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  • Temperature Measurement of PCBs
    High quality PCBs with SMD components are repaired in rework stations. Hot air is used to remove any defective components and residual solder, to perform solder paste printing and to solder new components into place. The repair process starts automatically when the PCB reaches a specific surface
  • The Low Mass Solution to 0402 Tombstoning
    . The subject of component Tombstone as a recorded internal process control defect has become an increasing concern. CCA's having this type of defect need special attention due to the high risk in late delivery and rework times associated with the replacement of parts and PCB repair.
  • PCB Fabricators Collaborate, Innovate for Success
    When an area array component is removed for repair, there typically is an excess of solder remaining on the board, which must be removed. This article explores ways to improve that repair process. Thermal uniformity across the pad array is improved when using ultra-wide solder iron tips. After BGA
  • The Contact Clip, the Heart of the Mill-Max Receptacle
    The basic component used for making electrical connections in a wide array of electronic equipment is the pin receptacle. The Mill-Max pin receptacle provides a highly reliable, low resistance electrical path to terminate the pins of a device or discrete wires to a PCB or other mating apparatus

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