Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: CoorsTek
Description: Precision ceramic components improve durability and handling of wafer stages and tables used during inspection and processing. CoorsTek components and tables provide precise dimensional stability, ultra-flatness and smoothness, and vacuum holding of wafers during
- Applications: Wear Parts / Tooling, Other
- Shape / Form: Fabricated / Custom Shape, Wafer Carrier / Holder
-
Supplier: CoorsTek
Description: Chemical Mechanical Planarization (CMP) wafer polishing tables and plates require strong abrasion, corrosion resistance, and extreme stiffness to produce pristine flat, polished surfaces. CoorsTek CeraSiC and UltraSiC™ Direct Sintered Silicon Carbide (SiC) components deliver this high
-
Supplier: SemiProbe
Description: 150 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages, chucks,
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 150 mm
- Measurement Capability: Electrical Test - Parametric / In-line
-
-
Supplier: SemiProbe
Description: 300 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages, chucks,
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 300 mm
- Measurement Capability: Electrical Test - Parametric / In-line
-
Supplier: SemiProbe
Description: 200 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages, chucks,
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 200 mm
- Measurement Capability: Electrical Test - Parametric / In-line
-
Supplier: SemiProbe
Description: 100 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages, chucks,
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 100 mm
- Measurement Capability: Electrical Test - Parametric / In-line
-
Supplier: Jiangyin Deli Laser Solutions Co., Ltd.
Description: We are experienced of all kinds of vacuum chuck for automation and mechinery industries,especiall y these with glass, quartz and ceramics material. With glass or quartz transparent material, the light could transmits from bottom, or the designer could put CCD under the table for alignment
- Chuck Geometry: Round
- Materials of Construction: Ceramic, Other
- Type: Vacuum Chuck
-
Supplier: PI (Physik Instrumente) L.P.
Description: efficiency and safety during operation. Application fields Optical alignment, wafer inspection, wafer alignment, measuring technology, inspection systems, calibration, scanning. Thanks to the friction-free motion, no particles are formed, which makes PIglide stages ideal for
- Design Units: Metric
- Load Capacity: 8.99 to 270 lbs
- Shape: Flat, Rectangular / Square
-
Supplier: CSA Group
Description: IEC 62276:2016 applies to the manufacture of synthetic quartz, lithium niobate (LN), lithium tantalate (LT), lithium tetraborate (LBO), and lanthanum gallium silicate (LGS) single crystal wafers intended for use as substrates in the manufacture of surface acoustic wave (SAW) filters and
-
Supplier: PI (Physik Instrumente) L.P.
Description: systems, wafer metrology, wafer inspection, measuring technology, inspection systems, calibration, scanning. Thanks to the friction-free motion, no particles are formed, which makes PIglide stages ideal for cleanroom applications. 3-Phase torque motor Brushless
- Load Capacity: 42.71 to 173 lbs
- Maximum Torque: 345 to 752 In-lbs
- Rotary Velocity / Speed: 3000 deg/sec
- Stage Type: Rotary Positioning
-
Supplier: PI (Physik Instrumente) L.P.
Description: systems, wafer metrology, wafer inspection, measuring technology, inspection systems, calibration, scanning. Thanks to the friction-free motion, no particles are formed, which makes PIglide stages ideal for cleanroom applications. 3-Phase torque motor Brushless
- Design Units: Metric
- Load Capacity: 42.71 to 173 lbs
- Shape: Flat, Round
-
Supplier: ATV Technologie GmbH
Description: Ever since its introduction in 1989 ATV’s Single Process Chamber approach has built a strong reputation in the R&D and pilot line production market. The SRO-700 table top IR vacuum reflow oven is the essential entry level reflow soldering oven capable of fulfilling all your basic
- Configuration: Bench / Cabinet
- Temperature Range: 450 to 700 F
-
Supplier: PI (Physik Instrumente) L.P.
Description: wafer inspection, fiber positioning, optics positioning, flat screen inspection, maskless lithography, and ultra-LED manufacturing. The noncontact design is ideal for cleanroom applications.
