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Supplier: CoorsTek
Description: Precision ceramic components improve durability and handling of wafer stages and tables used during inspection and processing. CoorsTek components and tables provide precise dimensional stability, ultra-flatness and smoothness, and vacuum holding of wafers during
- Material Type: Alumina / Aluminum Oxide, Carbide Materials, Silicon Carbide
- Shape / Form: Fabricated / Custom Shape, Wafer Carrier / Holder
- Features: Other
- Applications: Wear Parts / Tooling
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Supplier: CoorsTek
Description: minimizing intra-wafer and wafer-to-wafer variation. When the highest purity components are required, PureSiC CVD silicon carbide coatings are available. Strong abrasion resistance Superior stiffness Chemical corrosion resistance Extreme surface flatness Surface uniformity
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Supplier: IntelLiDrives, Inc.
Description: Planar ServoRing rotary tables provide superior angular positioning and are designed to eliminate backlash, friction and wear problems associated with worm, gear and belt drives. Low maintenance and high throughput characteristics of the Planar ServoRing stage yields the lowest total cost of
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Supplier: IntelLiDrives, Inc.
Description: Planar ServoRing rotary tables provide superior angular positioning and are designed to eliminate backlash, friction and wear problems associated with worm, gear and belt drives. Low maintenance and high throughput characteristics of the Planar ServoRing stage yields the lowest total cost of
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Supplier: IntelLiDrives, Inc.
Description: Planar ServoRing rotary tables provide superior angular positioning and are designed to eliminate backlash, friction and wear problems associated with worm, gear and belt drives. Low maintenance and high throughput characteristics of the Planar ServoRing stage yields the lowest total cost of
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Supplier: IntelLiDrives, Inc.
Description: Planar ServoRing rotary tables provide superior angular positioning and are designed to eliminate backlash, friction and wear problems associated with worm, gear and belt drives. Low maintenance and high throughput characteristics of the AccuRing stage yields the lowest total cost of
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Supplier: PI (Physik Instrumente) L.P.
Description: operation. Application fields Optical alignment, wafer inspection, wafer alignment, measuring technology, inspection systems, calibration, scanning. Thanks to the friction-free motion, no particles are formed, which makes PIglide stages ideal for cleanroom applications. 3-Phase torque
- Load Capacity: 8.992 to 269.76 lbs
- Shape: Flat, Rectangular / Square
- Design: Metric
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Supplier: ATV Technologie GmbH
Description: Ever since its introduction in 1989 ATV’s Single Process Chamber approach has built a strong reputation in the R&D and pilot line production market. The SRO-700 table top IR vacuum reflow oven is the essential entry level reflow soldering oven capable of fulfilling all your basic process
- Temperature Range: 450 to 700 F
- External: Bench / Cabinet
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Supplier: PI (Physik Instrumente) L.P.
Description: encoders supply explicit position information that enables immediate determination of the position. This means that referencing is not required during switch-on, which increases efficiency and safety during operation. Application fields Tomography, beamline systems, wafer metrology,
- Load Capacity: 42.712 to 173.096 lbs
- Shape: Flat, Round
- Design: Metric
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Supplier: PI (Physik Instrumente) L.P.
Description: encoders supply explicit position information that enables immediate determination of the position. This means that referencing is not required during switch-on, which increases efficiency and safety during operation. Application fields Tomography, beamline systems, wafer metrology,
- Load Capacity: 42.712 to 173.096 lbs
- Maximum Torque: 345.13274336283183 to 752.2123893805309 In-lbs
- Rotary Velocity / Speed: 3,000 deg/sec
- Stage Type: Rotary Positioning
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Description: definition. - Etch channels maximum number at quartz wafer of seed which do not pass through from surface to back surface are classified for three grades in 4.2.13 a). Users use seed portions of quartz wafers for devices. They request quartz wafers with less etch channels in
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Supplier: CSA Group
Description: definition. - Etch channels maximum number at quartz wafer of seed which do not pass through from surface to back surface are classified for three grades in 4.2.13 a). Users use seed portions of quartz wafers for devices. They request quartz wafers with less etch channels in
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Supplier: PI (Physik Instrumente) L.P.
Description: complete, ready-to-use positioning system. Accessories and options Air filter sets Built-in vacuum clamping mechanism Application fields The Z tip/tilt stage is ideally suited for high-precision applications, such as wafer inspection, fiber positioning, optics positioning, flat screen
- Load Capacity: 17.64 lbs
- Shape: Flat, Round
- Design: Metric
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Supplier: Jiangyin Deli Laser Solutions Co., Ltd.
