Products & Services
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver
- Use Temperature: -452 to 250 F
- Thermal Conductivity: 1.585 W/m-K
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Tensile Strength (Break): 6,000 to 6,500 psi
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Supplier: Newark, An Avnet Company
Description: Silver Conductive Epoxy Adhesive / 0.52 oz Syringes
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Supplier: Newark, An Avnet Company
Description: Silver Conductive Epoxy Adhesive / 5.72 oz tub kit
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Supplier: Epoxy Technology
Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and
- Viscosity: 800 to 1,600 cP
- Use Temperature: 482 F
- Thermal Conductivity: 1.4 W/m-K
- Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 83.33333333333333 µin/in-F
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of two part silver conductive epoxy systems, the
- Use Temperature: -452.47 to 257 F
- Thermal Conductivity: 1.442279 W/m-K
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Rubber / Elastomer
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Supplier: Accuris
Description: ADHESIVE, EPOXY, SILVER FILLED, CONDUCTIVE
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production
- Viscosity: 2,000 cP
- Thermal Conductivity: 2.5 to 3 W/m-K
- Coeff. of Thermal Expansion (CTE): 22.22222222222222 to 55.55555555555556 µin/in-F
- Substrate Compatibility: Ceramic / Glass, Metal
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Supplier: Epoxy Technology
Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and
- Viscosity: 25,000 to 45,000 cP
- Use Temperature: 482 F
- Thermal Conductivity: 2.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 51.99999999999999 to 88.99999999999999 µin/in-F
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Supplier: Allied Electronics, Inc.
Description: Cyanoacrylate Adhesive, 1.05 @ 75 ºF Specific Gravity Conductive Epoxy, Silver Epoxy Resin, Mild Odor Conductive Silver Epoxy Provides Excellent Electrical and Thermal Conductivity High Strength Conductive Bonding Repairs Defective
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Supplier: Accuris
Description: Adhesive, Electrically Conductive Silver-Filled Epoxy Resin
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Supplier: Accuris
Description: ADHESIVE, ELECTRICALLY CONDUCTIVE SILVER-FILLED EPOXY RESIN (STABILIZED TYPE)
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Supplier: Epoxy Technology
Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and
- Viscosity: 1,800 to 3,600 cP
- Use Temperature: -67 to 572 F
- Thermal Conductivity: 12.6 to 26.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 21.11111111111111 to 52.22222222222222 µin/in-F
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Supplier: SAE International
Description: This specification covers an electrically-conductive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
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Description: Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive
- Features: Electrically Conductive, Epoxy (EP), Silicone, Specialty / Other
- Industry: Semiconductors / IC Packaging
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Supplier: Epoxy Technology
Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and
- Viscosity: 12,000 to 20,000 cP
- Use Temperature: 662 F
- Thermal Conductivity: 0.9 W/m-K
- Coeff. of Thermal Expansion (CTE): 21.666666666666668 to 124.44444444444444 µin/in-F
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Supplier: Allied Electronics, Inc.
Description: Epoxy; Electrically Conductive; 2 part;silver; 1 lb liquid
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Supplier: Allied Electronics, Inc.
Description: effective heat sink adhesive. This Conductive Silver Epoxy comes in two 7g syringes. Epoxy electrically conductive adhesive with reaction product of epichlorohydrin and bisphenol F, silver chemical component.
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Supplier: Allied Electronics, Inc.
