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Supplier: Henkel Corporation - Industrial
Description: Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE® PE 3164 is a clear epoxy resin hardener which forms a black, fast gelling, low viscosity, room temperature cure potting compound with high
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 18.33 to 72.22 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2851FT, Epoxy, Encapsulant LOCTITE® STYCAST 2851FT is recommended for encapsulation of components that require heat dissipation and thermal shock properties . It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Tensile Strength (Break): 7250 psi
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Viscosity: 25000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant LOCTITE® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is recommended for encapsulation of components that require heat
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Viscosity: 225000 cP
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 to 72.22 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 8.89 to 37.78 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Epoxies Etc...
Description: 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.22 to 78.89 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxies Etc...
Description: 50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system ideal
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 16.67 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Techsil Limited
Description: MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: MacDermid Alpha Electronics Solutions
Description: Flame-retardant, thermally conductive epoxy potting compound designed for easy processing and enhanced thermal conductivity. Product Overview ER2220 Highly Thermally Conductive Epoxy Potting Compound is a flame retardant, two-part epoxy resin
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Hernon Manufacturing, Inc.
Description: Dissipator® 319 is a room temperature curing, two component thermal conductive epoxy adhesive for potting applications. Dissipator® 319 offers low viscosity for potting applications, is recommended for encapsulation of components that require heat dissipation and thermal
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2762 FT Black, formerly Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 400 kV/in
- Thermal Conductivity: 1.34 W/m-K
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass,
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: Toughened, two part epoxy Supreme 11ANHT withstands thermal cycling and is both thermally conductive and electrically insulative.
- Applied Thickness / Gap Fill: 0.0020 to 0.0040 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 16.67 to 19.44 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good chemical resistance, good electrical insulation properties, high thermal conductivity, and
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 1.2 W/m-K
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND, is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good chemical resistance, good electrical insulation properties, high thermal conductivity, and
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 1.2 W/m-K
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2850FT-FR Black, formerly Emerson and Cuming, is a two component, room temperature curing, fire resistant, epoxy encapsulant that is used for components that are exposed to thermal shock and need heat dissipation. It offers a low coefficient of
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 356 to 490 kV/in
- Tensile Strength (Break): 3300 to 8400 psi
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Supplier: Master Bond, Inc.
Description: Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting. Key features include its good flow properties, high temperature resistance, its ability to withstand aggressive chemicals, and high compressive strength.
- Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Master Bond, Inc.
Description: elevated temperatures. Other attractive properties include superb dimensional stability and superior physical strength properties. Its low viscosity and excellent flow characteristics make it an ideal thermally conductive potting epoxy. EP30AN-1 is also an excellent
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 14 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 10 to 11.67 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Epoxies Etc...
Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.72 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 12.22 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Epoxies Etc...
Description: 70-3811 is a two component, aluminum filled epoxy system. This system is used for making heat resistance tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 10 to 41.67 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
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Supplier: Techsil Limited
Description: Techsil® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System
- Features: Flame Retardant (e.g. UL 94 Rated), Thermal Compound / Interface (Thermally Conductive)
- Form: Liquid
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Supplier: GS Polymers, Inc.
Description: Two part, 1:1, thermal conductive compound, available in cartridges
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 809FR INSTAbond® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy.
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Flame Retardant / UL 94V-0 Rated: Yes
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST 2850KT/CATALYST 24LV ) LOCTITE STYCAST 2850KT is a thermally conductive, electrically insulatiive epoxy encapsulant designed for heat sink replacement in non-integrated electrical components and assemblies. it is also recommended for use in high
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: ELANTAS North America LLC
Description: Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 51.11 to 103 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Hapco, Inc.
Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.4 to 4.6
- Dielectric Strength: 654 kV/in
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Description: It is a one-component, thermosetting epoxy resin. It is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stress in handheld electronic devices.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System, Specialty / Other
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Hysol 1511184 black epoxy potting compound is compatible with ceramic, metal and plastic materials with a 24 hr cure time. Provides a 40 min working time. Works in a mix ratio of 2:1. Delivers great performance with a shear strength of 3000 psi.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Strength: 965 kV/in
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 0.2500 W/m-K
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Supplier: CHT USA Inc.