Description: We are experienced of all kinds of vacuum chuck for automation and mechinery industries,especially these with glass, quartz and ceramics material. With glass or quartz transparent material, the light could transmits from bottom, or the designer could put CCD under the table for alignment and
- Materials: Ceramic
- Jaws: None / NA
- Features: Other
- Chuck Geometry: Round
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Supplier: Newport MKS
Description: very high throughput stages used in wafer positioning, inspection and electronic manufacturing applications. NewDamp elastomers can be built into equipment isolation supports and even custom machinery feet. Superior Constant Natural Frequency (CNF) Design Constant Natural Frequency (CNF) is a
- Type: Optical Table
- Features: Vibration Isolation
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Supplier: Newport MKS
Description: two to five times better than other commercial elastomers. The high damping factor makes them ideal for supporting and damping the high acceleration amplitudes produced by very high throughput stages used in wafer positioning, inspection and electronic manufacturing applications. NewDamp
- Type: Optical Table
- Features: Vibration Isolation
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Supplier: Newport MKS
Description: two to five times better than other commercial elastomers. The high damping factor makes them ideal for supporting and damping the high acceleration amplitudes produced by very high throughput stages used in wafer positioning, inspection and electronic manufacturing applications. NewDamp
- Type: Optical Table
- Features: Vibration Isolation
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Supplier: Newport MKS
Description: throughput stages used in wafer positioning, inspection and electronic manufacturing applications. NewDamp elastomers can be built into equipment isolation supports and even custom machinery feet. Superior Constant Natural Frequency (CNF) Design Constant Natural Frequency (CNF) is a complex
- Type: Optical Table
- Features: Vibration Isolation
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Supplier: SemiProbe
Description: mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages, chucks, microscope
- Maximum Wafer / Part Size: 150.00000000000003 mm
- Measurements: Electrical Test - Parametric / In-line
- Mounting / Loading: Manual Loading
- Technology: Optical / Imaging System
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Supplier: Primatics, Inc.
Description: Primatics PDR160B rotary tables are among the most advanced direct drive tables available. They feature a high performance direct drive motor that creates sub arc-second repeatability and fast settling times, making the PDR series ideal for semiconductor wafer inspection, high
- Load Capacity: 44.1 lbs
- Maximum Torque: 63.716814159292 In-lbs
- Rotary Velocity / Speed: 150 to 2,100 deg/sec
- Positioning Accuracy: 0.00833333333333333 to 0.0125 degrees
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Supplier: Fountyl Technologies Pte. Ltd.
Description: guide rail, silicon carbide slide rail, silicon carbide vacuum suction cup, silicon carbide reflector, silicon carbide crossbeam, silicon carbide workpiece table, etc. the main function is to carry the wafer to perform high-speed ultra-precision motion along the designated movement
- Length: 62.99216 inch
- Alumina / Aluminate Type: Alumina / Aluminum Oxide
- Features: Other, Silicon Carbide
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Supplier: ASTM International
Description: 1.1 The purpose of this guide is to list, illustrate, and provide reference for various characteristic features and contaminants that are seen on highly specular silicon wafers. Recommended practices for delineation and observation of these artifacts are referenced. The artifacts described in
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Description: IEC/TR 62258-4:2012 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers; - singulated bare die; - die and wafers with attached connection structures; - minimally or partially encapsulated die and wafers. This
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Supplier: ASTM International
Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 The purpose of this guide is to list, illustrate, and provide reference for various characteristic features and contaminants that are seen on highly specular silicon wafers. Recommended practices for delineation and observation
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Supplier: DataPhysics Instruments USA Corp.