Description: CircuitWorks Conductive Epoxy is a two part, silver epoxy used in prototype, repair and general conductive bonding applications. CW2400 features strong mechanical gbonds, excellent electrical conductivity, and quick room temperature curing. CircuitWorks Condcutive
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Supplier: Techsil Limited
Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and
- Features: Electrically Conductive, Epoxy (EP), Thermal / Heat Conductive
- Industry: Electronics
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in
- Features: Electrically Conductive, Epoxy (EP), Thermal / Heat Conductive
- Industry: Electronics
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in
- Features: Electrically Conductive, Epoxy (EP), Thermal / Heat Conductive
- Industry: Electronics
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-SG™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG™ is formulated with proprietary nanomaterials and fillers. G6E-SG™
- Viscosity: 110,000 to 120,000 cP
- Use Temperature: 77 to 302 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Grease / Paste, Other, Specialty / Other
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Supplier: Ellsworth Adhesives
Description: ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. 4 g
- Viscosity: 29,500 to 582,000 cP
- Thermal Conductivity: 4.65 W/m-K
- Tensile Strength (Break): 450 psi
- Elongation: 20 to 30 %
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Supplier: Techsil Limited
Description: MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used
- Features: Electrically Conductive, Epoxy (EP), Thermal / Heat Conductive
- Industry: Electronics
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver
- Use Temperature: -452 to 275 F
- Thermal Conductivity: 1.585 W/m-K
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Tensile Strength (Break): 6,000 to 6,500 psi
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11™ has been developed based on advanced proprietary technology that requires 15% or less
- Viscosity: 80,000 to 85,000 cP
- Use Temperature: 77 to 302 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Grease / Paste, Other, Specialty / Other
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Supplier: Master Bond, Inc.
Description: easy to handle two part silver conductive epoxy has a one-to-one mix ratio, by weight or volume. It readily develops a high bonding strength of more than 1,500 psi tensile shear and a T-peel of greater than 30 pli when cured and measured at 75°F. It is 100% reactive and does not
- Use Temperature: -452 to 250 F
- Thermal Conductivity: 1.585 W/m-K
- Coeff. of Thermal Expansion (CTE): 39 to 50 µin/in-F
- Tensile Strength (Break): 6,000 psi
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Supplier: Graphene Laboratories, Inc.
Description: technology that utilizes 20% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. G6E-HTNS™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. A heating oven is required for curing. Uses
- Viscosity: 220,000 to 230,000 cP
- Use Temperature: 302 to 356 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Grease / Paste, Other, Specialty / Other
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 2902 Silver is a two component, room temperature curing epoxy adhesive. It is thermally and electrically conductive, solvent-free, and has good adhesion to a variety of substrates. 2.65 g Kit.
- Viscosity: 20,000 cP
- Thermal Conductivity: 2.99 W/m-K
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Ellsworth Adhesives
Description: ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity.
- Viscosity: 29,500 to 582,000 cP
- Thermal Conductivity: 4.65 W/m-K
- Tensile Strength (Break): 450 psi
- Elongation: 20 to 30 %
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-FXNS™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS™ is developed based on advanced proprietary technology that requires
- Viscosity: 210,000 to 220,000 cP
- Use Temperature: 302 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Flexible / Dampening, Grease / Paste, Other, Specialty / Other
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Supplier: Newark, An Avnet Company
Description: Silver Conductive Epoxy, 10 min. Pot Life, High Conductivity
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 56C Silver, formerly Emerson and Cuming ECCOBOND, is two component, heat curing, epoxy adhesive resin that is used to replace hot soldering for electrical connections. It offers high strength bonds, non-flowing properties, long pot life, high thermal
- Viscosity: 35 to 60 cP
- Thermal Conductivity: 3 W/m-K
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Industrial Adhesives - 3M CircuitWorks Conductive Adhesive - Silver 7 g Syringe - CW2400 - -- CW2400Supplier: R. S. Hughes Company, Inc.
Description: 3M CircuitWorks silver conductive adhesive. Minimum to maximum operating temperatures are -131 F to +212 F.
- Use Temperature: -131 to 212 F
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Supplier: Materion Corporation
Description: Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength.
