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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum ,
- Coeff. of Thermal Expansion (CTE): 17.22 to 87.78 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Thermal / Heat Conductive
- Industry: Electronics, Photonics / Optoelectronics, Semiconductors / IC Packaging
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Description: Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive
- Industry: Semiconductors / IC Packaging
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Description: Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire drawing problems, greatly saving production costs and waste. It is suitable for automatic adhesive dispensing, with excellent
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive
- Industry: Semiconductors / IC Packaging
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Description: Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive
- Industry: Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Two part Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the assembly ofnon heat cure products and can be used for repair work in the field. It also has a convenient 1:1 mix ratio.
- Coeff. of Thermal Expansion (CTE): 38.89 to 139 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production
- Coeff. of Thermal Expansion (CTE): 22.22 to 55.56 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Flexible / Dampening, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachsuch as RFID isotropic applications and can be dispensed, printed or pin transferred. It offers fast in-line cure at low temperature. One part
- Coeff. of Thermal Expansion (CTE): 22.22 to 66.67 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: A silver filled, fast curing, solvent-free, single component electroconductive adhesive with a high silver content for LED applications. It has a pot life of 2 days and its rheology is well suited to application by microdispenser. It exhibits an excellent thermal stability and a
- Coeff. of Thermal Expansion (CTE): 27.78 to 94.44 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Techsil Limited
Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive, Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum ,
- Coeff. of Thermal Expansion (CTE): 21.67 to 124 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Aerospace, Electronics
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Supplier: Techsil Limited
Description: Elecolit® 3653 is a 1 component silver filled, solvent-free conductive epoxy adhesive used in applications which are subject to vibrations or quick temperature fluctuations. This unique product can be cured thermally in a very short period of time and cures to a 60 - 75
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Epoxy Technology
Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system.
- Coeff. of Thermal Expansion (CTE): 17.22 to 87.78 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled
- Industry: Aerospace, Electronics, Medical / Food (Sanitary / FDA), Photonics / Optoelectronics
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Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum ,
- Coeff. of Thermal Expansion (CTE): 26.11 to 110 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Photonics / Optoelectronics
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 360 to 450 kV/in
- Dissimilar Substrates: Yes
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of two part silver conductive epoxy systems, the
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Filled, Thermal / Heat Conductive
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Rubber / Elastomer, Other
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Supplier: Techsil Limited
Description: MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive, Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Techsil Limited
Description: MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive, Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Materion Corporation
Description: Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength.
- Cure Type / Technology: Two Component System
- Features: Electrically Conductive
- Industry: Electronics
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Supplier: SAE International
Description: This specification covers an electrically-conduct ive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 360 to 450 kV/in
- Dissimilar Substrates: Yes
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 64C, Epoxy, Assembly LOCTITE® ABLESTIK 64C non-silver, electrically conductive adhesive is designed for a wide variety of applications. It is special recommended for use where exposure to sea water causes silver based electrically conductive
- Cure Type / Technology: Two Component System
- Use Temperature: 67 to 266 F
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11™ has been developed based on advanced proprietary technology that requires 15% or less
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 77 to 302 F
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Supplier: Master Bond, Inc.
Description: . This easy to handle two part silver conductive epoxy has a one-to-one mix ratio, by weight or volume. It readily develops a high bonding strength of more than 1,500 psi tensile shear and a T-peel of greater than 30 pli when cured and measured at 75°F. It is 100% reactive and
- Coeff. of Thermal Expansion (CTE): 39 to 50 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 360 to 450 kV/in
- Dissimilar Substrates: Yes
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-HTNS™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS™ is developed
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 302 to 356 F
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-FXNS™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS™ is developed based on advanced proprietary
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Flexible / Dampening
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 302 F
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-FXSG™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG™ is well suited for bonding of dissimilar
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Flexible / Dampening
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 77 to 320 F
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Supplier: Accuris
Description: ADHESIVE, EPOXY, SILVER FILLED, CONDUCTIVE
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 967-1, Epoxy, Die attach LOCTITE® ABLESTIK 967-1 adhesive is designed for applications which require lower-than-normal cure temperatures. Low temperature cure, electrically conductive paste with reduced risk to delicate components and increase manufacturing
- Cure Type / Technology: Two Component System
- Viscosity: 14000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 83CJ, Epoxy, Assembly LOCTITE® ABLESTIK 83CJ adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics at locations which cannot be subjected to high temperatures. LOCTITE
- Cure Type / Technology: Two Component System
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 2958, Epoxy, Bonding or Sealing LOCTITE® ABLESTIK 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications that require superior
- Cure Type / Technology: Two Component System
- Use Temperature: 76 to 347 F
- Viscosity: 40000 cP
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Supplier: Accuris
Description: Adhesive, Electrically Conductive Silver-Filled Epoxy Resin
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Supplier: Epoxies Etc...
Description: 40-3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm. 40-3900 is also well known for
- Coeff. of Thermal Expansion (CTE): 13.89 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Features: Electrically Conductive, Filled
- Industry: Electronics, Optical Grade / Material, Photonics / Optoelectronics
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Supplier: Ellsworth Adhesives
Description: ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity.
- Cure Type / Technology: Two Component System
- Elongation: 20 to 30 %
- Features: Thermal / Heat Conductive
- Tensile Strength (Break): 450 psi
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Supplier: Ellsworth Adhesives
Description: ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. 4 g
- Cure Type / Technology: Two Component System
- Elongation: 20 to 30 %
- Features: Thermal / Heat Conductive
- Tensile Strength (Break): 450 psi
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Supplier: Materion Corporation
Description: Silvertech PT-1™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder
- Cure Type / Technology: Two Component System
- Features: Electrically Conductive
- Industry: Electronics
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 3888 is a room temperature cure epoxy adhesive designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required. 2.5 g Packet.