- Design Units: Metric
- Load Capacity: 17.64 lbs
- Shape: Flat, Round
-
Supplier: Newport MKS
Description: acceleration amplitudes produced by very high throughput stages used in wafer positioning, inspection and electronic manufacturing applications. NewDamp elastomers can be built into equipment isolation supports and even custom machinery feet. Superior Constant Natural Frequency (CNF) Design
- Features: Vibration Isolation
- Type: Optical Table
-
Supplier: Newport MKS
Description: acceleration amplitudes produced by very high throughput stages used in wafer positioning, inspection and electronic manufacturing applications. NewDamp elastomers can be built into equipment isolation supports and even custom machinery feet. Superior Constant Natural Frequency (CNF) Design
- Features: Vibration Isolation
- Type: Optical Table
-
Supplier: Newport MKS
Description: produced by very high throughput stages used in wafer positioning, inspection and electronic manufacturing applications. NewDamp elastomers can be built into equipment isolation supports and even custom machinery feet. Superior Constant Natural Frequency (CNF) Design ND20 Natural
- Features: Vibration Isolation
- Type: Optical Table
-
Supplier: Newport MKS
Description: acceleration amplitudes produced by very high throughput stages used in wafer positioning, inspection and electronic manufacturing applications. NewDamp elastomers can be built into equipment isolation supports and even custom machinery feet. Superior Constant Natural Frequency (CNF) Design
- Features: Vibration Isolation
- Type: Optical Table
-
Description: IEC 62276:2016 applies to the manufacture of synthetic quartz, lithium niobate (LN), lithium tantalate (LT), lithium tetraborate (LBO), and lanthanum gallium silicate (LGS) single crystal wafers intended for use as substrates in the manufacture of surface acoustic wave (SAW) filters and
-
Supplier: Hitachi High-Tech America
Description: technique, offering easy-to-use, fast and non-destructive analysis, requiring little to no sample preparation, capable of analyzing solids or liquids over a wide element range from 13Al to 92U on the periodic table. FT160 High Resolution SDD
- Applications: Electroplated Films, Semiconductor Wafers
- Maximum Wafer / Part Size: 102 to 305 mm
- Measurement Capability: Composition, Thickness - Film / Layer
- Mounting / Loading: Manual Loading
-
Supplier: Primatics, Inc.
Description: Primatics PDR210 rotary tables are among the most advanced direct drive tables available. They feature a high performance direct drive motor that creates sub arc-second repeatability and fast settling times, making the PDR series ideal for semiconductor wafer inspection, high
- Drive Mechanism: Direct Drive
- Drive Type: Brushless Servo
- Features: Center Bore
- Load Capacity: 66.15 lbs
-
Supplier: Primatics, Inc.
Description: Primatics PDR160B rotary tables are among the most advanced direct drive tables available. They feature a high performance direct drive motor that creates sub arc-second repeatability and fast settling times, making the PDR series ideal for semiconductor wafer inspection, high
- Drive Mechanism: Direct Drive
- Drive Type: Brushless Servo
- Features: Center Bore
- Load Capacity: 44.1 lbs
-
Supplier: Primatics, Inc.
Description: Primatics PDR110B rotary tables are among the most advanced direct drive tables available. They feature a high performance direct drive motor that creates sub arc-second repeatability and fast settling times, making the PDR series ideal for semiconductor wafer inspection, high
- Drive Mechanism: Direct Drive
- Drive Type: Brushless Servo
- Features: Center Bore
- Load Capacity: 22.05 lbs
-
Supplier: ASTM International
Description: 1.1 The purpose of this guide is to list, illustrate, and provide reference for various characteristic features and contaminants that are seen on highly specular silicon wafers. Recommended practices for delineation and observation of these artifacts are referenced. The artifacts described in
-
Supplier: Fountyl Technologies Pte. Ltd.
Description: guide rail, silicon carbide slide rail, silicon carbide vacuum suction cup, silicon carbide reflector, silicon carbide crossbeam, silicon carbide workpiece table, etc. the main function is to carry the wafer to perform high-speed ultra-precision motion along the designated movement
- Aluminum Oxide / Aluminate Type: Alumina / Aluminum Oxide
- Applications: Other
- Length: 62.99 inch
-
Supplier: DataPhysics Instruments USA Corp.
