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Supplier: Newark, An Avnet Company
Description: LOCTITE STYCAST 2850FT IS A BLACK, THERMALLY CONDUCTIVE EPOXY ENCAPSULANT, 1GAL CAN
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Supplier: Epoxies Etc...
Description: 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure.
- Viscosity: 15,000 cP
- Use Temperature: -94 to 302 F
- Thermal Conductivity: 1.7307348 W/m-K
- Dielectric Strength: 480.0000000000012 kV/in
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Supplier: MacDermid Alpha Electronics Solutions
Description: Flame-retardant, thermally conductive epoxy potting compound designed for easy processing and enhanced thermal conductivity. Product Overview ER2220 Highly Thermally Conductive Epoxy Potting Compound is a flame retardant, two-part epoxy resin designed
- Type: Electrically Conductive, Thermal Compound / Thermally Conductive
- Features: Electronics, Encapsulant / Potting Compound, Flame Retardant (e.g. UL 94 Rated)
- Chemical System: Epoxy (EP)
- Industry: Semiconductors / IC Packaging
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Viscosity: 6,000 to 12,000 cP
- Use Temperature: 662 F
- Thermal Conductivity: 0.7 W/m-K
- Coeff. of Thermal Expansion (CTE): 18.333333333333332 to 72.22222222222221 µin/in-F
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Supplier: Master Bond, Inc.
Description: Toughened, two part epoxy Supreme 11ANHT withstands thermal cycling and is both thermally conductive and electrically insulative.
- Applied Thickness / Gap Fill: 0.002 to 0.004 inch
- Use Temperature: -112 to 400 F
- Thermal Conductivity: 2.88 to 3.1 W/m-K
- Coeff. of Thermal Expansion (CTE): 16.666666666666668 to 19.444444444444443 µin/in-F
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2850FT Black, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and need heat dissipation. It offers a low coefficient of thermal expansion, electrical
- Thermal Conductivity: 1.02 to 1.28 W/m-K
- Dielectric Strength: 365.7600000000008 to 381.0000000000008 kV/in
- Viscosity: 5,600 to 64,000 cP
- Features: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2850FT Black, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and need heat dissipation. It offers a low coefficient of thermal expansion, electrical
- Thermal Conductivity: 1.02 to 1.28 W/m-K
- Dielectric Strength: 365.7600000000008 to 381.0000000000008 kV/in
- Viscosity: 5,600 to 64,000 cP
- Features: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2851MT Blue, formerly Emerson and Cuming, is a one component, heat cured, thermally conductive, epoxy encapsulant. It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial chemicals and
- Thermal Conductivity: 1.9 W/m-K
- Tensile Strength (Break): 7,000 psi
- Viscosity: 115,000 to 165,000 cP
- Features: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2851FT Black, formerly Emerson and Cuming, is a one component, heat cured, thermally conductive, epoxy encapsulant. It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial chemicals and
- Thermal Conductivity: 1.36 W/m-K
- Tensile Strength (Break): 6,526.657771073865 to 7,977.026164645835 psi
- Viscosity: 3,000 to 10,000 cP
- Features: Encapsulant / Potting Compound
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Viscosity: 40,000 to 70,000 cP
- Use Temperature: 482 F
- Thermal Conductivity: 1.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 32.77777777777778 to 120 µin/in-F
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Viscosity: 6,000 to 13,000 cP
- Use Temperature: 527 F
- Thermal Conductivity: 0.6 W/m-K
- Coeff. of Thermal Expansion (CTE): 13.88888888888889 to 72.22222222222221 µin/in-F
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Supplier: Newark, An Avnet Company
Description: LOCTITE STYCAST 2850KT CAT 24LV EPOXY ENCAPSULANT THERMAL EPOXY, 2 PART (ORDER CATALYST SEPARATELY) 3 LB CONTAINER
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Viscosity: 300,000 to 400,000 cP
- Use Temperature: 572 F
- Thermal Conductivity: 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 8.88888888888889 to 37.77777777777778 µin/in-F
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Supplier: Master Bond, Inc.
Description: from metal, etc., over a wide temperature range. Physical strength thermal conductivity and electrical insulation properties of the cured EP121AO resin system are significantly superior to those exhibited by typical room temperature and also thermally cured epoxy resin systems. The
- Viscosity: 55,000 to 95,000 cP
- Use Temperature: -60 to 500 F
- Thermal Conductivity: 1.44 W/m-K
- Coeff. of Thermal Expansion (CTE): 10 to 11.67 µin/in-F
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Supplier: Master Bond, Inc.
Description: properties including high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability, as well as good physical strength properties. EP30AO is low viscosity with excellent flow characteristics making it ideal as a thermally conductive
- Viscosity: 50,000 to 70,000 cP
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 1.441 W/m-K
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
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Supplier: Master Bond, Inc.
