Products & Services
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Supplier: MacDermid Alpha Electronics Solutions
Description: A lead-free alloy delivering best-in-class yield, outperforming Sn/Cu-based materials. Product Overview SAC305 alloy is a proven, industry-standard lead-free solder composed of tin, silver, and copper, offering excellent thermal fatigue resistance and reliable
- Lead Free: Yes
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Supplier: MacDermid Alpha Electronics Solutions
Description: High-silver, lead-free alloys for wave and selective soldering. Product Overview ALPHA SAC305, SAC387, and SAC405, along with their replenishment alloys SAC300, SAC350, SAC380, and SAC400, are lead-free options suitable for
- Lead Free: Yes
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Supplier: Henkel Corporation - Electronics
Description: MULTICORE 97SC (SAC305) alloy is designed to be a lead free substitute for tin/lead alloys in most electronics assembly soldering operations. It meets or exceeds QQ-S-571, J-STD-006 and JIS Z 3282 Class A requirements.
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Supplier: ODG (Origin Data Global)
Description: SAC 305 LEAD FREE SOLDER PASTE T
- Equipment Type: Other
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Supplier: Indium Corporation
Description: Indium Corporation manufactures bar solder specifically to surpass the strict quality demands of the surface mount industry in order to provide more consistent and reliable performance. Bar solder is available in a full range of SnPb and Pb-free alloys, including industry
- Alloy: Tin-Lead (Sn-Pb)
- Approvals / Conformance: ASTM / UNS, JIS, Other
- Form / Shape: Other
- Lead Free: Yes
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Supplier: ODG (Origin Data Global)
Description: SAC 305 LEAD FREE SOLDER PASTE T
- Equipment Type: Other
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Supplier: Techsil Limited
Description: MG Chemicals 4900 Sn96 (SAC305) is an electronic grade, lead-free solder wire. It uses the predominant lead-free alloy composition and is complemented with a no clean, synthetically refined, splatter-proof resin flux core. The 4900 solder wire meets
- Form / Shape: Wire
- Lead Free: Yes
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Supplier: Indium Corporation
Description: Indium Corporation manufactures bar solder specifically to surpass the strict quality demands of the surface mount industry in order to provide more consistent and reliable performance. Bar solder is available in a full range of SnPb and Pb-free alloys, including industry
- Alloy: Tin-Lead (Sn-Pb)
- Approvals / Conformance: ASTM / UNS, JIS, Other
- Form / Shape: Other
- Lead Free: Yes
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Supplier: MacDermid Alpha Electronics Solutions
Description: -temperature, lead-free solder paste users who require a compatible alloy for Pin Through Hole (PTH) applications. Enables Low Temperature in Selective and Dip Soldering Processes Improves Energy Efficiency and Reduces Thermal Damage Reduce energy costs and thermal damage,
- Lead Free: Yes
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Supplier: Indium Corporation
Description: Very popular lead-free solder alloy. Alloy: 96.5Sn 3.0Ag 0.5Cu Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 220ºC Solidus Melting Temperature: 217ºC Pb-Free: Yes
- Alloy: Tin-Silver (Sn-Ag)
- Lead Free: Yes
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Supplier: Indium Corporation
Description: Very popular lead-free solder alloy. Alloy: 96.5Sn 3.0Ag 0.5Cu Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 220ºC Solidus Melting Temperature: 217ºC Pb-Free: Yes
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: MacDermid Alpha Electronics Solutions
Description: large (1mm pitch) BGA components containing lead-free spheres. Small print deposits remain fully coalesced, even in profiles hot enough to collapse SAC305 BGA spheres. Consistent Fine-Feature Print Volume Repeatability Low Post-Reflow Residue Reduction in Mid-Chip Solder
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Supplier: Techsil Limited
Description: MG Chemicals 4910 Tip Tinner is a lead-free mixture used for quickly cleaning, repairing, and maintaining solder iron tips. It is composed of SAC305 powder mixed with some thermally stable, oxide reducing compounds that form a convenient tinning block. The re-tinning