Description: automated sample mapping. In order to map silicon wafers, electronic turn tables with vacuum fixation are available. They allow to access any position for contact angle measurements, even on 12″ wafers. In any case, the 6.5-fold zoom lens and the high-performance camera with USB
- Properties Analyzed: Wettability / Contact Angle
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Description: Practice covers flangeless (wafer-type) and single flanged (lug-type) body designs, compatible with ASME B16.5 flanges for sizes NPS 3 (DN 80) through NPS 24 (DN 600) and ASME B16.47 Series A flanges for sizes NPS 30 (DN 750) through NPS 48 (DN 1200). Reference Tables 1 and 2. This
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Description: perspective of a circuit designer. Variability usually refers to a large scale variation that can occur on a wafer to wafer and lot to lot basis, and over long distances on a wafer. This phenomenon is well understood and the effects of variability are included in most integrated
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Supplier: Richardson RFPD
Description: On-chip Temperature and Power Sensing On-chip Gain Control for Temperature Compensation High-Speed SPI with Large On-Chip Beam Table Storage Wafer-Level Chip-Scale Package (WLCSP) compatible with low-cost PCB manufacturing Support for Large-Scale Arrays through Multiple Chip-Addressing
- Device Type: Beamformers, Receiver
- Technology: GPS
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Supplier: CSA Group
Description: requirements (Clause 13); e) revised Table 5 Ring and groove dimension C for PN 420 full-bore, NPS 2-1/2 valves; f) revised Table 8; and g) revised furnace calibration and survey requirements (Annex C). Scope 1.1 General This Standard covers steel valves primarily intended for use in
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Supplier: Robuster Quartz
Description: thin-wall boiling and distilling flasks to heavy-wall diffusion tubes used to process semiconductor wafers at furnace temperatures in excess of 1300 degrees. Robuster Quartz offers custom fabrication of fused quartz products to customer specification and configuration Most products are
- Width / O.D.: 0.0393701 to 1.574804 inch
- Outer Diameter (O.D.): 0.0393701 to 1.574804 inch
- Applications: Chemical / Materials Processing, Electrical / HV Parts
- Glass Type: Quartz
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Supplier: Palomar Technologies, Inc
Description: presentation of dual 8” wafers, or up to 72 wafflepacks, or tape dispensers provides a high production, flexible parts presentation platform. The 6 position, bi-directional tool turret allows “on-the-fly” tool changes to maximize speed and flexibility. A variety of options and variations adds
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Supplier: ASTM International
Description: of a circular silicon wafer having the opposite conductivity type from the thin layer to be measured or by the deposition of polysilicon over an insulating layer. Measurements are made at the center of the wafer using a single-configuration of the four-probe, that is, with the current
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Supplier: DigiPas Technologies Inc.
Description: meeting tight tolerance for highest quality in many manufacturing processes within semiconductor wafer foundries. Digi-Pas® DWL-1900XY dual axis model is used for monitoring a precision wafer manufacturing equipment's performance. Digi-Pas® DWL-1900XY is used in railway maintenance &
- Angular Range: 90 to 5 degrees
- Measuring Technology: Electronic
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Supplier: HG Optronics, Inc.
Description: applications of lasers, including machining, material processing, spectroscopy, wafer inspection, light displays, medical diagnostics, laser printing, and data storage, etc. It has been shown that Nd:YVO4 based diode pumped solid state lasers are rapidly occupying the markets traditionally
- Damage Threshold: 750,000 W/cm²
- Surface Flatness: λ/10
- Surface Quality: 10-5 Scratch / Dig
- Features: AR-Coated, Other, Other / Specialty Material
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Product Overview Used in wafer inspection, precision metrology, coordinate measurement, and laser processing equipment where friction-free motion and sub-micron positioning accuracy are required. Fountyl air floating tables replace traditional mechanical rolling or (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
, crossbeams, and wafer tables Supports high-speed, high-precision wafer motion in advanced lithography tools. Engineering & Manufacturing Advantages (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for Fountyl Technologies Pte. Ltd. -
-chip Temperature and Power Sensing • On-chip Gain Control for Temperature Compensation • High-Speed SPI with Large On-Chip Beam Table Storage • Wafer-Level Chip-Scale Package (WLCSP) compatible with low-cost PCB manufacturing • Support for Large-Scale Arrays through (read more)
Browse RF Modules Datasheets for Richardson RFPD -
working with thick silicon substrates that require extremely high geometric quality and defect-free surfaces. Thanks to their high processing speed, Marposs systems can monitor wafer processing directly inside CMP machines, even in challenging environments where slurry is present and the table (read more)
Browse Dimensional Gages and Instruments Datasheets for Marposs Corp -
specifications make them ideal for IGBT power modules, high-power heat sinks, and advanced wireless modules. Features High thermal conductivity Thermal expansion coefficient close to silicon wafer High strength and toughness (read more)
