Semiconductor Forming Gas

Description: higher fuel and oxygen pressures. Hydrogen is ideal here as it is supplied at higher pressures than other fuel gases. In the glass industry, hydrogen is used to form the rim on glasses. Hydrogen has a vast application spectrum beyond its value as a fuel gas. It is used in the

• Applications: Electronic and Semiconductor, Other
• Hydrogen, Hydrides and Hydrogen Compounds: Hydrogen
• Product Forms: Gas

Description: Argon is a rare atmospheric gas which is colorless, odorless, tasteless, and nontoxic. It is considered extremely inert and forms no known chemical compounds. The concentration of argon gas in the atmosphere by volume is 0.93%. Argon gas has numerous applications,

• Applications: Electronic and Semiconductor, Laser Gas, Welding / Thermal Process Gas, Other
• Composition: Pure Gas
• Concentration: 100 to 100 %
• Noble Gases: Argon

Description: colorless, odorless, tasteless and nontoxic gas. Argon, along with helium, neon, krypton, xenon and radon is also known as a "rare" gas. Argon forms no known chemical compounds. The gas is 1.38 times heavier than air and is slightly soluble in water. Argon is present in

• Applications: Electronic and Semiconductor, Laser Gas, Welding / Thermal Process Gas, Other
• Composition: Pure Gas
• Concentration: 100 to 100 %
• Noble Gases: Argon

Description: Helium is a rare atmospheric gas which is colorless, odorless, tasteless, nontoxic, nonflammable, and only slightly soluble in water. The concentration of helium gas in the atmosphere by volume percent is 5.24 x 10-4. Helium gas is principally shipped and used in either gaseous

• Applications: Laboratory / Analytical, Laser Gas, Other
• Composition: Pure Gas
• Concentration: 100 to 100 %
• Noble Gases: Helium

Description: applications support staff to assist with custom calibrations, rapid implementation and optimal utilization Applications: Process monitoring and QC of specialty gases Semiconductor manufacturing Mobile applications (on military vehicles) On-line process streams Environmental monitoring

Description: XENSIV™ PAS CO2 sensor – disruptive CO2 sensor based on photoacoustic spectroscopy (PAS) The XENSIV™ PAS CO2 sensor is a real carbon dioxide (CO2) sensor in an unprecedented small form factor. Designed on the basis of the photoacoustic spectroscopy (PAS) concept, the

• Input (Supply) Voltage: 3.3 to 12 volts
• RoHS Compliant: Yes

Description: , Indium9.72 is designed for reflow in a forming gas or nitrogen atmosphere. This product has superior wetting capabilities and offers low voiding with minimal attention to profiling.

• Approvals / Conformance: Other
• Form / Shape: Paste
• Soldering Filler Alloys: Tin-Lead (Sn-Pb)

Description: applies to in-line components containing electronics grade materials in the gaseous form, such as those used in semiconductor gas distribution systems. 1.3 Limitations: 1.3.1 This test method is limited by the sensitivity of current instrumentation, as well as by the response

Description: method applies to in-line components containing electronics grade materials in the gaseous form, such as those used in semiconductor gas distribution systems. 1.3 Limitations: 1.3.1 This test method is limited by the sensitivity of current instrumentation, as well as by the

Description: CORI-FLOW™ instruments can be applied for both gases and liquids in process fluid measurement or control systems in semiconductor processing, in fuel cell technology, in food, (petro-) chemical and pharmaceutical industries or analytical installations (e.g. GC, HPLC or SFC systems

• Mass Flow Rate: 7.35E-4 to 1.1 lbs/min
• Electrical Output: Analog Current, Analog Voltage
• End Fittings: Compression
• Features: Measures Density, Measures Temperature, Controller Functions

Description: , SMQ®51-SC is designed for reflow in a forming gas or nitrogen atmosphere at less than 100ppm O2. This product has superior wetting capabilities and offers low voiding with minimal attention to profiling

• Approvals / Conformance: Other
• Form / Shape: Paste
• Soldering Filler Alloys: Tin-Lead (Sn-Pb)

Description: method applies to in-line components containing electronics grade materials in the gaseous form, such as those used in semiconductor gas distribution systems. 1.3 Limitations: 1.3.1 This test method is limited by the sensitivity of current instrumentation, as well as by the

Description: alloys, Indium9.72-HF is designed for refl ow in a forming gas or nitrogen atmosphere at less than 100ppm O2. This product has superior wetting capabilities and offers low voiding with minimal attention to profi ling.

