Silicone Heat Sinks

Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.

• Chemical / Polymer System Type: Silicone

Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.

• Chemical / Polymer System Type: Silicone

Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.

• Chemical / Polymer System Type: Silicone

Description: COMPOUND, SILICONE, HEAT SINK

Description: COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE

Description: Compound, Heat Sink, Silicone and/or Non-Silicone

Description: Compound, Silicone, Heat Sink

Description: KSC2040 is a thermally conductive silicone RTV adhesive rubber developed for heat sink applications. KSC2040 is a 1-part silicone that when applied to the substrate enables adhesion to parts and heat transfer of the bonded assembly within minutes. When cured, the

• Cure Type / Technology: Single Component System
• Industry: Electronics
• Substrate / Material Compatibility: Metal, Plastic
• Viscosity: Up to 600000 cP

Description: MG Chemicals 860 Silicone Heat Transfer Compound is a low thermal resistance grease with a silicone base. It is electrically insulating, non-corrosive and used to improve the thermal interface contact conductivity between heat sinks, LEDs, motors, and heat

• Chemistry / Constituents: Silicone

Description: Techspray Silicone Free Heat Sink Compound is used to cool thermistors, calrods, thermocouple wells, and other electrical components. It is non-ozone depleting, easy to apply, and will not harden, separate, or crack. 4 oz Tube.

• Chemical / Polymer System Type: Silicone
• Compound Type: Thermally Conductive
• Cure Type / Technology: Single Component System
• Thermal Conductivity: 0.7000 W/m-K

Description: HEAT SINK COMPOUND, SILICONE FREE, TUBE, 4OZ. FREE 2 YEAR RADWELL WARRANTY

Description: tungsten, copper tungsten has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make copper tungsten an excellent choice even for extremely dense circuits.

• Device: Passive Heat Sink
• Material: Copper, Mixed Material, Other Materials
• Mounting: Other
• Thermal Resistance: 0.5490 °C / W

Description: Pure white, soft consistency, heat sink paste with marked thermal conductivity. Electrically insulating. Application WACKER® SILICONE PASTE P 12 is used especially in semiconductor technology as a heat sink paste. Wherever it is important to have good heat

• Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
• Dielectric Constant (Relative Permittivity): 3.5
• Dielectric Strength: 254 kV/in
• Features: Electrical Insulation / Dielectric Material

Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when

• Cure Type / Technology: Single Component System
• Industry: Electronics
• Substrate / Material Compatibility: Plastic
• Viscosity: Up to 150000 cP

Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that

• Cure Type / Technology: Single Component System
• Industry: Electronics
• Substrate / Material Compatibility: Metal, Plastic
• Viscosity: 11000 to 14000 cP

Description: PCB's to substrates and for use as a thermal adhesive between electronic components and heat sinks. Product Benefits Easy to use, one-component material Thermally conductive Flame retardant Non-corrosive to most metals Low volatility

• Compound Type: Thermal Compound / Heat Conductive
• Industry: Electronics

Description: flowable almost constant properties between -40 °C and +180 °C primerless adhesion Application versatile interface material for heat sink applications for the electronics industry thermally conductive adhesive material applicable as thin interface layer between PCB and metal housings

• Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Elongation: 90 %
• Features: Electrical Insulation / Dielectric Material

Description: SEMICOSIL® 975 TC is a 1-part thermally conductive paste that is curing into self-adhesive gap filling silicone. The thermal paste is able to efficiently fill finest gaps of heat generating and ablating substrates and thus helps to minimize contact resistance. Thermal resistivity is

• Coeff. of Thermal Expansion (CTE): 8.33 µin/in-F
• Cure Type / Technology: Single Component System
• Dielectric Strength: 279 kV/in
• Elongation: 10 %

Description: The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K. ? Soft and elastic after curing, maintaining the required thickness and providing shock absorption. ?