Description: Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting. Key features include its good flow properties, high temperature resistance, its ability to withstand aggressive chemicals, and high compressive strength.
- Applied Thickness / Gap Fill: 0.002 to 0.003 inch
- Viscosity: 50,000 to 90,000 cP
- Use Temperature: -60 to 500 F
- Thermal Conductivity: 1 to 1.15 W/m-K
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Supplier: Techsil Limited
Description: MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior shock
- Industry: Electronics (PCB / SMT Assembly)
- Chemical System: Epoxy (EP)
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Supplier: Epoxies Etc...
Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose
- Thermal Conductivity: 1.31247389 W/m-K
- Coeff. of Thermal Expansion (CTE): 15.222222222222221 µin/in-F
- Dielectric Strength: 369.99999999999903 kV/in
- Dielectric Constant (Relative Permittivity): 5.41
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Features: Air Setting / Film Drying, Encapsulating / Potting, Grease / Paste, Thermal / Heat Conductive
- Type: Electrical Insulation / Dielectric
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant LOCTITE® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is recommended for encapsulation of components that require heat
- Viscosity: 225,000 cP
- Chemical System: Epoxy (EP)
- Type: Thermal Compound / Thermally Conductive
- Cure / Technology: Two Component System
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Supplier: DigiKey
Description: Thermal Epoxy, 2 Part (Order Catalyst Separately) 5 gal Container
- Use Temperature: -85 F
- Chemical System: Epoxy (EP)
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Supplier: MacDermid Alpha Electronics Solutions
Description: Highly chemical-resistant epoxy potting compound formulated for harsh conditions in under-hood applications. Product Overview ER2223 Highly Chemical Resistant Epoxy Potting Compound has been specially formulated to meet the harsh operating conditions of under-hood applications in the
- Industry: Automotive, Semiconductors / IC Packaging
- Features: Electronics, Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Type: Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.
- Viscosity: 40,000 cP
- Use Temperature: -55 to 150 F
- Thermal Conductivity: 1.15 W/m-K
- Coeff. of Thermal Expansion (CTE): 12.222222222222221 µin/in-F
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Supplier: MacDermid Alpha Electronics Solutions
Description: A very low viscosity epoxy resin with excellent thermal stability, designed for compatibility with reflow applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use within the electronics industry. It offers a
- Features: Electronics, Encapsulant / Potting Compound, Flame Retardant (e.g. UL 94 Rated)
- Chemical System: Epoxy (EP)
- Industry: Semiconductors / IC Packaging
- Type: Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into cavities about 1 mm in width. The glass transition temperature is over 150°C, which helps to improve the thermal
- Viscosity: 6,000 cP
- Use Temperature: -67 to 410 F
- Thermal Conductivity: 0.7 W/m-K
- Coeff. of Thermal Expansion (CTE): 9.444444444444445 to 36.11111111111111 µin/in-F
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Supplier: RS Components, Ltd.
Description: MG thermally conductive epoxy 832TC
- Features: Encapsulating / Potting Compound, Specialty / Other, Thermal Compound / Interface (Thermally Conductive)
- Chemical System: Epoxy (EP)
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Supplier: Techsil Limited
Description: Techsil® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low
- Features: Electronics, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Liquid, Metal, Plastic, Thermal / Heat Conductive
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 809FR INSTAbond® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy.
- Features: Encapsulant / Potting Compound, Flame Retardant (e.g. UL 94 Rated), UL Approved
- Chemical System: Epoxy (EP)
- Type: Thermal Compound / Thermally Conductive
- Cure / Technology: Two Component System
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST 2850KT/CATALYST 24LV ) LOCTITE STYCAST 2850KT is a thermally conductive, electrically insulatiive epoxy encapsulant designed for heat sink replacement in non-integrated electrical components and assemblies. it is also recommended for use in high
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: GS Polymers, Inc.
Description: No Description Provided
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Composition: Filled
- Industry: OEM / Industrial
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Supplier: ELANTAS North America LLC
Description: Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation
- Use Temperature: 464 F
- Coeff. of Thermal Expansion (CTE): 51.11111111111111 to 103.33333333333333 µin/in-F
- Dielectric Strength: 1,600.0000000000002 kV/in
- Dielectric Constant (Relative Permittivity): 3.4
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Supplier: ELANTAS North America LLC
Description: enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Use Temperature: 311 F
- Thermal Conductivity: 0.67 to 0.77 W/m-K
- Coeff. of Thermal Expansion (CTE): 61.11111111111111 to 108.33333333333333 µin/in-F
- Viscosity: 15,000 to 20,000 cP
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Supplier: CHT USA Inc.