• Form / Shape: Paste
• Soldering Filler Alloys: Tin-Lead (Sn-Pb), Other

Description: reproducible errors. The pressure value can be read via the interface and at the same time it is also available in analog form as a 4…20 mA or 0…10 V versions.

• Accuracy: 0.2000 to 0.5000 ±% FS
• Electrical Output: Analog Voltage, Analog Current
• Features: Temperature Compensation
• Media: Liquid, Gas

Description: Applications: Chemical and Pharmaceutical Processing Solvent Recovery Forming Crystallization Dry Etching Sputtering Vapor Recovery Features: Patented variable pitch rotor design reduces power

• Applications: General Purpose / Industrial, Chemical / Corrosive Gas, Manufacturing Processing, Medical / Laboratory, Pharmaceutical / Sanitary, Semiconductor Manufacturing
• Configuration: Individual Vacuum Pump
• Lubrication Style: Dry / Oil-less
• Mechanical Pump Type: Rotary Screw

Description: both chemistry and equipment. Applications Base and precious metals plating Copper flash plate, panel plate, pattern plate Developing, etching, stripping Chemical cleaning MP100 Advantages Edge-to-edge processing forms a

Description: Heating Nitrogen is a critical process, which requires a heater of minimal Watt Density (WSI), less than 25 watts/square inch is required to heat Nitrogen safely. All Infinity CRES-SFC Heaters provide the necessary WSI to safely heat all forms of gases. Units which use WSI higher than

• AC Voltage Required: 120 to 480 volts
• Applications: Drying, Gases / Vapors, Clean Water Heating, Process Waters, High Purity Waters
• Fuel / Energy Source: Electric
• Heating Capacity: 0.2500 to 10 kW

Description: and gases in almost any diameter and a single or two-ply cross section with 2 to 13 convolutions. Leakage rates for split style Multi-Convolution Seals are improved by incorporating a Non-Welded Slip Joint Cover in flange applications that experience large radial growth due to thermal

• Application / Industry: Aerospace, Chemical & Processing, Piping and Valves, Power Generation, Oil & Gas, MIL-SPEC, Nuclear, Semiconductor, Specialized
• Cryogenic Application: Yes
• Material: Nickel / Nickel-Based Alloy, Stainless Steel, Specialized or Other
• Material Features: Heat-Treated, Plated / Coated

Description: /Coating Options: Silver (AMS 2410, 2411) Nickel (AMS 2403, 2424, QQ-N-290) Gold (Mil-G 45204) Please call for pricing and availability or fill out the Application Data Sheet (PDF) and Quote Request Form. Telephone: (800) 644.5660 Local Number: (509) 467.9133

• Application / Industry: Aerospace, Chemical & Processing, Piping and Valves, Power Generation, Oil & Gas, MIL-SPEC, Nuclear, Semiconductor, Specialized
• Cryogenic Application: Yes
• Material: Nickel / Nickel-Based Alloy, Specialized or Other
• Material Features: Heat-Treated, Plated / Coated

Description: : Silver (AMS 2410, 2411) Tin (ASTM B545) Nickel (AMS 2403, 2424, QQ-N-290) Gold (Mil-G 45204) Teflon (AMS 2515) Plasma/HVOF wear coatings Please call for pricing and availability or fill out the Application Data Sheet (PDF) and Quote Request Form. Telephone: (800) 644.5660 Local Number:

