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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require
- Coeff. of Thermal Expansion (CTE): 21.67 to 97.22 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.74
- Index of Refraction: 1.53
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require
- Coeff. of Thermal Expansion (CTE): 36.11 to 90 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.74
- Features: Electrical Insulating / Dielectric, Thermal / Heat Insulating
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Supplier: Epoxies Etc...
Description: 10-3000 is a clear 2 part flexible adhesive. 10-3000 is water clear and its low viscosity allows maximum penetration of substrates. Its flexibility maintains a tenacious bond on parts with widely differing coefficients of expansion. 10-3000 cures at room temperature or can be
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dissimilar Substrates: Yes
- Industry: Electronics, OEM / Industrial, Other
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electroni cc/ structural applications. The two components are combined in a
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 2.95 to 2.96
- Dielectric Strength: 400 to 450 kV/in
- Dissimilar Substrates: Yes
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Description: It is a low-viscosity, epoxy adhesive industrial product. After mixing, the two-component epoxy resin is cured at room temperature with minimal shrinkage to form an ultra-clear adhesive tape with excellent impact resistance. The fully cured epoxy resin is
- Cure Type / Technology: Two Component System, Room Temperature Curing
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Description: Off-white/universal structural adhesive, low to medium viscosity, good manufacturability, steel sheet bonding strength over 38Mpa, temperature resistance 200 degrees.
- Cure Type / Technology: Single Component System, Specialty / Other
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Description: The industrial window is wide, the operating time is 120min, and the bonding strength after curing is high. It is a high-viscosity industrial-grade epoxy adhesive with long service life. Once mixed, the two-component epoxy resin cures at room temperature to form a tough,
- Cure Type / Technology: Two Component System, Room Temperature Curing
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Supplier: Epoxies Etc...
Description: 10-3016 is a two component epoxy adhesive and sealant. This system is a low viscosity and unfilled. It can be pigmented if required.
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Industry: OEM / Industrial
- Viscosity: 1000 cP
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Supplier: Master Bond, Inc.
Description: Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various hardeners, EP34CA produces a low viscosity 100%
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Features: Electrically Conductive, Electrical Insulating / Dielectric, EMI / RFI Shielding Material, Encapsulating / Potting, Flexible / Dampening, Anti-static / ESD Control
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This
- Coeff. of Thermal Expansion (CTE): 14 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.44
- Dielectric Strength: 440 kV/in
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a five (5) to one (1) mix ratio by weight.
- Coeff. of Thermal Expansion (CTE): 39 to 50 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4
- Dielectric Strength: 360 to 450 kV/in
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Supplier: Techsil Limited
Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Epoxies Etc...
Description: These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4
- Dissimilar Substrates: Yes
- Features: Electrical Insulating / Dielectric
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Supplier: Epoxies Etc...
Description: 20-3003 is a low viscosity, potting, encapsulating, and adhesive system. Its low viscosity allows for good flow and wetting of substrates.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.61
- Elongation: 4.5 %
- Features: Encapsulating / Potting
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Epoxy Adhesives - Thermally Conductive, Non-Electrically Conductive, Low Viscosity Epoxy -- G6E-TSALSupplier: Graphene Laboratories, Inc.
Description: capable of withstanding thermal cycling, mechanical stresses, and temperature variations without developing cracks or compromising the integrity of the bond. KEY FEATURES: Low Viscosity: our adhesive has a relatively thin consistency, making it easier to apply and spread
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Features: Electrically Conductive, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Medical / Food (Sanitary / FDA), Other
- Thermal Conductivity: 1.8 W/m-K
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive EC-1469 is a cream colored, one-part heat curing low viscosity epoxy. 3M™ Scotch-Weld™ Epoxy Adhesive EC-1469 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Industry: Aerospace, OEM / Industrial
- Substrate / Material Compatibility: Metal
- Use Temperature: -70 to 300 F
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds even in cryogenic conditions. Please refer to the TDS
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric
- Industry: Optical Grade / Material
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Ellsworth Adhesives
Description: Parker LORD® Thermoset 70 Epoxy Adhesive Hardener Tan is a low viscosity curing epoxy hardener. It is used with several Thermoset epoxy resins to obtain a variety of handling and cured properties. 1 qt Bottle.
- Cure Type / Technology: Two Component System
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA 9340 is a two component, low viscosity, high strength epoxy adhesive with resistance to chemicals and exceptional high temperature performance. 2.7 oz Kit.