Description: CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This
- Use Temperature: -67 to 399.2 F
- Thermal Conductivity: 0.88 W/m-K
- Elongation: 55 %
- Tensile Strength (Break): 118.93020827290154 psi
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flame retardant non-halogenated system is thermally conductive, 9 (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
EP35AOLV is a thermally conductive, electrically insulating compound that withstands aggressive chemicals, such as those found in downhole oil and gas processing. EP35AOLV exhibits superior protection against corrosion in various harsh environments and helps prolong longevity of critical (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Key Features: Thermal conductivity exceeds 6 W/(m•K) Applicable in very thin bond lines Low thermal resistance Low coefficient of thermal expansion Used for bonding and sealing applications. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
thermal conductivity of 2.3-2.6 W/(m•K). This epoxy exhibits dimensional stability with low shrinkage upon curing and a low coefficient of thermal expansion of 14-16 x 10-6 in/in/°C. Mechanical properties include a tensile strength of 5,000 to 7,000 psi, a tensile modulus greater (read more)
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Product Advantages Easy to use, non-critical one to one mix ratio by weight Low viscosity, flows evenly and smoothly Reliable thermal conductivity and electrical insulation Low shrinkage and excellent dimensional stability Resists thermal cycling, vibration and shock Well suited for moderate to large encapsulation applications (read more)
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Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
electrical systems, threatening spacecraft integrity and crew safety. This case study explores how Master Bond EP21TDCS-LO, a two-component, silver-filled epoxy, met demanding requirements in two real-world space-environment applications (read more)
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Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. It has a thermally conductive, electrically insulative filler material with ultra small particle sizes. (read more)
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Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
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Mereco Silver Adhesive Cures In Only 45 Seconds
Founded in 1960, Metachem Resins Corporation (MERECO) is a specialized manufacturer of formulated adhesives, electrically conductive resins, encapsulants , epoxies , silicones, thermally conductive resins, urethanes, UV curable systems, and related products for applications in aerospace, defense, electronics, fiber optics, solar cell manufacturing, and …
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MERECO Silver Adhesive Meets Customer Packaging Requirements
Founded in 1960, Metachem Resins Corporation (MERECO) is a highly specialized manufacturer of formulated adhesives, electrically conductive resins, encapsulants , epoxies , silicones, thermally conductive resins, urethanes, UV curable systems, and related products for applications in aerospace, defense, electronics, fiber optics, solar cell manufacturing …
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Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
The first was to find high thermally conductive silver filled epoxies that can handle high power LEDs, while the second area was to find clear encapsulants that would not yellow with time.
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Creative Materials Announces Flip Chip Assembly Materials
Boston, MA -- Creative Materials, Inc., a supplier of electrically conductive inks, coatings, adhesives and encapsulants , announced the availability of an electrically conductive adhesive, GPC-251A/B, and a thermally conductive underfill epoxy , 123-38A/B187, designed for flip chip assembly.
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4.5.06 -- Feature Article: IMEC And University Of Ghent Present Concept For Bendable Packaged Ultra-Thin Chips
Creative Materials, Inc., a supplier of electrically conductive inks, coatings, adhesives and encapsulants , announced the availability of an electrically conductive adhesive, GPC-251A/B, and a thermally conductive underfill epoxy , 123-38A/B187, designed for flip chip assembly...
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Thermally Conductive MgO-Filled Epoxy Molding Compounds
[8] P. Bujard and J. P. Ansermet, “ Thermally conductive aluminum nitride- filled epoxy resin,” in Proc. 5th IEEE SEMI-THERM Symp., Feb. 1989, pp. 126–130. [9] P. Procter and J. Sole, “Improved thermal conductivity in microelectronic encapsulants ,” in Proc. Electron.
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Final report on grand challenge LDRD project : a revolution in lighting : building the science and technology base for ultra-efficient solid-state lighting.
Hence, the commercially available encapsulants used in this work are an epoxy and a thermally activated 2-part amino- siloxane/epoxide system, as amine and epoxide groups are generally chemically benign to metal sulfide and selenidenanoparticles. Many factors affect the photoluminescent spectrum and quantum yield (QY) of semi conducting nanoparticles, including particle size …
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Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging
This paper deals with the development and characterization of thermally conductive encapsulants with relatively low filler loading. … different ceramic fillers on the thermal conductivity and other critical properties of an epoxy based liquid encapsulant …
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High thermal conductance liquid encapsulants for direct chip attach
P. Procter and J. Solc, “Improved Thermal Conductivity in Microelectronic Encapsulants ,” 41st ECTC, 1991. P. Bujard and J.P. Ansemet, “ Thermally Conductive Aluminum Nitride-Filled Epoxy Resin,” 5th IEEE SEMTHERM Symposium,1989.
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Mixed filler combinations for enhanced thermal conductivity of liquid encapsulants for electronic packaging
Traditionally, epoxy based encapsulants are filled with silica, that has a relatively low thermal conductivity of 1.5 W/mK. As semiconductordevices increase in transistor densities, the heat dissipation requirements increase, resulting in the need for improved thermally conducting packaging materials [2].