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Supplier: Protavic America, Inc.
Description: PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.41 to 4.63
- Features: Electrical Insulation / Dielectric Material
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Epoxies Etc...
Description: 20-2365 is a new low viscosity polyurethane designed for low stress on sensitive components during and after cure. This filled polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. 20-2365 has a convenient
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Epoxies Etc...
Description: 20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100 exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. This system
- Coeff. of Thermal Expansion (CTE): 83.33 µin/in-F
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.1
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Supplier: Epoxies Etc...
Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end assemblies
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 6.63
- Dielectric Strength: 400 to 610 kV/in
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Supplier: Accuris
Description: Dielectric Compression Bond of Polyurethane Foam
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Supplier: MacDermid Alpha Electronics Solutions
Description: Clear amber modified polyurethane conformal coating specifically designed to protect electronic circuitry. Product Overview PUC Polyurethane Conformal Coating is a tough, abrasion-resistant coating with excellent mechanical and dielectric properties, while maintaining the
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Epoxies Etc...
Description: The 20-2135 is a two component, low durometer, potting, casting and encapsulating compound. This system is unfilled and low in viscosity allowing for fast self-leveling. The 20-2135 will quickly encapsulate components and electronic devices. The 20-2135 has outstanding thermal cycling properties, a
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.5
- Elongation: 50 %
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Supplier: MacDermid Alpha Electronics Solutions
Description: Ultra high-performance polyurethane offering exceptional protection in various environments with excellent electrical properties. Product Overview UR5118 is a highly water-resistant, RF polyurethane resin developed as an ultra-high-performan ce encapsulation and potting
- Compound Type: Encapsulating / Potting
- Industry: Aerospace, Automotive, Electronics, Marine, Semiconductors / IC Packaging
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Foams and Foam Materials - Closed-cell Polyurethane Dielectric Foam Material -- LAST-A-FOAM® RF-2206Supplier: General Plastics Manufacturing Co.
Description: LAST-A-FOAM® RF-2200 is an advanced dielectric material for use in radomes, antennas and other radio frequency (RF) communication systems. This series of Machin able, closed cell polyurethane foams provide an RF-transparent, low-loss protective layer for applications requiring
- Application: Other
- Bulk Density: 6 lbs/ft³
- Foam Type: Closed Cellular, Rigid
- Form / Shape: Stock Shape (Bar, Sheet, etc.), Board / Block / Bun
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Supplier: Zippertubing Co. (The)
Description: ZT-TAPE® is a fire retardant Polyurethane film electrical tape with a special pressure sensitive acrylic adhesive backing, an easy-to-remove paper release liner and is UL 510 recognized. The Polyurethane tape has excellent resistance to cold temperatures and is weather resistant. Use
- Adhesive: Acrylic
- Backing: Specialty / Other
- Performance Features: Dielectric / Insulating
- Temperature Resistance: -55 to 107 C
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Supplier: Accuris
Description: Procedure for Determining the Ability of Dielectrically Bonded Polyurethane Foam to Resist Arcing
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-9 Polyurethane Encapsulant is a two-component polyurethane system used for cable and connector potting and molding. It has superior hydrolytic stability, thermal shock resistance, high dielectric strength, and a low dissipation factor. Part B, 1 qt Can.
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 750 kV/in
- Elongation: 450 %
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-11 Polyurethane Amber is a two component, liquid molding and encapsulating system that is used to protect electrical assemblies against extreme environments. It offers flexibility, low viscosity, hydrolytic stability, high dielectric strength, and resistance to
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 0.0155 kV/in
- Elongation: 350 %
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Supplier: Ellsworth Adhesives
Description: , and wire wound devices. It offers good dielectric properties, hydrolytic stability, low viscosity, high elongation, and resistance to fungus and thermal shock. Part B, 5 gal Pail. Must purchase the EN-4 PART A GAL Polyurethane Encapsulant separately, see below. Mix Ratio by weight is
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 0.0199 kV/in
- Elongation: 400 %
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Supplier: Ellsworth Adhesives
Description: , and wire wound devices. It offers good dielectric properties, hydrolytic stability, low viscosity, high elongation, and resistance to fungus and thermal shock. Part B, 1 qt Can. Must purchase the EN-4 PART A GAL Polyurethane Encapsulant separately, see below. Mix Ratio by weight is
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 0.0199 kV/in
- Elongation: 400 %
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Supplier: Zippertubing Co. (The)
Description: Shielded ZT-Tape® is a combination of Zippertubing's fire retardant Polyurethane ZT-Tape® stagger bonded to a layer of Z-3250-CN shielding fabric with an electrically conductive adhesive backing. When spirally wrapped around electrical wires or other items using a 50% overlap technique
- Backing: Specialty / Other
- Performance Features: Dielectric / Insulating, Electrically Conductive, EMI / RFI Shielding
- Temperature Resistance: -45 to 107 C
- Thickness: 0.0180 inches
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Supplier: Protavic America, Inc.
