Solder Reflow Oven

Description: MicroCare Reflow Oven Cleaner melts burned-on flux residues from reflow ovens and wave solder machines. Ideal for cleaning pulleys, gears, pallets, clamps, housings, baffles, chains, and heating elements. Heat activated, minimal odor, nonflammable, and non-foaming.

• Type: Cleaner / Cleaning Agent

Description: MicroCare Reflow Oven Cleaner melts burned-on flux residues from reflow ovens and wave solder machines. Ideal for cleaning pulleys, gears, pallets, clamps, housings, baffles, chains, and heating elements. Heat activated, minimal odor, nonflammable, and non-foaming.

• Type: Cleaner / Cleaning Agent

Description: Single chamber process Processes Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to

• Temperature Range: 842 F

Description: the best reflow soldering results compared to any other standard equipment in the market. Formic acid together with vacuum results in significant void reduction over the full reflow soldering area as well as the entire product load. With the new generation of flux based solder

• Temperature Range: 450 F
• External: Bench / Cabinet

Description: With its Single Cold Wall Process Chamber approach ATV is setting the benchmark in both the R&D and Pilot Line Production markets. Here our highly successful SRO-714 and 716 series IR vacuum reflow oven marks the heart of ATV’s reflow soldering ovens and proves ready for

• Temperature Range: 450 F
• External: Bench / Cabinet

Description: Ever since its introduction in 1989 ATV’s Single Process Chamber approach has built a strong reputation in the R&D and pilot line production market. The SRO-700 table top IR vacuum reflow oven is the essential entry level reflow soldering oven capable of fulfilling all

• Temperature Range: 450 to 700 F
• External: Bench / Cabinet

Description: benefits of the SST 8303 include: Automated high-volume production vacuum pressure soldering system Enables low-void solder connections with preforms or with solder paste Offers maximum flexibility for processing a wide range of solder alloys and other alternative interconnect

• External: Continuous (Convey, Shuttle)

Description: consumer electronics products and includes reflow oven capability, board design and package sizes. This edition includes the following significant technical changes with respect to the previous edition: - the content has been adapted to the state-of-the-art of reflow-oven

Description: benefits of the 8301 include: Automated high-volume production vacuum pressure soldering system Enables low-void solder connections with preforms or with solder paste Offers maximum flexibility for processing a wide range of solder alloys and other alternative interconnect

• External: Continuous (Convey, Shuttle)

Description: warming impact. Quickly Clean Flux Residue From Oven & Wave Fingers Safe on Warm Ovens Non-Flammable Low VOC, Zero GWP Biodegradable Non-Ozone Depleting Applications: For Removal of Baked-On Flux Residues From SMT Oven and Wave Solder Equipment Recommended for Use In All

Description: consumer electronics products and includes reflow oven capability, board design and package sizes. This edition includes the following significant technical changes with respect to the previous edition: - the content has been adapted to the state-of-the-art of reflow-oven

Description: warming impact. Quickly Clean Flux Residue From Oven & Wave Fingers Safe on Warm Ovens Non-Flammable Low VOC, Zero GWP Biodegradable Non-Ozone Depleting Applications: For Removal of Baked-On Flux Residues From SMT Oven and Wave Solder Equipment Recommended for Use In All

Description: a second or third reflow cycle when temperature-sensitive components are used. Reduce Energy Consumption in Reflow Ovens for Greater Efficiency Low-temperature alloys reduce energy consumption in reflow ovens compared to standard lead-free alloys. 8-Hour Stencil

• Solder Alloy: Lead Free
• Joining Process / Product Form: Paste

Description: (WLP) provides for both interconnection and package sealing of circuits at the wafer level. Processes include flip chip solder reflow, solder lid sealing and wafer-to-wafer bonding using solder, glass, adhesives and direct fusion Applications Gated light arrays MEMS

