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Supplier: Henkel Corporation - Industrial
Description: Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE® PE 3164 is a clear epoxy resin hardener which forms a black, fast gelling, low viscosity, room temperature cure potting compound with high
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
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Supplier: Epoxies Etc...
Description: 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 18.33 to 72.22 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxies Etc...
Description: 50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system ideal
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 16.67 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2851FT, Epoxy, Encapsulant LOCTITE® STYCAST 2851FT is recommended for encapsulation of components that require heat dissipation and thermal shock properties . It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Tensile Strength (Break): 7250 psi
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Viscosity: 25000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant LOCTITE® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is recommended for encapsulation of components that require heat
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Viscosity: 225000 cP
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description ER2221 thermally conductive epoxy potting compound has been formulated as high temperature resistant and thermally conductive encapsulation resin which retains excellent characteristics throughout thermal cycling. ER2221 exhibits
- Form / Function: Encapsulant / Potting Compound
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description ER2183 Thermally conductive epoxy potting compound is an epoxy resin which meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission. It is a low viscosity alternative to ER2220 system
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.22 to 78.89 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 to 72.22 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Coeff. of Thermal Expansion (CTE): 8.89 to 37.78 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.9
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2762 FT Black, formerly Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 400 kV/in
- Thermal Conductivity: 1.34 W/m-K
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description ER2220 Highly thermally conductive epoxy potting compound is a flame retardant, two part epoxy resin. Designed to meet increasing demands for efficient thermal dissipation, ER2220 combines ease of processing with an enhanced thermal
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND, is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good chemical resistance, good electrical insulation properties, high thermal conductivity, and
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 1.2 W/m-K
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good chemical resistance, good electrical insulation properties, high thermal conductivity, and
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 1.2 W/m-K
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Supplier: Master Bond, Inc.
Description: Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting. Key features include its good flow properties, high temperature resistance, its ability to ithstand aggressive chemicals, and high compressive strength.
- Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2850FT-FR Black, formerly Emerson and Cuming, is a two component, room temperature curing, fire resistant, epoxy encapsulant that is used for components that are exposed to thermal shock and need heat dissipation. It offers a low coefficient of
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 356 to 490 kV/in
- Tensile Strength (Break): 3300 to 8400 psi
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description ER2074 Thermally conductive epoxy resin is a flame retardant system with UL94 V-0 approval. The flame retardant technology used is halogen free leading to relatively low toxicity fumes and low smoke emission and the lack of abrasive fillers means that there
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Supplier: Master Bond, Inc.
Description: elevated temperatures. Other attractive properties include superb dimensional stability and superior physical strength properties. Its low viscosity and excellent flow characteristics make it an ideal thermally conductive potting epoxy. EP30AN-1 is also an excellent
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 14 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 10 to 11.67 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Master Bond, Inc.
Description: performance properties including high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability, as well as good physical strength properties. EP30AO is low viscosity with excellent flow characteristics making it ideal as a thermally
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Epoxies Etc...
Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.72 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass,
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Digi-Key Electronics
Description: THERMAL POTTING EPOXY 0.75KG PAC
- Compound Type: Thermal Compound / Thermally Conductive
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.1 W/m-K
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Supplier: Epoxies Etc...
Description: 70-3811 is a two component, aluminum filled epoxy system. This system is used for making heat resistance tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Newark, An Avnet Company
Description: LOCTITE STYCAST 2850FT IS A BLACK, THERMALLY CONDUCTIVE EPOXY ENCAPSULANT, 1GAL CAN
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Supplier: Protavic America, Inc.
Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 12.22 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Techsil Limited
Description: Techsil® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System
- Features: Flame Retardant (e.g. UL 94 Rated), Thermal Compound / Interface (Thermally Conductive)
- Form: Liquid
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Supplier: GS Polymers, Inc.
Description: Two part, 1:1, thermal conductive compound, available in cartridges
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 809FR INSTAbond® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy.
