Solder Reflow Oven

Description: Overview The SST 1200 is a table top vacuum and pressure furnace designed for process development and low volume production of flux-free and void-free soldered joints in microelectronic packages and components. The station is easy to use and designed for a wide variety of soldering

• Temperature Range: 842 F

Description: With its Single Cold Wall Process Chamber approach ATV is setting the benchmark in both the R&D and Pilot Line Production markets. Here our highly successful SRO-714 and 716 series IR vacuum reflow oven marks the heart of ATV’s reflow soldering ovens and proves

• Configuration: Bench / Cabinet
• Temperature Range: 450 F

Description: Our all-new and groundbreaking SRO i-Line is a high volume production tool used for vacuum reflow soldering. Implementing this tool within the ATV single chamber approach will help to fulfil all your current and future demands. Since 1982 ATV‘s single chamber approach has proven

• Configuration: Bench / Cabinet
• Temperature Range: 450 F

Description: Ever since its introduction in 1989 ATV’s Single Process Chamber approach has built a strong reputation in the R&D and pilot line production market. The SRO-700 table top IR vacuum reflow oven is the essential entry level reflow soldering oven capable of fulfilling

• Configuration: Bench / Cabinet
• Temperature Range: 450 to 700 F

Description: Overview The SST 8301 is a single chamber, automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure. Featuring conveyor belts and a Cartesian gantry, the system provides high volume

• Configuration: Continuous (Convey, Shuttle)

Description: Overview The SST 8303 is a single chamber, automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure. Featuring conveyor belts and a Cartesian gantry, the system provides high volume

• Configuration: Continuous (Convey, Shuttle)

Description: MicroCare Reflow Oven Cleaner melts burned-on flux residues from reflow ovens and wave solder machines. Ideal for cleaning pulleys, gears, pallets, clamps, housings, baffles, chains, and heating elements. Heat activated, minimal odor, nonflammable, and non-foaming.

• Type: Cleaner / Cleaning Agent

Description: which will damage sensitive electrical circuit components. Wafer Level Packaging and Wafer Bonding. Wafer Level Packaging (WLP) provides for both interconnection and package sealing of circuits at the wafer level. Processes include flip chip solder reflow, solder lid sealing and

• Temperature Range: 662 F

Description: MicroCare Reflow Oven Cleaner melts burned-on flux residues from reflow ovens and wave solder machines. Ideal for cleaning pulleys, gears, pallets, clamps, housings, baffles, chains, and heating elements. Heat activated, minimal odor, nonflammable, and non-foaming.

• Type: Cleaner / Cleaning Agent

Description: IEC TR 60068-3-12:2014 presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded

Description: MulticoreLF328 is a halide-free no-clean Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Offers high tack to resist component movement during high-speed placement, long printer abandon times and excellent

Description: under 100°C. Eliminates the Need for a Second or Third Reflow Cycle Eliminates the need for a second or third reflow cycle when temperature-sensitiv e components are used. Reduce Energy Consumption in Reflow Ovens for Greater Efficiency Low

Description: MULTICORE LF328 is a halide-free no-clean Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Offers high tack to resist component movement during high-speed placement, long printer abandon times and excellent

Description: MulticoreLF328 is a halide-free no-clean Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Offers high tack to resist component movement during high-speed placement, long printer abandon times and excellent

Description: IEC TR 60068-3-12:2014 presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded

Description: This halide-free, no-clean and Pb-free solder paste has an excellent humidity resistance and a broad process window for both reflow and printing. It offers high tack to resist component movement during high-speed placement, long printer abandon times and excellent solderability

• Alloy: Other
• Form / Shape: Paste
• Lead Free: Yes

Description: Converts SOP IC to DIP IC. Enables SOP IC to be mounted on board manufactured for use with DIP IC. Suitable for use with reflow oven, soldering machine Pitch = 0.65mm Mounting Type = Surface Mount Body Orientation = Straight

• Contacts Pitch: 0.6500 mm
• Mounting: SMT
• Product Type: Package Adapters / Converters

