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Supplier: Epoxies Etc...
Description: 10-3000 is a clear 2 part flexible adhesive. 10-3000 is water clear and its low viscosity allows maximum penetration of substrates. Its flexibility maintains a tenacious bond on parts with widely differing coefficients of expansion. 10-3000 cures at room temperature or can be
- Viscosity: 650 cP
- Substrate Compatibility: Ceramic / Glass, Dissimilar Substrates, Metal, Plastic
- Industry: Electronics, OEM / Industrial
- Features: Epoxy (EP), Liquid, Other, Unfilled
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Supplier: Epoxy Technology
Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs. More recently, solar cells require our UV curing resin
- Viscosity: 350 to 550 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 21.666666666666668 to 97.22222222222221 µin/in-F
- Dielectric Constant (Relative Permittivity): 3.74
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a
- Viscosity: 50 to 200 cP
- Use Temperature: -60 to 450 F
- Tensile Strength (Break): 10,000 to 11,000 psi
- Elongation: 30 to 5 %
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Supplier: Epoxies Etc...
Description: 10-3016 is a two component epoxy adhesive and sealant. This system is a low viscosity and unfilled. It can be pigmented if required.
- Viscosity: 1,000 cP
- Features: Epoxy (EP)
- Industry: OEM / Industrial
- Cure / Technology: Room Temperature Curing, Two Component System
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Supplier: Epoxies Etc...
Description: These one component heat cure epoxy adhesives are fast setting materials formulated in three different viscosities. They are known for their low temperature cure, heat and excellent chemical resistance.
- Viscosity: 25,000 cP
- Use Temperature: -58 to 356 F
- Tensile Strength (Break): 4,000 psi
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic, Wood / Wood Product
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Supplier: Epoxy Technology
Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs. More recently, solar cells require our UV curing resin
- Viscosity: 350 to 550 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 36.11111111111111 to 90 µin/in-F
- Dielectric Constant (Relative Permittivity): 3.74
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Supplier: Epoxies Etc...
Description: 10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and
- Viscosity: 800 to 2,000 cP
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 0.4326837 W/m-K
- Tensile Strength (Break): 10,500 psi
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Supplier: Master Bond, Inc.
Description: Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various hardeners, EP34CA produces a low viscosity 100%
- Viscosity: 900 to 77,000 cP
- Use Temperature: 73.4 to 374 F
- Tensile Strength (Break): 3,500 to 11,000 psi
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive EC-1469 is a cream colored, one-part heat curing low viscosity epoxy. 3M™ Scotch-Weld™ Epoxy Adhesive EC-1469 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing
- Viscosity: 40,000 to 80,000 cP
- Use Temperature: -70 to 300 F
- Industry: Aerospace, OEM / Industrial
- Features: Epoxy (EP)
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Supplier: Master Bond, Inc.
Description: variety of substrates including metals, glass, ceramics, wood, rubbers, and many plastics. Once cured, EP21LV is an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting epoxy. As a Class VI epoxy, EP21LV
- Viscosity: 7,000 to 8,000 cP
- Use Temperature: -65 to 250 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 29 µin/in-F
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Description: It is a low-viscosity, epoxy adhesive industrial product. After mixing, the two-component epoxy resin is cured at room temperature with minimal shrinkage to form an ultra-clear adhesive tape with excellent impact resistance. The fully cured epoxy
- Features: Epoxy (EP)
- Cure / Technology: Room Temperature Curing, Two Component System
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This
- Use Temperature: -60 to 250 F
- Coeff. of Thermal Expansion (CTE): 14 µin/in-F
- Tensile Strength (Break): 7,800 psi
- Dielectric Strength: 440 kV/in
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Description: Off-white/universal structural adhesive, low to medium viscosity, good manufacturability, steel sheet bonding strength over 38Mpa, temperature resistance 200 degrees.
- Features: Epoxy (EP), Specialty / Other
- Cure / Technology: Single Component System
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Supplier: Techsil Limited
Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress
- Features: Epoxy (EP)
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low viscosity allow gap filling Reworkable Provides excellent protection from mechanical stress
- Features: Epoxy (EP)
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA 9430 is a two component, low viscosity, high strength epoxy adhesive with resistance to chemicals and exceptional high temperature performance. 2 lb Kit.
- Viscosity: 12,000 cP
- Tensile Strength (Break): 5,300 psi
- Elongation: 6 %
- Features: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: Parker LORD® Thermoset 70 Epoxy Adhesive Hardener Tan is a low viscosity curing epoxy hardener. It is used with several Thermoset epoxy resins to obtain a variety of handling and cured properties. 1 qt Bottle.
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA 9340 is a two component, low viscosity, high strength epoxy adhesive with resistance to chemicals and exceptional high temperature performance. 2.7 oz Kit.
