Tin-Lead Plating

Description: This specification covers the requirements for electrodeposited tin-lead plating.

Description: This specification covers the requirements for electrodeposited tin-lead plating intended for use as a coating for corrosion protection and as a base for soldering.

Description: PLATING, TIN-LEAD (ELECTRODEPOSITED)

Description: Plating, Tin-Lead (Electrodeposited)

Description: Medium grained, high speed, matte tin whisker resistant plating process based on MSA. Satisfies all requirements of JEDEC JESD 201. Can be formulated as a tin/lead process.

• Chemical / Process: Tin Plating

Description: Acts by coagulating and precipitating the stannic tin. Can be readily filtered, leaving behind a clear plating bath.

• Chemical / Process: Tin Plating

Description: Operates over a wide CD range for increased output and flexibility in production. Produces brilliant deposits with good ductility. Exhibits good throwing power and distribution characteristics.

• Chemical / Process: Tin Plating

Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders Soldering is a process in which two or more metal items

• Soldering Filler Alloys: Tin-Lead (Sn-Pb)
• Welding Process / Form: Other

Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders Soldering is a process in which two or more metal items

• Alloy: Tin-Lead (Sn-Pb)
• Form / Shape: Wire

Description: Wide current density capability tin lead process based on MSA.

• Chemical / Process: Tin Plating

Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders Soldering is a process in which two or more metal items

• Soldering Filler Alloys: Tin-Lead (Sn-Pb)
• Welding Process / Form: Other

Description: . Small amounts of various metals, notably antimony and silver, are added to tin-lead solders to increase their strength. These solders can be used for joints subjected to high or even subzero service temperatures. Applications Casting, Plating, Solder, Babitt Alloys, Bronze Alloys

• Applications: Chemical / Materials Processing, Other
• Metal / Alloy Types: Lead / Lead Alloy, Tin / Tin Alloy
• Shape / Form: Other

Description: PLATING, LEAD - TIN ALLOY

Description: PLATING, LEAD - TIN ALLOY OR TIN, BEARING

Description: -nickel, copper, silver, tin and tin-lead. Certain facilities also provide automated rack and barrel plating services, Phosphorus electroless nickel with co-deposit Teflon and plating on plastic for various needs. To provide its customers with the lowest cost solutions,

• Additional Services: Electropolishing, On-site / Field Plating, Material Selection / Design Assistance, Pickling / Chemical Deburring, Research & Development
• Industry: Aerospace, Automotive, Castings / Cast Metal, Electronics, Machine Tools, Medical / Healthcare, Military Specification
• Location: North America, United States Only, Europe Only, South Asia Only, Near East Only, East Asia / Pacific Only
• Material / Substrate: Aluminum, Copper / Copper Alloys, Metal, Nickel / Nickel Alloys, Precious Metals, Titanium

Description: mat, bright, and flow-brightened tin-lead coatings. Note 2-Tin-lead plating baths are composed of tin and lead fluoborates and of addition agents to promote stability. The final appearance may be influenced by the addition of proprietary brighteners. Without

Description: A PET backing with silicone adhesive, Red Plating tape is applied to circuit boards during the tin/lead stripping and gold plating operations. It is also suitable for painting and silicone paper film coating. Product Features Temperature Rating: 425° F/ 218°

• Adhesive: Silicone
• Carrier / Backing Material: PET / Polyester
• Peel Strength / Adhesion: 1.56 lbs/in
• Temperature Resistance: -17.78 to 260 C

Description: 9190 is a 1 mil, blue polyester film coated with 2mils of silicone adhesive (3 mil. total thickness). It is designed to perform in all phases of masking for printed circuit boards. It also protects circuitry from splashes and chemical fumes. Blue industry plater's tape protects boards in tin

• Adhesive: Specialty / Other
• Carrier / Backing Material: PET / Polyester, Plastic / Polymer
• Peel Strength / Adhesion: 1.56 lbs/in
• Thickness: 0.0030 inches

Description: Engineering grade plating tape used to protect boards in tin/lead stripping. Features: For the PC Board Manufacturing Industry Engineering grade plating tape Used to protect boards in tin/lead stripping and gold finger plating operation Suitable for painting &

• Adhesive: Silicone
• Temperature Resistance: -73 to 177 C
• Type: Single-Sided Adhesive

Description: Engineering grade plating tapes used to protect printed circuit boards during tin/lead stripping and gold finger plating processes. Also suitable for painting and silicone paper film splicing. Red PCB tapes are thicker than Blue PCB Plating Tape. Features: For the PC