Description: and automated sample mapping. In order to map silicon wafers, electronic turn tables with vacuum fixation are available. They allow to access any position for contact angle measurements, even on 12? wafers. In any case, the 6.5-fold zoom lens and the high-performance camera with
- Property Analyzed: Wettability / Contact Angle
-
Description: IEC/TR 62258-4:2012 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers; - singulated bare die; - die and wafers with attached connection structures; - minimally or partially encapsulated die and wafers. This
-
Supplier: ASTM International
Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 The purpose of this guide is to list, illustrate, and provide reference for various characteristic features and contaminants that are seen on highly specular silicon wafers. Recommended practices for delineation and
-
Description: . This Standard Practice covers flangeless (wafer-type) and single flanged (lug-type) body designs, compatible with ASME B16.5 flanges for sizes NPS 3 (DN 80) through NPS 24 (DN 600) and ASME B16.47 Series A flanges for sizes NPS 30 (DN 750) through NPS 48 (DN 1200). Reference Tables 1
-
Description: perspective of a circuit designer. Variability usually refers to a large scale variation that can occur on a wafer to wafer and lot to lot basis, and over long distances on a wafer. This phenomenon is well understood and the effects of variability are included in most integrated
-
Supplier: Richardson RFPD
Description: Fully calibrated for Gain/Phase Matching Across ICs Extensive On-chip Temperature and Power Sensing On-chip Gain Control for Temperature Compensation High-Speed SPI with Large On-Chip Beam Table Storage Wafer-Level Chip-Scale Package (WLCSP) compatible with low-cost PCB manufacturing
- Device Type: Beamformers, Receiver
- Technology: GPS
-
Supplier: CSA Group
Description: 9.4); d) revised sour service requirements (Clause 13); e) revised Table 5 Ring and groove dimension C for PN 420 full-bore, NPS 2-1/2 valves; f) revised Table 8; and g) revised furnace calibration and survey requirements (Annex C). Scope 1.1 General This Standard
-
Supplier: CSA Group
Description: .4); d) revised sour service requirements (Clause 13); e) revised Table 5 Ring and groove dimension C for PN 420 full-bore, NPS 2-1/2 valves; f) revised Table 8; and g) revised furnace calibration and survey requirements (Annex C). Scope 1.1 General This Standard
-
Supplier: DataPhysics Instruments USA Corp.
Description: zoom lens and the reliable auto focus system by Data Physics Instruments, the OCA 200 is equipped to handle any kind of sample size from a macroscopic silicon wafer to the microscopic mesh structure of a coronary stent. In combination with the high-performance camera with USB 3 interface even
- Property Analyzed: Wettability / Contact Angle
-
Supplier: Palomar Technologies, Inc
Description: . Automated presentation of dual 8” wafers, or up to 72 wafflepacks, or tape dispensers provides a high production, flexible parts presentation platform. The 6 position, bi-directional tool turret allows “on-the-fly” tool changes to maximize speed and flexibility. A variety of
-
Supplier: Robuster Quartz
Description: boats. From thin-wall boiling and distilling flasks to heavy-wall diffusion tubes used to process semiconductor wafers at furnace temperatures in excess of 1300 degrees. Robuster Quartz offers custom fabrication of fused quartz products to customer specification and configuration Most
- Applications: Chemical / Materials Processing, Electrical / HV Parts, Specialty / Other
- Glass Type: Quartz
- Shape / Form: Rod Stock
- Width / O.D.: 0.0394 to 1.57 inch
-
Description: IEC TS 62915:2023 sets forth a uniform approach to maintain type approval, design and safety qualification of terrestrial PV modules that have undergone or will undergo modification from their originally assessed design. This document addresses two types of PV module technologies, wafer
-
Supplier: HG Optronics, Inc.
Description: widespread applications of lasers, including machining, material processing, spectroscopy, wafer inspection, light displays, medical diagnostics, laser printing, and data storage, etc. It has been shown that Nd:YVO4 based diode pumped solid state lasers are rapidly occupying the markets
- Damage Threshold: 750000 W/cm²
- Features: AR-Coated
- Material: Other / Specialty Material
- Optical Application: Infrared, Ultraviolet
-
Supplier: DigiPas Technologies Inc.