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic, Wood / Wood Product
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA 9396 AERO is a two component, low viscosity, room temperature curing epoxy paste adhesive that possesses excellent strength properties at temperatures from -55 to 177 °C. 1 gal Kit.
- Viscosity: 3,500 cP
- Tensile Strength (Break): 1,200 to 3,500 psi
- Elongation: 3.4 %
- Features: Epoxy (EP)
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Epoxy Adhesives - Thermally Conductive, Non-Electrically Conductive, Low Viscosity Epoxy -- G6E-TSALSupplier: Graphene Laboratories, Inc.
Description: adhesive properties of a traditional adhesive. This product is unique in that it also requires strong electrical resistance, thereby broadening its range of possible applications. To achieve this, the G6E-TSAL™ Epoxy is formulated with a blend of proprietary nanomaterials,
- Viscosity: 40,000 to 50,000 cP
- Use Temperature: 77 to 302 F
- Thermal Conductivity: 1.8 W/m-K
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Medical / Food (Sanitary / FDA)
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Supplier: Allied Electronics, Inc.
Description: Scotch-Weld™ epoxy potting compound⁄adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy potting
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Supplier: Allied Electronics, Inc.
Description: Scotch-Weld™ epoxy potting compound⁄adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy potting
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Supplier: Lake Shore Cryotronics, Inc.
Description: Excellent low temperature thermal and electrical conductivity Low viscosity Thixotropic No resin bleed during curing Low weight loss Low volatility
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Supplier: Accuris
Description: ADHESIVE, EPOXY/PVC BLEND, STRUCTURAL, METAL-TO-METAL, 180 DEGREE C CURING, SPRAYABLE, PREGELLABLE, HEM FLANGE, LOW VISCOSITY ***TO BE USED WITH FORD WSS-M99P1111-A***
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 810LV A low-viscosity, very flowable formula. Excellent adhesion to most substrates.
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: ASTM International
Description: The specification covers a two-part modified epoxy paste adhesive for bonding metallic and nonmetallic materials. The adhesive should be suitable for forming bonds that can withstand environmental exposure to a certain temperature range when exposed to an expected combination of
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 16-1LV, Epoxy, General Assembly LOCTITE® ABLESTIK 16-1LV epoxy adhesive is designed for general purpose applications. This adhesive cures at room temperature, while providing a reasonable work life. This material is the lower viscosity version of
- Viscosity: 17,000 cP
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: ASTM International
Description: The specification covers a two-part modified epoxy paste adhesive for bonding metallic and nonmetallic materials. The adhesive should be suitable for forming bonds that can withstand environmental exposure to a certain temperature range when exposed to an expected combination of
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND F 112, Epoxy, Assembly LOCTITE® ECCOBOND F 112 adhesive is formulated for fiber optic assembly applications. Two components - requires mixing Low viscosity Thermal shock and impact resistant Low stress connections with no pistoning
- Viscosity: 1,800 cP
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Henkel Corporation - Industrial
Description: Room temperature-cure, toughened, medium viscosity, industrial grade structural epoxy adhesive with a medium working life. LOCTITE® EA E-40FL is a gray, opaque, room temperature-cure, toughened, medium viscosity, industrial grade structural epoxy adhesive
- Viscosity: 70,000 cP
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic, Rubber / Elastomer, Wood / Wood Product
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Description: LOCTITE® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh. Electrically conductive High thermal conductivity Solvent-free formulation Low viscosity
- Viscosity: 22,000 cP
- Features: Die Bonding Adhesive / Compound, Epoxy (EP), Specialty / Other
- Industry: Electronics, OEM / Industrial
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Newport MKS
Description: The NOA-85S UV-curing adhesive is an adhesive that will cure optically clear when exposed to long wavelength ultraviolet or visible light (blue-violet). The adhesive has low viscosity and meets the Bellcore specifications of 85C/85RH for 2000 hours. NOA-86S is
- Features: Epoxy (EP)
- Cure / Technology: UV / Radiation Cured (also EB, Light)
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-SG™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG™ is formulated with proprietary nanomaterials and fillers. G6E-SG™
- Viscosity: 110,000 to 120,000 cP
- Use Temperature: 77 to 302 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Grease / Paste, Other, Specialty / Other
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Supplier: Graphene Laboratories, Inc.
Description: fillers. This epoxy is low cost as compared to high temperature silver epoxy. Curing of G6E-HTC™ epoxy requires a heating oven. Uses for G6E-HTC™ epoxy include casting, coating, encapsulation, grounding, medical device manufacture and repair, etc. FEATURES: ·
- Viscosity: 18,000 to 420,000 cP
- Use Temperature: 600 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Grease / Paste, Other, Specialty / Other
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Description: Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off.
