Quartz Wafer

Description: Quartz boat is a loader which can be inserted by silicon wafer. So it is applied in semiconductor area. The cleaning process for quartz boat is very strictly. The boat should be dipped in concentration of 4-5% HF solutions keeped for 4 hours. Then soaked in DI water for 1 hours.

• Shape / Form: Fabricated / Custom Shape
• Glass Type: Quartz
• Features: Specialty / Other

Description: raw material, meticulous attention to detail, and stringent quality control process throughout various quartz manufacturing processes. We also stocks and supplies quartz glass in the other forms such as fused quartz silicon trays, quartz wares, quartz tubing,

• Width / O.D.: 0.0393701 to 1.574804 inch
• Outer Diameter (O.D.): 0.0393701 to 1.574804 inch
• Applications: Chemical / Materials Processing, Electrical / HV Parts
• Glass Type: Quartz

Description: We are experienced of all kinds of vacuum chuck for automation and mechinery industries,especially these with glass, quartz and ceramics material. With glass or quartz transparent material, the light could transmits from bottom, or the designer could put CCD under the table for

• Materials: Ceramic
• Jaws: None / NA
• Features: Other
• Chuck Geometry: Round

Description: The wafer edge grinders are designed to grind edge and circumference of a wide variety of wafers including silicon, compound semiconductors, such as, SiC, GaN, GaAs, and InP, oxide wafers, such as sapphire, quartz, LT, and LN, and glass, at high precision through

• Maximum Wafer / Part Size: 50.799972568014816 to 203.19989027205926 mm
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: End effectors, also referred to as semiconductor handling "blades", are the robot's hand to handle and move semiconductor wafers between positions. So end effectors must be dimensionally precise and thermally stable, while having a smooth, abrasion-resistant surface to safely handle

• Features: Alumina / Aluminum Oxide, Aluminum Nitride, Carbide Materials, Silica / Silicate Materials, Silicon Carbide, Specialty Ceramic, Yttria
• Applications: Chemical / Materials Processing, Wear Parts / Tooling
• Silicate Type: Quartz
• Shape / Form: Wafer Carrier / Holder

Description: EL-CAT Inc. is a stocking distributor of Silicon Wafers, Compound Semiconductors and other Crystal Materials for use in electronics.

Description: CoorsTek provides wafer boats, pedestals, and custom wafer carriers for both vertical / column and horizontal configurations. Advanced ceramics deliver excellent thermal resistance and plasma durability while mitigating particles and contaminants. Semiconductor-grade silicon carbide

• Material Type: Carbide Materials, Silicon Carbide
• Shape / Form: Fabricated / Custom Shape, Wafer Carrier / Holder
• Features: Other

Description: JST's Cleanroom Carts provide a particle-free, static-safe, low-humidity environment for the transport of sensitive materials. Specialized designs and materials provide secure transport of wafer boxes, reticles and other critical parts as well as acids and corrosives.

Description: ideal for microscopic patterning from wafers to large flat panel displays (FPD). Ceramic Components for Lithography & Wafer Inspection Perfect for next-generation lithography and wafer-handling applications, our ultra-pure ceramic components ensure minimal contamination and

• Applications: Chemical / Materials Processing
• Features: Dielectric / Electrical Insulation, Other
• Shape / Form: Wafer Carrier / Holder

Description: The graphene film is grown on copper foil and then transferred on to silicon wafer substrates. Size: 1cm*1cm monolayer ratio: >95%. We can offer custom service for your different request of size and layers.

• Features: Silica / Silicate Materials

Description: our proprietary process insures minimal filament sag ensuring long life. Tubular double-ended quartz infrared lamps are high-powered heat sources incorporating a tungsten filament within a quartz envelope. They are of the halogen type, which avoids blackening of the tubes and

• Lamp Power: 4,000 watts
• Maximum Overall Length: 11.63 inch
• Color Temperature: 3,150 K
• Features: Halogen Lamps, Heat Lamps

Description: width: <5μm Dicing street width: ≥300μm Positional accuracy: ±10μm (between parallel lines) Applicable workpiece materials: Transparent materials such as coated and uncoated glass, and quartz.

