Failure Analysis of Engineering Materials
This text introduces the important aspects associated with the failure analysis of engineering components, and provides a treatment of both macroscopic and microscopic observations of fracture surfaces.
TABLE OF CONTENTS Failure Analysis of Engineering Materials
Appendix G: Acronyms Used in Electronic Failure Analysis
Overview
| AE | atomic emission |
| AES | Auger electron spectroscopy |
| AF | atomic fluorescence |
| AFM | atomic force microscopy/microscope |
| AMI | acoustic microimaging |
| BGA | ball grid array |
| BSE | back-scattered electron |
| CFC | chlorofluorocarbon |
| CL | cathodoluminescence |
| C-SAM | C-mode scanning acoustic microscopy |
| CSP | chip scale packaging |
| CTE | coefficient of thermal expansion |
| CVD | chemical vapor deposition |
| DIP | dual inline package |
| DIT | differential infrared thermography |
| DMA | dynamic mechanical analysis |
| DRAM | dynamic random access memory |
| DSC | differential scanning calorimetry |
| EBIC | electron beam induced current |
| ECL | emitter-coupled logic |
| EDX | energy-dispersive x-ray |
| EDXA | energy-dispersive x-ray analysis |
| EOS | electrical overstress |
| ESD | electrostatic discharge |
| FAA | flame atomic absorption |
| FBSOA | forward bias safe operating area |
| FTIR | Fourier transform infrared |
| GFAA | graphite furnace atomic absorption |
| GOI | gate oxide integrity |
| HF-SAM | high-frequency scanning acoustic microscopy |
| HPLC | high-pressure liquid chromatography |
| IC | integrated circuit |
| ICP-E | inductively coupled plasma emission |
| ICP-MS | inductively coupled plasma mass spectrometry |
| I/O | input/output |
| IP | inner plane |
| IR | infrared |
| IRM | infrared microscopy/microscope |
| JDM | Joule displacement microscopy |
| LCC | leadless chip carrier |
| LEEM | low-energy electron microscopy |
| LM | light microscopy |
| MCM | multichip module |
| MELF | metal electrode leadless face (SMT component) |
| MFM | magnetic force microscopy |
| MOS | metal oxide semiconductor |
| MOSFET | metal oxide semiconductor field-effect transistor |
| nMOS | metal oxide semiconductor with n-type channel for "on" |
| OM | optical microscope/microscopy |
| OP-AMP | operational amplifier |
| PCB | printed-circuit board |
| PDM | photo displacement microscopy |
| PGC | pyrolysis-gas chromatography |
| PGC-MS | pyrolysis-gas chromatography mass spectroscopy |
| PIH | pin-in-hole (also called PTH) |
| PIN | p-i-n diode (I is for intrinsic) |
| PLCC | plastic leaded chip carrier |
| PTH | plated-through-hole (also called PIH) |
| PWB | printed wiring board |
| RBS | Rutherford back-scattered spectroscopy |
| RBSOA | reverse bias safe operating area |
| RI | radiographic inspection |
| SAM |
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