Wafer Loader

Description: wafer size - Version 1: 2" - 6" - selectable Version 2: 3" - 8" - selectable wafer type - OF - OK notch - option material - silicon - OK compound wafer - option single element wafer - option SOI - option others - option load / unload - cassettes* - 4 to 8 non

• Applications: Semiconductor Wafers

Description: -section profile after processing for feedback correction of the processing data. Basic CVP Specifications Wafer type: Notch Wafer Size: 12 in or 8 in (selectable) Loading/Unloading: 8-cassette or 2 dry stacks to 6-cassette or 4-cassette (or 2-casstte

• Applications: Semiconductor Wafers
• Maximum Wafer / Part Size: 50.8 to 203 mm
• Mounting / Loading: Manual Loading

Description: The NWL200 series is the first lineup of wafer loaders for inspection microscopes capable of loading 100 micron thin wafers. Thanks to a new chuck system, the NWL200 series achieves highly reliable loading suitable for inspection of next-generation semiconductors.

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System, Other
• Maximum Wafer / Part Size: 200 mm
• Measurement Capability: Defects / ADC

Description: SemiProbe IRIS inspection systems inspect, locate and identify defects created during wafer manufacturing, probing, bumping, dicing or general handling, providing microelectronic device manufacturers with accurate, timely quality assurance and process information. The IRIS inspection system

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System
• Measurement Capability: Defects / ADC, Electrical Test - Parametric / In-line, Particle Contamination

Description: High Precision Zirconia Ceramic Wafer Support Loader Zirconia Ceramic Wafer Carrier Support is highly precision machinind by flapping machine and CNC machined . It is used on the photovaltaic equipment machine to carry the wafer in semiconductor industry . Zirconia

• Compressive / Crushing Strength: 362592 psi
• Density: 6.02 g/cc
• MOR / Flexural Strength: 174044 psi
• Material Type: Zirconia, Specialty Ceramic

Description: Benchtop, automated Thickness measurement systems Cassette to cassette or manual loading Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution) Wafer 2” to 4” (50 to 100mm). Thickness range: 50um to 3mm

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 50 to 100 mm
• Measurement Capability: Thickness - Wafer / Disc (TTV)

Description: Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm. Dual white light chromatic coding probe technology with 10nm resolution Thickness range from 50um to 1mm Automated

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 156 mm
• Measurement Capability: Thickness - Wafer / Disc (TTV)

Description: The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness, thickness variation,

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System, Sensor / Sensing Element
• Maximum Wafer / Part Size: 300 mm

Description: Benchtop, Manual Thickness measurement system Patented sensing technology with APBP (dual automated positioning backpressure probes) (20nm resolution). Samples 2” to 12” (50 to 300mm) Thickness range: 20um to 5mm Automated calibration All materials, all type of surfaces Options Dual probes Vacuum

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 50 to 300 mm
• Measurement Capability: Thickness - Wafer / Disc (TTV)

Description: Automated Thickness measurement system IR interferometry probe technology. Single or dual probes. Manual Loading 0.5um accuracy. 0.1um resolution Wafer 4" to 12" (100 to 300mm) round or square Thickness range: 20um to 1mm Flexible recipe

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 100 to 300 mm
• Measurement Capability: Shape / Flatness, Thickness - Wafer / Disc (TTV)

Description: This manually-loaded particle deposition system deposits PSL and SiO2 spheres as small as 10 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom wafer calibration standards. Manual loading allows

• Applications: Semiconductor Wafers, CVD / PVD Films
• Form Factor: Other
• Maximum Wafer / Part Size: 150 to 300 mm
• Mounting / Loading: Manual Loading

Description: This manually-loaded particle deposition system deposits PSL and SiO2 spheres as small as 20 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom wafer calibration standards. Manual loading allows

• Applications: Semiconductor Wafers, CVD / PVD Films
• Form Factor: Other
• Maximum Wafer / Part Size: 150 to 300 mm
• Mounting / Loading: Manual Loading

Description: -cost, manual-load tabletop systems to fully automated standalone cassette-to-cassette tools. If you are searching for the next generation in thickness metrology, then look no further than the Filmetrics F80. The F80 is the tool CMP, CVD, PVD and Wafer Track Process Engineers have been

• Applications: Semiconductor Wafers, CVD / PVD Films
• Area Mapping: Yes
• Form Factor: Monitor / Instrument
• Mounting / Loading: In-situ / System Mounted

Description: Quartz boat is a loader which can be inserted by silicon wafer. So it is applied in semiconductor area. The cleaning process for quartz boat is very strictly. The boat should be dipped in concentration of 4-5% HF solutions keeped for 4 hours. Then soaked in DI water for 1 hours. Quartz