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Flame Retardant / UL 94V-0 Rated: Yes
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST 2850KT/CATALYST 24LV ) LOCTITE STYCAST 2850KT is a thermally conductive, electrically insulatiive epoxy encapsulant designed for heat sink replacement in non-integrated electrical components and assemblies. it is also recommended for use in high
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: ELANTAS PDG, Inc.
Description: Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 51.11 to 103 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Allied Electronics, Inc.
Description: 3M Scotch-Weld™ Epoxy Potting Compound-Adhesives Black opaque highly filled epoxy used for potting and encapsulating electronic circuits. Use to environmentally protect or conceal circuits. This product is excellent when used with GC Chassis Boxes. Working Time (Pott Life): 1
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Use Temperature: -40 to 300 F
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Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
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Mereco Silver Adhesive Cures In Only 45 Seconds
Founded in 1960, Metachem Resins Corporation (MERECO) is a specialized manufacturer of formulated adhesives, electrically conductive resins, encapsulants , epoxies , silicones, thermally conductive resins, urethanes, UV curable systems, and related products for applications in aerospace, defense, electronics, fiber optics, solar cell manufacturing, and …
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MERECO Silver Adhesive Meets Customer Packaging Requirements
Founded in 1960, Metachem Resins Corporation (MERECO) is a highly specialized manufacturer of formulated adhesives, electrically conductive resins, encapsulants , epoxies , silicones, thermally conductive resins, urethanes, UV curable systems, and related products for applications in aerospace, defense, electronics, fiber optics, solar cell manufacturing …
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Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
The first was to find high thermally conductive silver filled epoxies that can handle high power LEDs, while the second area was to find clear encapsulants that would not yellow with time.
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Creative Materials Announces Flip Chip Assembly Materials
Boston, MA -- Creative Materials, Inc., a supplier of electrically conductive inks, coatings, adhesives and encapsulants , announced the availability of an electrically conductive adhesive, GPC-251A/B, and a thermally conductive underfill epoxy , 123-38A/B187, designed for flip chip assembly.
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4.5.06 -- Feature Article: IMEC And University Of Ghent Present Concept For Bendable Packaged Ultra-Thin Chips
Creative Materials, Inc., a supplier of electrically conductive inks, coatings, adhesives and encapsulants , announced the availability of an electrically conductive adhesive, GPC-251A/B, and a thermally conductive underfill epoxy , 123-38A/B187, designed for flip chip assembly...
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Thermally Conductive MgO-Filled Epoxy Molding Compounds
[8] P. Bujard and J. P. Ansermet, “ Thermally conductive aluminum nitride- filled epoxy resin,” in Proc. 5th IEEE SEMI-THERM Symp., Feb. 1989, pp. 126–130. [9] P. Procter and J. Sole, “Improved thermal conductivity in microelectronic encapsulants ,” in Proc. Electron.
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Final report on grand challenge LDRD project : a revolution in lighting : building the science and technology base for ultra-efficient solid-state lighting.
Hence, the commercially available encapsulants used in this work are an epoxy and a thermally activated 2-part amino- siloxane/epoxide system, as amine and epoxide groups are generally chemically benign to metal sulfide and selenidenanoparticles. Many factors affect the photoluminescent spectrum and quantum yield (QY) of semi conducting nanoparticles, including particle size …
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Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging
This paper deals with the development and characterization of thermally conductive encapsulants with relatively low filler loading. … different ceramic fillers on the thermal conductivity and other critical properties of an epoxy based liquid encapsulant …
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High thermal conductance liquid encapsulants for direct chip attach
P. Procter and J. Solc, “Improved Thermal Conductivity in Microelectronic Encapsulants ,” 41st ECTC, 1991. P. Bujard and J.P. Ansemet, “ Thermally Conductive Aluminum Nitride-Filled Epoxy Resin,” 5th IEEE SEMTHERM Symposium,1989.
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Mixed filler combinations for enhanced thermal conductivity of liquid encapsulants for electronic packaging
Traditionally, epoxy based encapsulants are filled with silica, that has a relatively low thermal conductivity of 1.5 W/mK. As semiconductordevices increase in transistor densities, the heat dissipation requirements increase, resulting in the need for improved thermally conducting packaging materials [2].