6.1 Introduction

Failure analysis of electronic systems presents certain unique challenges due to the small size of their components and the complexity of their construction. Failures of electronic components may involve conventional mechanical fracture, the mechanisms and modes of which are described in previous chapters. However, there are unique electrical phenomena involved in their failure which are not encountered in exclusively mechanical systems that must also be considered, e.g., arcing and electromigration. In addition, the small size of many of the electronic components produces microstructural effects that may play a role in failure. For example, the fine wires for connectors may have a grain size comparable to that of the dimensions of the wire, thereby making the wires susceptible to low ductility and creep fracture. Also inclusions become important since properties such as strength are greatly affected by their size in structures that have comparable dimensions.

The tools described in Chap. 1 are applicable and adequate for many failure analyses of electronic structures and components. However, in some cases, the electrical nature of the components and their fine architecture may require other tools, and these are described in Sec. 6.4.

A comment about terminology is in order. Electronic systems and their components are described by a variety of terms, acronyms, and abbreviations. In this chapter, when such terms are first mentioned, they are defined; subsequent use may involve the shorter notation. To assist in keeping the terminology straight, App. G lists acronyms and their definitions.