• Temperature Range: 662 F

Description: range of reflow profiles in air and N2 reflow ovens and across a wide range of surface finishes including Ni/Au, immersion Sn, Immersion Ag and OSP Cu. Proflow compatible. Available with both AGS (20-45?m, equivalent to IPC type 3) and DAP (20-38?m, equivalent to IPC type 4)

Description: range of reflow profiles in air and N2 reflow ovens and across a wide range of surface finishes including Ni/Au, immersion Sn, Immersion Ag and OSP Cu. Proflow compatible. Available with both AGS (20-45?m, equivalent to IPC type 3) and DAP (20-38?m, equivalent to IPC type 4)

Description: range of reflow profiles in air and N2 reflow ovens and across a wide range of surface finishes including Ni/Au, immersion Sn, Immersion Ag and OSP Cu. Proflow compatible. Available with both AGS (20-45?m, equivalent to IPC type 3) and DAP (20-38?m, equivalent to IPC type 4)

Description: reflow profiles in air and nitrogen reflow ovens and across a wide range of surface finishes.

• Solder Alloy: Lead Free
• Features: Other
• Joining Process / Product Form: Paste
• Fluxes & Cleaners: Soldering Flux / Rosin

Description: The JJB-HT Series features a compact, reflow-compatible package that is suitable for direct board installation inside a product case. It’s available at 868MHz and 916MHz. A through-hole lead lets you solder the antenna to the PCB. Compact: reduced-height package is easy to hide inside

• Primary Frequency Range: 868 MHz
• Gain: -10.5 dB
• VSWR: 2 :1
• Operating Temperature: -40 to 194 F

Description: fine pitch as small as 0.015 in. Equipment includes high speed component placers, automatic & semi- automatic printers, convection reflow oven, Electrovert Wave Solder machines; X-ray inspection unit & AOI unit. Through hole assembly capabilities include axial insertion, radial

• Production Capabilities: Cabling, High Volume, Mid Volume, Prototype / Low Volume, Quick Turn
• Features: Canada Only, North America, Other
• Design Services: Conceptual Product Development, Electrical Design Services, Mechanical Design Services
• Material Acquisition: Customer Supplied, Vendor Supplied

Description: production wave solder equipment and convection ovens for solder reflow, we are able to simulate an actual production build to the greatest extent possible during the prototype stage. This means that RiverSide and the Customer are able to better manage initial circuit

• Additional Services: Design / Development, Testing / Inspection
• Capabilities: Electrical and Electromechanical Assembly, Electronic Manufacturing
• Industry / Application: Electronics / Semiconductors
• Features: Midwest US Only, North America, Other, United States Only

Description: extrusion/thermoforming machinery, HVAC and R, kilns, packaging equipment, sorting equipment, wave solder and reflow systems, lighting systems, pump controls, incubators, motor-switching, and UPS systems.

• Input (Pick-up) Voltage Range: 4 to 280 volts
• Dropout Voltage: 1 volts
• Input Current Range: 0.006 to 0.019 amps
• Maximum Current: 30 amps

Description: available for: Card Slots Natural Convection Forced Convection Conduction Cooled Solder Reflow Ovens For more advanced scenarios, pre-solved FloTHERM analyses can be imported to form a complex, 3D description of the surrounding air flow and temperature fields. Solving and

Description: of the convection reflow oven and the selection of soldering materials depending on the applied project standards; Preparation of production cycles and setting up an automatic installer for mounting printed circuit boards. ASSEMBLY OF PRINTED CIRCUIT BOARDS FROM SPECIALISTS The company

• Features: East Asia / Pacific Only, United States Only
• Supplier Capability: PCB Assembly

Description: boards (if necessary); Supply of electronic components (if necessary); Preparation of the thermal profile of the convection reflow oven and the selection of soldering materials depending on the applied project standards; Preparation of production cycles and setting up an automatic

• Features: East Asia / Pacific Only, United States Only
• Supplier Capability: PCB Assembly