RF Chipset

Description: Single Chip 2x2 802.11a/b/g/n MIMO MAC/BB/Radio The AR6004 chipset is a single chip, small form factor 2x2 IEEE 802.11 a/b/g/n MAC/baseband/radio optimized for low-power mobile applications. AR6004 Specs Wi-Fi Wi-Fi Standards 802.11n 802.11a

• Data Rate: 300000 kbps
• IC Package Type: BGA
• Interface: I²C, SPI, UART, USB
• Technology: Wi-Fi / WiMAX / Wi-Mesh

Description: Low-Energy Wi-Fi Dual-Band 802.11a/b/g/n SoC The QCA4004 is an intelligent platform for the Internet of Things that contains a low-power Wi-Fi connectivity solution on a single chip. It includes a number of TCP/IP-based connectivity protocols along with SSL, allowing a low-cost, low-complexity

• Data Rate: 10000 kbps
• IC Package Type: QFN
• Interface: I²C, SPI, UART
• Technology: Wi-Fi / WiMAX / Wi-Mesh

Description: Dual-band 1 x 1 802.11ac + Bluetooth 4.1 The QCA9377-3 is a single-die wireless local area network (WLAN) and Bluetooth combination solution to support 1 × 1 802.11a/b/g/n/ac WLAN standards and Bluetooth 4.1 + HS, designed to deliver superior integration of WLAN/Bluetooth and low-energy technology.

• Data Rate: 433000 kbps
• Interface: I²C, PCI Express, UART
• Technology: Bluetooth, Wi-Fi / WiMAX / Wi-Mesh

Description: Low-Energy Wi-Fi Single-Band 802.11a/b/g/n SoC QCA4002 is an intelligent Wi-Fi platform for the Internet of Things (IoT). This complete networking platform enables customers to add full-featured Wi-Fi to a wide variety of products with minimal development effort and cost. QCA4002 Specs Wi-Fi Wi-Fi

• Data Rate: 10000 kbps
• IC Package Type: QFN
• Interface: I²C, SPI, UART, USB
• Technology: Wi-Fi / WiMAX / Wi-Mesh

Description: XFRMR FOR LINEAR TECH CHIPSET

• Operating Temperature: -40 C
• Transformer Category: Signal / RF Transformer

Description: 4322CHIPSET

Description: RF TXRX MODULE CHIPSET

Description: ENTERPRISE 11AC RADIO CHIPSET

Description: PHASED ARRAY-RADAR CHIPSET-AESA

• Device Type: Other

Description: PHASED ARRAY-RADAR CHIPSET-AESA

• IC Package Type: Other
• Supply Voltage: Other

Description: AR9590 CHIPSET: (802.11N: PEACOC

• Device Type: Transceiver

Description: 63168 30A CHIPSET

• Transformer Category: Signal / RF Transformer

Description: VINAX-AD2 CHIPSET

• Transformer Category: Signal / RF Transformer

Description: WIFI PHONE CHIPSET

• Transformer Category: Signal / RF Transformer

Description: XFRMR SHDSL FOR INFINEON CHIPSET

• Mounting / Form Factor: Other
• Operating Temperature: -40 to 85 C
• Transformer Category: Signal / RF Transformer

Description: GEMINAX A8PXXS CHIPSET

• Transformer Category: Signal / RF Transformer

Description: RF IC Baseband ASIC for Dolphin Chipset Baseband ASIC for Dolphin Chipset 64-LQFP (10x10)

Description: RF IC Baseband ASIC for Dolphin Chipset Baseband ASIC for Dolphin Chipset 64-LQFP (10x10)

Description: XFRMR FOR ALCATEL ADSL CHIPSET

• Mounting / Form Factor: Chip Transformer
• Operating Temperature: -40 to 85 C
• Transformer Category: Signal / RF Transformer

Description: XFRMR FOR LINEAR TECH CHIPSET

• Mounting / Form Factor: Chip Transformer
• Operating Temperature: -40 to 125 C
• Transformer Category: Signal / RF Transformer

Description: XFRMR FOR LINEAR TECH CHIPSET

• Mounting / Form Factor: Other
• Operating Temperature: -40 to 125 C
• Transformer Category: Signal / RF Transformer
• Type: Other

Description: XFRMR FOR METALINK CHIPSET ANSI

• Mounting / Form Factor: Chip Transformer
• Operating Temperature: -40 to 85 C
• Transformer Category: Signal / RF Transformer

Description: KIT EVAL/DEMO FOR GPS CHIPSET

• Category: Development Board

Description: The AWT6251 meets the increasing demands for higher output power in 3GPP handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6250 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state

• Amplifier Type: Power Amplifier
• Frequency Range: 1850 to 1910 MHz
• Maximum Gain: 26 dB
• Maximum Operating Voltage: 3.4 volts

Description: The AWT6275 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6250 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state

• Amplifier Type: Power Amplifier
• Frequency Range: 1920 to 1980 MHz
• Maximum Gain: 26.5 dB
• Maximum Operating Voltage: 3.4 volts