Description: PNU-46202™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.41 to 4.63
- Features: Electrical Insulation / Dielectric Material
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: PNU-46203™ is an electronics grade, two-component polyurethane adhesive or encapsulant for high temperature resistance. PNU-46203™ is designed for the encapsulation by casting of completed circuit boards. Cured PNU-46203™ is expected to meet the flammability requirements of UL
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 6.89 to 7.01
- Features: Electrical Insulation / Dielectric Material, Filled, Flame Retardant (e.g. UL 94 Rated), Flexible / Dampening
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Supplier: Protavic America, Inc.
Description: PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
- Dielectric Constant (Relative Permittivity): 4.41 to 4.63
- Features: Electrical Insulation / Dielectric Material, Filled, Flexible / Dampening
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Description: Solderability, Dyeability, Moisture Resistance, Few Pin Holes, Low Dielectric Loss in high frequency, Suitable for high speed winding operation. Applications: Micro motors, Transformers, Automobile coils
- Applications: Automotive / Vehicular
- Coil Stock: Yes
- Gauge Thickness: 0.0120 to 0.6000 Gauge
- Metal / Alloy Types: Copper, Brass or Bronze Alloy (UNS C)
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Description: Solderability, Dyeability, Moisture Resistance, Few Pin Holes, Low Dielectric Loss in high frequency, Suitable for high speed winding operation. Applications: Micro motors, Transformers, Automobile coils
- Applications: Automotive / Vehicular
- Coil Stock: Yes
- Gauge Thickness: 0.0120 to 0.6000 Gauge
- Metal / Alloy Types: Copper, Brass or Bronze Alloy (UNS C)
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Description: Solderability, Dyeability, Moisture Resistance, Few Pin Holes, Low Dielectric Loss in high frequency, Suitable for high speed winding operation. Applications: Micro transformers, Linear motors, Relays, Solenoids, Micro motors, Watch coils, Magnet head, Instrumental coils
- Applications: Automotive / Vehicular
- Coil Stock: Yes
- Gauge Thickness: 0.0120 to 0.6000 Gauge
- Metal / Alloy Types: Copper, Brass or Bronze Alloy (UNS C)
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Protective Sleeving - Dual Wall F.R. Polyurethane Jacket with Z-3250-CN EMI Shield -- Z-Shield-2Lâ„¢Supplier: Zippertubing Co. (The)
Description: Z-Shield-2Lâ„¢ consists of two layers of fire retardant Polyurethane film encapsulating a Z-3250-CN EMI shield cloth and utilizes a double adhesive closure. The dual layer of Polyurethane film creates a finished jacket that has an inner dielectric spacer and will meet UL224, VW
- Sleeving: Wrap Around Sleeving
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Supplier: ELANTAS North America LLC
Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.5
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Supplier: Master Bond, Inc.
Description: such as strength, chemical resistance, and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. In addition, EP30D10 has been used successfully in a number of different cryogenic applications. Master Bond Polymer System EP30D-10 is
- Coeff. of Thermal Expansion (CTE): 50 µin/in-F
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: Over 400 kV/in
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Supplier: Master Bond, Inc.
Description: characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethane's including toughness, abrasion resistance and flexibility. Master Bond Polymer System EP30D-7 is formulated to cure at room temperature or more rapidly at elevated
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.8
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Supplier: Master Bond, Inc.