• X-axis Travel / Length Capacity: 11.81103 inch
• Y-axis Travel / Width Capacity: 11.023628 inch
• Z-axis / Vertical Travel: 0.1968505 inch
• Laser Output Power: 0 to 1 watts

Description: definition. - Etch channels maximum number at quartz wafer of seed which do not pass through from surface to back surface are classified for three grades in 4.2.13 a). Users use seed portions of quartz wafers for devices. They request quartz wafers with less

Description: definition. - Etch channels maximum number at quartz wafer of seed which do not pass through from surface to back surface are classified for three grades in 4.2.13 a). Users use seed portions of quartz wafers for devices. They request quartz wafers with less

Description: Applies to single crystal wafers intended for manufacturing substrates made of synthetic quartz crystal, lithium niobate, lithium tantalate, lithium tetraborate crystals for surface acoustic wave (SAW) filters and resonators. Lays down specifications and measuring methods.

Description: work piece or polishing cloth, it will dry soft and so reduce scratching otherwise associated with standard colloidal silica re-crystallization. Applications: Chemical - Mechanical Planarization (CMP) of sapphire wafers, silicon wafers, gallium nitride, quartz, ceramics,

• Type: CMP / Wafer Planarization
• Compound / Abrasive Type: Ceramic, Silica
• Materials / Substrates Finished: Ceramics / Glass, Semiconductors / Electronics (Wafers)
• Form: Liquid / Dispersion

Description: Lift pins are used in assemblies to lift and move wafers through semiconductor processing positions. Since they are exposed to chamber or other processing conditions, they require robust thermal stability and corrosion resistance. Semiconductor Processing Components CoorsTek is your partner

• Features: Alumina / Aluminum Oxide, Aluminum Nitride, Carbide Materials, Silica / Silicate Materials, Silicon Carbide, Specialty Ceramic, Yttria
• Applications: Chemical / Materials Processing, Wear Parts / Tooling
• Silicate Type: Quartz
• Shape / Form: Wafer Carrier / Holder

Description: The Sycon STM-100 Thickness/Rate Monitor/MF a precision mass and film thickness measurement instrument for use in thin film deposition processes and other quartz crystal microbalance applications.

• Applications: CVD / PVD Films
• Form Factor: Monitor / Instrument

Description: LeakDefender™ brand thermocouples are used in ASM® EPSILON® Reactors in conjunction with the TC Sentry System™ to monitor for quartz sheath leaks in real time. In the harsh environment of a reactor, the quartz sheath is attacked and can fail prematurely. This will cause at least one or

Description: The STC-200 utilizes the time tested 6Mhz quartz crystal as the sensor device. It's CRT display allows the clear presentation of data and deposition status. Both numeric and graphical data are used. The Run Time display is the main operating display. All the critical process information is

• Applications: CVD / PVD Films
• Form Factor: Monitor / Instrument

Description: customers will have access to advanced DRIE process up to 1:30 aspect ratio. As well as reliable and qualified deep vacuum wafer level package process below 10mTorr. Tronics offer is not limited to wafer processing. We also perform wafer level test and dicing. This ensures

• Services: Design / Engineering, Production, Prototyping, R & D / Development
• Capabilities: Dry Etching (Plasma / RIE), Inspection / Testing, Metallization - Electroplating, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Screen Printing, Wafer Bonding, Wet / Chemical Etching
• Features: Europe Only, Specialty / Other
• Materials: Quartz, SOI, Silicon

Description: sq ft facility is situated in Palm Beach County, FL. Wafer World, Inc. is an ISO 9001:2008 and AS9100:2004 certified manufacturing facility for Silicon, Gallium Arsenide, Germanium, Indium Phosphide, Sapphire and Quartz.

Description: Tech Cool MicroCut 28S is a fully synthetic coolant specially formulated for wire-saw cutting of the toughest materials, including ceramics and metallic alloys. This coolant can be used on annular saws for wafering ceramics, optical, electro-optical and quartz materials and is designed to

• Function: Coolant (Flood / Mist), Grinding Fluid

Description: Versatile storage systems optimize the purity, safety and productivity of front-end wafer fabrication Support platens securely support delicate quartz tubes of varying diameters to minimize costly damage Ergonomic, space-saving designs minimize floorspace requirements, provide easy

• Length: 48 inch
• Width: 24 inch
• Cart / Truck Type: Cabinet Cart
• Tires: Solid / Cushion

Description: Versatile storage systems optimize the purity, safety and productivity of front-end wafer fabrication Support platens securely support delicate quartz tubes of varying diameters to minimize costly damage Ergonomic, space-saving designs minimize floorspace requirements, provide easy

• Height: 89.5 to 100 inch
• Width: 78.75 inch
• Depth: 43.4 to 55.1 inch
• Use: Industrial

Description: Sapphire is single-crystal alumina, a transparent material with excellent chemical stability and valuable mechanical, thermal and optical properties. Its material properties are vastly superior to glass, quartz and other mass-produced transparent materials.