• Compound Type: Thermal Compound / Heat Conductive
• Dielectric Constant (Relative Permittivity): 7.5
• Industry: Electronics
• Thermal Conductivity: 5 W/m-K

Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi. ? Minimum interface thickness can reach as

• Chemical / Polymer System Type: Starch
• Features: Thermal / Heat Conductive
• Industry: Electronics
• Thermal Conductivity: 1 W/m-K

Description: ThermaCool TF1860 series are thermally conductive silicone-coated fiberglass fabrics offering high temperature resistance and conformability as a low-cost heat sink gasket. The fiberglass fabric supports the silicone rubber and aids in dimensional stability and

• Features: Color Options
• Material: Foam, Silicone Rubber
• Operating Temperature: -79.6 F
• Thickness: 0.0075 to 0.0090 inch

Description: ThermaCool TF1870 series are thermally conductive, silicone-coated fabrics offering high temperature capability and conformability in a heat sink gasket. Fiberglass fabric supports the thermally conductive silicone rubber impregnation and adds dimensional stability and

• Features: Color Options
• Material: Foam, Silicone Rubber
• Operating Temperature: -79.6 F
• Thickness: 0.0071 to 0.0087 inch

Description: ThermaCool TF400 series are thermally conductive, silicone-coated fabrics offering high temperature capability and conformability in a heat sink gasket. Fiberglass fabric supports the thermally conductive silicone rubber impregnation and adds dimensional stability and

• Features: Color Options
• Material: Foam, Silicone Rubber
• Operating Temperature: -79.6 F
• Thickness: 0.0071 to 0.0087 inch

Description: ThermaCool TF1818 is a silicone-coated fabric offering high temperature capability and conformability in a heat sink gasket. Fiberglass fabric supports the thermally conductive silicone rubber impregnation and adds dimensional stability and cut-through resistance.

• Features: Color Options
• Material: Foam, Silicone Rubber
• Operating Temperature: -79.6 F
• Thickness: 0.0180 inch

Description: capability allows higher wattage levels Optional custom profiled heat density creates a uniform heat sink temperature which can improve processing yields High temperature capability to 235°C (455°F) Custom shapes and sizes to 22" x 90" (560 x 2285 mm) Custom

• AC Voltage Required: 115 volts
• Maximum Operating (Sheath) Temperature: -26 to 212 F
• Strip Length: 4 inch
• Strip Thickness: 0.0600 inch

Description: Birk's silicone rubber heaters are rugged, flexible and chemical-resistant. Our rugged flexible heaters can be combined with many components. Thermostats, fuses, thermocouples, RTDs, thermistors, connectors, heat sinks, wiring harnesses, motors and any other desired hardware are

Description: Dow DOWSIL™ 340 Heat Sink Compound White is a one component, non-curing, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, low bleed, thermally conductive, and has high temperature stability. 360 g

• Density / Specific Gravity (@15.6°C, 60°F): 2 specific gravity
• Kinematic Viscosity (@ 40°C): 542000 cSt
• Thermal Conductivity: 0.6700 W/m-K
• Type / Function: Lubricant

Description: Dow DOWSIL™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability. 142 g

• Compound Type: Thermally Conductive
• Cure Type / Technology: Single Component System
• Dielectric Strength: 210 kV/in
• Thermal Conductivity: 0.6700 W/m-K

Description: Dow DOWSIL™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability. 9 kg

• Compound Type: Thermally Conductive
• Cure Type / Technology: Single Component System
• Dielectric Strength: 210 kV/in
• Thermal Conductivity: 0.6700 W/m-K

Description: Base Material Al. Extrusion Base Color Black Fin Material Aluminum alloy Heat-pipe 2pcs F4mm Weight 122g (Heatsink Only) Dimension 131.1(L) x 76.5(W) x 9.6(H) mm Thermal conductive silicone rubber L37-5 (120 x 20 x 0.3t mm)

Description: /mK Two-part, RT curing Constant properties from –50 °C to +180 °C Low stress, soft and tacky D4-D8 < 350ppm Low abrasive Application Interface material for heat sink applications for the electronics industry

• Compound Type: Encapsulating / Potting
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
• Dielectric Strength: 203 kV/in
• Features: Electrical Insulation / Dielectric Material

Description: Aavid Thermalloy low profile heatsinks for use with TO-220 package through hole discrete semiconductors. Length = 20.96mm Width = 22.99mm Dimensions = 20.96 x 22.99 x 0.15mm Colour = Green, Grey Material = Silicone Series = 53

• Length: 20.96 mm
• Material: Other Materials
• Width: 22.99 mm

Description: Aavid Thermalloy low profile heatsinks for use with TO-218 package through hole discrete semiconductors. Length = 23.8mm Width = 19.05mm Dimensions = 23.8 x 19.05 x 0.15mm Colour = Green, Grey Material = Silicone Series = 53

• Length: 23.8 mm
• Material: Other Materials
• Width: 19.05 mm

Description: 50-1220 is a one component thermal grease. This heavy filled Heat Sink Compound promotes high thermal conductivity, low bleed, and high temperature stability.

