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Supplier: Newark, An Avnet Company
Description: PIN GRID ARRAY SOCKETS
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Supplier: Newark, An Avnet Company
Description: PIN GRID ARRAY ADAPTORS
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Supplier: Sensata Technologies
Description: 29 Series 1 1/4 x 1 1/4 Pin Grid Array Carrier with Clip
- Product Type: IC Socket
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Supplier: Aries Electronics, Inc.
Description: 105°C] Sn plating : -67°F to 257°F [-55°C to 125°C] Au plating STANDARD CONTACT INSERTION FORCE : 67g/pin WITHDRAWAL FORCE : 30g/pin NORMAL FORCE : 45g/pin; based on a 0.018 [0.46] dia. test lead SPECIAL ULTRA-LOW INSERTION FORCE : 22g/pin WITHDRAWAL FORCE :
- Current Rating: 3 amps
- Operating Temperature: -55 to 125 C
- Number of Contacts: 9 to 625
- Contacts Pitch: 2.54 mm
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Supplier: Accuris
Description: Rules for the preparation of detail specifications for In-Line and Pin-Grid Array Sockets
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Supplier: Accuris
Description: Detail Specification Nonmechanically Actuated Flexible Carrier Sockets for Pin Grid Array for Use in Electronic Equipment
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Supplier: Sensata Technologies
Description: Accepts wide range of PGA packages from 8 X 8 through 15 X 15 Carrier can be molded from Electro-Static-Dissipative (ESD) materials Designed to be used with automatic test handlers For other PGA requirements consult factory Molded for high temperature materials for applications up to 150°C For
- Product Type: IC Socket
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Supplier: Allied Electronics, Inc.
Description: Pin Grid Array Socket, 0.020 in. Dia. Pin, 0.125 in. Length Sockets solder tail length is standard, long and low profile Choice of three low force clips to cover all applications. Hi-temp PCT polyester insulator material suitable for all forms of soldering.
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Supplier: Accuris
Description: Detail Specification for Adaptor \x96 Carrier Quad Flatpack to Pin Grid Array Sockets for Use in Electronic Equipment
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Supplier: Accuris
Description: Blank Detail Specification for Adaptor - Carrier Quad Flat Pack to Pin Grid Array Sockets for Use in Electronic Equipment
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Supplier: IPC International, Inc.
Description: This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy
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Supplier: Newark, An Avnet Company
Description: Heat Sink, For Ball Grid Array, Push-Pin, BGA, 9 C/W, 15 mm, 49 mm, 49 mm RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: Heat Sink, For Ball Grid Array, Push-Pin, BGA, 7 C/W, 20 mm, 49 mm, 49 mm RoHS Compliant: Yes
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Description: Establishes the requirements and interactions necessary for Printed Board Assembly processes for interconnecting high performance/high pin count I/C packages. Included is information on design principles, material selection, board fabrication, assembly technology, testing strategy, and
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Supplier: Powell Electronics, Inc.
Description: PIN GRID ARRAY SOCKET
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Supplier: Lingto Electronic Limited
Description: PIN GRID ARRAY SOCKET 180PIN
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Supplier: Rochester Electronics
Description: 80C196KB - Microcontroller, 16-bit, MCS-96, 68-pin Pin Grid Array (PGA)
- Bits: 16 Bit
- Features: Other
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Supplier: Mill-Max Mfg. Corp.
Description: offering two new connector sets: a five pin, compact cable-to-board socket and header and a 40 pin board-to-board header and socket combination. The five pin connectors have two contacts for power and three for signal, the 40 pin connectors have 30 signal and 10 power
- Contact Plating: Gold Plating
- Product Type: IC Socket
- RoHS Compliant: RoHS Compliant
- Mounting: Through-hole
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Supplier: Advanced Interconnections Corp.
Description: Our low insertion force Pin Grid Array (PGA) Sockets and Adapters are available in a variety of RoHS Compliant insulators with hundreds of screw-machined terminal choices. Virtually any PGA footprint can be accommodated, including interstitial patterns, and designs can be
- Number of Contacts: 4 to 2,000
- Contacts Pitch: 2.54 mm
- Product Type: IC Headers
- Contact Type: Low Profile Pins, Solder Tail Pins
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Supplier: Advanced Interconnections Corp.
Description: Our low insertion force Pin Grid Array (PGA) Sockets and Adapters are available in a variety of RoHS Compliant insulators with hundreds of screw-machined terminal choices. Virtually any PGA footprint can be accommodated, including interstitial patterns, and designs can be
- Number of Contacts: 4 to 2,209
- Contacts Pitch: 2.54 mm
- Contact Plating: Gold Plating
- Product Type: IC Socket
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Supplier: Advanced Interconnections Corp.
Description: Our Peel-A-Way® Pin Grid Array (PGA) Sockets are designed for low profile applications and feature our patented removable terminal carrier and high reliability screw-machined terminals. Virtually any PGA footprint can be accommodated, including interstitial patterns, and designs
- Number of Contacts: 4 to 2,000
- Contacts Pitch: 2.54 mm
- Contact Plating: Gold Plating
- Product Type: IC Socket
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Supplier: Indium Corporation
Description: Features Suitable for Pin-Grid Array and standard Ball Grid Array applications Airless Packaging Excellent solderability to all common surface metallizations No-clean residue Can be used for printing, dipping, and pin transfer deposition Offers high yields
- Features: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: placement of all the solder preforms needed on connector pins, pin grid arrays (PGAs) and other multiple-pad/pin components. They solve both assembly and product design challenges by allowing users to specify fabrications in the most complex arrays,
- Solder Alloy: Indium (In), Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
- Joining Process / Product Form: Preform
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Supplier: Boyd
Description: Aavid provides the broadest product line of heat sinks and thermal solutions for cooling integrated circuits such as Field Programmable Grid Arrays (FPGAs) and the surface mount packaging used for integrated circuits like Ball Grid Arrays (BGAs). Choose from a number of
- Device: Active Heat Sink
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Supplier: IPC International, Inc.