- Features: Die Bonding Adhesive / Compound, Electrically Conductive, Epoxy (EP), Powder, Specialty / Other
- Industry: Electronics
- Cure / Technology: Two Component System
Find Suppliers by Category Top
Featured Products Top
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Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards Master Bond EP77M-FMed is a two part epoxy adhesive and sealant designed for use in the assembly of medical devices. It meets the ISO 10993-5 requirements and is not considered to have a (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
electrical systems, threatening spacecraft integrity and crew safety. This case study explores how Master Bond EP21TDCS-LO, a two-component, silver-filled epoxy, met demanding requirements in two real-world space-environment applications (read more)
Browse Conductive Compounds Datasheets for Master Bond, Inc. -
Supreme 11AOHTLP Product Information Two component, thermally conductive, electrically insulative epoxy for bonding, sealing and coating Key Features Convenient (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
of robots demand enhanced heat dissipation, protection, and operational stability. Thermal conductive potting adhesives, which combine thermal conductivity, electrical insulation, and structural encapsulation, have become an indispensable thermal management solution in modules such as robotic (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
EP21TCHT-1 Two component epoxy compound for high performance bonding and sealing challenging bonding applications, elevated temperature cures are not possible. In order to overcome this deficiency, Master Bond (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Supreme 12AOHT-LO Product Information One part, thermally conductive, electrically insulating, high performance epoxy for bonding and sealing; meets NASA low outgassing specifications Master Bond Supreme 12 (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
include FR-4, which is inherently halogen-free. Other halogen-free substrate options include polyimide (PI) and PTFE-based materials. Conductive Traces: The conductive traces on a PCB are typically made of copper, which is an excellent conductor of electricity. Copper (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd.
Conduct Research Top
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Silver Filled, Electrically Conductive Adhesives
In the realm of electrically conductive epoxies and silicone, there is nothing like silver. Not only does silver have very high electrical conductivity, it also retains its low resistance over many years, even decades. This is much more desirable than other metals that are highly conductive
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Conductive Adhesives for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging (.pdf)
This paper discusses silver filled and boron nitride filled epoxies for heat-sinking and thermal transfer. Case studies of thermal resistance calculations have been presented with comparisons made against eutectic die-attach.
More Information Top
Indicates content that may require registration and/or purchase.
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:: New Materials Zone ::
Home Adhesives (Structural) Silver conductive epoxy adhesive has rapid set up time .
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Master Bond contact details and news
Silver conductive epoxy adhesive seets stringent NASA low outgassing standards .
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Polymer‐Based Magnetoelectric Materials
Composites were prepared by bonding a Gd crystal plate to the P(VDF-TrFE) with a silver conductive adhesive epoxy to ensure a good thermal contact between the layers.
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:: New Materials Zone ::
Home Adhesives (Structural) Silver conductive epoxy adhesive seets stringent NASA low outgassing standards .
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Carbonized electrospun polyacrylonitrile nanofibers as highly sensitive sensors in structural health monitoring of composite structures
After sanding off the surface, a sil- ver conductive epoxy adhesive was applied in order to avoid contact resistance.
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Fast and Efficient Fabrication of Intrinsically Stretchable Multilayer Circuit Boards by Wax Pattern Assisted Filtration
Silver epoxy (8330S Silver Conductive Epoxy Adhesive , MGchemicals) was diluted in ethanol (400 µL epoxy, 100 µL ethanol) and stencil printed through the PMMA mask to create the contact pads.
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Biomimetic and Biohybrid Systems
Then we apply a thin layer of highly conductive epoxy - approx 0.5 mm thickness (8331 Silver Conductive Epoxy Adhesive manufactured by MGChemicals) that yields a 0.017 Ωcm and it cures in a few hours.
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Biodegradable Materials for Multilayer Transient Printed Circuit Boards
[33] MG Chemicals, 8331 Silver Conductive Epoxy Adhesive , http://www. mgchemicals.com/products/adhesives/electrically-conductive/ silver-conductive-epoxy-8331/.
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Drawing the electric
'MG Chemical, 8331 Silver Conductive Epoxy Adhesive : Moderate Cure .
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Preparation and optical properties of a poly(N-vinylcarbazole) material
Wire (500-mm diameter) leads were attached to the ITO electrodes as shown in Fig. 2 by the use of conducting silver epoxy adhesive purchased from Epoxy Technology, Inc.