Browse Thermal and Refractory Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Thermal expansion coefficient close to silicon wafer High strength and toughness Application High power IGBT power module High power heat sink Wireless module Material Properties Table (read more)
Browse Ceramic Sheets and Boards Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Is This The Linear Motion Component You’re Using For Wafer Manufacturing We're not referring to linear bearings that incorporate ball bearings - meaning friction is reduced between moving parts by recirculating (usually metal) balls. We (read more)
Browse Crossed Roller Slides Datasheets for NB Corporation of America -
-power LEDs, and advanced heat dissipation components. Features • High thermal conductivity (170~230W/m.K), up to 9.5 times than alumina; • Thermal expansion coefficient close to silicon wafer, achieve high reliability of Silicon chip and thermal (read more)
Browse Ceramic Sheets and Boards Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
required to reach 10nm, the mask silicon wafer simultaneous step and scanning speed are 150nm/s and 120nm/s respectively, and the mask scanning speed is close to 500nm / s, And the workpiece table is required to have very high motion accuracy and stability. Schematic diagram of workpiece table and (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for 3X Ceramic Parts Company Limited -
highly reliable, with lifespans often exceeding the devices they power. Manufacturing Process Creating a microchip involves a meticulous and highly technical process. It starts with a wafer made from pure (read more)
Browse Microcontrollers (MCU) Datasheets for ODG (Origin Data Global)
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Why use Microporous Ceramic for Vacuum Chucks
Vacuum chucks are used in the thinning, dicing, cleaning, handling, and other processes of semiconductor electronic chips, like wafers. Why choose microporous ceramic vacuum chucks? 1. During the polishing and cleaning process of wafers, polishing liquid and water mist enter the working table
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AN3018: Known Good Die Delivery Specification
2010, Class B criteria. Die will be delivered on wafer tape per Table 1. Unit of measure is die. Quantity per shipping container will vary. Noncompliant die will be identified per Table 4. Wafer Map Format * SEMI E142 compliant * XML file format * ASCII bin format * Map file name is equivalent
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Impact of Thermal Limits on Motor Performance
For semiconductor equipment, motors are essential components, and are used in various systems such as indexing (theta) tables and wafer-handling robots. Motor torque is extremely important, but to get higher torque, you need to apply higher current. As current increases, motor winding temperature
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Designing Atmospheric-Pressure Plasma Sources for Surface Engineering of Nanomaterials
for separation of. one particle type from a heterogeneous sample [8, 9, 11, 13,. 14, 16, 35]. 3 Methods. 3.1 Device fabrication. A silicon master stamp was fabricated on a o100> workinggrade. silicon substrate (University Wafer, South Boston, MA,. USA). The wafer was coated with AZ 9260 photoresist (AZ
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Machine vision for alignment and inspection in die bonder
This frame is then loaded onto the wafer table .
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Method for measuring the granite surface topography of wafer stage with laser interferometer
Topography of a granite surface has an effect on the vertical positioning of a wafer table in a lithographic tool, when the wafer table moves on the granite.
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Overlay improvement on 0.15-&mgr;m production with ASML IOSc (improved overlay scanner) package
wafer table , IOSc, Improved Overlay Scanner, ASML, 0.15um .
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LED Manufacturer Profiles - World - 2013
As it does not currently have MOCVD for GaN LED production, and as the wafer capacity shown in this report only refers to GaN LED die capacity, the wafer table seen in many other profiles is not shown here.
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Extending immersion lithography down to 1x nm production nodes
Finally we address reduction of leveling process dependencies, stage servo dynamics and wafer table flatness to enhance on-product focus and leveling performance.
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High-productivity immersion scanner enabling 1xnm hp manufacturing
NSR-S622D has various additional functions compared to the previous model such as the newly developed illumination system, new projection lens, new AF system new wafer table in addition to the matured Streamlign platform.
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Toward 7nm target on product overlay for C028 FDSOI technology
We have been able to highlight key figures to focus on, like reticle heating, wafer table contamination and etch processing effects.
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Adaptive Discretionary Wiring For Wafer Scale Integration Using Electron Beam Lithography
The wafer table must be moved by high speed motors between writing fields.
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Front-to-back alignment metrology
The reference mark images Ri1 and Ri2 are the projections of R1 and R2, which are included in the optics and thus fixed to the wafer table .
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Modeling a die bonder with Petri nets: a case study
components are: wafer table (component class WaferHandler), PickAndPlace (component class PP_Stop), and indexer (component class Indexer1).