Description: CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 470 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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flame retardant non-halogenated system is thermally conductive, 9 (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
EP35AOLV is a thermally conductive, electrically insulating compound that withstands aggressive chemicals, such as those found in downhole oil and gas processing. EP35AOLV exhibits superior protection against corrosion in various harsh environments and helps prolong longevity of critical (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Key Features: Thermal conductivity exceeds 6 W/(m•K) Applicable in very thin bond lines Low thermal resistance Low coefficient of thermal expansion Used for bonding and sealing applications. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
thermal conductivity of 2.3-2.6 W/(m•K). This epoxy exhibits dimensional stability with low shrinkage upon curing and a low coefficient of thermal expansion of 14-16 x 10-6 in/in/°C. Mechanical properties include a tensile strength of 5,000 to 7,000 psi, a tensile modulus greater (read more)
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Product Advantages Easy to use, non-critical one to one mix ratio by weight Low viscosity, flows evenly and smoothly Reliable thermal conductivity and electrical insulation Low shrinkage and excellent dimensional stability Resists thermal cycling, vibration and shock Well suited for moderate to large encapsulation applications (read more)
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Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
electrical systems, threatening spacecraft integrity and crew safety. This case study explores how Master Bond EP21TDCS-LO, a two-component, silver-filled epoxy, met demanding requirements in two real-world space-environment applications (read more)
Browse Conductive Compounds Datasheets for Master Bond, Inc. -
Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. It has a thermally conductive, electrically insulative filler material with ultra small particle sizes. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
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Mereco Silver Adhesive Cures In Only 45 Seconds
Founded in 1960, Metachem Resins Corporation (MERECO) is a specialized manufacturer of formulated adhesives, electrically conductive resins, encapsulants , epoxies , silicones, thermally conductive resins, urethanes, UV curable systems, and related products for applications in aerospace, defense, electronics, fiber optics, solar cell manufacturing, and …
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MERECO Silver Adhesive Meets Customer Packaging Requirements
Founded in 1960, Metachem Resins Corporation (MERECO) is a highly specialized manufacturer of formulated adhesives, electrically conductive resins, encapsulants , epoxies , silicones, thermally conductive resins, urethanes, UV curable systems, and related products for applications in aerospace, defense, electronics, fiber optics, solar cell manufacturing …
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Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
The first was to find high thermally conductive silver filled epoxies that can handle high power LEDs, while the second area was to find clear encapsulants that would not yellow with time.
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Creative Materials Announces Flip Chip Assembly Materials
Boston, MA -- Creative Materials, Inc., a supplier of electrically conductive inks, coatings, adhesives and encapsulants , announced the availability of an electrically conductive adhesive, GPC-251A/B, and a thermally conductive underfill epoxy , 123-38A/B187, designed for flip chip assembly.
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4.5.06 -- Feature Article: IMEC And University Of Ghent Present Concept For Bendable Packaged Ultra-Thin Chips
Creative Materials, Inc., a supplier of electrically conductive inks, coatings, adhesives and encapsulants , announced the availability of an electrically conductive adhesive, GPC-251A/B, and a thermally conductive underfill epoxy , 123-38A/B187, designed for flip chip assembly...
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Thermally Conductive MgO-Filled Epoxy Molding Compounds
[8] P. Bujard and J. P. Ansermet, “ Thermally conductive aluminum nitride- filled epoxy resin,” in Proc. 5th IEEE SEMI-THERM Symp., Feb. 1989, pp. 126–130. [9] P. Procter and J. Sole, “Improved thermal conductivity in microelectronic encapsulants ,” in Proc. Electron.
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Final report on grand challenge LDRD project : a revolution in lighting : building the science and technology base for ultra-efficient solid-state lighting.
Hence, the commercially available encapsulants used in this work are an epoxy and a thermally activated 2-part amino- siloxane/epoxide system, as amine and epoxide groups are generally chemically benign to metal sulfide and selenidenanoparticles. Many factors affect the photoluminescent spectrum and quantum yield (QY) of semi conducting nanoparticles, including particle size …
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Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging
This paper deals with the development and characterization of thermally conductive encapsulants with relatively low filler loading. … different ceramic fillers on the thermal conductivity and other critical properties of an epoxy based liquid encapsulant …
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High thermal conductance liquid encapsulants for direct chip attach
P. Procter and J. Solc, “Improved Thermal Conductivity in Microelectronic Encapsulants ,” 41st ECTC, 1991. P. Bujard and J.P. Ansemet, “ Thermally Conductive Aluminum Nitride-Filled Epoxy Resin,” 5th IEEE SEMTHERM Symposium,1989.
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Mixed filler combinations for enhanced thermal conductivity of liquid encapsulants for electronic packaging
Traditionally, epoxy based encapsulants are filled with silica, that has a relatively low thermal conductivity of 1.5 W/mK. As semiconductordevices increase in transistor densities, the heat dissipation requirements increase, resulting in the need for improved thermally conducting packaging materials [2].