• Application / Industry: Aerospace, Chemical & Processing, Piping and Valves, Power Generation, Oil & Gas, MIL-SPEC, Nuclear, Semiconductor, Specialized
• Cryogenic Application: Yes
• Material: Nickel / Nickel-Based Alloy, Specialized or Other
• Material Features: Heat-Treated, Plated / Coated

Description: : Aerospace equipment, Semiconductors, Cryogenics, Engines, Nuclear instruments, Heat exchangers, Reactors, Hot Runners, Oil & Gas, Flow meters, Chemical fibers, Food & Medicine equipment etc. Specifications: Working temperature: -270°C ~ +800°C

• Application / Industry: Aerospace, Chemical & Processing, Power Generation, Oil & Gas, MIL-SPEC, Nuclear, Semiconductor, Specialized
• Cryogenic Application: Yes
• Material: Aluminum, Copper, Nickel / Nickel-Based Alloy, Stainless Steel, Steel, Titanium, Specialized or Other
• Material Features: Heat-Treated, Plated / Coated

Description: . Applications: Aerospace equipment, Semiconductors, Cryogenics, Engines, Nuclear instruments, Heat exchangers, Reactors, Hot Runners, Oil & Gas, Flow meters, Chemical fibers, Food & Medicine equipment etc. Specifications: Working temperature: -270°C

• Application / Industry: Aerospace, Chemical & Processing, Power Generation, Oil & Gas, MIL-SPEC, Nuclear, Semiconductor, Specialized
• Cryogenic Application: Yes
• Material: Aluminum, Copper, Nickel / Nickel-Based Alloy, Stainless Steel, Steel, Titanium, Specialized or Other
• Material Features: Heat-Treated, Plated / Coated

Description: . Spring Energized Metal O-Ring seals can withstand significantly larger loads for rough surfaces and have a much lower leakage rate because of the spring inside the tube. Applications: Aerospace equipment, Semiconductors, Cryogenics, Engines, Nuclear instruments, Heat exchangers

• Application / Industry: Aerospace, Chemical & Processing, Power Generation, Oil & Gas, MIL-SPEC, Nuclear, Semiconductor, Specialized
• Cryogenic Application: Yes
• Material: Aluminum, Copper, Nickel / Nickel-Based Alloy, Stainless Steel, Steel, Titanium, Specialized or Other
• Material Features: Heat-Treated, Plated / Coated

Description: , gas, etc Leak Rate: 1E-10pa m³/s Dimensions: Outer diameters: 0.250" (6mm) to 177" (4500mm) Cross section: 1/32" (0.9mm) to 1/2"(12.7mm) Material & Form Options: Conventional

• Application / Industry: Aerospace, Chemical & Processing, Power Generation, Oil & Gas, MIL-SPEC, Nuclear, Semiconductor, Specialized
• Cryogenic Application: Yes
• Material: Aluminum, Copper, Nickel / Nickel-Based Alloy, Stainless Steel, Steel, Titanium, Specialized or Other
• Material Features: Heat-Treated, Plated / Coated

Description: Cryogenic vacuum pumps are pumps that form a vacuum by condensing or absorbing gases at extremely low temperatures. They are used as key facilities in semiconductor, display, space, quantum technology, and surface science fields that require "high vacuum (UHV) and ultra-high

• Applications: Other
• Configuration: Individual Vacuum Pump
• High / Ultrahigh Vacuum Type: Cryogenic / Cryosorption
• Pumping Speed: 2966 to 76280 CFM

Description: ) Nickel (AMS 2403, 2424, QQ-N-290) Gold (Mil-G 45204) Teflon (AMS 2515) Plasma/HVOF wear coatings Please call for pricing and availability or fill out the Application Data Sheet (PDF) and Quote Request Form. Telephone: (800) 644.5660 Local Number: (509) 467.9133