• Chemical / Polymer System Type: Silicone
• Dielectric Constant: 5
• Dielectric Strength: 210 kV/in
• Electrical Resistivity: 2.00E15 ohm-cm

Description: Aavid Thermalloy In-Sil-8 series thermal interface pads provide thermal conductance and electrical isolation in one package. In-Sil-8 pads are silicone-based insulators that come with thermally conductive fillers to isolate up to 6000 volts AC. In-Sil-8 pads withstand the rigors of assembly

• Length: 17.27 mm
• Material: Other Materials
• Width: 14.22 mm

Description: -D14 outperforms virtually every other air cooler on the market, even besting Corsair's H50 water cooling system at idle! This enormous nickel-plated copper cooler features two pre-installed fans to whisk heat away from the aluminum fins, and Noctua even includes mounting screws and rubber

Description: Fin Material Aluminum alloy Weight 75g(Heatsink Only) Dimension 125(L) x 46(W) x 9.6(H) mm Thermal conductive silicone rubber L37-5 (120 x 20 x 0.3t mm)

Description: components, or between any surfaces where thermal conductivity or heat dissipation is important. It is ideal for application on the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers, semiconductors, thermostats, power resistors,

• Chemical / Polymer System Type: Silicone
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Grease / Paste
• Thermal Conductivity: 0.9000 W/m-K

Description: Silicone Rubber Heaters Silicone Rubber heaters have wire-wound or etched foil heating circuits laminated between thin layers of fiberglass-reinforce d, high-temperature insulation, silicone rubber. The thin profile transfers heat quickly because the actual resistance

• AC Voltage Required: 115 volts
• Length: 12 to 48 inch
• Maximum Operating (Sheath) Temperature: -70 to 450 F
• Sleeve (Sheath) Material: Rubber

Description: Silicone Rubber Heaters Silicone Rubber heaters have wire-wound or etched foil heating circuits laminated between thin layers of fiberglass-reinforce d, high-temperature insulation, silicone rubber. The thin profile transfers heat quickly because the actual resistance

• AC Voltage Required: 115 volts
• Maximum Operating (Sheath) Temperature: -70 to 450 F
• Sleeve (Sheath) Material: Rubber
• Watt Density: 2.5 to 10 W/in²

Description: BERGQUIST TGR 1500A, High Performance, Value Compound for High-End Computer Processors BERGQUIST® TGR 1500A is a high performance, thermally conductive compound intended for use as a thermal interface material between a high end computer processor and a heat sink. Other high watt

• Compound Type: Thermal Compound / Heat Conductive
• Thermal Conductivity: 1.5 W/m-K
• Use Temperature: 302 F

Description: LiPOLY’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped

• Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
• Compound Type: Thermal Compound / Heat Conductive
• Dielectric Strength: 381 kV/in
• Features: UL Approved

Description: easy application and rework. ? High compressibility, softness, and elasticity suitable for low-pressure applications. ? Low silicone oil bleed. ? Customizable shapes per client requirements. ? Compliant with RoHS, Halogen, REACH environmental and safety

• Dielectric Strength: 0.0025 kV/in
• Elongation: 10 %
• Features: Thermal / Heat Conductive
• Industry: Electronics

Description: force (e.g. dispensing or assembly process). The material is an excellent solution for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing. Once cured, it remains a low modulus elastomer designed to assist in relieving CTE

• Compound Type: Leveling / Filling Compound, Thermal Compound / Heat Conductive
• Thermal Conductivity: 3.6 W/m-K
• Use Temperature: 76 to 392 F

Description: line applications. Sarcon® SG-07NS and SG-26NS are non-silicone, polysynthetic-based thermal greases that have high thermal conductivity properties. Infused with heat-conductive metal oxides, this nonmigrating material operates consistently in high temperatures. Sarcon® non

• Chemical / Polymer System Type: Silicone
• Dielectric Strength: 386 kV/in
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Grease / Paste

