349 to 900 F

Description: No-clean, Pb-freePb-free solder paste designed for low-temperature, Pb-free solder alloys. This material is formulated to provide excellent dispensability, printability and solderability through various reflow profiles.

• Alloy: Other
• Form / Shape: Paste
• Lead Free: Yes