Optical Wafer Inspection

Description: SemiProbe IRIS inspection systems inspect, locate and identify defects created during wafer manufacturing, probing, bumping, dicing or general handling, providing microelectronic device manufacturers with accurate, timely quality assurance and process information. The IRIS

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System
• Measurement Capability: Defects / ADC, Electrical Test - Parametric / In-line, Particle Contamination

Description: The Nanotronics Imaging nSpec® is an inspection device designed for high resolution microscopy and detection of wafer defects. With particular application in silicon carbide and Galium Nitride epi wafers, the nSpec® offers fast quantification and qualification of defects

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System
• Measurement Capability: Defects / ADC
• Mounting / Loading: Manual Loading

Description: The NWL200 series is the first lineup of wafer loaders for inspection microscopes capable of loading 100 micron thin wafers. Thanks to a new chuck system, the NWL200 series achieves highly reliable loading suitable for inspection of next-generation semiconductors.

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System, Other
• Maximum Wafer / Part Size: 200 mm
• Measurement Capability: Defects / ADC

Description: L200 series performs exceptionally precise optical inspection of wafers, photo masks, reticles and other substrates. 3 Models to Choose From L200: Offers 200mm wafer and mask inspection capabilities for reflected light illumination defect identification with

• Application: Semiconductor Inspection
• Computer Interface: Yes
• Fine Focus: Yes
• Grade: Benchtop

Description: Nikon Eclipse L300N/L300ND FPD / Wafer Inspection microscopes incorporate Nikon’s renowned CFI60 infinity optics, offering the world’s highest level of optical performance. The enhanced epi-fluorescence function, which enables 365nm UV excitation, is optimal for the

• Application: Semiconductor Inspection
• Computer Interface: Yes
• Fine Focus: Yes
• Grade: Benchtop

Description: Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection

Description: The Olympus MX51 industrial inspection microscope is cost-effective and optimized for the inspection requirements of a variety of electronic components, wafers and large samples.

• Application: Semiconductor Inspection
• Computer Interface: Yes
• Digital Display: Yes
• Eyepiece Style: Binocular

Description: 1.1 This practice covers an inspection procedure for determining the surface quality of silicon wafers that have been polished on one side. 1.2 This practice is intended as a large-volume acceptance method and as such does not require use of a microscope or other optical

Description: Semiconductor devices \x96 Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Part 2: Test method for defects using optical inspection

Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This practice covers an inspection procedure for determining the surface quality of silicon wafers that have been polished on one side. 1.2 This practice is intended as a large-volume acceptance method and does not

Description: IEC 63068-2:2019(E) provides definitions and guidance in use of optical inspection for detecting as-grown defects in commercially available 4H-SiC (Silicon Carbide) epitaxial wafers. Additionally, this document exemplifies optical images to enable the detection and

Description: The LLC6 is a precise linear lens changer with 6 lens ports providing ultra fast, automatic lens changing without the need of re-qualifying the lens. It is the ideal tool for TFT-LCD and Photomask Inspection/Repair applications or other tasks where multiple optical magnifications are

• Applications: Semiconductor Wafers, Flat Panel Displays
• Form Factor: Other
• Mounting / Loading: In-situ / System Mounted
• Non-contact: Yes

Description: Avantier Inc. offers a wide range of materials, cutting edge equipment, and optic and component capabilities for custom or OEM optics and components. We have over 50 years of expertise in custom optics and custom optical component manufacturing of lenses, prisms, windows, wafers, and

• Additional Services: Prototyping
• Design Services: Optical Component Design
• Location: North America, United States Only, Northeast US Only, Canada Only, East Asia / Pacific Only, Oceania Only

Description: Ceramic Fork Aluminum Nitride Vacuum Plate for LED wafer Aluminum nitride ceramic fork have excellent physical properties such as high thermal conductivity, low dielectric constant, reliable electrical insulation, thermal expansion coefficient matched with silicon, insulation and non

• Applications: Dielectric / Electrical Insulation
• Density: 3.36 g/cc
• MOR / Flexural Strength: 58015 psi
• Material Type: Aluminum Nitride, Specialty Ceramic