• Glass Type: Quartz
• Shape / Form: Fabricated / Custom Shape, Specialty / Other

Description: The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System, Sensor / Sensing Element
• Maximum Wafer / Part Size: 76 to 300 mm

Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 10 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic wafer

• Applications: Semiconductor Wafers, CVD / PVD Films
• Form Factor: Other
• Maximum Wafer / Part Size: 200 to 300 mm
• Mounting / Loading: Floor Mounted / Stand-alone

Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 20 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic wafer

• Applications: Semiconductor Wafers, CVD / PVD Films
• Form Factor: Other
• Maximum Wafer / Part Size: 200 to 300 mm
• Mounting / Loading: Floor Mounted / Stand-alone

Description: Manual Prober for contacting of active devices on both sides of the wafer. Precision controls enable the user to probe from the top side of the wafer, the bottom side of the wafer, or to simultaneously probe the top and bottom sides of the wafer.

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System
• Maximum Wafer / Part Size: 100 to 200 mm

Description: Features high-temperature ceramic low-noise probes

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System
• Maximum Wafer / Part Size: 200 mm
• Measurement Capability: Electrical Test - Parametric / In-line

Description: Designed specifically for DC/CV parametric measurement applications

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System
• Maximum Wafer / Part Size: 150 mm
• Measurement Capability: Electrical Test - Parametric / In-line

Description: Features high-temperature ceramic low-noise probes

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System
• Maximum Wafer / Part Size: 200 mm
• Measurement Capability: Electrical Test - Parametric / In-line

Description: this projects , we have made a 99% alumina horizontal wafer boat , it is for wafer diameter 75~80mm . Horizontal wafer boat made of 99% alumina ceramic 99% alumina ceramic Vertical wafer boat we have made Zirconia wafer carrier to load silicone wafer

• Material Type: Carbide Materials, Silicon Carbide
• Shape / Form: Fabricated / Custom Shape

Description: ' nPlace? wafer transfer system, an automatic robot system. This system features interchangeable wafer chucks and a 25 piece loading capacity. Please see Nanotronics' web site for a video demonstration of the nPlace in action.

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System
• Measurement Capability: Defects / ADC
• Mounting / Loading: Manual Loading

Description: 150 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages, chucks,

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System
• Maximum Wafer / Part Size: 150 mm
• Measurement Capability: Electrical Test - Parametric / In-line

Description: 300 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages, chucks,

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System
• Maximum Wafer / Part Size: 300 mm
• Measurement Capability: Electrical Test - Parametric / In-line

Description: thickness: 1.2mm Automatic workpiece loading and unloading Processing method: Backside cutting Cutting speed: 0-800mm/s Cutting line width: <5µm Dicing street width: =300µm Positional accuracy: ±10µm (between parallel lines) Applicable workpiece materials: Transparent materials such as coated

• Laser Output Power: 0.0 to 1 watts
• Materials Processed: Metal / Conductive Materials, Semiconductors / Electronics, Soft / Fibrous (Wood, Foams, Textiles)
• Unit Type: Work Station

Description: wafer handling system DOA equipment integrated wafer loading & unloading, unloading the wafers from the Ceramic boat to the cassette or loading the wafers from the cassette to the ceramic boat. Available for double back-to-back wafers in one slot

• Compressive / Crushing Strength: 290074 psi
• Density: 6 g/cc
• MOR / Flexural Strength: 116029 psi
• Material Type: Zirconia, Specialty Ceramic

Description: -quality images using basic features, and offers the market's fastest loading and imaging time. The reliable autofocus and source alignment make this the most user-friendly system on the market. The Phenom Pure is the most economic and efficient tool for high-resolution imaging. Its worry

• Applications: Semiconductor Wafers, CVD / PVD Films, Packaged ICs / Ceramic Substrates
• Area Mapping: Yes
• FIB / Ion Mill: Yes
• Form Factor: Monitor / Instrument

Description: available for facilitating the fast loading of any sample into the Phenom. From long axial-shaped samples to moist biomaterials, there is always a suitable container for the sample that needs to be analyzed. The Phenom Pro is a complete and ready-to-go system. The imaging unit, the 19'

• Applications: Semiconductor Wafers, CVD / PVD Films, Packaged ICs / Ceramic Substrates
• Area Mapping: Yes
• FIB / Ion Mill: Yes
• Form Factor: Monitor / Instrument