Description: The AWT6274 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6275 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state

• Amplifier Type: Power Amplifier
• Frequency Range: 1850 to 1910 MHz
• Maximum Gain: 27 dB
• Maximum Operating Voltage: 3.4 volts

Description: The BGS16GA14 is a Single Pole Six Throw (SP6T) Diversity Switch Module optimized for wireless applications up to 3.8 GHz. As part of a pin- and functional-compatibl e SP3T-SP8T product family it has been designed to meet the requirements of chipset reference designs. The module comes in a

• Actuator Type: Other
• Actuator Voltage: 2.4 to 3.4 volts
• Control Interface: Other
• Frequency Range: 100 to 3800 MHz

Description: The BGS18GA14 is a Single Pole Eight Throw (SP8T) Diversity Switch Module optimized for wireless applications up to 3.8 GHz. As part of a pin- and functional-compatibl e SP3T-SP8T product family it has been designed to meet the requirements of chipset reference designs. The module comes in

• Actuator Type: SP8T, Other
• Actuator Voltage: 2.4 to 3.4 volts
• Control Interface: Other
• Frequency Range: 100 to 3800 MHz

Description: The AWT6135 meets the increasing demands for higher efficiency and linearity in CDMA 1XRTT handsets. The PA module is optimized for VREF = +2.8 V, a requirement for compatibility with the Qualcomm® 6000 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology

• Amplifier Type: Power Amplifier
• Frequency Range: 1850 to 1910 MHz
• Maximum Gain: 26.5 dB
• Maximum Operating Voltage: 3.4 volts

Description: Antennas GPS RADIONOVA RF Module MTK chipset

Description: Key Features 1. Two Six-Core AMD Opteron™ 2000 Series (Socket F) processor support; HT3.0 Link support 2. AMD SR5690/SP5100 Chipset PCI-E Gen2 3. 8x 3.5" Hot-swap SAS / SATA Drive Trays + 2x Fixed HDD Drive Bays 4. Up to 128GB Reg. ECC

• Form Factor: Tower
• Server Type: Network Server

Description: Key Features 1. Four AMD Opteron™ 6000 Series processors (G34); 16/12/8-Core ready 2. AMD SR5690/SR5670/SP5100 Chipset 3. LSI 2008 8 port SAS2 controller 4. 5x 3.5" Hot-swap SAS / SATA Drive Bays 5. Up to 512GB of DDR3 Reg. ECC

• Form Factor: Tower
• Server Type: Network Server

Description: Key Features 1. Two Six-Core / Quad-Core AMD Opteron™ 2000 Series (Socket F) support; HT3.0 Link support 2. Dual AMD SR5690 + SP5100 Chipset PCI-E Gen2 support 3. Up to 128GB Registered ECC DDR2 800/667/533 SDRAM in 16 DIMM 4. Intel®

• Form Factor: Tower
• Server Type: Network Server

Description: The nRF9131 Mini SiP is a powerful solution perfect for applications. It also supports cellular operations utilizing the same LTE stack as nRF9161. The nRF9131 will simplify traditional chipset-based designs, making it ideal for high-volume cellular IoT applications. With

• Processor Core: ARM

Description: Antennas GPS/GNSS RADIONOVA RF Module MTK chipset

Description: Manufacturer: Texas Instruments Win Source Part Number: 1166817-DBB03AIPMR Packaging: Reel - TR Package: 64-LQFP Function: Baseband ASIC for Dolphin Chipset Part Status: Obsolete(EOL) Secondary Attributes: Baseband ASIC for Dolphin Chipset Family Name: DBB03A

Description: Manufacturer: Würth Elektronik Category: Transformers -Switching Converter, SMPS Transformers Series: WE-UNIT, MID-OLPI Package: Tray Product Status: Active Type: For AC/DC Converters Applications: Flyback Converters Intended Chipset: LNK605 Chipset Manufacturer: Power Integrations

• Transformer Category: Signal / RF Transformer

Description: The BT55-187S is a general purpose Bluetooth module designed to be incorporated into an end product. This Bluetooth Module is a Class 2 Bluetooth device based on the BlueCore5-External chipset from Cambridge Silicon Radio, a leading Bluetooth chipset supplier. It provides a fully

• Applications: Mobile / Wireless Systems
• Communication Interface: Serial Interface
• Data Rate: 2000 to 3000 kbps
• Features: Antenna Connector

Description: The BT44-191S is a general purpose Bluetooth module incorporating an on-board meandering line antenna designed to be incorporated into an end product. The BC04 Bluetooth Module is a Class 2 Bluetooth module using BlueCore4-External chipset from Cambridge Silicon Radio, a leading Bluetooth

• Applications: Mobile / Wireless Systems
• Communication Interface: Serial Interface
• Data Rate: 2000 to 3000 kbps
• Features: Antenna Connector

Description: The BT44-eb101S is a general purpose Bluetooth module incorporating an on-board ceramic antenna designed to be incorporated into an end product. This Bluetooth Module assembly is based onthe BlueCore4-External chipset from Cambridge Silicon Radio, a leading Bluetooth chipset supplier.