Description: selection allows the operator to load different products instantly. Wafer handler parameters and recipe settings are displayed on the LCD display. Operators can now confirm routines and results before and after inspection. The AL120 provides non-contact optical centering and

• Application: Semiconductor Inspection
• Digital Display: Yes
• Eyepiece Style: Binocular
• Grade: Benchtop

Description: retrieval of wafers to begin analysis. The Prior Scientific motorized Shuttle Stage is designed to be used with the Nikon and Olympus wafer loader systems for 3, 4, 6, and 8 inch wafers. The system greatly reduces operator fatigue while increasing inspection accuracy and

• Features: Programmable
• Lighting: Reflected Light
• Maximum X-Distance: 154 to 256 mm
• Maximum Y-Distance: 154 to 215 mm

Description: Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Part 4: Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence

Description: acceleration amplitudes produced by very high throughput stages used in wafer positioning, inspection and electronic manufacturing applications. NewDamp elastomers can be built into equipment isolation supports and even custom machinery feet. Superior Constant Natural Frequency (CNF)

• Features: Vibration Isolation
• Type: Optical Table

Description: acceleration amplitudes produced by very high throughput stages used in wafer positioning, inspection and electronic manufacturing applications. NewDamp elastomers can be built into equipment isolation supports and even custom machinery feet. Superior Constant Natural Frequency (CNF)

• Features: Vibration Isolation
• Type: Optical Table

Description: produced by very high throughput stages used in wafer positioning, inspection and electronic manufacturing applications. NewDamp elastomers can be built into equipment isolation supports and even custom machinery feet. Superior Constant Natural Frequency (CNF) Design ND20 Natural

• Features: Vibration Isolation
• Type: Optical Table

Description: acceleration amplitudes produced by very high throughput stages used in wafer positioning, inspection and electronic manufacturing applications. NewDamp elastomers can be built into equipment isolation supports and even custom machinery feet. Superior Constant Natural Frequency (CNF)

• Features: Vibration Isolation
• Type: Optical Table

Description: stage rail designs normally seen on high-end machine tools. VMR-Z120X maximum magnification model Offers even greater precision, providing optical magnification to 120x. Ideal for wafer level CSP, wafer bump height and SIP, rerouted masks and masks for MEMS. Other features

• Applications / Capabilities: Electronics or Semiconductor Inspection
• Image Source: Optical Microscope
• System Type: Turnkey / Complete System

Description: /distance/d isplacement measurement of both transparent and opaque materials. Such as, mobile phone’s camera module and motherboard measurement,curved glass profile measurement, chip measurement,glass thickness measurement, LCD screen inspection, wafer depth/thickness

• Gaging Technology: LED / Optical Micrometer

Description: /distance/d isplacement measurement of both transparent and opaque materials. Such as, mobile phone’s camera module and motherboard measurement,curved glass profile measurement, chip measurement,glass thickness measurement, LCD screen inspection, wafer depth/thickness

• Gaging Technology: LED / Optical Micrometer

Description: IEC 63068-4:2022(E) provides a procedure for identifying and evaluating defects in as-grown 4H-SiC (Silicon Carbide) homoepitaxial wafer by systematically combining two test methods of optical inspection and photoluminescence (PL). Additionally, this document exemplifies

Description: Custom Optics and Custom Optical Components Avantier Inc. offers a wide range of materials, cutting edge equipment, and optic and component capabilities for custom or OEM optics and components. We have over 50 years of expertise in custom optics and custom optical component

• Materials: Germanium

Description: widespread applications of lasers, including machining, material processing, spectroscopy, wafer inspection, light displays, medical diagnostics, laser printing, and data storage, etc. It has been shown that Nd:YVO4 based diode pumped solid state lasers are rapidly occupying the

• Damage Threshold: 750000 W/cm²
• Features: AR-Coated
• Material: Other / Specialty Material
• Optical Application: Infrared, Ultraviolet

Description: Rubicon’s sapphire epi-polished wafers are ultra-flat, super clean, stress-free large diameter substrates, offered with precision orientations and offsets and wafer-to-wafer uniformity, with one or both surfaces finished. These sapphire wafers are custom designed to meet

• Applications: Dielectric Ceramics / Materials, Electroceramics (Electrical and Electronic Ceramics), Optics / Optical Grade
• Width / O.D.: Up to 7.87 inch