• Adhesive: Silicone
• Temperature Resistance: -73 to 177 C
• Type: Single-Sided Adhesive

Description: Engineering grade plating tapes used to protect printed circuit boards during tin/lead stripping and gold finger plating processes. Also suitable for painting and silicone paper film splicing. BLUE tapes have higher elasticity than GREEN and RED PCB Tapes. Features: Using in

• Adhesive: Silicone
• Temperature Resistance: -73 to 177 C
• Type: Single-Sided Adhesive

Description: Electroless nickel, electroless palladium and semi-autocatalytic gold plating Umicore's ENEPIG process provides an universal finish to the PCB industry with excellent wire-bonding performance and the highest degree of solder joint reliability (SJR) with lead-free SAC 305 alloy. The

Description: film photoresists, the system features a unique blend of components that promotes a high strip rate, easily filterable particles, and complete removal of dry film residues and adhesion promoters. UltraStrip contains no caustic, glycol ethers, or other solvents, so it will not attack copper,

Description: -Based Electrolytes for Semiconductor Wafer Plating The process is suited for high-speed electrodeposition, producing smooth surface morphology, solderable reflowed bumps with tight control of alloy compositions. Pre-Reflow Uniformity, Wide Process Window, Tin-Silver Capping Designed

Description: Strike Capabilities Non-Radioactive and Mainenance Free Low Capacitance = 1.5pF Nickel or Tin Plating Part Number DC Breakdown Voltage (1) Impulse Breakdown Voltage Insulation

• Application: Data Lines, Telecommunications
• Approvals: UL Recognized Component Mark (US and Canadian), RoHS
• Capacitance Range: 1.5 pF
• Construction: Ceramic

Description: Natural PC Test Point Brass, Tin-Lead Plating Surface Mount Mounting Type

• Packing Method: Tape Reel
• Type / Mounting: Surface Mount

Description: Body Features Connector Profile : Standard PCB Retention Feature Material : Copper Alloy PCB Retention Feature Plating Material : Tin-Lead over Nickel Primary Product Color : Black

• Contact Plating: Gold Plating, Other
• Contacts Pitch: 1.27 mm
• Current Rating: 0.5000 amps
• Dielectric Withstanding Voltage: 0.3000 kilovolts

Description: ] Mating Tab Width : .5 MM [.02 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead Terminal Type : Tab Dimensions PCB Hole Diameter (MM

• Applications / Industry: Motor
• Length: 0.3504 inch
• OD / Width : 0.0197 inch
• Plating / Coating: Tin, Specialty / Other

Description: Body Features Connector Profile : Standard Frame Style : Ladder, Open Sleeve Material : Brass Sleeve Plating Material : Tin-Lead Configuration Features

• Contact Plating: Gold Plating, Other
• Contact Resistance: 1.00E10 milliohms
• Contacts Pitch: 2.54 mm
• Current Rating: 3 amps

Description: Body Features Connector Profile : Standard Frame Style : Ladder, Open Sleeve Material : Brass Sleeve Plating Material : Tin-Lead Configuration Features

• Contact Plating: Gold Plating, Other
• Contact Resistance: 1.00E10 milliohms
• Contacts Pitch: 2.54 mm
• Current Rating: 3 amps

Description: Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Changes with respect to the previous

Description: Mounting Type: Through Hole Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead

• Contact Plating: Gold Plating, Other
• Mounting: Through-hole, Other
• Operating Temperature: -65 to 105 C
• Product Type: IC Headers

Description: number 864-0713 has board locks for PCB mount retention. Number of Contacts = 5 Body Orientation = Straight Mounting Type = Through Hole Contact Plating = Tin Lead Alloy over Nickel Contact Material = Brass Voltage Rating = 50 V dc

• Contact Plating: Nickel Plating, Other
• Mounting: Through-hole
• Number of Contacts: 5
• Product Type: IC Headers

Description: F connectors have been a standard for the CATV industry for over thirty years. Bodies are nickel-plated with either Delrin or Teflon insulators. Center contacts are available in either gold or tin-lead plating. All connectors are 75 Ohm impedance.

• Gender: Female / Jack
• Geometry: Right Angle

Description: USB, Power USB, Input Output Connector, Receptacle, Through Hole, 8 Pins, Shield with Tin/Lead over Ni Plating, 3 amps, 24Volts, Red Housing, Amphenol is one of the leading manufacturers of Powered USB. Contact us today for more details of USBpluspwr, part number 10135709-601LF.

• Geometry: Right Angle