Description: DVD-64C identifies all of the important through-hole and surface mount component types – including: through-hole resistors, capacitors, diodes, potentiometers, pin grid arrays, sockets, DIPs, SIPs, transistors, LEDs, inductors, chokes, torroids, filters, fuses, breakers,
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Supplier: Skyworks Solutions, Inc.
Description: and systems. An integrated logarithmic power detector is included to provide closed-loop power control within the system. The device is housed in a 24-pin 3 x 5 mm Land Grid Array (LGA) package.
- Amplifier Type: Power Amplifier
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Supplier: Skyworks Solutions, Inc.
Description: and systems. An integrated logarithmic power detector is included to provide closed-loop power control within the system. The device is housed in a 24-pin 3 x 5 mm Land Grid Array (LGA) package.
- Amplifier Type: Power Amplifier
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Supplier: Richardson RFPD
Description: coupler intended for 802.11ax applications and systems. The LNA and PA disable functions ensure low leakage current in off mode. An integrated logarithmic power detector is included to provide closed-loop power control within the system. The device is provided in a compact, 16-pin 3 x 3 mm
- Device Type: Front End
- Package Type: LGA
- Features: Other
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Supplier: Skyworks Solutions, Inc.
Description: coupler intended for 802.11ax applications and systems. The LNA and PA disable functions ensure low leakage current in off mode. An integrated logarithmic power detector is included to provide closed-loop power control within the system. The device is provided in a compact, 16-pin 3 x 3 mm
- Frequency Range: 5,150 to 5,925 MHz
- Features: Other
- Package Type: Surface Mount Technology (SMT), Through Hole Technology (THT)
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Supplier: TE Connectivity
Description: Packaging Quantity : 120 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Insertion Force Type : Zero Insertion Force (ZIF) Leg Style : Pin Grid Array (PGA) ZIF Actuator : Screwdriver/Cam Termination Features Termination Method to PCB : Surface
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Supplier: Skyworks Solutions, Inc.
Description: Land Grid Array (LGA) package.
- Frequency Range: 2,400 to 2,500 MHz
- Features: Other
- Package Type: Surface Mount Technology (SMT), Through Hole Technology (THT)
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Supplier: Everspin Technologies, Inc.
Description: power loss by low-voltage inhibit circuitry to prevent writes with voltage out of specification. The MR256A08B is the ideal memory solution for applications that must permanently store and retrieve critical data and programs quickly. The MR256A08BCMA35 is the 48-pin ball grid
- Density: 256 kbits
- Number of Words: 32 k
- Bits per Word: 8 bits
- Access Time: 35 ns
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Supplier: Amphenol PCD
Description: .075]) provides high contact density for advanced electronics packaging. The metallic shell is equipped with grounding, guide pins, and keying devices to ensure mechanical reliability. The modularity Within the standard SEM E form factor, the SMASH connector provides a wide array of
- Current Rating: 3 amps
- Number of Contacts: 132 to 150 #
- Features: Board Mount Connector, Straight
- Gender: Female / Jack, Male / Plug
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Supplier: Richardson RFPD
Description: × 3 mm, RoHS-compliant, land grid array (LGA) package and can operate from −40 C to +105 C.
- Frequency Range: 24,000 to 32,000 MHz
- Insertion Loss: 1.1 dB
- Isolation (Port to Port): 38 dB
- Switching Speed: 0.00006 ms
![Pin Grid Array Sockets/Headers on 0.100 [2.54] Centers with Solder Tail Pins](https://partimages.globalspec.com/20/4220/2979220_medium.png "Pin Grid Array Sockets/Headers on 0.100 [2.54] Centers with Solder Tail Pins")
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mode. An integrated logarithmic power detector is included to provide closed-loop power control within the system. The device is provided in a compact, 16-pin 3 x 3 mm Land Grid Array (LGA) package (read more)
Browse WiFi and WiMAX Wireless Chips Datasheets for Skyworks Solutions, Inc. -
ball grid array (BGA) package of the AD4854 includes all critical power supply and reference bypass capacitors, minimizing the full solution footprint and component count, as well as reducing sensitivity to the application printed circuit board (PCB) layout. The AD4854 operates over an extended (read more)
Browse Analog-to-Digital Converter (ADC) Chips Datasheets for DigiKey
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Spring Probe based Pin Grid Arrays (PGAs) for MRI Applications
Spring probes offer high density and have a very high mating cycle life, often higher than traditional pin & socket contact systems, and this is needed to keep very expensive MRI systems operating to their full capacity and patient throughput to a maximum.
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Spring Probe PGA Technology Spring Probe based Pin Grid Arrays (PGAs) for MRI Applications
developed non-magnetic spring probes with mating cycles exceeding 60,000, specifically for MRI applications. Using a spring probe grid array allows for the designer to customize the number of ground pins used to optimize the performance of the connector for specific frequencies/coil designs, saving
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Unique Application of Solder Ball Technology on QFP Pads Improves Processing Reliability
challenges associated with QFP packages such as non-coplanar leads "lifting" after reflow, opened the door for newer, high density packages, such as Ball Grid Array (BGA), that are ultimately more cost effective and process friendly.