Description: as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. In addition EP30DP can be used at cryogenic temperatures. It can be readily cast in thick cross sections, (e.g., several inches) without the
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.8
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30C is a new, versatile two component nickel modified polymer system featuring high electrical conductivity, superior bonding strength and chemical resistance for EMI/RFI shielding as well as bonding and sealing applications. This electrically highly conductive compound
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Strength: Over 400 kV/in
- Dissimilar Substrates: Yes
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Supplier: Zippertubing Co. (The)
Description: Z-Shield® is a wrap around EMI shielded jacket made of fire retardant Polyurethane film, Z-3250-CN EMI shielding cloth and an adhesive closure. This combination provides excellent electromagnetic shielding of wires and cables in applications requiring outstanding flexibility, flame retardant
- Sleeving: Wrap Around Sleeving
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Supplier: RS Components, Ltd.
Description: Tough, flexible modified polyurethane conformal coating. Designed for protection of electronic circuitry. Excellent adhesion to a wide variety of substrates. Fluoresces under UV light for ease of inspection. Resistance to a wide variety of chemicals including acids and alkalis. Wide operating
- Use Temperature: -67 to 266 F
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Description: Clause 15 to remove specific wire specimen sizes; - consolidation of 17.1 and 17.2 of the solderability requirements; - modification to Clause 19, Dielectric dissipation factor; - new Clause 23, Pin hole test. Key words: requirements of solderable enamelled round copper winding wire, class
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Supplier: ELANTAS North America LLC
Description: CONAP® CONATHANE® Superior Moisture Barriers CONAP® and CONATHANE® products represent the gold standard in conformal coatings for the insulation of electronic components and printed circuitry. Available in acrylic and polyurethane formulations
- Chemistry: Polyurethane, Resin Base / Polymer Binder
- Features: Chemical / Oil Resistant, Dielectric, Protective
- Form: Liquid
- Industry: Automotive, Electronics, Military Specification
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Supplier: CSA Group
Description: Clause 15 to remove specific wire specimen sizes; - consolidation of 17.1 and 17.2 of the solderability requirements; - modification to Clause 19, Dielectric dissipation factor; - new Clause 23, Pin hole test. Key words: requirements of solderable enamelled round copper winding wire, class
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Supplier: Boyd
Description: ), UV sensitive OCA Protective films & tapes Insulating films Metal foils & graphite sheets Microcellular urethane foams Polyurethane, polypropylene, polyethylene, polyolefin foams Densified SOLIMIDE® Foam
- Enhancement / Function: Anti-static / ESD Control, Dielectric / Insulating, EMI / RFI Shielding
- Features: Hard Coat / Thin Film, Moisture / Vapor Barrier, Thermally Insulating / Insulative, Transparent
- Film Material: PET / Polyester, Acrylic / Acrylate
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Supplier: TelephoneStuff.com
Description: : - All-Dielectric Construction requires no grounding or bonding requirements - Small Diameter and bend-radius for easy installation in space-constrained areas - Polyurethane outer jacket for Environmental and Mechanical protection - Flexible characteristic facilitates portability -
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Featured Products Top
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Is Polyurethane Dielectric Foam Durable Enough for Aerospace and RF Applications? In the aerospace and RF industries (read more)
Browse Electrical Insulation and Dielectric Materials Datasheets for General Plastics Manufacturing Co. -
-2200 is an advanced dielectric material for use in radomes, antennas and other radio frequency (RF) communication systems. This series of machinable, closed cell polyurethane foams provide an RF-transparent, low-loss protective layer for applications requiring optimal performance where (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
Dexmet® Corporation, a part of PPG’s engineered materials division
Polyurethane foam microwave and radar absorbers
Foam Absorbers Cuming Microwave manufactures a family of flexible, carbon loaded, polyurethane foam microwave and radar absorbers. These are all electrically resistive (read more)
Browse Foams and Foam Materials Datasheets for Dexmet® Corporation, a part of PPG’s engineered materials division -
DIELECTRIC BROCHURE DIELECTRIC MATERIALS General Plastics offers a variety of LAST-A-FOAM® (read more)
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How is Aerospace Polyurethane Foam Applied? Aerospace polyurethane foam is an important component in modern aerospace (read more)
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LAST-A-FOAM® FR-3700 Performance Core Last-A-FoamFR-3700 is a CFC-free, rigid, closed-cell, flame-retardant polyurethane foam available in densities ranging from 3 to 40 pounds per cubic foot. It exhibits a (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
-component polyurethanes that assure consistent cure and performance even in small “shot-size” potting applications (Bectron® PK materials). Dielectric gels that provide outstanding electronic protection with very low stress on (read more)
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Easypoxy® K-230 Optically clear in thin film, semi-flexible Excellent for bonding glass and dissimilar materials Polyurethane ELANTAS (read more)
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TPE – A large group of materials that includes both thermoplastic – thermoset blends and co-polymers. Increasingly used as a flexible, “green” alternative to PVC. Polyurethane – A strong, elastic thermoplastic with superior cut (read more)
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materials that do more than merely resist fire. They predict constant performance under heat, impact, wetness, and over time. When properly manufactured, flame-retardant polyurethane foam lives up to these expectations. It must pass fire tests, retain mechanical strength, and withstand environmental (read more)
Browse Protective Liners and Lining Systems Datasheets for General Plastics Manufacturing Co.