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore C400 Flux Cored Wire ) LOCTITE C 400 cored solder wire has been specially formulated to complement no clean wave and reflow soldering processes. Multicore C400 wires provide fast soldering on copper, brass and solder coated materials. It is availalble
- Alloy: Tin-Lead (Sn-Pb), Other
- Approvals / Conformance: Other
- Form / Shape: Wire
- Lead Free: Yes
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore C502 Cored Wire ) LOCTITE C 502 cored solder wire has been specially formulated to complement no clean wave and reflow soldering processes. LOCTITE C 502 is also well suited for soldering applications requiring high melting temperature alloys. It is
- Alloy: Tin-Lead (Sn-Pb), Other
- Approvals / Conformance: Other
- Form / Shape: Wire
- Lead Free: Yes
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore C511 ) LOCTITE C 511 cored solder wire has been specially formulated to compliment no clean wave and reflow soldering processes. It is available in several tin/lead alloys as well as Lead Free. It is available with Sn63, Sn62, Sn60, 96SC
- Alloy: Tin-Lead (Sn-Pb), Other
- Approvals / Conformance: Other
- Form / Shape: Wire
- Lead Free: Yes
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Supplier: Littelfuse, Inc.
Description: temperature soldering guaranteed: 265°C./10 seconds/ 0.375â€,(9.5mm) lead length, 51bs., (2.3kg) tension Plastic package has Underwriters Laboratory Flammability classification 94V-O Matte Tin Lead–free plated
- Diode Type: Transient Voltage Suppressor Diodes (TVS)
- VR: 36 volts
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Supplier: RS Components, Ltd.
Description: WSW SAC L0 solders have been developed to meet the electronics industryâ??s increasingly stringent quality requirements. WSW SAC L0 lead-free solder wire with Sn3.0Ag0.5Cu alloy. L0 - Halogen-free flux. For a long life of the soldering tips. Fast and
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 423 to 430 F
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Supplier: RS Components, Ltd.
Description: WSW SAC L0 solders have been developed to meet the electronics industryâ??s increasingly stringent quality requirements. WSW SAC L0 lead-free solder wire with Sn3.0Ag0.5Cu alloy. L0 - Halogen-free flux. For a long life of the soldering tips. Fast and
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 423 to 430 F
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Supplier: RS Components, Ltd.
Description: WSW SAC L0 solders have been developed to meet the electronics industryâ??s increasingly stringent quality requirements. WSW SAC L0 lead-free solder wire with Sn3.0Ag0.5Cu alloy. L0 - Halogen-free flux. For a long life of the soldering tips. Fast and
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 423 to 430 F
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Supplier: RS Components, Ltd.
Description: WSW SAC L0 solders have been developed to meet the electronics industryâ??s increasingly stringent quality requirements. WSW SAC L0 lead-free solder wire with Sn3.0Ag0.5Cu alloy. L0 - Halogen-free flux. For a long life of the soldering tips. Fast and
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 423 to 430 F
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Supplier: Win Source Electronics
Description: Manufacturer: LEMO Win Source Part Number: 871755-FGG.1B.305.CL AD52Z Series: 1B Operating Temperature Range: -55°C ~ 250°C Features: 5 Position Circular Connector Plug, Male Pins Solder Cup Package: Bulk Mounting: Free Hanging (In-Line) Family Name
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Supplier: PACE
Description: “set†and “actual†temperatures of the individual heaters. Additionally, the system can be put into a closed loop control mode where the heater activity is controlled by a thermocouple placed on the PCB being worked on.High mass, Lead Free PCBs are no
- Equipment Type: Soldering Equipment
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Supplier: Radwell International
Description: MARCON,40FAL305U, CAPACITOR,SHUNT CAPACITOR, 3UF, 400VAC, SOLDER TERMINALS. FREE 2 YEAR RADWELL WARRANTY
- Capacitance Range: 4.00E7 microF
- Configuration / Form Factor: Leaded Capacitor
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Supplier: Aries Electronics, Inc.
