Wafer Prober

Description: Designer for laboratory testing and sampling, Technic’s portable tabletop wafer plating test cell features all the tools needed to simulate full scale production. Specifications 16” long, 12” wide, 14” deep constructed from

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System
• Measurement Capability: Electrical Test - Wafer Sort / Functional

Description: The wafer surface inspection system LS series can detect defects on unpatterned wafers with a mirror-finished surface. Applied technology of laser scattering achieves high sensitivity and high throughput detection of small contaminants and various types of defects on wafer

• Form Factor: Wafer Probing System
• Mounting / Loading: Floor Mounted / Stand-alone

Description: Designed specifically for DC/CV parametric measurement applications

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System
• Maximum Wafer / Part Size: 150 mm
• Measurement Capability: Electrical Test - Parametric / In-line

Description: The ONLY production vacuum probing system designed to grow with your requirements and your business. • Probing modules can be added or exchanged with no interruption to your test operation • Ideal for MEMS, Microbolometers, or any product that is vacuum packaged.

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System
• Maximum Wafer / Part Size: 150 to 200 mm

Description: Manual Prober for contacting of active devices on both sides of the wafer. Precision controls enable the user to probe from the top side of the wafer, the bottom side of the wafer, or to simultaneously probe the top and bottom sides of the wafer.

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System
• Maximum Wafer / Part Size: 100 to 200 mm

Description: SemiProbe IRIS inspection systems inspect, locate and identify defects created during wafer manufacturing, probing, bumping, dicing or general handling, providing microelectronic device manufacturers with accurate, timely quality assurance and process information. The IRIS

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System
• Measurement Capability: Defects / ADC, Electrical Test - Parametric / In-line, Particle Contamination

Description: The XE-WAFER is a fully automated industrial AFM designed specifically to address surface roughness, trench width, depth, and angle measurements on 200mm & 300mm wafers in a production environment. The system provides superior accuracy and precision nanometrology over any other system

• Application: Semiconductor Inspection
• Scanning Probe Microscope Type: AFM

Description: The ESPion advanced Langmuir probe for rapid, reliable and accurate plasma diagnostics for industry and academia.

• Applications: Etching - Plasma / Wet, Other
• Form Factor: Controller, Wafer Probing System
• Measurement Capability: Deposition Rate
• Mounting / Loading: In-situ / System Mounted

Description: SA-8VP Semiautomatic Vacuum Probing System The ONLY vacuum probing system designed to grow with your requirements and your business Easily customized to meet a variety of applications and budgets Ideal for MEMS, Sensors, Switches, Microbolometers, or any product that is

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System
• Maximum Wafer / Part Size: 200 mm

Description: The NWL200 series is the first lineup of wafer loaders for inspection microscopes capable of loading 100 micron thin wafers. Thanks to a new chuck system, the NWL200 series achieves highly reliable loading suitable for inspection of next-generation semiconductors. Improved wafer

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System, Other
• Maximum Wafer / Part Size: 200 mm
• Measurement Capability: Defects / ADC

Description: The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness, thickness variation,

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System, Sensor / Sensing Element
• Maximum Wafer / Part Size: 300 mm

Description: Automated Thickness measurement system IR interferometry probe technology. Single or dual probes. Manual Loading 0.5um accuracy. 0.1um resolution Wafer 4" to 12" (100 to 300mm) round or square Thickness range: 20um to 1mm Flexible recipe

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 100 to 300 mm
• Measurement Capability: Shape / Flatness, Thickness - Wafer / Disc (TTV)

Description: Built-in anti-vibration support

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System
• Maximum Wafer / Part Size: 300 mm
• Measurement Capability: Electrical Test - Parametric / In-line

Description: Benchtop, automated Thickness measurement systems Cassette to cassette or manual loading Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution) Wafer 2” to 4” (50 to 100mm). Thickness range: 50um to 3mm

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 50 to 100 mm
• Measurement Capability: Thickness - Wafer / Disc (TTV)

Description: Automated Thickness measurement system Cassette to cassette or manual loading. Patented sensing technology with APBP (dual automated positioning backpressure probes). Manual Loading 20mm resolution Wafer 2" to 12" (50 to 300mm) round or square

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 50 to 300 mm
• Measurement Capability: Shape / Flatness, Thickness - Wafer / Disc (TTV)

Description: Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm. Dual white light chromatic coding probe technology with 10nm resolution Thickness range from 50um to 1mm Automated

• Applications: Semiconductor Wafers
• Form Factor: Monitor / Instrument
• Maximum Wafer / Part Size: 156 mm
• Measurement Capability: Thickness - Wafer / Disc (TTV)

Description: Temptronic ThermoChucks are conductive heating and cooling systems for wafer testing at temperature. Its primary use is for wafer testing in Probe Stations, as well as Laser Trim and Wafer Burn-in. A few specialized applications include Low leakage probing (fA

Description: Ozone generators can be sold individually or as a system. Applied Science and Technology (ASTeX).

Description: Features high-temperature ceramic low-noise probes

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System
• Maximum Wafer / Part Size: 200 mm
• Measurement Capability: Electrical Test - Parametric / In-line

Description: Features high-temperature ceramic low-noise probes

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System
• Maximum Wafer / Part Size: 200 mm
• Measurement Capability: Electrical Test - Parametric / In-line

Description: Guide for Standard Probe Pad Sizes and Layouts for Wafer-Level Electrical Testing

Description: STANDARD METHOD FOR MEASURING RESISTIVITY OF SILICON WAFERS USING A SPREADING RESISTANCE PROBE

Description: The Wentworth MP-926 is a manual probe station that accepts wafers up to 6 inches in diameter. It features a rugged and stable cast aluminum base. It also has a generous platen work area for mounting manipulators. It is a "chuck above platen" probe station design.