Description: much lower coefficient of thermal expansion. Machining and finishing components such as positioning stages, wafer chucks, pin chucks (with lithographic patterning), bar mirrors, and light-weighted optics require special expertise. ZYGO's proprietary machining techniques enable us to fabricate

• Application / Industries Served: Optical Components
• Fabrication Process: Machining
• Location: North America, United States Only, Northeast US Only, Southwest US Only
• Materials: Glass Ceramic, Sapphire, Silicate / Fused Silica, Specialty / Other

Description: Industry Challenges In a world of Industry 4.0, precision measurement technology plays a crucial role to meet the increasing demand for automation of manufacturing, inspection processes, and ensuring reliable quality assurance. To satisfy the industrial challenges for superior quality and

• Applications / Capabilities: Alignment / Guidance, Assembly Quality, Bar / Matrix Code, Biotechnology or Medical, Color Mark / Color Recognition, Container or Product Counting, Edge Detection, Electronics or Semiconductor Inspection, Electronics Rework, Flaw Detection, Food & Beverage, Gauging, Scanning & Dimensioning,

Description: much lower coefficient of thermal expansion. Machining and finishing components such as positioning stages, wafer chucks, pin chucks (with lithographic patterning), bar mirrors, and light-weighted optics require special expertise. ZYGO's proprietary machining techniques enable us to fabricate

• Additional Operations: Etching / Blasting, Lapping / Polishing, Other
• Application Expertise: Optical / Semiconductor
• Coating Services: Anti-Reflective Coating, Other
• Fabrication Services: Design Assistance, Glass Part Fabrication, Materials Development / R&D, Material Selection, Inspection / Testing

Description: . In resolutions from 16 to 67 megapixels, Genie Nano-CXP ensures robust build quality, wide operating temperature, and an unmatched feature set—all at an incredible price. Typical Applications Semiconductor wafer inspection Surface and bump inspection

• Application / Industry: Industrial
• Camera Function: Still
• Horizontal Resolution: 4096 to 5120 lines
• Maximum Frame Rate: 80 to 120 fps

Description: The measurement of light scattered by surfaces can be used to locate and identify roughness, particulates, and defects on a wide variety of materials. Applications include the inspection of silicon wafers, optics, and storage media, characterization of thin film roughness,

• Modality: On-site / In Plant
• Technology / Subject: Design / Engineering Methods (ESDU, DFx, etc.), Photonics / Optics
• Type: Course

Description: . Noncontact inspection, X-ray inspection, and AOI (automated optical inspection). Sensor and ultrasonic tests. Semiconductor manufacturing: Wafer processing and inspection. Laser machining: Laser welding. Highly dynamic applications in precision automation,

• Stroke or X-Axis Travel: 0.0157 to 0.0315 inch

Description: -ray inspection, and AOI (automated optical inspection). Sensor and ultrasonic tests. Semiconductor manufacturing: Wafer processing and inspection. Laser machining: Laser welding. Highly dynamic applications in precision automation, smooth scan motion, minimum

• Actuation Type: Electrical
• Axis Configuration: X Axis Only
• Bearing Type: Ball/Roller Bearing
• Motor Specifications: Linear Motor

Description: efficiency and safety during operation. Application fields Optical alignment, wafer inspection, wafer alignment, measuring technology, inspection systems, calibration, scanning. Thanks to the friction-free motion, no particles are formed, which makes PIglide stages

• Design Units: Metric
• Load Capacity: 8.99 to 270 lbs
• Shape: Flat, Rectangular / Square

Description: In addition to advanced optical systems and Shimadzu's unique "Lo-Ray-Ligh" diffraction gratings, which substantially reduce stray light, Shimadzu's ultra-compact single-monochromator UV-2600 and double monochromator UV- 2700 offer a number of high-performance and productivity

• Application Software Included: Yes
• Computer Interface: Yes
• Detector Type: Photomultiplier, Other Detector
• Display Options: None

Description: virtually any microscope or optical system. The H101A stage enables the user to increase labor efficiency by automatically scanning your specimens and storing points for later recollection and inspection with unmatched repeatability. The H101A is ideal for scanning or inspection