Description: and allows automatic loading and unattended operation. This fast, accurate, easy-to-use instrument has robust hardware and powerful analytical software to achieve low detection limits. The Multi-Channel Acquisition resolution provides superior peak-to-background ratio for improved detector

• Applications: Semiconductor Wafers, CVD / PVD Films, Electroplated Films
• Form Factor: Monitor / Instrument
• Measurement Capability: Composition
• Mounting / Loading: Floor Mounted / Stand-alone, Manual Loading

Description: X-Calibur SDD Bench Top EDXRF Spectrometer versatile, high energy resolution Our X-Calibur SDD EDXRF spectrometer features similar configuration like X-Calibur but with Silicon Drift Detector. Thanks to SDD high count rates the instrument improves its response time thus minimizing down time. The SDD

• Applications: Semiconductor Wafers, CVD / PVD Films, Electroplated Films
• Form Factor: Monitor / Instrument
• Measurement Capability: Composition
• Mounting / Loading: Floor Mounted / Stand-alone, Manual Loading

Description: RoHS Vision The Fast and Easy Method for Ensuring Compliance with Regulations for Hazardous Substances The Restriction of Hazardous Substances Directive (RoHS) restricts toxic metals in electrical and electronic equipment. Xenemetrix’s new RoHS Vision uses a high resolution detector, a software

• Applications: Semiconductor Wafers, CVD / PVD Films, Electroplated Films
• Form Factor: Monitor / Instrument
• Measurement Capability: Composition
• Mounting / Loading: Floor Mounted / Stand-alone, Manual Loading

Description: X-PMA Precious Metals EDXRF Spectrometer fast, accurate, easy to use XRF is a non-destructive analytical technique that can rapidly and easily identify and determine the presence of various elements such as gold, platinum, silver and other precious metals present in solid, powdered and liquid

• Applications: Semiconductor Wafers, CVD / PVD Films, Electroplated Films
• Form Factor: Monitor / Instrument
• Measurement Capability: Composition
• Mounting / Loading: Floor Mounted / Stand-alone, Manual Loading

Description: The Phenom ProX desktop scanning electron microscope is the ultimate all-in-one imaging and X-ray analysis system. With the Phenom ProX desktop SEM, sample structures can be physically examined and their elemental composition determined. Viewing three-dimensional images of microscopic structures

• Applications: Semiconductor Wafers, CVD / PVD Films, Packaged ICs / Ceramic Substrates
• Area Mapping: Yes
• FIB / Ion Mill: Yes
• Form Factor: Monitor / Instrument

Description: The APM650™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral precision. Powerful

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Depth Profiling: Yes
• Form Factor: Monitor / Instrument

Description: Adjustable Oscillating Spray Nozzles & Pressures Manual Wafer Loading or Automated Transfer Precision Distance Control Between nozzles & Water Chemical mixing/Blending to .02 ml accuracy Chemical Dispense & Recycling Precision wafer speed control from 1 rpm to 6,000 rpm with a

Description: Loading or Automated Transfer Precision Distance Control Between nozzles & Water Chemical mixing/Blending to .02 ml accuracy Chemical Dispense & Recycling Precision wafer speed control from 1 rpm to 6,000 rpm with a repeatability of .2 rpm.Multi Substrate Size Capability

Description: Capacitive Miniature Proximity Sensors - WAFER HOUSING The wafer design is basically the size of a thick coin, a great solution for applications where sensor body length is a concern. Housing sizes of 18mm, 22mm, and 30mm Sensing distances from 4mm to 10mm

• Body: Other
• DC Load: 3-Wire NPN, 3-Wire PNP
• Load: DC Load
• Operating Distance: 0.1575 to 0.3937 inch

Description: Overview The SST 3250 is a high vacuum multi-atmosphere furnace that has been designed for soldering and bonding components and wafers up to 8-inch (200 mm) diameter. The system is fully operational at vacuum levels of 10-7 Torr and pressures up to 12 psig with automatic

• Application: Brazing / Soldering, Curing, Industrial, Other
• Computer Interface: Yes
• Configuration: Top Loading
• Controller Type: Programmable

Description: Baumer’s innovative photoelectric sensors have been successfully employed for years in numerous industrial fields, where they can securely solve even the trickiest detection and measurement problems. A wide variety of employed sensor technologies forms the basis for an extremely broad area of

• Body: Rectangular
• Load: DC Load
• Operating Distance: 4.84 to 5.63 inch
• Operating Temperature: 23 to 122 F

Description: The MSA-500 Micro System Analyzer is the premier measurement technology for the analysis and visualization of structural vibrations and surface topography in micro structures such as MEMS (Micro-Electro-Mecha nical Systems) devices. By fully integrating a microscope with Scanning Laser-Doppler