Description: Specification Measuring range: 90.000° ~ ±5.000° dual-axis Measurement Resolution Table: Vertical Stroke Length (mm) Resolution 50 1µm / 50mm 100 2µm / 100mm 150 3µm / 150mm 300 5µm / 300mm 400 7µm / 400mm
- Angular Range: 5 to 90 degrees
- Measuring Technology: Electronic
-
Supplier: ASTM International
Description: the surface of a circular silicon wafer having the opposite conductivity type from the thin layer to be measured or by the deposition of polysilicon over an insulating layer. Measurements are made at the center of the wafer using a single-configuration of the four-probe, that is, with
-
Supplier: ASTM International
Description: 1.1 This test method covers the direct measurement of the average sheet resistance of thin layers of silicon with diameters greater than 15.9 mm (0.625 in.) which are formed by epitaxy, diffusion, or implantation onto or below the surface of a circular silicon wafer having the opposite
-
Description: The m924 (4channel) and m922 (2channel) Semiconductor OEM modules are the newest Luxtron products for Etcher and Wafer Fab equipment temperature monitoring of Electrostatic Chucks, Chambers and other devices. The m920 Series modules are high performance solutions that are flexible, reliable
- Device Category: Sensor / Transducer
- Electrical Outputs: Current, Serial
- Operating Temperature: 32 to 140 F
- Technology: Optical Pyrometer
-
Supplier: DR. JOHANNES HEIDENHAIN GmbH
Description: shaft speeds and medium loads, with high to very high bearing accuracies as well as the highest degree of repeatability. They are suited to the specific requirements of metrology applications. Typical applications therefore include laser trackers for metrology, highprecision rotary tables in
- Electrical Output and Interface: Digital: Square Wave, Other
- Hollow Shaft: Yes
- Operating Temperature: 32 to 122 F
- Rotor Inertia: 0.0184 oz-in-sec²
-
Supplier: DR. JOHANNES HEIDENHAIN GmbH
Description: shaft speeds and medium loads, with high to very high bearing accuracies as well as the highest degree of repeatability. They are suited to the specific requirements of metrology applications. Typical applications therefore include laser trackers for metrology, highprecision rotary tables in
- Electrical Output and Interface: Digital: Square Wave, Other
- Hollow Shaft: Yes
- Operating Temperature: 32 to 122 F
- Rotor Inertia: 0.3965 oz-in-sec²
Find Suppliers by Category Top
Featured Products Top
-
, crossbeams, and wafer tables Supports high-speed, high-precision wafer motion in advanced lithography tools. Engineering & Manufacturing Advantages (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for Fountyl Technologies Pte. Ltd. -
-chip Temperature and Power Sensing • On-chip Gain Control for Temperature Compensation • High-Speed SPI with Large On-Chip Beam Table Storage • Wafer-Level Chip-Scale Package (WLCSP) compatible with low-cost PCB manufacturing • Support for Large-Scale Arrays through (read more)
Browse RF Modules Datasheets for Richardson RFPD -
working with thick silicon substrates that require extremely high geometric quality and defect-free surfaces. Thanks to their high processing speed, Marposs systems can monitor wafer processing directly inside CMP machines, even in challenging environments where slurry is present and the table (read more)
Browse Dimensional Gages and Instruments Datasheets for Marposs Corp -
specifications make them ideal for IGBT power modules, high-power heat sinks, and advanced wireless modules. Features High thermal conductivity Thermal expansion coefficient close to silicon wafer High strength and toughness (read more)
Browse Thermal and Refractory Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Thermal expansion coefficient close to silicon wafer High strength and toughness Application High power IGBT power module High power heat sink Wireless module Material Properties Table (read more)
Browse Ceramic Sheets and Boards Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Is This The Linear Motion Component You’re Using For Wafer Manufacturing We're not referring to linear bearings that incorporate ball bearings - meaning friction is reduced between moving parts by recirculating (usually metal) balls. We (read more)
Browse Crossed Roller Slides Datasheets for NB Corporation of America -
X&Y axis of work-table surface PERPENDICULARITY (when used in conjunction with DWL1500XY) and providing perpendicularity 3-Dimensional information SIMULTANEOUSLY in real-time on smartphone or tablet. The simultaneous display for dual-axis feature of Digi-Pas® DWL-1900XY master (read more)