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Dielectric Materials for Use in Radomes
Polyurethane Foam: Dielectric Materials for Use in Radomes and Other Applications. Many polyurethane foams offer a wide variety of physical properties, as well as desirable dielectric properties for applications requiring minimal dielectric constant and loss tangent. In many such applications
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Polyurethane Resin Vs Silicone Resin Conformal Coating Material For Electronics
and offer increased dielectric resistance and protection against humidity, fungus, heat, corrosion, and contaminants like dust and dirt. Conformal coatings also enhance the operational integrity of the devices.
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Electrolube's Polyurethane Resin A Success for Tier 1 Automotive Supplier
Electrolube proposed looking at a thermally conductive resin with lower viscosity and better flow properties, to be able to fill even the smallest gaps in the unit more effectively. Furthermore, the customer also needed high dielectric strength, excellent protection to automotive fluids and support
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Indicates content that may require registration and/or purchase.
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Insight into influence of conducting polymer functionalized graphene on electromechanical activity of polyurethane-based intelligent shape-changing composites
2.2 Functionalized graphene– polyurethane dielectric elastomer composites .
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Flexible and Stretchable Electronic Composites
Chen T, Qiu J, Zhu K, He X, Kang X, Dong E (2014) Poly(methylmethacrylate)- functionalized graphene/ polyurethane dielectric elastomer composites with superior electric field induced strain.
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Electric Actuation of Nanostructured Thermoplastic Elastomer Gels with Ultralarge Electrostriction Coefficients
Both the SEBS and MA gels had ultralarge Q values, compared with those of conventional ferroelectric materials such as inorganic PZT and organic PVDF, and even compared with a polyurethane dielectric elastomer, a fluoroelastomer, and a polyurethane-based molecular composite with …
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Structural Health Monitoring 2009
The fabricated L-C circuit sensor shown in the figure 4 has a theoretical nominal capacitance of 5.53 pF for the polyurethane dielectric material and a nominal capacitance of 1.58pF for the PDMS dielectric material.
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Trade Science Inc. - Abstract
Melamine-Formaldehyde Modified Mesua Ferrea Linn Polyurethane Dielectric Thin Films .
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Dynamic mechanical properties of nanoclay filled TPU/PP blends with compatibiliser
C. Tian, Q. Jinhao, Z. Kongjun, H. Xiaoyuan, K. Xin and D. E-liang: ‘Poly(methyl methacrylate)-functionalized graphene/ polyurethane dielectric elastomer composites with superior electric field induced strain’, Mater.
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Polythiophene Nanofibril Bundles Surface‐Embedded in Elastomer: A Route to a Highly Stretchable Active Channel Layer
sistor.[16] The polyurethane dielectric used by Chortos et al. is not comparable to the nonstretchable dielectrics.[33] Therefore, to test the possibility as a stretchable active layer, the SEBS/ P3HT film on a PDMS substrate was stretched first and then …
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Materials Science : An Indian Journal - Table of Contents
Melamine-Formaldehyde Modified Mesua Ferrea Linn Polyurethane Dielectric Thin Films .
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Electrical insulation system for the shell-vacuum vessel and poloidal field gap in the ZTH machine
Polyurethane dielectric testing has also included simultaneous application of pressure (200 psi), temperature (lOO°C), and solvents.
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Track Design Handbook for Light Rail Transit, Second Edition
Embedding the rail and filling the entire trough with an insulating dielectric polyurethane or other suitable insulating material.