• Applications: Other
• Form Factor: Sensor / Sensing Element
• Measurement Capability: Roughness / Waviness, Shape / Flatness, Other
• Mounting / Loading: Manual Loading

Description: Four Point Probe Automatic Resistivity Meter Easy to operate: simply load the wafer and close the lid. Automatic calculation and display of sheet or slice resistivity, V/I, metallization thickness, and P-N type. Ideal for epitaxial, diffused, ion implanted, and

Description: retrieval of wafers to begin analysis. The Prior Scientific motorized Shuttle Stage is designed to be used with the Nikon and Olympus wafer loader systems for 3, 4, 6, and 8 inch wafers. The system greatly reduces operator fatigue while increasing inspection accuracy and

• Features: Programmable
• Lighting: Reflected Light
• Maximum X-Distance: 154 to 256 mm
• Maximum Y-Distance: 154 to 215 mm

Description: Whether processing 6", 8", or 12" wafers or a combination, JST can design an automated wet process tool to meet your needs. Multiple platforms are available as well as a combination acid and/or solvent tool.Multitasking is based on look ahead scheduling to ensure optimal throughput. Just

Description: TC-300 Series Thermostatic Wafer Steam Trap Carbon Steel For pressures to 250 psig (17 bar) . . . Cold water start-up capacities to 1,000 lb/hr (454 kg/hr) The TC-300 is sized precisely to handle the extremely low condensate load found in most instrument

• Connection Style: Socket Weld / Tube, Flanged, Threaded
• Material: Steel - Stainless
• Maximum Capacity: 1000 lbs/hr
• Maximum Operating Pressure: 250 psi

Description: Industrial design for high performance and high load With the V-817, PI has a linear stage in its portfolio for industrial solutions that has a high load capacity and high dynamics. Its design is consistently geared to demanding industrial conditions and it is characterized by high

• Stroke or X-Axis Travel: 24.02 to 32.01 inch

Description: Zero-Max's New ServoClass Couplings are specifically designed to meet the precision positioning requirements and high reverse-load characteristics common to many of today's AC and DC servomotor applications. Aided by Finite Element Analysis, the flexible discs accommodate higher torque

• Angular Misalignment: 1 degrees
• Axial Misalignment: 0.0350 inch
• Bore Diameter: 0.6250 inch
• Coupling Diameter: 2.68 inch

Description: The GANB012-040CBA is a 40 V, 12 mO bi-directional Gallium Nitride (GaN) High Electron-Mobility-Tr ansistor (HEMT) in a Wafer Level Chip-Scale (WLCSP) package. It is a normally-off e-mode device offering superior performance. Features and benefits Enhancement mode

• Package Type: Other

Description: Some couplings are too stiff radially; they resist misalignment and thus overload bearings. Low Wind-Up and low Radial Loads are almost mutually exclusive. and always a compromise. The best compromise is found in flexible disc couplings-where rotational position is transmitted by means of

• Angular Misalignment: 3 degrees
• Coupling Diameter: 1.5 inch
• Coupling Length: 2.63 inch
• Coupling Type: Wafer / Flexible Disc

Description: misalignment. Torsional rigidity. Uniform velocity. No friction. wear. or lubrication. Long life. Low side loads on bearings. Accurate concentricity. Unaffected by dust or corrosive atmosphere. Available in four O.D. sizes. and any bore in inch or metric.

• Bore Diameter: 0.1200 to 0.1250 inch
• Coupling Diameter: 0.7500 inch
• Coupling Type: Wafer / Flexible Disc
• Rated Speed: 5000 rpm

Description: angular misalignment. Torsional rigidity. Uniform velocity. No friction. wear. or lubrication. Long life. Low side loads on bearings. Accurate concentricity. Unaffected by dust or corrosive atmosphere. Available in four O.D. sizes. and any bore in inch or metric.

• Bore Diameter: 0.1562 to 0.1850 inch
• Coupling Diameter: 1 inch
• Coupling Type: Wafer / Flexible Disc
• Rated Speed: 5000 rpm

Description: offset and angular misalignment. Torsional rigidity. Uniform velocity. No friction. wear. or lubrication. Long life. Low side loads on bearings. Accurate concentricity. Unaffected by dust or corrosive atmosphere. Available in four O.D. sizes. and any bore in inch or metric.

• Bore Diameter: 0.4531 to 0.4687 inch
• Coupling Diameter: 1.5 inch
• Coupling Type: Wafer / Flexible Disc
• Rated Speed: 5000 rpm