- Industry: Aerospace, OEM / Industrial
- Features: Epoxy (EP), Flexible / Dampening, Grease / Paste
- Cure / Technology: Room Temperature Curing, Thermosetting / Crosslinking, Two Component System
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Featured Products Top
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-critical mix ratio of 100 to 5 by weight and offers a variety of cure schedules at moderately elevated temperatures from 140-257°F [60-125°C]. With a mixed viscosity of 2,000-5,000 cps, EP62-1BF can be used for potting small components. Additionally, it has low shrinkage upon curing (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Two part epoxy, Master Bond EP88FL, is a low viscosity, optically clear system featuring good flexibility for high performance bonding, coating, sealing and potting. It is easy to use, with a mixing ratio of one to one by weight or volume. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
EP3SP5FL is considered a “snap cure” type epoxy system and can be used in a variety of applications in the aerospace, electronics and specialty OEM industries, among others, particularly when ultra fast curing and repairability are desirable features. It requires no mixing (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
, encapsulation and casting applications. It produces very low smoke levels and is well suited for the computer, aerospace and related industries. This two part epoxy features a convenient one to one mix ratio by weight and cures at room temperature or more quickly at elevated temperatures (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
EP21TCHT-1 Two component epoxy compound for high performance bonding and sealing challenging bonding applications, elevated temperature cures are not possible. In order to overcome this deficiency, Master Bond (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond EP30LP-2 is an optically clear epoxy with superb light transmission properties. This low viscosity, electrical insulator also features outstanding dimensional stability. Featuring easy handling, this compound has a convenient two to one mix ratio by weight or (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
MB297FLNT has a low viscosity of 130-150 cps. This adhesive requires no mixing or heating, with minimal fixturing time for curing (typically 20-40 seconds). The most special feature of this system is its toughness. The rubber additive in the formulation mitigates the inherent stiffness (read more)
Browse Cyanoacrylate Adhesives Datasheets for Master Bond, Inc. -
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Dymax OP-81-LS Low-Shrink™ optical positioning epoxy is engineered for bonding delicate optical components where alignment stability is critical. The material cures quickly with UV/Visible or LED light and includes a low-temperature heat-cure option for shadowed areas or heat (read more)
Browse Industrial Adhesives Datasheets for Dymax
Conduct Research Top
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Epoxy Underfill Chip Level Adhesives
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. One-component epoxy resin adhesive
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Optical Transmission Properties of Adhesives
of wavelengths ranging from 400 to 3000 nm for these adhesives: EP30, MasterSil 151, MB600 and UV15. EP30 shows very good optical clarity with superior light transmission when compared to many other epoxies. It is a low viscosity, two part epoxy, widely used for bonding, coating, sealing and casting
More Information Top
Indicates content that may require registration and/or purchase.
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https://dspace.lib.cranfield.ac.uk/bitstream/1826/5315/1/Stennett%20et%20al.%20SCCM2009_pre-published.pdf
A low viscosity epoxy adhesive was used to join the two target components together.
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:: New Materials Zone ::
Home Adhesives (Structural) Low viscosity epoxy adhesive for cryogenic applications .
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Microfluidics for Biological Applications
A low viscosity epoxy adhesive is then flowed into the gap between the interconnect and the glass chip through a dedicated adhe- sive via.
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Passive smart self-repairing concrete beams by using shape memory alloy wires and fibers containing adhesives
A low viscosity epoxy adhesive was served as the sealing/repairing chemicals.
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The Behavior of Ni, Ni-60Co, and Ni3 Al during One-Dimensional Shock Loading
Targets were then reas- sembled using a low viscosity epoxy adhesive and held in a special jig for a minimum of 12 hours.
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On the Influence of Chain Morphology on the Shock Response of Three Thermoplastics
Target assemblies were made by fixing a manganin stress gage (MicroMeasurements type LMSS-025CH-048, Micro- Measurements, Rayleigh, NC) between 5- or 6-mm plates of the polymers with a low viscosity epoxy adhesive .
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Tacticity in shocked polymer hydrocarbons
Target assemblies were made by fixing a manganin stress gauge (MicroMeasurements type LMSS-025CH-048) between 5 or 6 mm plates of the polymers with a low viscosity epoxy adhesive .
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Handbook of Adhesives and Sealants, Second Edition > MAJOR TRENDS IN TECHNOLOGY AND MARKETS
A clear, medical grade, low viscosity epoxy adhesive has proven useful in the fabrication of access ports that are implanted beneath the skin of patients who require multiple infusions.
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Shear stress measurement in nickel and nickel–60 wt% cobalt during one-dimensional shock loading
The target assemblies were reassembled using a low viscosity epoxy adhesive , and held in a special jig for a minimum of 12 h.
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Shock and release of polycarbonate under one-dimensional strain
Target assemblies were made by fixing a manganin stress gauge (MicroMeasurements type LM- SS-025CH-048) between 5 or 6 mm plates of polycarbon- ate with a low viscosity epoxy adhesive .