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  • Thermal and Mechanical Reliability of Low-Temperature Solder Alloys for Handheld Devices
    Low temperature alloys are used to achieve peak reflow temperatures from 170 to 200°C. Sn-Bi alloy stands as logic choices due to its low melting point, higher strength and low cost. However, use of Sn42-Bi58 alloy as soldering material is limited by a series of drawbacks such as low ductility
  • Comprehensive Report on Low Temperature Solder Alloys for Portable Electronics
    We present here the findings of Alpha's Alloy Development Program on the next generation of low temperature alloys that can be used in reflow soldering temperatures from 170 to 200oC. Approaches in alloy development, test methodologies and results are discussed. The alloy properties targeted
  • Low Temperature Assembly of LED Packages on PET & Polyimide Flexible Substrates
    This paper presents a structured study covering the assembly of LED packages on thermally conductive flexible substrates. Multek's Polyimide and Polyester (PET) Q-Prime (R) flexible substrates were used with Alpha's standard SAC and low temperature solder paste. Initially, the feasibility
  • Development of Low-Temperature Drop Shock Resistant Solder Alloys for Handheld Devices
    that can be used in reflow soldering temperatures from 170 to 200oC. By using micro-additives we have created low temperature alloys with superior mechanical properties, higher drop shock resistance and improved fatigue life.
  • Flow Solder Machines
    position feedback from highly accurate, continuous, absolute output. * Low temperature coefficient for stable output with varying operational temperature. * Superior EMI and noise immunity ensure trouble free operation in a wide range of applications. * Simultaneous multiple position sensing
  • Low Pass Filter Mounting Information
    ASSEMBLY CONSIDERATION Solder paste type 3 Use 0.005 inch stencil thickness Nitrogen purge is recommended during solder reflow This is a lead free part. A low temperature, leaded solder profile is shown. A lead free profile may be used. This is a recommendation based on third party testing. Each
  • Low Voiding, High Reliability Solder Paste for Automotive, LED and Other Demanding Applications
    Electronic assemblies used in automotive,. telecommunications, high power LEDs, and other. demanding applications require soldering materials that can withstand high temperature, vibration, thermal shock and other harsh conditions. For example, electronics in automotive application typically
  • Soldering Processes
    characteristics. Tin-silver alloys have the same characteristics as tin-antimony solders and are used for delicate instrument work and high-strength applications. Tin-zinc alloys are used mainly for soldering aluminum -- primarily where a low soldering temperature is
  • Metals and Ceramics
    -to-ceramic bonds. Seals between metals and glass can be made by collapsing a low-temperature glass around the glass/metal interface. As the intermediary glass is acting as a solder it is referred to as "solder glass. " There are four techniques for metallizing ceramics that rely on strong chemical
  • Tin
    Tin is characterized by a low-melting point (450 F), fluidity when molten, readiness to form alloys with other metals, relative softness, and good formability. The metal is nontoxic, solderable, and has a high boiling point. The temperature range between melting and boiling points exceeds

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