• Applications: Mobile / Wireless Systems
• Communication Interface: Serial Interface
• Data Rate: 2000 to 3000 kbps
• Features: Antenna Connector

Description: Use with Broadcom's Chipset BCM4100 & 4210 PCB Package Isolation Voltage: 1500Vrms Passband Frequency: 4.25MHz - 9.75 MHz Input Impedance: 50 ? - 1M ? (1Hz to 30MHz)

• Insertion Loss: 2.2 dB
• Operating Temperature: -25 to 80 C
• Package Type: Surface Mount Technology (SMT)

Description: The IGX-UACF1-9379b7-BT is a highly integrated Wireless Local Area Network (WLAN) system-on-chip (SOC) for 5GHZ 802.11ac, or 2.4/5GHz 802.11n WLAN applications. Dual-stream spatial multiplexing up to 867Mbps data rate is featured. It is based on the Qualcomm Atheros QCA9379 chipset.

• Modulation: Other
• Operating Frequency: 2400 to 5845 MHz
• Operating Temperature: 0.0 to 70 C
• Output Power: 11 to 15 dBm

Description: The IGX-SACF1-9379a3-BT is a single-die Wireless Local Area Network (WLAN) and Bluetooth (BT) combo module. It supports 2×2 MIMO with two spatial streams. It features IEEE 802.11 a/b/g/n/ac WLAN standards and BT v4.2+HS. Based on the Qualcomm QCA9379-3 chipset it enables seamless integration

• Modulation: Other
• Operating Frequency: 2400 to 5850 MHz
• Output Power: 2 to 4 dBm
• Radio Technique: Frequency-Hopping Spread Spectrum

Description: SiRF-IV GPS Receiver for Positioning, Tracking and Navigation The R4 Series GPS receiver module is a self-contained high-performance GPS receiver ideal for the engineer looking for an easy way to add GPS to their product. Based on the SiRF-IV chipset, it provides exceptional

• Applications: Mobile / Wireless Systems, Other
• Features: RoHS
• Form Factor / Package: Surface Mount Technology (SMT)
• Modulation: Other

Description: SiRF-IV GPS Receiver for Positioning, Tracking and Navigation The F4 Series GPS receiver module is a self-contained high-performance GPS receiver. Based on the SiRFstar IV chipset, it provides exceptional sensitivity, even in dense foliage and urban canyons. The module’s very low

• Applications: Mobile / Wireless Systems, Other
• Features: RoHS
• Form Factor / Package: Surface Mount Technology (SMT)
• Modulation: Other

Description: nanotron MN03SWBLE, swarm bee LE v3 module Embedded 2.4 GHz Chirp Radio Location Awareness and Concurrent Wireless Communication swarm bee LE V3 integrates nanotron’s location RF-Chip, nanoLOC, and is complemented with embedded accelerometer and temperature sensors

• Applications: Mobile / Wireless Systems

Description: Please note: this product is being discontinued and is not recommended for new designs. The SE5008L is a single chip integrated front-end module (FEM) with a low noise amplifier and switch to complement WLAN chipsets with an integrated 5GHz Power Amplifier. The Low Noise Amplifier includes a

• Frequency Range: 4900 to 5850 MHz
• Maximum Gain: 14 dB
• Maximum Operating Voltage: 3.3 volts
• Minimum Gain: 14 dB

Description: Feature Designed for Conexant SMART HCF FFI Chipset UL1950 / EN60950 and BABT approved SMT package Small size

• Mounting / Form Factor: PC / PCB Mount
• Standards: RoHS Compliant, UL
• Transformer Category: Signal / RF Transformer
• Type: Telecom / LAN Transformer

Description: Feature Designed for use of Conexant SMART HCF FFI Chipset. Approved to UL1950 BABT EN60950. SMT package

• Mounting / Form Factor: PC / PCB Mount
• Standards: RoHS Compliant, UL
• Transformer Category: Signal / RF Transformer
• Type: Telecom / LAN Transformer

Description: The RM Series GPS receiver module is a self-contained high-performance Global Positioning System receiver designed for navigation, tracking and positioning applications. Based on the MediaTek chipset, it can simultaneously acquire on 66 channels and track on up to 22 channels. This gives the

• Form Factor / Package: Surface Mount Technology (SMT)
• Operating Frequency: 1575 MHz
• Operating Temperature: -40 to 85 C
• Source Type: DC (Battery) Power

Description: : -40°C ~ 125°C Intended Chipset: LT3573, LT3574, LT3575, LT3748 Chipset Manufacturer: Linear Technology Footprint: 0.385" L x 0.360" W (9.78mm x 9.14mm) Height - Seated (Maximum): 0.420" (10.67mm) Popularity: Medium Fake Threat In the Open Market: 46 pct. Supply and Demand Status:

• Operating Temperature: -40 to 125 C
• Transformer Category: Signal / RF Transformer