Description: ), NSMD SOLDER SPHERES: 63/37 Sn/Pb or Lead-free SAC 305 TRACE WIDTH/SPACE: 0.003 [0.0762] OPERATING TEMPERATURE: 221°F [105°C] FR-4, 266°F [130°C] Lead-free MOUNTING CONSIDERATIONS SUGGESTED PCB PAD SIZE: 0.022 [0.559] for 1.27mm pitch; 0.020 [0.51] for 1.00mm
- Contact / Pin Type: Other
- Contact Plating: None
- Contacts Pitch: 0.4000 to 1.27 mm
- Mounting: SMT
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Supplier: Umicore Metal Deposition Solutions
Description: Electroless nickel, electroless palladium and semi-autocatalytic gold plating Umicore's ENEPIG process provides an universal finish to the PCB industry with excellent wire-bonding performance and the highest degree of solder joint reliability (SJR) with lead-free SAC 305
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Supplier: Win Source Electronics
Description: -D-RA; 76383-310LF; 1-746610-50702472051 ; 70247-2051.; 70247-2051..; 702472051; Country of Origin: SK Popularity: Low Fake Threat In the Open Market: 62 pct. Supply and Demand Status: Shortage Maximum Operating Temperature: 120 °C Depth: 6.3 mm Lead Free: Yes
- Current Rating: 2.5 amps
- Number of Contacts: 20 #
- Voltage Rating: 250 volts
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Supplier: Win Source Electronics
Description: Contact Type: Male Pin Number of Positions Loaded: All Number of Rows: 1 Termination: Solder Fastening Type: Push-Pull Contact Material: Copper Alloy Current Rating: 3A Material Flammability Rating: UL94 V-0 Insulation Material: Thermoplastic Style: Board to
- Current Rating: 3 amps
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Supplier: Win Source Electronics
Description: -10520010894106 ; 01089-4106; 010894106; 10894106; A-70216-0394; Country of Origin: US Popularity: Low Fake Threat In the Open Market: 45 pct. Supply and Demand Status: Shortage Lead Free: Yes Mount: Through Hole RoHS: Compliant ELV: Compliant Flammability Rating: UL94 V-0 Glow Wire
- Current Rating: 3 amps
- Number of Contacts: 10 #
- Voltage Rating: 250 volts
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Supplier: ESAB Welding and Cutting Products
Description: Features Lead free-cadmium free solder and flux kit for joining copper and dissimilar metals in drinking water lines. Works, melts, and solders better than 50/50 lead/tin solder. Good corrosion resistance. Meets all Government and Plumbing Code specs.
- Form / Shape: Paste
- Lead Free: Yes
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Featured Products Top
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-quality lead-free alloy that is capable of soldering at a temperature lower than standard tin silver copper alloys. ALPHA HRL3 solder alloy is able to demonstrate reliability performance comparable to standard tin silver copper alloys (SAC305). To ensure consistent sphere size, uniformity, and alloy content, ALPHA Solder Spheres are manufactured to the highest quality control standards. (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for applications such as fine feature printing, low temperature processing, and many others. Alpha's® solder pastes are available in a wide range of alloy offerings, including low-Ag SACX (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
options like SAC305 and other high-reliability alternatives, Innolot MXE delivers exceptional thermal cycling, vibration, and drop shock performance. In addition, it achieves high creep-fatigue resistance, through a refined microstructure, making it ideal for the most demanding ruggedized applications (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
introduced an alloy transition program from ALPHA® SAC305 to SACX®0307 and SACX®0107, leveraging their proven balance of performance, reliability, and reduced silver content. To ensure consistent implementation and repeatable results, Mac (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
Enables use of lower cost substrates & components Reduction of warpage (component & substrate) vs SAC process Excellent electrical reliability; passes JIS Z 3197 & J-STD-004B SIR testing Exhibits low voiding characteristics; passes IPC Class 3 voiding on BGA components Halide-free & zero-halogen compliant (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
, this new preform technology is offered in all SAC, Innolot and low-temp SnBi alloys. For more information on ALPHA® AccuFlux™ BTC-578 Solder Preforms, visit the Alpha website (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