- Cure Type / Technology: Two Component System
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Wood / Wood Product
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA 9430 is a two component, low viscosity, high strength epoxy adhesive with resistance to chemicals and exceptional high temperature performance. 2 lb Kit.
- Cure Type / Technology: Two Component System
- Elongation: 6 %
- Tensile Strength (Break): 5300 psi
- Viscosity: 12000 cP
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Supplier: Henkel Corporation - Industrial
Description: Room temperature-cure, toughened, medium viscosity, industrial grade structural epoxy adhesive with a medium working life. LOCTITE® EA E-40FL is a gray, opaque, room temperature-cure, toughened, medium viscosity, industrial grade structural epoxy adhesive
- Cure Type / Technology: Two Component System
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Rubber / Elastomer, Wood / Wood Product
- Viscosity: 70000 cP
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Supplier: Henkel Corporation - Industrial
Description: Epoxy light white translucent adhesive for electronic component bonding applications. A set open time following activation allows component assembly. LOCTITE® EA 3355 is a translucent, light white, medium-viscosity, cationic epoxy adhesive liquid designed for
- Cure Type / Technology: Single Component System, UV / Radiation Cured (also EB, Light)
- Industry: Optical Grade / Material
- Viscosity: 5000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK CE 3513, Epoxy, Assembly LOCTITE® ABLESTIK CE 3513 adhesive is designed for use in automated assembly and in-line curing operations. Electrically conductive One component Low viscosity No bleed Good dispense behavior Fast cure at high temperatures Long
- Coeff. of Thermal Expansion (CTE): 22.22 µin/in-F
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 2.5 W/m-K
- Use Temperature: 302 F
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA E-00CL is a two component, low viscosity, fast-setting, industrial grade epoxy adhesive. It works on a wide variety of substrates including plastic, metal, glass, rubber, wood and ceramics. 50 mL Cartridge.
- Cure Type / Technology: Two Component System
- Dielectric Strength: 406 kV/in
- Elongation: 13 %
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Rubber / Elastomer, Wood / Wood Product
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Description: LOCTITE® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh. Electrically conductive High thermal conductivity Solvent-free formulation Low viscosity
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: Electronics, OEM / Industrial
- Viscosity: 22000 cP
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Description: One-component epoxy resin adhesive is a filling resin that can be reused in CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to provide good protection to prevent failure due to mechanical stress. Low viscosity allows filling gaps under CSP or
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Industry: Electronics
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Supplier: Lake Shore Cryotronics, Inc.
Description: This epoxy is used to permanently attach test samples or temperature sensors to sample holders. It is a 100% solid, two component, low temperature curing, silver-filled epoxy which features very high electrical and thermal conductivity combined with excellent strength and
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 810LV A low-viscosity, very flowable formula. Excellent adhesion to most substrates.
- Cure Type / Technology: Two Component System
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Supplier: Newport MKS
Description: The NOA-85S UV-curing adhesive is an adhesive that will cure optically clear when exposed to long wavelength ultraviolet or visible light (blue-violet). The adhesive has low viscosity and meets the Bellcore specifications of 85C/85RH for 2000 hours. NOA-86S is
- Cure Type / Technology: UV / Radiation Cured (also EB, Light)
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Supplier: Accuris
Description: ADHESIVE, EPOXY/PVC BLEND, STRUCTURAL, METAL-TO-METAL, 180 DEGREE C CURING, SPRAYABLE, PREGELLABLE, HEM FLANGE, LOW VISCOSITY ***TO BE USED WITH FORD WSS-M99P1111-A***
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Supplier: Hernon Manufacturing, Inc.