• Thermal Conductivity: 42 W/m-K
• MOR / Flexural Strength: 100,075.419156466 psi
• Compressive / Crushing Strength: 426,408.307710159 psi
• Modulus of Elasticity: 68,167,314.4978826 psi

Description: poromeric structure helps to produce exact surface finishes. All pads are offered with adhesive backing which simplifies its fixing and removal. Sizes: 305mm to 1400mm diameters Applications: Silicon Wafer, Glass, Plastic, Ceramics, GaAs, Quartz, Metal Parts etc.

Description: possible in small workpieces, wafers, larger substrates, and material blanks. Aspect ratios as high as 25-to-1 are possible, depending on the material type and feature size. View the ultrasonic machining 3D animation to learn more about how ultrasonic machining works.

• Additional Services: Design Assistance, High Volume Production, Low Volume Production, Prototype Services
• Materials: Glass, Quartz
• Features: Midwest US Only, North America, United States Only

Description: flatness. Precise optical flatness control of work piece. The LLCD series of machines ability to be set up for use as a lapping or polishing means they can be used for processing large Plano optics including : Calcium, Fluoride, Fused, Silica, BK7, Quartz, Zerodur etc. In addition to

• Maximum Part Diameter / Width: 780 mm
• Features: Automated Loading, Flat Panel Display, Integral Process Controller, MEMS, Magnetic Storage, Optical Coatings, Other, Semiconductor Manufacturing
• Type: Batch System (Single Chamber / Multiple Wafers), Continuous / Web System, Inline System (Semi-continuous)
• Materials Processed: Dielectric / Ceramic, Metal, Oxides, Silicon

Description: No Description Provided

• Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Dielectric / CVD Thin Film, Dry Etching (Plasma / RIE), Inspection / Testing, Metallization - Electroplating, Metallization - PVD Thin Film, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Screen Printing, Wafer Bonding,
• Materials: Compound Semiconductor, Glass, Quartz, SOI, Silicon
• Services: Design / Engineering, Pilot / Scale-Up, Production, Prototyping, R & D / Development
• Features: Midwest US Only, North America, Specialty / Other, United States Only

Description: facility contains processing equipment capable of volume manufacturing yet flexible enough to accommodate wafer sizes from 50mm to 200mm. We offer full Device Fabrication and Design services along with a variety of individual processes to support our growing network of satisfied customers.

• Materials: Ceramic, Compound Semiconductor, Glass, Quartz, SOI, Silicon
• Services: Design / Engineering, Pilot / Scale-Up, Production, Prototyping, R & D / Development
• Capabilities: Dielectric / CVD Thin Film, Metallization - PVD Thin Film, Oxidation / Doping
• Features: North America, Northwest US Only, Specialty / Other, United States Only

Description: No Description Provided

• Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Dielectric / CVD Thin Film, Dry Etching (Plasma / RIE), Inspection / Testing, LIGA, Metallization - Electroplating, Metallization - PVD Thin Film, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Wafer Bonding, Wet /
• Materials: Ceramic, Compound Semiconductor, Glass, Metal / Nickel, Polymer / Organic, Quartz, SOI, Silicon
• Services: Design / Engineering, Pilot / Scale-Up, Production, Prototyping, R & D / Development
• Features: North America, Southwest US Only, Specialty / Other, United States Only

Description: (options depending) Chamber Height: 100mm Heated Area: 230 x 217mm Chamber Lid Open/Closing: Manual IR Heating: Array of 8 IR lamps in Quartz glass tubes (2 Heating zones) Power connection: 3Ph-N-PE 230/400V, 50/60Hz Power: 6,5 kW Features SRO-700 Flux-less, with Flux and solder paste FORMIC

• Temperature Range: 450 to 700 F
• External: Bench / Cabinet