6.3.1 General introduction

The first indication of faulty electronic components usually is the inability to perform electrically in an expected manner. The observed phenomena in an electrical test are an open, a short, an undefined malfunction, or a shift in some parameter such as output. Table 6.8 shows the distribution of such phenomena in IC packages at the system level.

The sequence of steps used in the analysis of electronic devices, components, or systems is dependent on the type of item to be analyzed. This is illustrated in Fig. 6.42. In the case of systems and assemblies, electrical testing or circuit analysis techniques (respectively) may be required to isolate problems related to either design or defective parts. Once the specific root cause of failure of the specific part or process has been isolated, sophisticated failure analysis techniques can be used to determine solution(s) to the problem. This may involve interactions between manufacturer, user, and several test laboratories. The findings of such an exercise may then be extended to design for failure prevention and elimination.

Figure 6.42: A typical failure analysis flowchart with key processes identified. ( From Pabbisetty. ^[16])

6.3.2 Stages in failure analysis

There are usually seven stages in the failure analysis (FA) of most failed devices:

1. Examination prior to package opening

   Table 6.8: Typical Observations of IC Failures at System Level

   System failures	Percent of reports
   Opens	30
   Shorts	26
   Malfunctions	25
   Parameter shifts	19
   SOURCE: From Dicken. [4]

2. Package...