• Application / Industry: Aerospace, Chemical & Processing, Piping and Valves, Power Generation, Oil & Gas, MIL-SPEC, Nuclear, Semiconductor, Specialized
• Material: Nickel / Nickel-Based Alloy, Stainless Steel, Specialized or Other
• Material Features: Heat-Treated, Plated / Coated
• Outside Diameter: 0.9740 to 13.51 inch

Description: balance office. Our manufacturing capabilities include eyeleting, orbital and press riveting, hand soldering, resistance welding and ultrasonic welding. We also provide a wide variety of bench assembly such as gluing, staking, forming, etc. We do marking and decorating such as hot stamping

• Industry Served: General Industrial, General Consumer, Electronics / Semiconductor, Health and Beauty, Household Product, Medical / Surgical
• Location: North America, United States Only, Midwest US Only
• Packaging: Bagging, Blister / Clamshell Packing, Custom Hand Assembly, Labeling / Relabeling, Repackaging, Shrink / Skin Wrapping
• Services: Assembly Services, Package Testing, Package Design Services

Description: eliminate air or gas during start-up. The electronic control function forms part of the normal circuitry in the meter. Alternatively the liquid flow can be controlled using a close-coupled pump.

• Accuracy: 1 ±% FS
• Control Signal Output: Analog Voltage, Current Loop, Serial / Digital, Other
• Control Technique: PID Control
• Controller Inputs: DC Voltage Input

Description: eliminate air or gas during start-up. The electronic control function forms part of the normal circuitry in the meter. Alternatively the liquid flow can be controlled using a close-coupled pump.

• Mass Flow Rate: 7.35E-5 to 0.0367 lbs/min
• Electrical Output: Analog Current, Analog Voltage
• End Fittings: Compression, Threaded
• Features: Controller Functions, Recorder / Totalizer Functions

Description: eliminate air or gas during start-up. The electronic control function forms part of the normal circuitry in the meter. Alternatively the liquid flow can be controlled using a close-coupled pump.

• Mass Flow Rate: 9.19E-6 to 0.0037 lbs/min
• Electrical Output: Analog Current, Analog Voltage
• End Fittings: Compression, Threaded
• Features: Controller Functions, Recorder / Totalizer Functions

Description: Electrostatic chuck has the function of normal use in vacuum atmosphere, and plays the role of holding and temperature control of wafer in high vacuum plasma or special gas environment, assisting semiconductor process equipment to realize the change of electrical characteristics and

• Application: Wafer Chuck
• Chuck Geometry: Round
• Materials of Construction: Ceramic, Other
• Number of Jaws: None / NA

Description: microorganisms are blocked in the filtration. The surface of the media or the inside is well filtered. After a period of use, the porous ceramic filter material is backwashed with gas or liquid to restore the original filtration capacity. Application Semiconductor Industry - Wafer

• Application: Wafer Chuck
• Chuck Geometry: Round
• Diameter: 4 to 12 inch
• Materials of Construction: Ceramic

Description: high vacuum environment, and have excellent corrosion resistance and resistance. Therefore, BN ceramic products are the ideal choice for many industries, such as: Crucible for smelting semiconductors; High temperature vessels for metallurgy; Semiconductor heat dissipation

• Applications: Electrical / HV Parts
• Coeff. of Thermal Expansion (CTE): 2 µm/m-C
• Material Type: Boron Nitride, Specialty Ceramic
• Thermal Conductivity: 33 W/m-K

Description: ; Semiconductor heat dissipation and insulation parts; High temperature bearings; Thermowell; Glass forming mold. Boron Nitride (HBN) Basic Information High heat resistance: sublimation at 3000°C; at 1800°C, its strength is twice

• Applications: Electrical / HV Parts
• Coeff. of Thermal Expansion (CTE): 2 µm/m-C
• Material Type: Boron Nitride, Specialty Ceramic
• Shape / Form: Rod Stock

Description: metallurgy; Semiconductor heat dissipation and insulation parts; High temperature bearings; Thermowell; Glass forming mold. Boron Nitride (HBN) Basic Information High heat resistance: sublimation at 3000°C; at 1800°C,