Browse Levels Datasheets for DigiPas Technologies Inc. -
-power LEDs, and advanced heat dissipation components. Features • High thermal conductivity (170~230W/m.K), up to 9.5 times than alumina; • Thermal expansion coefficient close to silicon wafer, achieve high reliability of Silicon chip and thermal (read more)
Browse Ceramic Sheets and Boards Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
required to reach 10nm, the mask silicon wafer simultaneous step and scanning speed are 150nm/s and 120nm/s respectively, and the mask scanning speed is close to 500nm / s, And the workpiece table is required to have very high motion accuracy and stability. Schematic diagram of workpiece table and (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for 3X Ceramic Parts Company Limited -
highly reliable, with lifespans often exceeding the devices they power. Manufacturing Process Creating a microchip involves a meticulous and highly technical process. It starts with a wafer made from pure (read more)
Browse Microcontrollers (MCU) Datasheets for ODG (Origin Data Global)
Conduct Research Top
-
Why use Microporous Ceramic for Vacuum Chucks
Vacuum chucks are used in the thinning, dicing, cleaning, handling, and other processes of semiconductor electronic chips, like wafers. Why choose microporous ceramic vacuum chucks? 1. During the polishing and cleaning process of wafers, polishing liquid and water mist enter the working table
-
AN3018: Known Good Die Delivery Specification
2010, Class B criteria. Die will be delivered on wafer tape per Table 1. Unit of measure is die. Quantity per shipping container will vary. Noncompliant die will be identified per Table 4. Wafer Map Format * SEMI E142 compliant * XML file format * ASCII bin format * Map file name is equivalent
-
Impact of Thermal Limits on Motor Performance
For semiconductor equipment, motors are essential components, and are used in various systems such as indexing (theta) tables and wafer-handling robots. Motor torque is extremely important, but to get higher torque, you need to apply higher current. As current increases, motor winding temperature
-
Designing Atmospheric-Pressure Plasma Sources for Surface Engineering of Nanomaterials
for separation of. one particle type from a heterogeneous sample [8, 9, 11, 13,. 14, 16, 35]. 3 Methods. 3.1 Device fabrication. A silicon master stamp was fabricated on a o100> workinggrade. silicon substrate (University Wafer, South Boston, MA,. USA). The wafer was coated with AZ 9260 photoresist (AZ
More Information Top
Indicates content that may require registration and/or purchase.
-
Machine vision for alignment and inspection in die bonder
This frame is then loaded onto the wafer table .
-
Method for measuring the granite surface topography of wafer stage with laser interferometer
Topography of a granite surface has an effect on the vertical positioning of a wafer table in a lithographic tool, when the wafer table moves on the granite.
-
Overlay improvement on 0.15-&mgr;m production with ASML IOSc (improved overlay scanner) package
wafer table , IOSc, Improved Overlay Scanner, ASML, 0.15um .
-
LED Manufacturer Profiles - World - 2013
As it does not currently have MOCVD for GaN LED production, and as the wafer capacity shown in this report only refers to GaN LED die capacity, the wafer table seen in many other profiles is not shown here.
-
Extending immersion lithography down to 1x nm production nodes
Finally we address reduction of leveling process dependencies, stage servo dynamics and wafer table flatness to enhance on-product focus and leveling performance.
-
High-productivity immersion scanner enabling 1xnm hp manufacturing
NSR-S622D has various additional functions compared to the previous model such as the newly developed illumination system, new projection lens, new AF system new wafer table in addition to the matured Streamlign platform.
-
Toward 7nm target on product overlay for C028 FDSOI technology
We have been able to highlight key figures to focus on, like reticle heating, wafer table contamination and etch processing effects.
-
Adaptive Discretionary Wiring For Wafer Scale Integration Using Electron Beam Lithography
The wafer table must be moved by high speed motors between writing fields.
-
Front-to-back alignment metrology
The reference mark images Ri1 and Ri2 are the projections of R1 and R2, which are included in the optics and thus fixed to the wafer table .
-
Modeling a die bonder with Petri nets: a case study
components are: wafer table (component class WaferHandler), PickAndPlace (component class PP_Stop), and indexer (component class Indexer1).