Description: Converts SOP IC to DIP IC. Enables SOP IC to be mounted on board manufactured for use with DIP IC. Suitable for use with reflow oven, soldering machine Pitch = 1.27mm Mounting Type = Surface Mount Body Orientation = Straight

• Contacts Pitch: 1.27 mm
• Mounting: SMT
• Product Type: Package Adapters / Converters

Description: packages & ultra fine pitch as small as 0.015 in. Equipment includes high speed component placers, automatic & semi- automatic printers, convection reflow oven, Electrovert Wave Solder machines; X-ray inspection unit & AOI unit. Through hole assembly capabilities include axial

• Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services
• Location: North America, Canada Only
• Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly, Other
• Material Acquisition: Customer Supplied, Vendor Supplied

Description: ), cable assembly & electro-mechanical assembly. SMT capabilities include placing packages as small as 0402; BGA, SOIC, PLCC, QFP packages & ultra fine pitch as small as 0.015 in. Equipment includes high speed component placers, automatic & semi- automatic printers, convection reflow

• Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing, Mechanical Assembly
• Industry Served: Aerospace / Avionics, Automotive, Consumer / Retail, Electronics / Semiconductors, Industrial / Commercial, Marine, Telecommunications, Other
• Location: North America, United States Only, Canada Only
• Services: Just-in-Time Delivery, Kitting, Low Volume Production, Packaging, Private Labeling, Shipping and Freight, Sourcing, Turnkey Product Manufacturing, Testing / Inspection, Warehousing / Stocking

Description: The JJB-HT Series features a compact, reflow-compatible package that is suitable for direct board installation inside a product case. It’s available at 868MHz and 916MHz. A through-hole lead lets you solder the antenna to the PCB. Compact: reduced-height package is easy to

• Gain: -12.3 dB
• Operating Temperature: -40 to 194 F
• Primary Frequency Range: 916 MHz
• VSWR: 2 :1

Description: Converts SOP IC to DIP IC. Enables SOP IC to be mounted on board manufactured for use with DIP IC. Suitable for use with reflow oven, soldering machine End 1 = 24 Pin Female SOP End 2 = 24 Pin Female DIP End 1 Number of Contacts = 24 End 2 Number of Contacts = 24 End 1 Type =

• Mounting: Through-hole
• Product Type: Package Adapters / Converters

Description: Converts SOP IC to DIP IC. Enables SOP IC to be mounted on board manufactured for use with DIP IC. Suitable for use with reflow oven, soldering machine End 1 = 14 Pin Female SOP End 2 = 14 Pin Female DIP End 1 Number of Contacts = 14 End 2 Number of Contacts = 14 End 1 Type =

• Mounting: Through-hole
• Product Type: Package Adapters / Converters

Description: /thermoform ing machinery, HVAC and R, kilns, packaging equipment, sorting equipment, wave solder and reflow systems, lighting systems, pump controls, incubators, motor-switching, and UPS systems.

• Application Type: General Application Relay
• Dropout Voltage: 1 volts
• Features: Built-in Heat Sink, Visual Indicator
• Input (Pick-up) Voltage Range: 4 to 280 volts

Description: uses production wave solder equipment and convection ovens for solder reflow, we are able to simulate an actual production build to the greatest extent possible during the prototype stage. This means that RiverSide and the Customer are able to better manage initial

• Capabilities: Electronic Manufacturing, Electrical and Electromechanical Assembly
• Industry Served: Electronics / Semiconductors, Other
• Location: North America, United States Only, Midwest US Only
• Services: Design / Development, Testing / Inspection, Other

Description: electronic components (if necessary); Preparation of the thermal profile of the convection reflow oven and the selection of soldering materials depending on the applied project standards; Preparation of production cycles and setting up an automatic installer for mounting printed

• Location: United States Only, East Asia / Pacific Only
• Supplier Capability: PCB Assembly

Description: ; Manufacturing of printed circuit boards (if necessary); Supply of electronic components (if necessary); Preparation of the thermal profile of the convection reflow oven and the selection of soldering materials depending on the applied project standards; Preparation of

• Location: United States Only, East Asia / Pacific Only
• Supplier Capability: PCB Assembly