Description: electrical ground resulting in exceptional accuracy and repeatability for most wafer types. The Proforma 300i system includes full remote control operating software and Ethernet network interface capability. *Gallium-Arsenide requires probe reconfiguration for semi-insulating materials

• Applications: Semiconductor Wafers
• Area Mapping: Yes
• Form Factor: Wafer Probing System, Sensor / Sensing Element
• Maximum Wafer / Part Size: 76 to 300 mm

Description: Ask for current price. The 6100 Model is an economical analytical probe station for wafers or packaged devices. Fast X-Y stage movement controls allows 5" wafers (6" optional) to be scanned. Conversation from a wafer prober to a packaged device prober or

Description: Standard Test Method for Measuring Resistivity of Silicon Wafers Using a Spreading Resistance Probe

Description: Testing Method of Resistivity for Silicon Crystals and Silicon Wafers with Four-Point Probe

Description: Features of the Model FWPX Large-size wafer probe station Largest wafer sample size: 4 in Sample translation for rapid probing Customizable to accept 6 in wafers Lake Shore’s FWPX probe station is designed for researchers who require large

• NDT Probe Technology: Magnetic / Hall Effect
• Special Features: Array

Description: The Nanotronics Imaging nSpec® is an inspection device designed for high resolution microscopy and detection of wafer defects. With particular application in silicon carbide and Galium Nitride epi wafers, the nSpec® offers fast quantification and qualification of defects

• Applications: Semiconductor Wafers
• Form Factor: Wafer Probing System
• Measurement Capability: Defects / ADC
• Mounting / Loading: Manual Loading

Description: The Volta Series Probe Head addresses a need for reduced test time set-up and increased throughput in high reliability testing of Wafer Level Packages (WLP), Wafer Level Chip Scale Packages (WLCSP) and Known Good Die (KGD) at 180 µm pitch and higher. Features & Benefits

Description: cool-down Customizable for sample transfer with no exposure to atmosphere Customizable to accommodate a 4 in wafer With a modular design to meet the needs of a breadth of experiments, the Model CPX is Lake Shore’s most versatile, high-performance cryogenic probe

• NDT Probe Technology: Magnetic / Hall Effect
• Special Features: Array

Description: helium or liquid nitrogen. The TTPX operates over a temperature range of 4.2 K to 475 K with options to extend as low as 3.2 K or to a higher range of 20 K to 675 K. This model accommodates full and partial wafers up to 51 mm (2 in) in diameter. A wide selection of probes, cables,

• NDT Probe Technology: Magnetic / Hall Effect
• Special Features: Array

Description: -VF is one of Lake Shore’s premium probe stations for combining microwave measurements with magnetic field. The CPX-VF is designed to enable true 90° wafer probing on wafers up to 51 mm (2 in) in diameter. The sample can be maintained at elevated temperature during

• NDT Probe Technology: Magnetic / Hall Effect
• Special Features: Array

Description: MERMAID is a unique measurement instrument for analysis of liquid and thin film properties using magnetoelastic resonance (MER) sensors. Dynamic events such as viscosity change, phase transitions or bio film growth can be analyzed. The MER sensor can measure properties of either a coating on top of

• Applications: CVD / PVD Films, Polymers / Photoresists, Other
• Form Factor: Wafer Probing System, Sensor / Sensing Element
• Measurement Capability: Deposition Rate, Endpoint Detection / Plasma Diagnostics, Thickness - Film / Layer, Other
• Mounting / Loading: In-situ / System Mounted, Floor Mounted / Stand-alone

Description: a portable USB spectrometer coupled to a reflectance probe and light source. The optical properties are obtained from reflection and thickness is measured by detecting the sinusoidal fringe pattern from the sample's specular reflectance. Several spectrometer models are available to suit your

• Applications: Semiconductor Wafers, CVD / PVD Films, Data Storage / Memory, Flat Panel Displays, Optical Components , Polishing / CMP, Polymers / Photoresists, Other
• Form Factor: Monitor / Instrument
• Measurement Capability: Thickness - Film / Layer, Thickness - Wafer / Disc (TTV)
• Mounting / Loading: In-situ / System Mounted

Description: from about 0.24 to about 330 [omega][dot]cm in -type wafers). 1.2 This test method requires the formation of a Schottky barrier diode with a mercury probe contact to an epitaxial or polished wafer surface. Chemical treatment of the silicon surface may be required to produce a

Description: carriers/cm (resistivity range from about 0.1 to about 100 O-cm in n-type wafers and from about 0.24 to about 330 O-cm in p-type wafers). 1.2 This test method requires the formation of a Schottky barrier diode with a mercury probe contact to an epitaxial or polished wafer

Description: carriers/cm 3 (resistivity range from about 0.1 to about 100 O·cm in n-type wafers and from about 0.24 to about 330 O·cm in p-type wafers). 1.2 This test method requires the formation of a Schottky barrier diode with a mercury probe contact to an epitaxial or polished

Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This test method covers the measurement of the resistivity of silicon wafers with a in-line four-point probe. The resistivity of a silicon crystal is an important materials acceptance requirement. This test method

Description: Applies to double- and single-column arrays of metal probe pads, on a semiconductor wafer or chip, that are electrically connected to one or more test structures.

Description: The CHRocodile DW optical sensor works with infrared light and was specifically optimized for easy gauge measuring for highly-remunerated wafers. Additional application areas are the gauge measurement of visual opaque as well as transparent plastics. The interferometric measuring procedure

Description: Ultra Low tip force of 0.03 to 0.06 N 10 mm Measuring Range Nylon and Ruby tips available Pneumatic or Spring actuation IP50 Sealing The Ultra Feather Touch probe has so light a tip force, it is a viable alternative to a non-contact sensor