• Features: Programmable, Slide Holder
• Lighting: Reflected Light
• Maximum X-Distance: 114 mm
• Maximum Y-Distance: 75 mm

Description: circuit / Transistor / Resistor/ Capacitor / Inductor / IC chip-completed in one scan ? Plasma etching, wafer solder joint, CMOS chip Goldwire defect detection ? Printed circuit inspection Lithium Battery ? Metal film scratch detection ? Electrode edge

• Imaging Technology / Camera Type: Other
• Performance Features: Line Scan

Description: ) package. These qualities make the Xcyte laser the ideal replacement for bulky and inefficient HeCd and argon lasers in varied applications such as flow cytometry, microstereolithograp hy and semiconductor wafer inspection. All Xcyte series lasers feature the rugged and efficient DCP

• Beam Area: 0.9000 mm²
• CDRH Classification: Class IIIb
• Laser Output: Continuous Wave, Pulsed
• Laser Power: 20 to 150 milliwatts

Description: , and AOI (automated optical inspection). Sensor and ultrasonic tests. Semiconductor manufacturing: Wafer processing and inspection. Laser machining: Laser welding. Highly dynamic applications in precision automation, smooth scan motion, minimum tracking errors, and short

• Stroke or X-Axis Travel: 24.02 to 32.01 inch

Description: which the shape of the cornea is changed in favor of the optical properties. For this ArF lasers are used at 193 nm. Visual inspection and metrology Optics and micro-optics inspection Laser patterning and scribing Micromachining brittle materials, such as ceramic

• Laser Output: Pulsed
• Laser Power: 1200 to 10000 milliwatts
• Laser Type: Excimer Lasers
• Laser Wavelength: Ultraviolet

Description: imaging in light starved conditions like these: FPD Inspection PCB Inspection Wafer Inspection Gene Sequencing Digital Pathology

• Camera Function: Video
• Format / Output: Other, Camera Link^®
• Horizontal Resolution: 16384 lines
• Monochrome / Color: Monochrome

Description: Primatics PCL40 Series linear positioning stages are our most compact linear guide bearing stages. Ideal for applications such as automated microscope inspection, medical assembly and semiconductor wafer testing and fabrication, the PCL40 offers unparalleled flexibility, allowing the

• Actuation Type: Electrical
• Axis Configuration: X Axis Only
• Carriage Load: 22.05 lbs
• Drive Specifications: Ball Screw

Description: . Typical Applications Lithography tools: optical steppers and scanners, e-beam & laser mask writers Metrology tools: Mask, wafer and LCD inspection and measurement tools, CD-SEMs Process equipment: memory repair tools, probers, die bonders, drilling tools

• Measurement: Displacement / Position
• Optical Configuration: Other

Description: happy to work with you to develop a custom wafer / die that meets your specific application. The SWIR wavelength range also requires specialized optical detectors as standard silicon detectors have a maximum sensitivity limit of approximately 1100nm. Marktech produces a line of InGaAs

• Color: Infrared
• Forward Voltage: 1 volts
• Optical Power Output: 5 milliwatts
• Peak Wavelength: 1300 nm

Description: happy to work with you to develop a custom wafer / die that meets your specific application. The SWIR wavelength range also requires specialized optical detectors as standard silicon detectors have a maximum sensitivity limit of approximately 1100nm. Marktech produces a line of InGaAs

• Color: Infrared
• Forward Voltage: 1.1 volts
• Lens Type: Domed Lens
• Optical Power Output: 8 milliwatts

Description: happy to work with you to develop a custom wafer / die that meets your specific application. The SWIR wavelength range also requires specialized optical detectors as standard silicon detectors have a maximum sensitivity limit of approximately 1100nm. Marktech produces a line of InGaAs

• Color: Infrared
• Forward Voltage: 1.2 volts
• Lens Type: Flat Lens
• Optical Power Output: 1.2 milliwatts

Description: happy to work with you to develop a custom wafer / die that meets your specific application. The SWIR wavelength range also requires specialized optical detectors as standard silicon detectors have a maximum sensitivity limit of approximately 1100nm. Marktech produces a line of InGaAs

• Color: Infrared
• Forward Voltage: 0.7000 volts
• Lens Type: Domed Lens
• Optical Power Output: 0.7500 milliwatts