ALPHA OM-362, next-generation ultra-low voiding solder paste This lead-free, zero-halogen, no-clean paste can deliver less than 10 (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
, coatings, etc.) don’t contain hazardous substances such as lead (Pb), cadmium (Cd), mercury (Hg), hexavalent chromium (Cr??), PBB, or PBDE. Using lead-free solder and an environmental substrate. Supplier Qualification: It is necessary to ask the raw material suppliers to provide (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
Stainless Steel ensuring low contact resistance and superior solder joints where lead-free soldering or reflow processes are employed. Click Here to learn more about all of Keystone's High Performance Battery Holders for Cylindrical Battery's (read more)
Browse Battery Holders Datasheets for Keystone Electronics Corp. -
1-1886HCSP2 is available in a lead-free, RoHS compliant 2.5x2.5 mm chip scale surface mount package (CSP2) and is compatible with standard leaded and lead-free PCB reflow soldering processes. (read more)
Browse RF Mixers Datasheets for Marki Microwave LLC
Conduct Research Top
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Achieving High-Reliability Low-Cost Lead-Free SAC Solder Joints via Mn Doping
In this study, the reliability of low-Ag SAC alloy doped with Mn (SACm (R)) was evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to eutectic SnPb, SAC105, and SAC305 alloys.
More Information Top
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http://etd.auburn.edu/bitstream/handle/10415/3818/Motalab_dissertation_R14.pdf?sequence=2
The two developed methods were then applied to determine the Anand constants for SAC305 lead free solder using the two completely different sets of experimental test data presented in the previous chapter.
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Determination of Anand constants for SAC solders using stress-strain or creep data
… Properties with Temperature and Strain Rate [Reflowed Cooling Profile, No Aging] Determination of Anand Model Constants from the Stress- Strain Data Using the 2-step procedure discussed above, the nine Anand model parameters for SAC305 lead free solder have been determined from …
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Mechatronics and Intelligent Materials III
Three key solder joint’s process parameters, pad length, gap height and solder paste’s volume are chosen to build an orthogonal array , 25 PLCC lead free SAC305 solder joint’s models with different parameters combination are built in Surface Evolver to predict the solder …
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Program—Symposium AAA | 2014 MRS Spring Meeting | San Francisco
In-Situ X-Ray Full Field Imaging and Nano-Fluorescence Microscopy of Intermetallic Compound Formation in SAC305 Lead Free Solder .
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The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints
In our prior work on aging effects (Ma, et al., ECTC 2006), we demonstrated that the observed material behavior variations of SAC405 and SAC305 lead free solders during room temperature aging (25 °C) were unexpectedly large and universally detrimental to reliability.
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Thermal cycling reliability assessment and enhancement of embedded wafer level LGA packages for power applications
The solder joints of the eWLL packa SAC305 lead free solder material.
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Characterization of aging effects in lead free solder joints using nanoindentation
In the current work, we have explored aging phenomena in actual solder joints by nano-mechanical testing of single SAC305 lead free solder joints extracted from PBGA assemblies.
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Study on interfacial behavior and shear strength of lead-free micro-interconnect bump after SnPb reballing
The No.1, No.2, No.4 and No.5 samples were converted from lead free ( SAC305 ) solder ball to Sn63Pb37 solder ball.
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Inverse analysis of solder joint creep properties
In this study, 96.5Sn3.0AgO.5Cu ( SAC305 ) lead free solder was used.
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Improved reliability testing with multiaxial electrodynamics vibration
They examined the vibration durability of Sn37Pb and SAC305 ( lead free ) solders using a combination of harmonic excitation tests and finite element modeling.