- Compound Type: Electrically Conductive, Thermally Conductive
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 1.5 W/m-K
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Supplier: DigiKey
Description: SILVER CONDUCTIVE EPOXY, 10 MIN.
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Supplier: ThreeBond International, Inc.
Description: conductive filler. They are used to connect various electrical contacts and for conduction. Silver, nickel, carbon, etc. are used as the electro-conductive fillers, and epoxy resin, urethane resin, silicone resin, and synthetic rubber are used as binders. With different
- Features: Electrically Conductive
- Industry: Automotive, Electronics
- Substrate / Material Compatibility: Rubber / Elastomer
- Viscosity: 25000 cP
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Supplier: Accuris
Description: ADHESIVE, ELECTRICALLY CONDUCTIVE SILVER-FILLED EPOXY RESIN (STABILIZED TYPE)
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Supplier: SAE International
Description: This specification covers an electrically-conduct ive adhesive supplied as two components; a paste of silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
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Supplier: DigiKey
Description: SILVER CONDUCTIVE EPOXY, 4 HR PO
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Supplier: DigiKey
Description: SILVER CONDUCTIVE EPOXY, 4 HR PO
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 2902 Silver is a two component, room temperature curing epoxy adhesive. It is thermally and electrically conductive, solvent-free, and has good adhesion to a variety of substrates. 2.65 g Kit.
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 2.99 W/m-K
- Viscosity: 20000 cP
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Supplier: DigiKey
Description: SILVER CONDUCTIVE EPOXY 120G
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Featured Products Top
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Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards Master Bond EP77M-FMed is a two part epoxy adhesive and sealant designed for use in the assembly of medical devices. It meets the ISO 10993-5 requirements and is not considered to have a (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
electrical systems, threatening spacecraft integrity and crew safety. This case study explores how Master Bond EP21TDCS-LO, a two-component, silver-filled epoxy, met demanding requirements in two real-world space-environment applications (read more)
Browse Conductive Compounds Datasheets for Master Bond, Inc. -
Supreme 11AOHTLP Product Information Two component, thermally conductive, electrically insulative epoxy for bonding, sealing and coating Key Features Convenient (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
of robots demand enhanced heat dissipation, protection, and operational stability. Thermal conductive potting adhesives, which combine thermal conductivity, electrical insulation, and structural encapsulation, have become an indispensable thermal management solution in modules such as robotic (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
EP21TCHT-1 Two component epoxy compound for high performance bonding and sealing challenging bonding applications, elevated temperature cures are not possible. In order to overcome this deficiency, Master Bond (read more)
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Supreme 12AOHT-LO Product Information One part, thermally conductive, electrically insulating, high performance epoxy for bonding and sealing; meets NASA low outgassing specifications Master Bond Supreme 12 (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
include FR-4, which is inherently halogen-free. Other halogen-free substrate options include polyimide (PI) and PTFE-based materials. Conductive Traces: The conductive traces on a PCB are typically made of copper, which is an excellent conductor of electricity. Copper (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd.
Conduct Research Top
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Silver Filled, Electrically Conductive Adhesives
In the realm of electrically conductive epoxies and silicone, there is nothing like silver. Not only does silver have very high electrical conductivity, it also retains its low resistance over many years, even decades. This is much more desirable than other metals that are highly conductive
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Conductive Adhesives for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging (.pdf)
This paper discusses silver filled and boron nitride filled epoxies for heat-sinking and thermal transfer. Case studies of thermal resistance calculations have been presented with comparisons made against eutectic die-attach.
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:: New Materials Zone ::
Home Adhesives (Structural) Silver conductive epoxy adhesive has rapid set up time .
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Master Bond contact details and news
Silver conductive epoxy adhesive seets stringent NASA low outgassing standards .
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Polymer‐Based Magnetoelectric Materials
Composites were prepared by bonding a Gd crystal plate to the P(VDF-TrFE) with a silver conductive adhesive epoxy to ensure a good thermal contact between the layers.
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:: New Materials Zone ::
Home Adhesives (Structural) Silver conductive epoxy adhesive seets stringent NASA low outgassing standards .
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Carbonized electrospun polyacrylonitrile nanofibers as highly sensitive sensors in structural health monitoring of composite structures
After sanding off the surface, a sil- ver conductive epoxy adhesive was applied in order to avoid contact resistance.
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Fast and Efficient Fabrication of Intrinsically Stretchable Multilayer Circuit Boards by Wax Pattern Assisted Filtration
Silver epoxy (8330S Silver Conductive Epoxy Adhesive , MGchemicals) was diluted in ethanol (400 µL epoxy, 100 µL ethanol) and stencil printed through the PMMA mask to create the contact pads.
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Biomimetic and Biohybrid Systems
Then we apply a thin layer of highly conductive epoxy - approx 0.5 mm thickness (8331 Silver Conductive Epoxy Adhesive manufactured by MGChemicals) that yields a 0.017 Ωcm and it cures in a few hours.
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Biodegradable Materials for Multilayer Transient Printed Circuit Boards
[33] MG Chemicals, 8331 Silver Conductive Epoxy Adhesive , http://www. mgchemicals.com/products/adhesives/electrically-conductive/ silver-conductive-epoxy-8331/.
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Drawing the electric
'MG Chemical, 8331 Silver Conductive Epoxy Adhesive : Moderate Cure .
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Preparation and optical properties of a poly(N-vinylcarbazole) material
Wire (500-mm diameter) leads were attached to the ITO electrodes as shown in Fig. 2 by the use of conducting silver epoxy adhesive purchased from Epoxy Technology, Inc.