• Applications: Electrical / HV Parts
• Coeff. of Thermal Expansion (CTE): 2 µm/m-C
• Material Type: Boron Nitride, Specialty Ceramic
• Shape / Form: Spout /  Nozzle (Launder Pouring / Atomization)

Description: in high vacuum environment, and have excellent corrosion resistance and resistance. Therefore, BN ceramic products are the ideal choice for many industries, such as: Crucible for smelting semiconductors; High temperature vessels for metallurgy; Semiconductor heat

• Applications: Electrical / HV Parts
• Coeff. of Thermal Expansion (CTE): 2 µm/m-C
• Material Type: Boron Nitride, Specialty Ceramic
• Thermal Conductivity: 33 W/m-K

Description: Raw materials are FDA and USP Class VI compliant REACH and RoHS compliant PTFE is free of BPA, phthalates and latex FEP and PFA are free of conflict minerals Ultra-high-purity grades available for the semiconductor industry (FEP and PFA only

• Application: Chemical, Cryogenic, Food Processing / Beverage, Water
• Material Choices: Plastic Tubing
• Maximum Inside Diameter / Size: 0.0310 inch
• Minimum Bend Radius: 0.5000 inch

Description: , corrosion resistance, wear resistance, insulation and other properties. It can be used in high temperature, vacuum and corrosive gas environment for a long time, and is widely used in various semiconductor production equipment. The ceramic arm produced by our company is made of

• Material Type: Alumina / Aluminum Oxide

Description: intervals in the vertical direction and exposing the wafer's surfaces to high temperature gases in a furnace, usually to form an oxide film on these surfaces or to deposit certain atoms therein. To maximize the amount of surface area exposed to the heat treatment, the wafers are

• Compressive / Crushing Strength: 290074 psi
• Density: 6 g/cc
• Material Type: Zirconia, Specialty Ceramic

Description: applications such as aviation, aerospace, automotive, energy (gas, oil and wind), precision optics, bearings, semiconductors and medical devices. Precision motion comes in many forms and applications, each with their own set of pertinent specifications. Because the diversity of

• Drive Specifications: Direct Drive, Handwheel/Crank, Micrometer
• Motor Specifications: DC Brushless Servo

Description: StudSeal™ hermetic terminal seals provide a secure barrier for high current or high voltage transfers in sealed environments. Our products are designed for high vacuum and pressure applications, including air conditioning and refrigeration compressors, semiconductor processing equipment

Description: StudSeal™ hermetic terminal seals provide a secure barrier for high current or high voltage transfers in sealed environments. Our products are designed for high vacuum and pressure applications, including air conditioning and refrigeration compressors, semiconductor processing equipment

Description: StudSeal™ hermetic terminal seals provide a secure barrier for high current or high voltage transfers in sealed environments. Our products are designed for high vacuum and pressure applications, including air conditioning and refrigeration compressors, semiconductor processing equipment

Description: highly responsive mass flow controller (MFC) is essential for performing control of reactive gas while monitoring changes in plasma emission. HORIBA STEC, enjoying the largest market share of MFC production for semiconductor manufacturing systems*, offers the best MFC for each system

Description: flakes and powders to suit many electronic applications. We are acknowledged as a leading supplier of precious metal flakes and powders to the global semiconductor die attach industry. Formulators can choose from a wide variety of our silver powders and flakes to ensure

• Shape / Form: Powder

Description: 1.1 This classification covers a system by which advanced ceramics may be classified. The system has been devised to cover all types of advanced ceramics in the forms of inorganic precursors for ceramic powder production, powders, granular forms, fibers, whiskers, platelets, single

Description: Automotive industry: crankshaft counterweights and chassis weights Watch industry: bobs on watch rotors Sports equipment: golf clubs Optical industry: microscopes and measuring instrument Oil and gas drilling: down hole logging tools High elasticity

• Weight Types: Balancing / Dynamic Balancing Weight, Counterweight / Counterbalance Weight