Description: Tuffbond® 326 is a two-component epoxy known for its low-viscosity, toughness, and long working life at ambient temperatures with shortened cure times at elevated temperatures. The resin offers a combination of high shear strength and hardness. Often used for potting, this epoxy
- Cure Type / Technology: Two Component System
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial
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-critical mix ratio of 100 to 5 by weight and offers a variety of cure schedules at moderately elevated temperatures from 140-257°F [60-125°C]. With a mixed viscosity of 2,000-5,000 cps, EP62-1BF can be used for potting small components. Additionally, it has low shrinkage upon curing (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Two part epoxy, Master Bond EP88FL, is a low viscosity, optically clear system featuring good flexibility for high performance bonding, coating, sealing and potting. It is easy to use, with a mixing ratio of one to one by weight or volume. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
EP3SP5FL is considered a “snap cure” type epoxy system and can be used in a variety of applications in the aerospace, electronics and specialty OEM industries, among others, particularly when ultra fast curing and repairability are desirable features. It requires no mixing (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
, encapsulation and casting applications. It produces very low smoke levels and is well suited for the computer, aerospace and related industries. This two part epoxy features a convenient one to one mix ratio by weight and cures at room temperature or more quickly at elevated temperatures (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
EP21TCHT-1 Two component epoxy compound for high performance bonding and sealing challenging bonding applications, elevated temperature cures are not possible. In order to overcome this deficiency, Master Bond (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond EP30LP-2 is an optically clear epoxy with superb light transmission properties. This low viscosity, electrical insulator also features outstanding dimensional stability. Featuring easy handling, this compound has a convenient two to one mix ratio by weight or (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
MB297FLNT has a low viscosity of 130-150 cps. This adhesive requires no mixing or heating, with minimal fixturing time for curing (typically 20-40 seconds). The most special feature of this system is its toughness. The rubber additive in the formulation mitigates the inherent stiffness (read more)
Browse Cyanoacrylate Adhesives Datasheets for Master Bond, Inc. -
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Dymax OP-81-LS Low-Shrink™ optical positioning epoxy is engineered for bonding delicate optical components where alignment stability is critical. The material cures quickly with UV/Visible or LED light and includes a low-temperature heat-cure option for shadowed areas or heat (read more)
Browse Industrial Adhesives Datasheets for Dymax
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Epoxy Underfill Chip Level Adhesives
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. One-component epoxy resin adhesive
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Optical Transmission Properties of Adhesives
of wavelengths ranging from 400 to 3000 nm for these adhesives: EP30, MasterSil 151, MB600 and UV15. EP30 shows very good optical clarity with superior light transmission when compared to many other epoxies. It is a low viscosity, two part epoxy, widely used for bonding, coating, sealing and casting
More Information Top
Indicates content that may require registration and/or purchase.
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https://dspace.lib.cranfield.ac.uk/bitstream/1826/5315/1/Stennett%20et%20al.%20SCCM2009_pre-published.pdf
A low viscosity epoxy adhesive was used to join the two target components together.
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:: New Materials Zone ::
Home Adhesives (Structural) Low viscosity epoxy adhesive for cryogenic applications .
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Microfluidics for Biological Applications
A low viscosity epoxy adhesive is then flowed into the gap between the interconnect and the glass chip through a dedicated adhe- sive via.
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Passive smart self-repairing concrete beams by using shape memory alloy wires and fibers containing adhesives
A low viscosity epoxy adhesive was served as the sealing/repairing chemicals.
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The Behavior of Ni, Ni-60Co, and Ni3 Al during One-Dimensional Shock Loading
Targets were then reas- sembled using a low viscosity epoxy adhesive and held in a special jig for a minimum of 12 hours.
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On the Influence of Chain Morphology on the Shock Response of Three Thermoplastics
Target assemblies were made by fixing a manganin stress gage (MicroMeasurements type LMSS-025CH-048, Micro- Measurements, Rayleigh, NC) between 5- or 6-mm plates of the polymers with a low viscosity epoxy adhesive .
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Tacticity in shocked polymer hydrocarbons
Target assemblies were made by fixing a manganin stress gauge (MicroMeasurements type LMSS-025CH-048) between 5 or 6 mm plates of the polymers with a low viscosity epoxy adhesive .
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Handbook of Adhesives and Sealants, Second Edition > MAJOR TRENDS IN TECHNOLOGY AND MARKETS
A clear, medical grade, low viscosity epoxy adhesive has proven useful in the fabrication of access ports that are implanted beneath the skin of patients who require multiple infusions.
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Shear stress measurement in nickel and nickel–60 wt% cobalt during one-dimensional shock loading
The target assemblies were reassembled using a low viscosity epoxy adhesive , and held in a special jig for a minimum of 12 h.
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Shock and release of polycarbonate under one-dimensional strain
Target assemblies were made by fixing a manganin stress gauge (MicroMeasurements type LM- SS-025CH-048) between 5 or 6 mm plates of polycarbon- ate with a low viscosity epoxy adhesive .