Description: transfer from heat generating device to heat spreader or heat sink. FEATURES: Fill large gaps while providing superior thermal transfer. Conformable with very low compression forces. Excellent vibration absorption capabilities. Maintains all

• Chemical / Polymer System Type: Silicone
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Gap Filling Compound
• Thermal Conductivity: 5 W/m-K

Description: transfer from heat generating device to heat spreader or heat sink. FEATURES: Fill large gaps while providing superior thermal transfer. Conformable with very low compression forces. Excellent vibration absorption capabilities. Maintains all

• Chemical / Polymer System Type: Silicone
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Gap Filling Compound
• Thermal Conductivity: 2 W/m-K

Description: insulation and fiberglass materials increase the strength of its structure making it cut resistant. SH1500/2000/3000 is the best choice for high torque screw setting. It functions well with electrical isolative of high power electronic component and the heat sink.

• Applied Thickness / Gap Fill: 0.0091 to 0.0138 inch
• Compound Type: Thermal Compound / Heat Conductive
• Features: UL Approved
• Industry: Electronics

Description: stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUS is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices. Thermal conductivity: 1.0 W

• Chemical / Polymer System Type: Silicone
• Thermal Conductivity: 1 W/m-K
• Use Temperature: 76 to 392 F

Description: the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUSB is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices

• Chemical / Polymer System Type: Silicone
• Thermal Conductivity: 1 W/m-K
• Use Temperature: 76 to 392 F

Description: easy application and rework. ? High compressibility, softness, and elasticity suitable for low-pressure applications. ? Low silicone oil bleed. ? Customizable shapes per client requirements. ? Compliant with RoHS, Halogen, REACH environmental and safety

• Dielectric Strength: 0.0025 kV/in
• Elongation: 20 %
• Features: Thermal / Heat Conductive
• Industry: Electronics

Description: line applications. Sarcon® SG-07NS and SG-26NS are non-silicone, polysynthetic-based thermal greases that have high thermal conductivity properties. Infused with heat-conductive metal oxides, this nonmigrating material operates consistently in high temperatures. Sarcon® greases offer

• Chemical / Polymer System Type: Specialty / Other
• Dielectric Strength: 314 kV/in
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Grease / Paste

Description: The Chemtronics CircuitWorks heat sink grease is easy to use. This product is formulated to work in electrical equipment applications. Main ingredient is comprised of silicone. Is rated as Military Grade. Can be used under the following temperature ranges: -40 F minimum

• Applications / Function: MIL-SPEC / Military
• Type: Grease / Gel

Description: fiberglass materials increase the strength of its structure making it cut resistant. DCTP140-s is the best choice for high torque screw setting. It functions well with electrical isolative of high power electronic component and the heat sink.

• Applied Thickness / Gap Fill: 0.0098 to 0.0177 inch
• Compound Type: Thermal Compound / Heat Conductive
• Dielectric Strength: 4 to 6 kV/in
• Features: Electrical Insulation / Dielectric Material, Laminating / Composites, UL Approved

Description: (Known as E&C STYCAST 5952 A/B thermally conductive silicone encapsulant ) LOCTITE STYCAST 5952 RD PTA is a filled, addition cured, silicone encapsulant. It features good thermal conductivity, excellent electrical insulation properties. It was designed for encapsulating heat

• Industry: Electronics
• Use: Encapsulant / Potting Compound

Description: Silicone Heat Sink Compound

Description: LiPOLY’s ST6000 is a UL thermally conductive tape with high-temperature heat resistance. The thermal conductivity is 1.8W/m*K. The stickiness and strength of the thermal tape will increase when temperatures and pressure rise. They are designed to securely bond heat sinks to

• Backing: Rubber, Silicone
• Temperature Resistance: -60 to 170 C
• Thickness: 0.0079 inches

Description: Heat sink grease gives excellent thermal conductivity. Will not dry out, harden or melt. Maximises heat transfer between circuit components & heat sinks Thermal Conductivity = 0.63W/m·K Material = Silicone Maximum Operating Temperature = +200°C Minimum

• Chemical / Polymer System Type: Silicone
• Material Type: Grease / Paste
• Thermal Conductivity: 0.6300 W/m-K
• Use Temperature: -99.4 to 392 F